Semiconductor device

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Description

FIG. 1 is a front, bottom and right side perspective view of a semiconductor device showing our new design;

FIG. 2 is a front view thereof;

FIG. 3 is a rear view thereof;

FIG. 4 is a top view thereof;

FIG. 5 is a bottom view thereof;

FIG. 6 is a left side view thereof; and,

FIG. 7 is a right side view thereof.

The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.

Claims

The ornamental design for a semiconductor device, as shown and described.

Referenced Cited
U.S. Patent Documents
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D556686 December 4, 2007 Matsuo
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D721048 January 13, 2015 Nakamura
D759604 June 21, 2016 Yoneyama
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D805485 December 19, 2017 Kawase
20100149774 June 17, 2010 Matsumoto
Patent History
Patent number: D864884
Type: Grant
Filed: Apr 5, 2018
Date of Patent: Oct 29, 2019
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Rei Yoneyama (Tokyo), Nobuchika Aoki (Tokyo), Hideki Tsukamoto (Fukuoka), Akihiko Yamashita (Hyogo), Masayuki Ando (Tokyo)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/643,231