Seal members for use in semiconductor production apparatuses
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Description
The broken lines shown in Reproduction
Claims
The ornamental design for seal member for use in semiconductor production apparatus, as shown and described.
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Patent History
Patent number: D898171
Type: Grant
Filed: Jun 7, 2018
Date of Patent: Oct 6, 2020
Assignee: Valqua, Ltd. (Tokyo)
Inventors: Nobuhiro Yoshida (Gojo), Sangho Kim (Gojo)
Primary Examiner: Richard E Chilcot
Application Number: 35/506,183
Type: Grant
Filed: Jun 7, 2018
Date of Patent: Oct 6, 2020
Assignee: Valqua, Ltd. (Tokyo)
Inventors: Nobuhiro Yoshida (Gojo), Sangho Kim (Gojo)
Primary Examiner: Richard E Chilcot
Application Number: 35/506,183
Classifications
Current U.S. Class:
Gasket Or Packing (D23/269)