Heat insulating unit for substrate processing apparatus

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Description

FIG. 1 is a front, top and right side perspective view of a heat insulating unit for substrate processing apparatus showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof; and,

FIG. 7 is a bottom plan view.

Claims

We claim the ornamental design for a heat insulating unit for substrate processing apparatus, as shown (and described).

Referenced Cited
U.S. Patent Documents
D440138 April 10, 2001 Campbell
D599386 September 1, 2009 Moellering
D613245 April 6, 2010 Honna
D654211 February 14, 2012 Melzner
D670247 November 6, 2012 Savill, Jr.
D703238 April 22, 2014 Ueno
D709323 July 22, 2014 Brown
9082694 July 14, 2015 Saido
9134052 September 15, 2015 Kuo
D758317 June 7, 2016 Plassiard
D766833 September 20, 2016 Plassiard
Patent History
Patent number: D788706
Type: Grant
Filed: Feb 18, 2016
Date of Patent: Jun 6, 2017
Assignee: HITACHI KOKUSAI ELECTRIC INC. (Tokyo)
Inventors: Hideto Tateno (Toyama), Daisuke Hara (Toyama)
Primary Examiner: Daniel Bui
Assistant Examiner: Andrew Kerr
Application Number: 29/555,044