Fiber optic module
A fiber optic module includes a connector connected to a mother board of a host computer, an LD semiconductor IC for converting serial data received from the mother board to an LD electric signal for a laser diode, an LD module for converting the LD electric signal to an LD optical signal, a PD module for converting a photodiode optical signal to a PD electric signal, a PD semiconductor IC for converting the PD electric signal to PD serial data, a circuit board having the connector and carrying LD semiconductor IC and PD semiconductor IC, an LD shielding plate and a PD shielding plate for electrically shielding the LD module and the PD module, respectively, a first frame and a second frame for holding the circuit board, LD module and PD module. In the fiber optic module, the connector is of a surface mounting type, leads of the LD and PD modules are connected to a side of the circuit board mounted with the connector, the circuit board has an LD variable resistor for adjusting a drive current of the LD module, the LD variable resistor is provided to a side of the circuit board opposite to the connector, the circuit board has a PD variable resistor provided to the side of the circuit board opposite to the connector for detecting a signal of the PD module, 3 signal processing semiconductor ICs or less are provided.
Latest Matsushita Electric Industrial Co., Ltd. Patents:
- Cathode active material for a nonaqueous electrolyte secondary battery and manufacturing method thereof, and a nonaqueous electrolyte secondary battery that uses cathode active material
- Optimizing media player memory during rendering
- Navigating media content by groups
- Optimizing media player memory during rendering
- Information process apparatus and method, program, and record medium
This is a continuation of application Ser. No. 09/087,857, which was filed on Jun. 1, 1998 to seek reissue of U.S. Pat. No. 5,596,663, which issued on Jan. 21, 1997 on application Ser. No. 08/372,078, filed on Jan. 12, 1995.
More than one reissue application has been filed for the reissue of U.S. Pat. No. 5,596,663. The reissue applications are application Ser. No. 09/087,857, now U.S. Pat. No. Re 36,886, application Ser. No. 09/571,334, the present application, and application Ser. No. 10/766,488.
BACKGROUND OF THE INVENTIONThe present invention relates to a fiber optic module which can be used in such a device as to perform data transfer between apparatuses.
There has been so far known such a fiber optic module as shown in
However, the above prior art has had several problems which follow.
1) The electric signals are transferred on a parallel data basis, and then even though each of parallel signals consists of, e.g., 8 bits, the number of signal lines transferring the parallel signals as well as other signals becomes as many as 50, which requires the large size of connectors and semiconductor ICs for serial/parallel conversion, which results in that the size of the entire unit must be inevitably made large. Further, not only the large size of this unit per se goes against a recent tendency of the rapid downsizing movement of host computer but this also largely limits the design flexibility of mother board for system manufacturers.
2) The fixation between the fiber optic module and mother board in the prior art is effected by means of the J-letter shaped clip 9 in the form of a resin leg extended from the lower frame 7b as already explained in connection with FIG. 18. This requires a large hole as an opening for fixation in the mother board, whereby the design flexibility of the mother board by the system manufacturer is largely limited. Further, since the prior art has such a structure that a load caused by the force derived by mounting and dismounting of the optical fiber is applied to the J-letter shaped clip 9 and the lead (not shown) of the connector 6, this causes a breakage of the J-letter shaped resin-clip 9 made from resin or a poor connection of the connector lead, with the result of reduction in the reliability of the fiber optic module.
Furthermore, for the purpose of avoiding any stress applied to the leads of the LD modules 1 and PD modules 2, the accuracy of each of the parts must be increased and thus parts management (such as parts acceptance inspection) becomes necessary, which make it difficult to obtain a low-cost fiber optic module.
3) The prior art fiber optic module is fixed by soldering the connector 6 to the circuit board 3 and thereafter the signal lines of the connector 6 are directly connected to the mother board by soldering. The necessity of these works hinders realization of a low-cost fiber optic module.
4) In the method for holding the circuit board 3 as shown in
5) Since most area of the circuit board is in its exposed state, when a worker handles the prior art fiber optic module or a user mounts the prior art fiber optic module onto the mother board, the prior art fiber optic module is susceptible to electrostatic destruction, which leads to poor reliability and costliness of the fiber optic module.
6) During a long-term storage, dust or foreign matter invades into the LD and PD modules into which optical fibers are to plug, which causes improper or poor connection between the optical fiber and the module, thus resulting in remarkable reduction in the reliability of the fiber optic module.
SUMMARY OF THE INVENTIONIt is accordingly an object of the present invention to provide a fiber optic module which can solve the above problems in the prior art and can be made compact in size, high in the design flexibility of mother board, low in cost and high in reliability.
In accordance with an aspect of the present invention, the above object is attained by providing a fiber optic module which includes a connector connected to a mother board of a host computer, an LD semiconductor IC for converting serial data received from the mother board to an LD electric signal for a laser diode, an LD module for converting the LD electric signal to an LD optical signal, a PD module for converting a photodiode optical signal to a PD electric signal, a PD semiconductor IC for converting the PD electric signal to PD serial data, a circuit board having the connector and carrying LD semiconductor IC and PD semiconductor IC, an LD shielding plate for electrically shielding the LD module, a PD shielding plate for electrically shielding the PD module, a first frame for holding the circuit board, LD module and PD module, and a second frame for holding the circuit board, LD module and PD module. In the fiber optic module, the connector may be of a surface mounting type,, leads of the LD and PD modules may be connected to a side of the circuit board mounted with the connector, the circuit board may have an LD variable resistor for adjusting a drive current of the LD module, the LD variable resistor may be provided to a side of the circuit board opposite to the connector, the circuit board may have a PD variable resistor for detecting a signal of the PD module, the PD variable resistor may be provided to the side of the circuit board opposite to the connector 3 signal processing semiconductor ICs or less may be provided, an outline configuration of the circuit board may measure 17 mm through 25.4 mm wide and 30 mm through 50 mm long, the outline dimensions of the fiber optic module may be 19 mm through 25.4 mm wide, 45 mm through 65 mm high and 9 mm through 25.4 mm high, the second frame may be provided with pawls for coupling of the optical signal, the first frame may be provided with projections for protecting the pawls, the first and second frames may be made of resin material, the first and second frames may have means for holding the circuit board, the holding means may be a snap-fit mechanism, a tipmost end of the circuit board may be held by the first and second frames, the first frame may have an arm, a recess provided to the arm may be used to hold at least one rear part of the circuit board, and the data transmission rate of the optical signal may be 200 Mbits/s or more.
The present invention will be explained with reference to the accompanying drawings, in which parts having the same reference numerals represent identical parts.
Referring first to
A high speed data transmission with LD elements emitting 780 nm wavelength with 5 mW maximum rating voltage, for example. The fiber optic module of the invention is in conformity of the ANSI x3T9.3 fiber channel standard and performs data transmission rates at 133 Mbits/s, 266 Mbits/s, 531 Mbits/s and 1061 Mbits/s. A typical performance is shown in FIG. 20.
In
Explanation will next be made as to the compact design of the PCB 30 by referring also to FIG. 1.
General expansion slots for insertion of a mother board into a host computer are designed, in most cases, at intervals of 25.4 mm, in which case a fiber optic module must be designed adaptive to the intervals of 25.4 mm so that the module can be mounted horizontally or vertically to the mother board. In other words, it is desirable to design the width-directional dimension of the PCB 30 to be shorter the 25.4 mm.
