Headphone

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Description

FIG. 1 is a perspective view of a headphone showing the new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a side elevational view thereof;

FIG. 5 is an opposite side elevational view thereof;

FIG. 6 is a top view thereof; and,

FIG. 7 is a bottom view thereof.

The broken lines to the logo outline on the exterior headphone in FIGS. 1-5 and 7 represent the bounds of the claimed design. The broken lines immediately adjacent the shaded areas represent the bounds of the claimed design. All other broken lines are directed to environment; the broken lines form no part of the claimed design.

Claims

The ornamental design for a headphone, as shown and described.

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Patent History
Patent number: D944762
Type: Grant
Filed: Jan 3, 2020
Date of Patent: Mar 1, 2022
Assignee: Harman International Industries, Incorporated (Northridge, CA)
Inventors: Jieyu Chen (Shenzhen), Rafal Mateusz Czaniecki (Shenzhen), Effrosini A. Karayiannis (Saint Louis, MO)
Primary Examiner: Paula Allen Greene
Application Number: 29/719,430
Classifications
Current U.S. Class: Headphone Or Headset (D14/205)