Instrument module

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Description

FIG. 1 is a front perspective view of an instrument module in accordance with an embodiment;

FIG. 2 is a rear perspective view of an instrument module in accordance with an embodiment;

FIG. 3 is a front elevational view of an instrument module in accordance with an embodiment;

FIG. 4 is a rear elevational view of an instrument module in accordance with an embodiment;

FIG. 5 is a left side elevational view of an instrument module in accordance with an embodiment;

FIG. 6 is a right side elevational view of an instrument module in accordance with an embodiment;

FIG. 7 is a top view of an instrument module in accordance with an embodiment; and,

FIG. 8 is a bottom view of an instrument module in accordance with an embodiment.

The broken lines shown in the figures represent portions of the instrument module that form no part of the claimed design. The broken line showing immediately adjacent the shaded areas represents boundaries to the claimed design and forms no part of the claimed design.

Claims

The ornamental design for an instrument module, as shown and described.

Referenced Cited
U.S. Patent Documents
D645367 September 20, 2011 Hayashi
D669189 October 16, 2012 Liu
D676143 February 12, 2013 Liu
D676568 February 19, 2013 Liu
D685483 July 2, 2013 LiCalzi
D735878 August 4, 2015 Chang
D738243 September 8, 2015 Selberg
D740955 October 13, 2015 Gutmann et al.
Foreign Patent Documents
1517913 February 2015 JP
DM081998 April 2014 WO
Patent History
Patent number: D812241
Type: Grant
Filed: Jun 27, 2016
Date of Patent: Mar 6, 2018
Assignee: Siemens Healthcare Diagnostics Inc. (Tarrytown, NY)
Inventors: Daniel LiCalzi (New York, NY), Scott Salmon (Tenafly, NJ), Josh Hartl (Philadelphia, PA)
Primary Examiner: Wan Laymon
Assistant Examiner: Mark Booker
Application Number: 29/569,389
Classifications