When the PCB connector 32 has 22 pins (arranged in 2 columns with 11 lines) with pin pitches of 1.27 mm, the connector has a width-directional dimension of about 14 mm and a longitudinal dimension of 2.5 mm, which results in that the outline of the PCB connector 32 including its housing and lead parts (not shown) has a width-directional dimension of 17 mm and a longitudinal dimension of 5 mm. The outline of the semiconductors IC (33 and 35) has a width-directional dimension of 7 mm and a longitudinal dimension of 10 mm (or may have a width-directional dimension of 10 mm and a longitudinal dimension of 7 mm). When not only the outline dimensions of the PCB connector 32 and semiconductor ICs but also the parts mounting to the PCB 30 and the wiring pattern of the PCB 30 are taken into consideration, it is desirable that the outline of the PCB 30 have a width-directional dimension of 19 mm or more and a longitudinal dimension of 30 mm or more. Even when the number of such semiconductor ICs for use in signal processing is increased up to 3, the longitudinal dimension of the PCB 30 can be designed to be 50 mm or less. Thus, it is desirable to set the width of the PCB 30 between 17 mm and 25.4 mm and the length of the PCB 30 between 30 mm and 50 mm. In the first aspect of the present invention, the PCB 30 is set to have a width of 22.5 mm, a length of 32 mm (the longest part) and a thickness of 1.6 mm (providing a mechanical strength), thus realizing a reliable PCB 30. Further, the PCB connector 32 is of a surface mounting type and only two of the semiconductor ICs are employed for signal processing, whereby a small size of PCB 30 is realized. In the first aspect of the present invention, the thickness of the PCB 30 is not specifically limited. In this connection, since the use of the surface mounting type of PCB connector 32 enables minimization of unnecessary radiation issued from the connector, this is especially useful for such a compact fiber optic module as in the present aspect.
Shown in
The PCB 30 is held by an upper frame 10 and a lower frame 20 to form an assembly or fiber optic module. The PCB 30 is mounted thereon with an LD driver 33 formed as a semiconductor IC for driving an LD element (refer to FIG. 8), variable resistors 34 for adjusting a current for driving of the LD element (not shown), and a PCB connector 32 for connection with a mother board (not shown). In order to keep constant the average wall thickness of the upper frame 10, a thin wall part 17 is provided in the upper frame 10.
As already explained even in connection with the compact design of the PCB 30 of
Next, with regard to the longitudinal direction, in view of the fact that the PCB 30 has a longitudinal dimension of 30 mm-50 mm and the LD module 50 has a length of about 15 mm, the fiber optic module has a length of 45 mm-65 mm. That is, the longitudinal dimension of the fiber optic module is set to be desirably about between 45 mm and 65 mm.
As already explained in connection with the height direction, in view of the fact that the fiber optic module of the present invention is to be vertically or horizontally positioned to be built in between the expansion slots of the host computer, the height of the module is set to be desirably 25.4 mm or less. When additional consideration is given to such a situation that two of the fiber optic modules of the present invention are mounted as doubly overlapped to the mother board, the module height is set to be more desirably 12.7 mm or less. Further, when consideration is given to the wrong insertion preventing mechanism of an optical fiber plug (not shown) to be fitted into the fiber optic module, the receptacle of the optical fiber plug, the strength of the frame, etc., it is more preferable that the fiber optic module have a height of 9 mm or more. Accordingly, it is preferable for the fiber optic module to have a height-directional dimension of about 9 mm-25.4 mm.
Under such conditions as mentioned above, the aspect of the present invention shown in
In addition, since the variable resistors 34 are disposed on the upper side of the PCB 30, the adjustment step during assembly of the fiber optic module can be facilitated. In other words, since the PCB connector 32 of the PCB 30 is mounted to a jig substrate of the PCB 30 for assembly/adjustment of the fiber optic module, so that, when compared with such a case that the variable resistors 34 are disposed on the same side as the PCB connector 32, the case of mounting the variable resistors 34 on the upper side of the PCB 30 can be made high in the efficiency of adjusting works of the fiber optic module by a worker. Thus, the more efficient adjusting works lead to realization of a low-cost fiber optic module.
Each of PD and LD leads 47 and 57 has a relatively large land (not shown) on its PCB connector 32 side to improve its assembling efficiency to the PCB 30. Meanwhile, the mother board 60 also has a mother connector 62 to be associated with the PCB 30.
The PCB 30 mounted with the PD module 40, LD module 50 and so on is temporarily fixed by means of a snap-fit mechanism based on a projection 12 of the upper frame 10 and a recess 22 of the lower frame 20, so that a resultant assembly including these upper and lower frames 10 and 20 and the PCB 30 forms a fiber optic module. The PD and LD modules 40 and 50 mounted on the PCB 30 are fixed to the upper and lower frames 10 and 20 through PD and LD shielding plates 41 and 51 made of plate springs. Further, the PD and LD shielding plates 41 and 51 are fixedly mounted to the PCB 30 by soldering or by other means and surrounded by the lower frame 20, so that the PD and LD shielding plates 41 and 51 can be secured with very high mechanical stability. Since the shielding plates 41 and 51 are electrically isolated from the mother board 60 by the lower frame 20, any short-circuiting and leakage of the plates with respect to parts mounted on the mother board 60 can be avoided, thus realizing a reliable fiber optic module.
The lower frame 20 is provided with pawls 23 for coupling the optical signal with other fiber optic modules, so that the pawls 23 can snugly engage with optical fiber plugs (not shown).
After the temporarily fixed fiber optic module is positioned at its rough position on the mother board 60 by fitting the PCB connector 32 into the mother connector 62, the fiber optic module is completely fixedly mounted onto the mother board 60 by means of tapping screws 70. More specifically, the tapping screws 70 are passed through mother openings 61 provided in the mother board 60, lower frame openings 21 and PCB connector 32, and then tightly tightened into upper frame openings 11, whereby the fiber optic module is completely fixed onto the mother board 60.
In general, reduction in the positioning accuracy between the mother connector 62 and PCB connector 32 lead to the fact that a load is imposed on the respective leads (PD leads 47 and LD leads 57) of the PD module 40 and LD module 50. In other words, although the respective leads of the PD module 40 and LD module 50 are fixed onto the PCB 30 by soldering or the like, since the PCB connector 32 is also fixed onto the PCB 30 by soldering or the like. For this reason, if the positioning accuracy of the mother connector 62 with respect to the mother openings 61 and the positioning accuracy of the PCB connector 32 with respect to PCB openings 31 are not improved, then these positioning errors result in loads imposed on the respective leads of the LD module 50 and on lands (not shown) of the PCB 30. More in detail, when the mother connector 62 is mounted inaccurately apart from the mother openings 61 at the time of building the fiber optic module into the mother board 60, tensile stresses are imposed on the PD and LD leads 47 and 57 and the lands of the PCB 30; whereas, when the mother connector 62 is conversely mounted inaccurately close to the mother openings 61, compression stresses are imposed on the PD and LD leads 47 and 57 and the lands of the PCB 30. These stresses result in the fact that the reliability of the fiber optic module is remarkably reduced. For the purpose of avoiding these tensile and compression stresses, it is necessary to improve the positioning accuracy of the connector part, which undesirably involves an increase in the cost of the fiber optic module. It goes without saying that the similar detrimental effect takes place even for the PCB connector 32.
