Light emitting diode package
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Description
1. Light emitting diode package
Claims
The ornamental design for light emitting diode package, as shown and described.
Referenced Cited
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Patent History
Patent number: D892067
Type: Grant
Filed: Oct 12, 2018
Date of Patent: Aug 4, 2020
Assignee: Seoul Semiconductor Co., Ltd. (Ansan-si)
Inventors: SeungRi Choi (Ansan-si), SeMin Bang (Ansan-si), MyungHee Lee (Ansan-si)
Primary Examiner: Robert M. Spear
Application Number: 35/506,576
Type: Grant
Filed: Oct 12, 2018
Date of Patent: Aug 4, 2020
Assignee: Seoul Semiconductor Co., Ltd. (Ansan-si)
Inventors: SeungRi Choi (Ansan-si), SeMin Bang (Ansan-si), MyungHee Lee (Ansan-si)
Primary Examiner: Robert M. Spear
Application Number: 35/506,576
Classifications
Current U.S. Class:
Electron Or Vacuum Tube (23) (D13/180)