Housing module for an electronic device
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The ornamental design for a housing module for an electronic device, as shown and described.
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Type: Grant
Filed: Sep 4, 2018
Date of Patent: Feb 2, 2021
Assignee: Apple Inc. (Cupertino, CA)
Inventors: Jody Akana (San Francisco, CA), Molly Anderson (San Francisco, CA), Bartley K. Andre (Palo Alto, CA), Shota Aoyagi (San Francisco, CA), Anthony Michael Ashcroft (San Francisco, CA), Kristina A. Babiarz (San Jose, CA), Marine C. Bataille (San Francisco, CA), Jeremy Bataillou (San Francisco, CA), Carlo Catalano (Capitola, CA), Markus Diebel (San Francisco, CA), Ross M. Errett (San Jose, CA), Lee B. Hamstra (Mountain View, CA), M. Evans Hankey (San Francisco, CA), Julian Hoenig (San Francisco, CA), Richard P. Howarth (San Francisco, CA), Jonathan P. Ive (San Francisco, CA), Julian Jaede (San Francisco, CA), Duncan Robert Kerr (San Francisco, CA), Melody L. Kuna (Palo Alto, CA), Carli E. Oster (San Francisco, CA), Florence Wong Ow (Burlingame, CA), Peter Russell-Clarke (San Francisco, CA), Benjamin Andrew Shaffer (San Jose, CA), Mikael Silvanto (San Francisco, CA), Sung-Ho Tan (San Francisco, CA), Clement Tissandier (San Francisco, CA), Eugene Antony Whang (San Francisco, CA), Devin M. Williams (Washington, DC), Alex Chun Lap Yeung (South San Francisco, CA), Rico Zörkendörfer (San Francisco, CA)
Primary Examiner: Austin Murphy
Application Number: 29/662,274