Semiconductor device
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Description
The broken lines illustrate portions of the semiconductor device that form no part of the claimed designs.
Claims
The ornamental design for a semiconductor device, as shown and described.
Referenced Cited
U.S. Patent Documents
| D288557 | March 3, 1987 | Du Bois |
| D441726 | May 8, 2001 | Sofue |
| D556686 | December 4, 2007 | Matsuo |
| 7425757 | September 16, 2008 | Takubo |
| D589012 | March 24, 2009 | Soyano |
| D704671 | May 13, 2014 | Chen |
| D705184 | May 20, 2014 | Takahashi |
| D712853 | September 9, 2014 | Nakamura |
| D719537 | December 16, 2014 | Kawase |
| D721048 | January 13, 2015 | Nakamura |
| D759604 | June 21, 2016 | Yoneyama |
| D773413 | December 6, 2016 | Yoneyama |
| D805485 | December 19, 2017 | Kawase |
| 20100149774 | June 17, 2010 | Matsumoto |
Patent History
Patent number: D864884
Type: Grant
Filed: Apr 5, 2018
Date of Patent: Oct 29, 2019
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Rei Yoneyama (Tokyo), Nobuchika Aoki (Tokyo), Hideki Tsukamoto (Fukuoka), Akihiko Yamashita (Hyogo), Masayuki Ando (Tokyo)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/643,231
Type: Grant
Filed: Apr 5, 2018
Date of Patent: Oct 29, 2019
Assignee: Mitsubishi Electric Corporation (Tokyo)
Inventors: Rei Yoneyama (Tokyo), Nobuchika Aoki (Tokyo), Hideki Tsukamoto (Fukuoka), Akihiko Yamashita (Hyogo), Masayuki Ando (Tokyo)
Primary Examiner: Elizabeth J Oswecki
Application Number: 29/643,231
Classifications
Current U.S. Class:
Semiconductor, Transistor Or Integrated Circuit (24) (D13/182)