However, in accordance with a third aspect of the present invention, in which the mother openings 61, lower frame openings 21 and PCB openings 31 are set to have a diameter of 3.2 mm and the upper frame openings 11 are set to have a diameter of 2.2 mm and further the fixation of the fiber optic module is effected by means of the employment of the tapping screws 70 (having a diameter of about 2.6 mm), requirement of the positioning accuracy of the mother connector 62 with respect to the mother openings 61 and the positioning accuracy of the PCB connector 32 with respect to the PCB openings 31 can be reduced so that loads caused by the tensile and compression stresses imposed on the leads (47 and 57) of the PD and LD modules 40 and 50 and on the lands of the PCB 30, which has been a big problem in the prior art, are eliminated, thus realizing a reliable fiber optic module. Further, since the requirement of parts positioning accuracy can be radically reduced compared to the prior art, not only the production management of assembly of the PCB connector 32 for the PCB 30 can be facilitated but the required accuracy of parts used in the PCB 30 and PCB connector 32 can also be reduced, whereby a very inexpensive fiber optic module can be realized.
The aforementioned numeric values for the upper frame openings 11, lower frame openings 21, etc. are given as an example and thus the present invention is not limited to the specific values. With the arrangement of the third aspect of the present invention, it will be noted that values other than the above numeric values may be employed with substantially the same effects as the above.
In this way, when the fiber optic module is made compact and small in size and is provided with indispensable minimum functions, the system manufacturer can also design the mother board highly flexible. That is, since the fiber optic module of the present invention is made compact with its small occupation area to the mother board and the fixation of the fiber optic module requires only 3 small holes, the mother board can be designed highly flexible.
In addition to the above, the arrangement of the 3 openings (upper and lower frame openings 11 and 21 and mother openings 61) forms such an isosceles triangle that stress loads caused by mounting and dismounting of the fiber optic module are ideally dispersed, with the result of implementation of a fiber optic module having a high reliability.
Shown in
The upper and lower frame openings 11 and 21 may also be used as reference holes for parts acceptance test of the upper and lower frames 10 and 20 respectively. Since the 3 upper frame openings 11 and the 3 lower frame openings 21 are set to have a drawing taper of 0 degree at their molding time, the accuracy of the respective openings (upper and lower frame openings 11 and 21) can be maintained high. Since the accuracy of the openings can be kept high, when jigs designed for the parts acceptance test associated with the openings are prepared, the parts inspection can be facilitated. In other words, the upper and lower frame openings 11 and 21 can be used not only as holes for fixation of the fiber optic module to the mother board 60 but also as parts inspection holes.
Further, the fiber optic module of the present invention is arranged so that loads imposed on the fiber optic module caused by the mounting and dismounting of the optical fiber plug are supported by the 3 tapping screws 70. More specifically, the specification of the Japanese Industrial Standards JIS of the fiber optic module prescribes 90N (newtons) with respect to the force derived by mounting and dismounting of the optical fiber plug, so that, for the purpose of satisfying this specification, it is desirable that the tapping screws 70 have a diameter of 1.3 mm or more. Further, from the viewpoint of safety design, the tapping screws 70 are set to have a diameter of more desirably 2 mm or more. In the fiber optic module of the present invention, since the tapping screws 70 are set to have a diameter of 2.6 mm, there is realized a reliable fiber optic module having a safety factor of 3 or more.
Although the fixation of the mother board 60 has been attained with use of the tapping screws 70 in the fourth aspect of the present invention, insert nuts (not shown) may be mounted in the upper frame openings 11 and the tapping screws 70 may be replaced by ordinary small screws (such as small crosshead screws and small slotted screws) or the like with substantially the same effects as the present invention.
When the fiber optic module has such an arrangement as shown in the fourth aspect of
Describing in more detail, parallel data 96 transmitted from the mother board are transferred to parallel to serial converter 37 via PCB connector 38 on PCB 30 to be converted to serial data. On the contrary, serial data 93 converted from the optical data are converted to parallel data 95 by serial to parallel converter 36 and then transferred to the mother board. PCB connector 38 of the aspect is different from PCB connector 32 previously described and shown in
The prior art PCB is arranged so that the rearmost and frontmost ends of the PCB are depressed by frames, thus causing a warpage problem. On the other hand, since the PCB 30 in accordance with the fifth aspect of the present invention is arranged so that the PCB 30 is held at its foremost part and a part slightly displaced rearward from its center part, such a warpage problem as in the prior art can be solved. Further, though the prior art arrangement requires special strokes (length) for the PCB and the upper and lower frames, the arrangement of the present aspect can eliminate the need for such strokes and thus the fiber optic module of the invention can easily be made small in size.
There is shown in
In the sixth aspect of the present invention, the upper and lower frames 10 and 20 are made of polybutylene terephthalate (PBT) mixed with 10-30% of glass, with the result that the frames are excellent in durability. In particular, the material of the frames improves the durability of pawls 23 of a lower frame 20 for mounting and dismounting of an optical fiber plug. Further, in order to reduce forces imposed on the pawls 23 of the lower frame 20, upper frame projection 16 (not shown: refer to
Although the frames have been made of PBT material in the sixth aspect of the present invention, the present invention is not limited to the above specific example but other suitable materials may be employed as necessary.
Referring to
The optical fiber plug is mechanically mounted and dismounted to and from the fiber optic module by utilizing pawls 23 of the lower frame 20. The fiber optic module of the present invention has upper frame openings 21 in the vicinity of the pawls 23 subjected to the highest load during the above mounting and dismounting operation. In this case, the diameter of the upper frame openings 21 is set to be about 3 mm in order to ensure 1.5 mm of the average wall thickness of the lower frame 20. Since the fiber optic module of the present invention is highly downsized over the prior art fiber optic module, the provision of the openings for fixation of the fiber optic module disposed at the center part of the lower frame 20 and in the vicinity of the pawls 23 creates great effect of realizing a reliable fiber optic module. In the seventh aspect of the present invention, the lower frame openings 21 having a diameter of 3 mm are provided in the lower frame at positions about 2.5 mm apart from associated lower frame projections 26 subjected to the highest stress applied to the pawls 23, so that the rigid lower frame 20 having an average wall thickness of 1.5 mm is realized and therefore a highly reliable fiber optic module is implemented.
Shown in
In this way, even the arrangement of the fiber optic module shown in
Of course, the fourth aspect of
Although the 3 pins 71 (for tapping screws 70) have been used in the ninth aspect of the invention (or in fourth aspect), only one pin 71 (or tapping screw 70) may be employed for the opening in the vicinity of the pawls 23 imposed with the highest stress load due to the mounting or dismounting of the optical fiber plug and resin projections extended from the lower frame may be utilized for the other openings in the vicinity of the arm 14, with substantially the same effects of the invention.
The material of the cover 18 is not specifically restricted by the presence or absence of electrical conductive property of the material. In other words, the material of the cover is not limited from the viewpoint of resistance of the PCB 30 to the electrostatic destruction and metallic and resin material can be employed. More specifically, though the cover 18 has been made of the same PBT as the upper frame in the present aspect, the electrostatic destruction of the PCB 30 possibly caused during handling of the fiber optic module, which has been a problem in the prior art, can be eliminated.
Further, even when the cover 18 is made of iron alloy from the viewpoint of the electrostatic destruction resistance of the PCB 30 and the electromagnetic shielding of the PD module 40, substantially the same effects can be achieved. It will be noted that, even when the cover 18 is made of not only iron alloy but also iron, aluminum, aluminum alloy, copper, copper alloy or the like, substantially the same effects can be obtained. It will also be appreciated that a method for fixing the cover 18 to the fiber optic module may be the fitting method based on the arm 14, the snap-fit method or bonding but the invention is not restricted to the specific example.
