Audio device
Latest Samsung Electronics Patents:
- THIN FILM STRUCTURE AND METHOD OF MANUFACTURING THE THIN FILM STRUCTURE
- MULTILAYER ELECTRONIC COMPONENT
- ELECTRONIC DEVICE AND OPERATING METHOD THEREOF
- ULTRASOUND PROBE, METHOD OF MANUFACTURING the same, AND STRUCTURE COMBINABLE WITH MAIN BACKING LAYER OF THE SAME
- DOWNLINK MULTIUSER EXTENSION FOR NON-HE PPDUS
The broken lines in the figures illustrate portions of the design that form no part of the claimed design.
The dot-dot-dash broken lines in
The horizontal broken lines on the rear in
Claims
We claim the ornamental design for an audio device, as shown and described.
D348659 | July 12, 1994 | Miller |
D437045 | January 30, 2001 | Luster |
D438866 | March 13, 2001 | Suzuki |
D646242 | October 4, 2011 | Honda |
D659677 | May 15, 2012 | Kim |
D692426 | October 29, 2013 | Gervais |
D742365 | November 3, 2015 | Kim |
D743373 | November 17, 2015 | Kim |
2016302108078 | October 2016 | CN |
30-2014-0042692 | April 2015 | KR |
30-2014-0063825 | August 2015 | KR |
Type: Grant
Filed: May 31, 2017
Date of Patent: Oct 22, 2019
Assignee: Samsung Electronics Co., Ltd. (Suwon-si)
Inventors: Sungil Bang (Seoul), Gyoosang Choi (Suwon-si), Bumho Chun (Yongin-si), Junpyo Kim (Seoul), Chanhee Han (Seoul)
Primary Examiner: Keli L Hill
Application Number: 29/605,856