Light emitting diode package

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Description

1. Light emitting diode package

1.1 : Perspective

1.2 : Front

1.3 : Back

1.4 : Left

1.5 : Right

1.6 : Top

1.7 : Bottom

Claims

The ornamental design for light emitting diode package, as shown and described.

Referenced Cited
U.S. Patent Documents
D476960 July 8, 2003 Fukasawa
D548704 August 14, 2007 Wu
D565514 April 1, 2008 Cho
D590354 April 14, 2009 Tsuchiya
D591247 April 28, 2009 Miyashita
D606936 December 29, 2009 Nakayama
D619111 July 6, 2010 Wu
D623611 September 14, 2010 Okuwaki
D628166 November 30, 2010 Okuwaki
D647068 October 18, 2011 Okuwaki
D647865 November 1, 2011 Miyashita
D661263 June 5, 2012 Okuwaki
D662903 July 3, 2012 Kobayakawa
D664106 July 24, 2012 Kobayakawa
D669042 October 16, 2012 Kanemaru
D669043 October 16, 2012 Kamijo
D697877 January 21, 2014 Hsu
9406852 August 2, 2016 Nakabayashi
D786203 May 9, 2017 Ide
9741907 August 22, 2017 Oh
D797688 September 19, 2017 Tanaka
D843957 March 26, 2019 Liu
D854713 July 23, 2019 Liu
D865226 October 29, 2019 Liu
D865687 November 5, 2019 Oh
20070114555 May 24, 2007 Takemoto
20160300987 October 13, 2016 Sanga
Patent History
Patent number: D889422
Type: Grant
Filed: Oct 12, 2018
Date of Patent: Jul 7, 2020
Assignee: Seoul Semiconductor Co., Ltd. (Ansan-si)
Inventors: SeungRi Choi (Ansan-si), SeMin Bang (Ansan-si), MyungHee Lee (Ansan-si)
Primary Examiner: Robert M. Spear
Application Number: 35/506,573
Classifications