In the fiber optic module of the present invention, next, the upper surface of the upper frame 10 is made flat and the bottom plate of the lower frame 20 is made also flat in order to increase the rigidity of the lower frame 20, so that an identification label 90 indicative of the place of production of the fiber optic module and a certification label 91 indicative of satisfied specifications of laser safety standard can be easily pasted or bonded on the flat surface of the upper or lower frame.
Further the flat part (not shown) of the upper frame 10 and the flat part or a recess (not shown) of the lower frame 20 are provided respectively with a step difference part or a recess (not shown) of about 0.3 mm to allow easy bonding work of the identification label 90 or certification label 91.
It goes without saying that, for the purpose of decreasing the cost of the fiber optic module of the invention, not only these label indications may be adhesive bonded as labels but may also be marked in the respective frames.
Shown in
Referring to
Next, the module cap 80 will be detailed in connection with
Shown in
As has been explained in the foregoing, in accordance with the present invention, when there is provided a compact fiber optic module which is made to be 25.4 mm wide, 50.8 mm long and 11.5 mm high and which is provided with indispensable minimum functions, the fiber optic module can obtain the following features 1) to 6).
1) Since transfer of electric signals is carried out in the form of serial data, the number of signal lines can be made as small as 22, the configuration of the connector can be made small and further the need for such semiconductor ICs for serial/parallel conversion can be eliminated. Thus, not only the present invention can follow a recent tendency of the rapid downsizing movement of host computer but the design flexibility of mother board in system manufacturers can also be remarkably expanded.
2) The fixation of the fiber optic module to the mother board in the present invention is achieved by means of the tapping screws passed through the respective openings and only 3 of small holes as the openings of the mother board is sufficient. Therefore, the design flexibility of the mother board for the system manufacturer can be remarkably expanded. Further, since the fiber optic module of the invention is structured so that force loads caused by the mounting and dismounting of the optical fiber are all imposed on the tapping screws, electrical lead connection failure can be completely avoided and thus a highly reliable fiber optic module can be realized.
In addition, since the invention is arranged so that the 3 openings accommodate variations in the dimensional accuracies of parts, stresses to be applied to the leads of the respective modules can be removed and it becomes unnecessary to increase the accuracies of the parts and to manage the parts (such as parts acceptance test), thereby realizing an inexpensive fiber optic module.
3) When the connector in the fiber optic module of the present invention is of a surface mounting type, manual works including direct connection of the signal line to the mother board by soldering can be eliminated and thus the cost of the fiber optic module can be made low.
4) When the printed circuit board is provided at its front side with holding means for holding the circuit board by a snap-fit mechanism of the upper and lower frames and at its rear side with holding means for holding the circuit board by the upper frame having a very weak elastic property, the circuit board can be prevented from being warped and therefore can be made remarkably high in reliability. Further, the need for the sufficient circuit board holding length L, which has been necessary to be long enough in the prior art, can be eliminated and thus a compact fiber optic module can be implemented.
5) The circuit board is covered with the upper and lower frames and/or the cover, therefore, worker's handling of the fiber optic module for assembly or inspection can be facilitated, the assembling and inspection efficiencies of the fiber optic module can be enhanced, the fiber optic module can be manufactured inexpensively with a high reliability while preventing the electrostatic destruction of the circuit board.
6) When an inexpensive module cap having a simple shape is attached to the fiber optic module, the cap can prevent dust from invading into the fiber optic module during a long-term of shelf-keeping time, any improper connection between the optical fiber and module can be avoided, and thus the fiber optic module can be made remarkably high in reliability.
In this way, the present invention has high practical effects.
Claims
1. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to an laser diode electric signal for a laser diode;
- an laser diode module for converting said laser diode electric signal to an laser diode optical signal;
- a photo diode module for converting a photodiode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said connector is of a surface mounting type.
2. A fiber optic module as set forth in claim 1, wherein leads of said laser diode and photo diode modules are connected to a surface of said circuit board provided thereon with said connector.
3. A fiber optic module as set forth in claim 2, further comprising an laser diode variable resistor for adjusting a drive current of said laser diode module and wherein said laser diode variable resistor is provided on a surface of said circuit board opposed to said surface having said connector thereon.
4. A fiber optic module as set forth in claim 2, further comprising a photo diode variable resistor for detecting a signal of said photo diode module and wherein said photo diode variable resistor is provided on a surface of said circuit board opposed to said surface having said connector thereon.
5. A fiber optic module as set forth in claim 1, wherein said photo diode electric signal conversion means includes a plurality of semiconductor integrated circuits.
6. A fiber optic module as set forth in claim 1, wherein said circuit board measures 17 mm through 25.4 mm wide, 30 mm through and 50 mm long.
7. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to an laser diode electric signal for a laser diode;
- an laser diode module for converting said laser diode electric signal to an laser diode optical signal;
- a photo diode module for converting a photodiode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein outline dimensions of said fiber optic module are 19 mm through 25.4 mm wide, 45 mm through 65 mm high and 9 mm through 25.4 mm high.
8. A fiber optic module as set forth in claim 7, further comprising a casing, said casing comprising said first and second frames forms an outside casing.
9. A fiber optic module as set forth in claim 7, wherein said first and second frames are made of resin material.
10. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to an laser diode electric signal for a laser diode;
- an laser diode module for converting said laser diode electric signal to an laser diode optical signal;
- a photo diode module for converting a photodiode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said module comprises mounting means for mounting said first and second frames to said another board.
11. A fiber optic module as set forth in claim 10, wherein said mounting means includes a screw.
12. A fiber optic module as set forth in claim 11, further comprising a first frame openings provided in said first frame, a second frame openings provided in said second frame, a circuit board openings provided in said circuit board, and a mother board openings provided in said mother board, and wherein screws are inserted into said first openings, second frame openings, said circuit board openings and said mother board openings to cause said first frame, said second frame, said circuit board and said mother board to be mutually fixed.
13. A fiber optic module as set forth in claim 12, wherein said first frame openings is smaller than said second frame openings and said circuit board openings and said mother board openings have substantially the same diameter as said second frame opening.
14. A fiber optic module as set forth in claim 10, wherein said screws have an effective diameter of 1.3 mm or more.
15. A fiber optic module as set forth in claim 12, wherein 3 of said first frame openings are provided in said first frame and said first frame openings are arranged to form a substantially isosceles triangle.
16. A fiber optic module as set forth in claim 12, wherein said first frame openings are used also as reference holes for parts inspection of said first frame and said second frame openings are used also as reference holes for parts inspection of said second frame.
17. A fiber optic module as set forth in claim 11, wherein said screws are tapping screws.
18. A fiber optic module as set forth in claim 10, wherein pins erected on at least one of said first and second frames are used as said mounting means.
19. A fiber optic module as set forth in claim 18, wherein pins erected only on said second frame are used as said mounting means.
20. A fiber optic module as set forth in claim 19, further comprising first frame openings provided in said first frame, a circuit board openings provided in said circuit board, and a mother board openings provided in said mother board, and wherein screws are inserted into said first frame openings, said circuit board openings and said mother board openings to cause said first frame, said circuit board and said mother board to be mutually fixed.
21. A fiber optic module as set forth in claim 20, wherein said first frame openings are larger than a diameter of said pin and said circuit board openings and said mother board openings have substantially the same diameter as said first frame openings.
