Flexible printed wiring board with device

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Description

FIG. 1 is a front view of a flexible printed wiring board with device shown in a used condition mounted on a photovoltaic power device for a photovoltaic module or a light emitting diode device for a light emitting diode module shown in broken lines showing our new design;

FIG. 2 is a rear view thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a bottom plan view thereof;

FIG. 5 is a right side view thereof;

FIG. 6 is a left side view thereof;

FIG. 7 is an enlarged top plan view of a portion taken along lines 7-7 of FIG. 3;

FIG. 8 is an enlarged bottom plan view of a portion taken along lines 8-8 of FIG. 4;

FIG. 9 is an enlarged front view of a portion taken along lines 9-9 of FIG. 1;

FIG. 10 is an enlarged rear view of a portion taken along lines 10-10 of FIG. 2;

FIG. 11 is a right side view of FIG. 7; and,

FIG. 12 is an enlarged left side view of FIG. 6.

The even dashed broken lines shown in the drawings represent portions of the flexible printed wiring board with device that form no part of the claimed design. The long dashed and short dashed line indicates only a boundary line between the claimed and unclaimed areas of the design.

Claims

The ornamental design for a flexible printed wiring board with device, as shown and described.

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Patent History
Patent number: D810707
Type: Grant
Filed: Dec 5, 2016
Date of Patent: Feb 20, 2018
Assignee: SUMITOMO ELECTRIC INDUSTRIES, LTD. (Osaka)
Inventors: Koji Mori (Osaka), Takashi Iwasaki (Osaka), Kazumasa Toya (Osaka), Kenji Saito (Osaka), Yoshiya Abiko (Osaka), Youichi Nagai (Osaka), Makoto Inagaki (Osaka), Rui Mikami (Osaka)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/586,563