Leadframe

- Diodes Incorported
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Description

FIG. 1 is a top perspective view of a leadframe showing our new design;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a front elevational view thereof;

FIG. 5 is a rear elevational view thereof;

FIG. 6 is a right side elevational view thereof; and,

FIG. 7 is a left side elevational view thereof.

The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design.

The shade lines in the figures show contours and not surface ornamentation.

Claims

The ornamental design for a leadframe, as shown and described.

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Patent History
Patent number: D969764
Type: Grant
Filed: Oct 28, 2021
Date of Patent: Nov 15, 2022
Assignee: Diodes Incorported (Plano, TX)
Inventors: Li-Ju Huang (Tainan), Michael Yimin Zhang (Palo Alto, CA)
Primary Examiner: Selina Sikder
Application Number: 29/813,451