22. A fiber optic module as set forth in claim 19, wherein said pin has a diameter of 1.3 mm or more.
23. A fiber optic module as set forth in claim 19, wherein said pin is made of metallic material.
24. A fiber optic module as set forth in claim 19, wherein said pin is integrally formed with said second frame or press fitted therein.
25. A fiber optic module as set forth in claim 20, wherein 3 of said first frame openings are provided in said first frame and said first frame openings are arranged to form a substantially isosceles triangle.
26. A fiber optic module as set forth in claim 20, wherein said first frame openings are used also as reference holes for parts inspection of said first frame and said pins are used also as reference holes for parts inspection of said second frame.
27. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to an laser diode electric signal for a laser diode;
- an laser diode module for converting said laser diode electric signal to an laser diode optical signal;
- a photo diode module for converting a photodiode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said circuit board is temporarily fixed to at least one of said first and second frames.
28. A fiber optic module as set forth in claim 27, wherein said temporary fixing means is a snap-fit mechanism.
29. A fiber optic module as set forth in claim 28, wherein said circuit board is temporarily fixed at an end thereof by said snap-fit mechanism.
30. A fiber optic module as set forth in claim 27, wherein an elastic arm is provided to at least one of said first and second frames and said circuit board is temporarily fixed to the other frame by said elastic arm.
31. A fiber optic module as set forth in claim 27, wherein said circuit board is temporarily fixed at a front part thereof by a snap-fit mechanism and said circuit board is temporarily fixed to the other frame at a rear part thereof by an elastic arm.
32. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to an laser diode electric signal for a laser diode;
- an laser diode module for converting said laser diode electric signal to an laser diode optical signal;
- a photo diode module for converting a photodiode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said module further comprises supporting means for tightening to fix said first and second frames and said mother board from their outer periphery.
33. A fiber optic module as set forth in claim 32, wherein said supporting means is made of metallic plate.
34. A fiber optic module as set forth in claim 33, wherein said metallic plate is provided in its both ends with recesses and said recesses are rotated to tighteningly fix said metallic plate.
35. A fiber optic module as set forth in claim 32, wherein said supporting means is positioned at a position opposed to said laser diode and photo diode modules.
36. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to an laser diode electric signal for a laser diode;
- an laser diode module for converting said laser diode electric signal to an laser diode optical signal;
- a photo diode module for converting a photodiode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said module further includes a cover for covering an externally exposed part of said circuit board therewith.
37. A fiber optic module as set forth in claim 36, wherein said cover is made of resin material.
38. A fiber optic module as set forth in claim 36, wherein said cover is made of metallic material.
39. A fiber optic module as set forth in claim 36, wherein said cover is made in the form of said first frame.
40. A fiber optic module as set forth in claim 36, wherein said cover is provided therein with an opening.
41. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to an laser diode electric signal for a laser diode;
- an laser diode module for converting said laser diode electric signal to an laser diode optical signal;
- a photo diode module for converting a photodiode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said module further comprises indication parts indicative of a safety certification and a place of production provided respectively onto said first and second frames.
42. A fiber optic module as set forth in claim 41, wherein said indication part provided onto said first frame is opposed to said indication part provided onto said second frame.
43. A fiber optic module as set forth in claim 42, wherein said first and second frames have a recess and said indication parts are provided to said recesses.
44. A fiber optic module as set forth in claim 41, wherein said indication parts are seal labels.
45. A fiber optic module as set forth in claim 41, wherein said indication parts are provided integrally to said first and second frames respectively.
46. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to an laser diode electric signal for a laser diode;
- an laser diode module for converting said laser diode electric signal to an laser diode optical signal;
- a photo diode module for converting a photodiode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein a data transmission rate of said optical signal is 130 Mbits/s or more.
47. A fiber optic module as set forth in claim 46, wherein the data transmission rate of said optical signal is 200 Mbits/s or more.
48. A fiber optic module as set forth in claim 46, wherein the data transmission rate of said optical signal is 500 Mbits/s or more.
49. A fiber optic module as set forth in claim 46, wherein the data transmission rate of said optical signal is 1000 Mbits/s or more.
50. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to an laser diode electric signal for a laser diode;
- an laser diode module for converting said laser diode electric signal to an laser diode optical signal;
- a photo diode module for converting a photodiode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said fiber optic module further includes a module cap to be inserted into light outlet and inlet openings defined by said first and second frames along a light inlet and outlet direction.
51. A fiber optic module as set forth in claim 50, wherein said module cap has cap fixing means engaged with part of said first and second frames and fixed to at least one of said first and second frames.
52. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to an laser diode electric signal for a laser diode;
- an laser diode module for converting said laser diode electric signal to an laser diode optical signal;
- a photo diode module for converting a photodiode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said fiber optic module includes a shielding member for shielding at least one of said laser diode and photo diode modules.
53. A fiber optic module as set forth in claim 52, wherein a shielding plate for exclusive use of said laser diode module and a shielding plate for exclusive use of said photo diode module.
54. A fiber optic module as set forth in claim 52, wherein at least one of said first and second frames is provided integrally with a shielding plate.
55. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to an laser diode electric signal for a laser diode;
- an laser diode module for converting said laser diode electric signal to an laser diode optical signal;
- a photo diode module for converting a photodiode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein elastic pawls to be engaged with an optical fiber plug are provided to at least one of said first and second frames and said pawls are provided at their root parts with first projections extended toward the other frame.
56. A fiber optic module as set forth in claim 55, wherein second projections for projecting said first projections are provided to an opposite frame being opposite to the frame provided with said first projections.
57. A fiber optic module as set forth in claim 55, wherein said first and second frames and said pawls are made of resin material.
58. A fiber optic module comprising:
- a connector for connection with a mother board of a computer;
- a first semiconductor integral circuit for converting a first parallel data provided from the mother board into a first serial data for a laser diode;
- a second semiconductor integral circuit for converting said first serial data for the laser diode converted by said first semiconductor integral circuit into a first electrical signal;
- a laser diode module including a laser diode for converting said first electrical signal for the laser diode into a first optical signal of the laser diode;
- a photodiode module including a photodiode for converting a second optical signal received by said photodiode into a second electrical signal of the photodiode;
- a third semiconductor integral circuit for converting said second electrical signal of the photodiode into a second serial data of the photodiode;
- a fourth semiconductor integral circuit for converting said second serial data of the photodiode converted by said third semiconductor integral circuit into a second parallel data;
- a circuit board for furnishing with said connector, said first semiconductor integral circuit, said second semiconductor integral circuit, said third semiconductor integral circuit and said fourth semiconductor integral circuit;
- a first shielding plate for electrically shielding said laser diode module;
- a second shielding plate for electrically shielding said photo diode module;
- a first frame for holding said circuit board, said laser diode module and said photo diode module; and
- a second frame for cooperating with said first frame to hold said circuit board, said laser diode module and said photo diode module.
59. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to a laser diode electric signal for a laser diode;
- a laser diode module for converting said laser diode electric signal to a laser diode optical signal;
- a photo diode module for converting a photo diode optical signal to a photo diode electric signal;
- a photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said connector is of a surface mounting type.
60. A fiber optic module as set forth in claim 59, wherein leads of said laser diode and photo diode modules are connected to a surface of said circuit board provided thereon with said connector.
61. The fiber optic module as set forth in claim 60, further comprising a laser diode variable resistor for adjusting a drive current of said laser diode module and wherein said laser diode variable resistor is provided on a surface of said circuit board opposed to said surface having said connector thereon.
