Solid state relay

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Description

FIG. 1 is a front, top, left-side perspective view of the solid state relay;

FIG. 2 is a front elevational view thereof, the rear elevational view (not provided) being a mirror image thereof;

FIG. 3 is a top plan view thereof;

FIG. 4 is a right-side elevational view thereof, the left-side elevational view (not provided) being a mirror image thereof;

FIG. 5 is a bottom plan view thereof; and,

FIG. 6 is a rear, bottom, left-side perspective view thereof.

The broken lines in the drawings illustrate portions of the solid state relay that form no part of the claimed design.

Claims

The ornamental design for a solid state relay, as shown and described.

Referenced Cited
U.S. Patent Documents
4361371 November 30, 1982 Williams
5229739 July 20, 1993 Oh
D357462 April 18, 1995 Terasawa
D518792 April 11, 2006 Ohta
D539761 April 3, 2007 Takahashi
D548203 August 7, 2007 Takahashi
D717253 November 11, 2014 Jo
D719926 December 23, 2014 Sohn
D770994 November 8, 2016 Hasegawa
20050194552 September 8, 2005 Yamaguchi
20080128889 June 5, 2008 Jeong
20130286594 October 31, 2013 Onai
20180160569 June 7, 2018 Yoshihara
Foreign Patent Documents
1587425 October 2017 JP
Patent History
Patent number: D836565
Type: Grant
Filed: Mar 15, 2018
Date of Patent: Dec 25, 2018
Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. (Tokyo)
Inventor: Mitsumasa Sasaki (Hanno)
Primary Examiner: Angela J Lee
Assistant Examiner: Shawn T Gingrich
Application Number: 29/640,569
Classifications
Current U.S. Class: Relay (D13/159)