Press-fit pin case

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Description

FIG. 1 is a top perspective view of a press-fit pin case showing our new design;

FIG. 2 is a top plan view of the press-fit pin case;

FIG. 3 is a bottom plan view of the press-fit pin case;

FIG. 4 is a first side elevation view of the press-fit pin case;

FIG. 5 is a second side elevation view of the press-fit pin case;

FIG. 6 is a first end elevation view of the press-fit pin case; and,

FIG. 7 is a second end elevation view of the press-fit pin case.

Any broken lines in the drawings are for purposes of depicting portions and form no part of the claimed design. All evenly spaced broken lines are directed to the environment. The dot-dash lines depict the bounds of the claimed design, and form no part of the claimed design. In addition, the unshaded surfaces that directly adjoin the claimed solid line edge form no part of the claimed design.

Claims

What is claimed is an ornamental design for a press-fit pin case, as shown and described herein.

Referenced Cited
U.S. Patent Documents
4723919 February 9, 1988 Crane
6024584 February 15, 2000 Lemke
6093035 July 25, 2000 Lemke
6325644 December 4, 2001 Lemke
D550628 September 11, 2007 Whiteman, Jr.
7950962 May 31, 2011 Mase
D741813 October 27, 2015 Leung
D745852 December 22, 2015 Harper, Jr.
D768086 October 4, 2016 Leung
D770984 November 8, 2016 Leung
10396481 August 27, 2019 Lauermann
D887366 June 16, 2020 Madathil Sankarankutty Nair
Foreign Patent Documents
303415221 October 2015 CN
303647504 April 2016 CN
2940718 April 2018 EP
WO-2018159230 September 2018 WO
Other references
  • Infineon. Link: https://www.infineon.com/dgdl/Infineon-AN2009-01_Mounting_Instructions_Easy_PressFIT-ApplicationNotes-v02_04-EN.pdf?fileId=db3a30431ed1d7b2011ef425e7c75c5c. Jun. 17, 2019. Assembly Instructions for the Easy-PressFIT Modules. (Year: 2019).
  • Vincotech, “Vincotech Adds flor E1/E2 Product Family,” Aug. 2018 Product News, Oct. 21, 2018.
  • Vincotech, “10-Ex12PMA0335C-L188A48x_FD,” datasheet, rev. 2, May 11, 2018.
Patent History
Patent number: D922329
Type: Grant
Filed: Jul 12, 2019
Date of Patent: Jun 15, 2021
Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC (Phoenix, AZ)
Inventors: Jihwan Kim (Seoul), Yushuang Yao (Shenzhen), Bosung Won (Seoul), Atapol Prajuckamol (Thanyaburi), Olaf Zschieschang (Vaterstetten)
Primary Examiner: Lauren D McVey
Application Number: 29/697,995