62. A fiber optic module as set forth in claim 60, further comprising a photo diode variable resistor for detecting a signal of said photo diode module and wherein said photo diode variable resistor is provided on a surface of said circuit board opposed to said surface having said connector thereon.
63. A fiber optic module as set forth in claim 59, wherein said photo diode electric signal conversion means includes a plurality of semiconductor integrated circuits.
64. A fiber module as set forth in claim 59, wherein said circuit board measures 17 mm through 25.4 mm wide, 30 mm through and 50 mm long.
65. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to a laser diode electric signal for a laser diode;
- a laser diode module for converting said laser diode electric signal to a laser diode optical signal;
- a photo diode module for converting a photo diode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein a data transmission rate of said optical signal is 130 Mbits/s or more.
66. A fiber optic module as set forth in claim 65, wherein the data transmission rate of said optical signal is 1000 Mbit/s or more.
67. A fiber optic module as set forth in claim 65, wherein the data transmission rate of said optical signal is 200 Mbits/s or more.
68. A fiber optic module as set forth in claim 65, wherein the data transmission rate of said optical signal is 500 Mbits/s or more.
69. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to a laser diode electric signal for a laser diode;
- a laser diode module for converting said laser diode electric signal to a laser diode optical signal;
- a photo diode module for converting a photo diode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said fiber optic module further includes a module cap to be inserted into light outlet and inlet openings defined by said first and second frames along a light inlet and outlet direction.
70. A fiber optic module as set forth in claim 69, wherein said module cap has cap fixing means engaged with part of said first and second frames and fixed to at least one of said first and second frames.
71. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to a laser diode electric signal for a laser diode;
- a laser diode module for converting said laser diode electric signal to a laser diode optical signal;
- a photo diode module for converting a photo diode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said fiber optic module includes a shielding member for shielding at least one of said laser diode and photo diode modules.
72. A fiber optic module as set forth in claim 71, wherein a shielding plate is provided for exclusive use of said laser diode module and a shielding plate for exclusive use of said photo diode module.
73. A fiber optic module as set forth in claim 71, wherein at least one of said first and second frames is provided integrally with a shielding plate.
74. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to a laser diode electric signal for a laser diode;
- a laser diode module for converting said laser diode electric signal to a laser diode optical signal;
- a photo diode module for converting a photo diode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein outline dimensions of said fiber optic module are 19 mm through 25.4 mm wide, 45 mm through 65 mm long and 9 mm through 25.4 mm high.
75. A fiber optic module as set forth in claim 74, further comprising a casing, said casing comprising said first and second frames to form an outside casing.
76. A fiber optic module as set forth in claim 74, wherein said first and second frames are made of resin material.
77. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to a laser diode electric signal for a laser diode;
- a laser diode module for converting said laser diode electric signal to a laser diode optical signal;
- a photo diode module for converting a photo diode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said module comprises mounting means for mounting said first and second frames to said mother board.
78. A fiber optic module as set forth in claim 77, wherein said mounting means includes a screw.
79. A fiber optic module as set forth in claim 78, further comprising a first frame openings provided in said first frame, a second frame openings provided in said second frame, circuit board openings provided in said circuit board, and mother board openings provided in said mother board, and wherein screws are inserted into said first openings, second frame openings, said circuit board openings and said mother board openings to cause said first frame, said second frame, said circuit board and said mother board to be mutually fixed.
80. A fiber optic module as set forth in claim 79, wherein said first frame openings are smaller than said second frame openings and said circuit board openings and said mother board openings have substantially the same diameter as said second frame opening.
81. A fiber optic module as set forth in claim 79, wherein three of said first frame openings are provided in said first frame and said first frame openings are arranged to form a substantially isosceles triangle.
82. A fiber optic module as set forth in claim 79, wherein said first frame openings are used also as reference holes for parts inspection of said first frame, and said second frame openings are used also as reference holes for parts inspection of said second frame.
83. A fiber optic module as set forth in claim 78, wherein said screw is a tapping screw.
84. A fiber optic module as set forth in claim 77, wherein said mounting means includes screws having effective diameters of 1.3 mm or more.
85. A fiber optic module as set forth in claim 77, wherein pins erected on at least one of said first and second frames are used as said mounting means.
86. A fiber optic module as set forth in claim 85, wherein pins erected only on said second frame are used as said mounting means.
87. A fiber optic module as set forth in claim 86, further comprising first frame openings provided in said first frame, circuit board openings provided in said circuit board, and mother board openings provided in said mother board, and wherein screws are inserted into said first frame openings, said circuit board openings and said mother board openings to cause said first frame, said circuit board and said mother board to be mutually fixed.
88. A fiber optic module as set forth in claim 87, wherein said first frame openings are larger than a diameter of said pin and said circuit board openings and said mother board openings have substantially the same diameter as said first frame openings.
89. A fiber optic module as set forth in claim 87, wherein three of said first frame openings are provided in said first frame, and said first frame openings are arranged to form a substantially isosceles triangle.
90. A fiber optic module as set forth in claim 87, wherein said first frame openings are used also as reference holes for parts inspection of said first frame, and said pins are used also as reference holes for parts inspection of said second frame.
91. A fiber optic module as set forth in claim 86, wherein said pin has a diameter of 1.3 mm or more.
92. A fiber optic module as set forth in claim 86, wherein said pin is made of metallic material.
93. A fiber optic module as set forth in claim 86, wherein said pin is integrally formed with said second frame or press fitted therein.
94. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to a laser diode electric signal for a laser diode;
- a laser diode module for converting said laser diode electric signal to a laser diode optical signal;
- a photo diode module for converting a photo diode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said circuit board is temporarily fixed to at least one of said first and second frames.
95. A fiber optic module as set forth in claim 94, wherein said temporary fixing means is a snap-fit mechanism.
96. A fiber optic module as set forth in claim 95, wherein said circuit board is temporarily fixed at an end thereof by said snap-fit mechanism.
97. A fiber optic module as set forth in claim 94, wherein an elastic arm is provided to at least one of said first and second frames, and said circuit board is temporarily fixed to the other frame by said elastic arm.
98. A fiber optic module as set forth in claim 94, wherein said circuit board is temporarily fixed at a front part thereof by a snap-fit mechanism, and said circuit board is temporarily fixed to the other frame at a rear part thereof by an elastic arm.
99. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to a laser diode electric signal for a laser diode;
- a laser diode module for converting said laser diode electric signal to a laser diode optical signal;
- a photo diode module for converting a photo diode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said module further comprises supporting means for tightening to fix said first and second frames and said mother board from their outer periphery.
100. A fiber optic module as set forth in claim 99, wherein said supporting means is made of metallic plate.
101. A fiber optic module as set forth in claim 100, wherein said metallic plate is provided in its both ends with recesses and said recesses are rotated to tighteningly fix said metallic plate.
102. A fiber optic module as set forth in claim 99, wherein said supporting means is positioned at a position opposed to said laser diode and photo diode modules.
103. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to a laser diode electric signal for a laser diode;
- a laser diode module for converting said laser diode electric signal to a laser diode optical signal;
- a photo diode module for converting a photo diode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode module,
- wherein said module further includes a cover for covering an externally exposed part of said circuit board therewith.
