Heat insulating unit for substrate processing apparatus
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Description
Claims
We claim the ornamental design for a heat insulating unit for substrate processing apparatus, as shown (and described).
Referenced Cited
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Patent History
Patent number: D788706
Type: Grant
Filed: Feb 18, 2016
Date of Patent: Jun 6, 2017
Assignee: HITACHI KOKUSAI ELECTRIC INC. (Tokyo)
Inventors: Hideto Tateno (Toyama), Daisuke Hara (Toyama)
Primary Examiner: Daniel Bui
Assistant Examiner: Andrew Kerr
Application Number: 29/555,044
Type: Grant
Filed: Feb 18, 2016
Date of Patent: Jun 6, 2017
Assignee: HITACHI KOKUSAI ELECTRIC INC. (Tokyo)
Inventors: Hideto Tateno (Toyama), Daisuke Hara (Toyama)
Primary Examiner: Daniel Bui
Assistant Examiner: Andrew Kerr
Application Number: 29/555,044
Classifications