Vapor chamber

- DYNATRON CORPORATION
Skip to: Description  ·  Claims  ·  References Cited  · Patent History  ·  Patent History
Description

FIG. 1 is a perspective view of the vapor chamber showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof;

FIG. 8 is another perspective view thereof for showing the use situation; and,

FIG. 9 is another perspective view thereof for showing the use situation.

The broken lines illustrate unclaimed features that form no part of the claimed design.

Claims

The ornamental design for the vapor chamber, as shown and described.

Referenced Cited
U.S. Patent Documents
D822629 July 10, 2018 Kimura
D845921 April 16, 2019 Saito
D892754 August 11, 2020 Beckedahl
D903611 December 1, 2020 Sannai
D909979 February 9, 2021 Tseng
20160091259 March 31, 2016 Lin
20160276927 September 22, 2016 Das
20210199385 July 1, 2021 Guo
20220057145 February 24, 2022 Wang
Other references
  • Amazon, “Dynatron N8 Cooper Lake, Ice Lake LGA 4189 2U Passive CPU Cooler” First for sale Oct. 29, 2020. (https://www.amazon.com/Dynatron-Cooper-Lake-Passive-Cooler/dp/B08M6JBJTB) (Year: 2020).
  • Amazon, “Dynatron A31 AMD EPYC . . . ”, First on sale Feb. 20, 2018. (https://www.amazon.com/Dynatron-A31-Heatsink-Aluminum-Exhausting/dp/B079YJ8KKV) (Year: 2018).
Patent History
Patent number: D952585
Type: Grant
Filed: Mar 16, 2020
Date of Patent: May 24, 2022
Assignee: DYNATRON CORPORATION (Union City, CA)
Inventor: Tai-Chi Huang (Taipei)
Primary Examiner: April Rivas
Application Number: 29/728,037
Classifications
Current U.S. Class: Heat Sink (D13/179)