104. A fiber optic module as set forth in claim 103, wherein said cover is made of resin material.
105. A fiber optic module as set forth in claim 103, wherein said cover is made of metallic material.
106. A fiber optic module as set forth in claim 103, wherein said cover is made in the form of said first frame.
107. A fiber optic module as set forth in claim 103, wherein said cover is provided therein with an opening.
108. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to a laser diode electric signal for a laser diode;
- a laser diode module for converting said laser diode electric signal to a laser diode optical signal;
- a photo diode module for converting a photo diode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode modules,
- wherein said module further comprises indication parts indicative of a safety certification and a place of production provided respectively onto said first and second frames.
109. A fiber optic module as set forth in claim 108, wherein said indication part provided onto said first frame is opposed to said indication part provided onto said second frame.
110. A fiber optic module as set forth in claim 109, wherein first and second frames have a recess and said indication parts are provided to said recesses.
111. A fiber optic module as set forth in claim 108, wherein said indication parts are seal labels.
112. A fiber optic module as set forth in claim 108, wherein said indication parts are provided integrally to said first and second frames respectively.
113. A fiber optic module comprising:
- a connector for connection with a mother board;
- laser diode electric signal conversion means for converting serial data received from said mother board to a laser diode electric signal for a laser diode;
- a laser diode module for converting said laser diode electric signal to a laser diode optical signal;
- ua photo diode module for converting a photo diode optical signal to a photo diode electric signal;
- photo diode electric signal conversion means for converting said photo diode electric signal to photo diode serial data;
- a circuit board for carrying thereon said connector, said laser diode electric signal conversion means, said laser diode module and said photo diode module; and
- first and second frames for holding said circuit board, said laser diode module and said photo diode modules,
- wherein elastic pawls to be engaged with an optic fiber plug are provided to at least one of said first and second frames and said pawls are provided are provided at their root parts with first projections extended toward the other frame.
114. A fiber optic module as set forth in claim 113, wherein second projections for protecting said first projections are provided to an opposite frame being opposite to the frame provided with said first projections.
115. A fiber optic module as set forth in claim 113, wherein said first and second frames and said pawls are made of resin material.
116. A fiber optic module for transmitting serial data to and receiving serial data from a computer, the fiber optic module comprising:
- a surface mount type connector to transmit the serial data between the fiber optic module and a computer;
- a laser diode driver to convert serial data received through said surface mount type connector to a laser diode electrical signal for a laser diode;
- a laser diode module including said laser diode, to convert said laser diode electrical signal to a laser diode optical signal, said laser diode optical signal adapted for transmission to an optical fiber, said laser diode optical signal having a data transmission rate of 1000 Mbits/s or more;
- a photo diode module to receive a photo diode optical signal from an optical fiber, and to convert the photo diode optical signal to a photo diode electrical signal, said photo diode optical signal having a data transmission rate of 1000 Mbits/s or more;
- a semiconductor integrated circuit to output a photo diode serial data according to said photo diode electrical signal, said photo diode serial data adapted for transmission through said surface mount type connector;
- a sole circuit board to mount thereon said surface mount type connector, said laser diode driver, said laser diode module, said photo diode module and said semiconductor integrated circuit; and
- a frame to hold said circuit board, said laser diode module and said photo diode module;
- wherein said laser diode module and said photo diode module are mounted proximate to a first end of said circuit board, and said surface mount type connector is mounted proximate to a second end of said circuit board that is opposite said first end of said circuit board.
2899669 | August 1959 | Johanson |
3264601 | August 1966 | Hartholz |
3332860 | July 1967 | Diebold et al. |
3474380 | October 1969 | Miller |
3497866 | February 1970 | Patton, Jr. |
3523269 | August 1970 | Witek, Jr. et al. |
3670290 | June 1972 | Angele et al. |
3673545 | June 1972 | Rundle |
3706869 | December 1972 | Sorenson |
3737729 | June 1973 | Carney |
3790923 | February 1974 | Mathe |
3792284 | February 1974 | Kaelin |
3805116 | April 1974 | Nehmann |
3809908 | May 1974 | Clanton |
3976877 | August 24, 1976 | Thillays |
3990761 | November 9, 1976 | Jayne |
4047242 | September 6, 1977 | Jakob et al. |
4129349 | December 12, 1978 | Von Roesgen |
4149072 | April 10, 1979 | Smith et al. |
4156903 | May 29, 1979 | Barton et al. |
4161650 | July 17, 1979 | Caouette et al. |
4167303 | September 11, 1979 | Bowen et al. |
4176897 | December 4, 1979 | Cameron |
4217019 | August 12, 1980 | Cameron |
4217488 | August 12, 1980 | Hubbard |
4226491 | October 7, 1980 | Kazama et al. |
4234968 | November 18, 1980 | Singh |
4249266 | February 1981 | Nakamori |
4252402 | February 24, 1981 | Puech et al. |
4257124 | March 17, 1981 | Porter et al. |
4268756 | May 19, 1981 | Crouse et al. |
4273413 | June 16, 1981 | Bendiksen et al. |
4276656 | June 1981 | Petryk, Jr. |
4291943 | September 29, 1981 | Binek et al. |
4294682 | October 13, 1981 | Deczky |
4295181 | October 13, 1981 | Chang et al. |
4301543 | November 1981 | Palmer |
4330870 | May 18, 1982 | Arends |
4345808 | August 24, 1982 | Ingham |
4347655 | September 7, 1982 | Zory et al. |
4357606 | November 2, 1982 | Fortescue |
4360248 | November 23, 1982 | Bickel et al. |
4366565 | December 28, 1982 | Herskowitz |
4369494 | January 18, 1983 | Bienvenu et al. |
4380360 | April 19, 1983 | Parmer et al. |
4388671 | June 14, 1983 | Hall et al. |
4393516 | July 12, 1983 | Itani |
4398073 | August 9, 1983 | Botz et al. |
4398780 | August 16, 1983 | Novotny et al. |
4399563 | August 16, 1983 | Greenberg |
4408273 | October 4, 1983 | Plow |
4422088 | December 20, 1983 | Gfeller |
4427879 | January 24, 1984 | Becher et al. |
4430699 | February 7, 1984 | Segarra et al. |
