Case for a circuit board

- Samsung Electronics
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Description

FIG. 1 is a perspective view of a case for a circuit board showing our new design.

FIG. 2 is a front elevation view thereof.

FIG. 3 is a rear elevation view thereof.

FIG. 4 is a left side elevation view thereof.

FIG. 5 is a right side elevation view thereof.

FIG. 6 is a top plan view thereof.

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 is a perspective view of a case for a circuit board shown in an example environment.

The broken lines are for environmental purposes only and form no part of the claimed design.

Claims

The ornamental design for a case for a circuit board, as shown and described.

Referenced Cited
U.S. Patent Documents
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D255030 May 20, 1980 Holce
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D607419 January 5, 2010 Kurisaki
D626173 October 26, 2010 Inoue
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D682930 May 21, 2013 Aoki
D767673 September 27, 2016 Nanjo
D875173 February 11, 2020 Naito
20150375512 December 31, 2015 Kondo
20170339797 November 23, 2017 Guo
Patent History
Patent number: D890709
Type: Grant
Filed: Feb 26, 2019
Date of Patent: Jul 21, 2020
Assignee: SAMSUNG ELECTRONICS CO., LTD. (Suwon-si)
Inventor: Gwangman Lim (Seoul)
Primary Examiner: Angela J Lee
Assistant Examiner: Shawn T Gingrich
Application Number: 29/681,470