Module-based field termination assembly
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Claims
The ornamental design for a module-based field termination assembly, as shown and described.
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Type: Grant
Filed: Jan 31, 2019
Date of Patent: Feb 21, 2023
Assignee: Honeywell International Inc. (Charlotte, NC)
Inventors: Dawa Pakimo (Bangalore), Dinesh Kumar KN (Bangalore), Chandrashekar Thayumanavan (Bangalore), Jaison Cherian (Bangalore), Shripurnabodh Deshpande (Bangalore), Karma Bhutia (Bengaluru), Hemanth Vijaykumar (Bangalore), Vishwanath Balakrishna (Bengaluru)
Primary Examiner: Kathleen L Jones
Application Number: 29/678,898