Light emitting diode package

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Description

1. Light emitting diode package

1.1 : Perspective

1.2 : Front

1.3 : Back

1.4 : Left

1.5 : Right

1.6 : Top

1.7 : Bottom

Claims

The ornamental design for light emitting diode package, as shown and described.

Referenced Cited
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Patent History
Patent number: D894853
Type: Grant
Filed: Oct 12, 2018
Date of Patent: Sep 1, 2020
Assignee: Seoul Semiconductor Co., Ltd. (Ansan-si)
Inventors: MyungHee Lee (Ansan-si), SeungRi Choi (Ansan-si), SeMin Bang (Ansan-si)
Primary Examiner: Robert M. Spear
Application Number: 35/506,562
Classifications