4432604 | February 21, 1984 | Schwab |
4434537 | March 6, 1984 | Bean et al. |
4437190 | March 1984 | Rozenwaig et al. |
4439006 | March 27, 1984 | Stevenson |
4446515 | May 1, 1984 | Sauer et al. |
4449244 | May 15, 1984 | Kopainsky |
4449784 | May 22, 1984 | Basov et al. |
4453903 | June 12, 1984 | Pukaite |
4459658 | July 10, 1984 | Gabbe et al. |
4461537 | July 24, 1984 | Raymer, II et al. |
4470154 | September 1984 | Yano |
4486059 | December 4, 1984 | Deyoung |
4493113 | January 8, 1985 | Forrest et al. |
4501021 | February 19, 1985 | Weiss |
4502130 | February 26, 1985 | Kuckuk |
4505035 | March 19, 1985 | Burton et al. |
4506937 | March 26, 1985 | Cosmos et al. |
4510553 | April 9, 1985 | Faultersack |
4511207 | April 16, 1985 | Newton et al. |
4514586 | April 30, 1985 | Waggoner |
4516204 | May 7, 1985 | Sauer et al. |
4519670 | May 28, 1985 | Spinner et al. |
4519672 | May 28, 1985 | Rogstadius |
4519673 | May 28, 1985 | Hamilton |
4522463 | June 11, 1985 | Schwenda et al. |
4526438 | July 2, 1985 | Essert |
4526986 | July 2, 1985 | Fields et al. |
4527286 | July 1985 | Haworth |
4529266 | July 16, 1985 | Delebecque |
4530566 | July 23, 1985 | Smith et al. |
4531810 | July 30, 1985 | Carlsen |
4533208 | August 6, 1985 | Stowe |
4533209 | August 6, 1985 | Segerson et al. |
4534616 | August 13, 1985 | Bowen et al. |
4534617 | August 13, 1985 | Kloots et al. |
4535233 | August 13, 1985 | Abraham |
4537468 | August 27, 1985 | Degoix et al. |
4539476 | September 3, 1985 | Donuma et al. |
4540237 | September 10, 1985 | Winzer |
4540246 | September 10, 1985 | Fantone |
4541036 | September 10, 1985 | Landries et al. |
4541685 | September 17, 1985 | Anderson |
4542076 | September 17, 1985 | Bednarz et al. |
4544231 | October 1, 1985 | Peterson |
4544233 | October 1, 1985 | Iwamoto et al. |
4544234 | October 1, 1985 | DeVeau, Jr. et al. |
4545074 | October 1, 1985 | Balliet et al. |
4545077 | October 1, 1985 | Drapala et al. |
4545642 | October 8, 1985 | Auracher et al. |
4545643 | October 8, 1985 | Young et al. |
4545644 | October 8, 1985 | DeVeau, Jr. et al. |
4545645 | October 8, 1985 | Mignien |
4548465 | October 22, 1985 | White |
4548466 | October 22, 1985 | Evans et al. |
4548467 | October 22, 1985 | Stoerk et al. |
4549782 | October 29, 1985 | Miller |
4549783 | October 29, 1985 | Schmachtenberg, III |
4550975 | November 5, 1985 | Levinson et al. |
4553811 | November 19, 1985 | Becker et al. |
4553813 | November 19, 1985 | McNaughton et al. |
4553814 | November 19, 1985 | Bahl et al. |
4556279 | December 3, 1985 | Shaw et al. |
4556281 | December 3, 1985 | Anderton |
4556282 | December 3, 1985 | Delebecque |
4557551 | December 10, 1985 | Dyott |
4560234 | December 24, 1985 | Shaw et al. |
4563057 | January 7, 1986 | Ludman et al. |
4566753 | January 28, 1986 | Mannschke |
4568145 | February 4, 1986 | Colin et al. |
4569569 | February 11, 1986 | Stewart |
4573760 | March 4, 1986 | Fan et al. |
4580295 | April 1986 | Richman |
4580872 | April 8, 1986 | Bhatt et al. |
4588256 | May 13, 1986 | Onstott et al. |
4589728 | May 20, 1986 | Dyott et al. |
4595839 | June 17, 1986 | Braun et al. |
4597631 | July 1, 1986 | Flores |
4612670 | September 16, 1986 | Henderson |
4614836 | September 30, 1986 | Carpenter et al. |
4625333 | November 1986 | Takezawa et al. |
4629270 | December 16, 1986 | Andrews, Jr. et al. |
4634239 | January 6, 1987 | Buhrer |
4641371 | February 3, 1987 | Shutterly |
4647148 | March 3, 1987 | Katagiri |
4652976 | March 24, 1987 | Fushimoto |
4663240 | May 5, 1987 | Hajdu et al. |
4663603 | May 5, 1987 | van Riemsdijk et al. |
4678264 | July 7, 1987 | Bowen et al. |
4679883 | July 14, 1987 | Assini et al. |
RE32502 | September 15, 1987 | Kumar |
4695106 | September 22, 1987 | Feldman et al. |
4697864 | October 6, 1987 | Hayes et al. |
4708433 | November 24, 1987 | Kakii et al. |
4715675 | December 29, 1987 | Kevern et al. |
4720630 | January 19, 1988 | Takeuchi et al. |
4722584 | February 2, 1988 | Kakii et al. |
4727248 | February 23, 1988 | Meur et al. |
4736100 | April 5, 1988 | Vastagh |
4737008 | April 12, 1988 | Ohyama et al. |
4756593 | July 12, 1988 | Koakutsu et al. |
4762388 | August 9, 1988 | Tanaka et al. |
4767179 | August 30, 1988 | Sampson et al. |
4772931 | September 20, 1988 | Rogers |
4779952 | October 25, 1988 | Hayashi et al. |
4789218 | December 6, 1988 | Paul et al. |
4798430 | January 17, 1989 | Johnson et al. |
4798440 | January 17, 1989 | Hoffer et al. |
4807006 | February 21, 1989 | Rogers et al. |
4807955 | February 28, 1989 | Ashman et al. |
4808115 | February 28, 1989 | Norton et al. |
4811165 | March 7, 1989 | Currier et al. |
4812133 | March 14, 1989 | Fleak et al. |
4821145 | April 11, 1989 | Corfits et al. |
4823235 | April 18, 1989 | Suzuki et al. |
4836107 | June 6, 1989 | Lang et al. |
4838630 | June 13, 1989 | Jannson et al. |
4840451 | June 20, 1989 | Sampson et al. |
4844581 | July 4, 1989 | Turner |
4847711 | July 11, 1989 | Inoue |
4847771 | July 11, 1989 | Scarnera |
4849944 | July 18, 1989 | Matsushita |
4857002 | August 15, 1989 | Jensen et al. |
4862327 | August 29, 1989 | Ansell et al. |
4872212 | October 3, 1989 | Roos et al. |
4872736 | October 10, 1989 | Myers et al. |
4881789 | November 21, 1989 | Levinson |
4884336 | December 5, 1989 | Waters et al. |
4897711 | January 30, 1990 | Blonder et al. |
4906197 | March 6, 1990 | Noll |
4911519 | March 27, 1990 | Burton et al. |
4912521 | March 27, 1990 | Almquist et al. |
4913511 | April 3, 1990 | Tabalba et al. |
4927225 | May 22, 1990 | Levinson |
4944568 | July 31, 1990 | Danbach et al. |
4945229 | July 31, 1990 | Daly et al. |
4945448 | July 31, 1990 | Bremenour et al. |
4953929 | September 4, 1990 | Basista et al. |
4955817 | September 11, 1990 | Sugai |
4963104 | October 16, 1990 | Dickie |
4967312 | October 30, 1990 | Ozawa et al. |
4969924 | November 13, 1990 | Suverison et al. |
4977329 | December 11, 1990 | Eckhardt et al. |
4979787 | December 25, 1990 | Lichenberger |
4979793 | December 25, 1990 | Bowen et al. |
4979794 | December 25, 1990 | Evans |
4986625 | January 22, 1991 | Yamada et al. |
4989934 | February 5, 1991 | Zavracky et al. |
4990104 | February 5, 1991 | Schieferly |
4991062 | February 5, 1991 | Nguyenngoc |
5002495 | March 26, 1991 | Tanaka |
5004434 | April 2, 1991 | Aiello et al. |
5005939 | April 9, 1991 | Arvanitakis et al. |
5006286 | April 9, 1991 | Dery et al. |
5011246 | April 30, 1991 | Corradetti et al. |
5011425 | April 30, 1991 | Van Zanten et al. |
5013247 | May 7, 1991 | Watson |
5018130 | May 21, 1991 | Suzuki et al. |
5019769 | May 28, 1991 | Levinson |
5029254 | July 2, 1991 | Stickney |
5035482 | July 30, 1991 | ten Berge et al. |
5035641 | July 30, 1991 | Van-Santbrink et al. |
5039194 | August 13, 1991 | Block et al. |
5040993 | August 20, 1991 | Krug et al. |
5041025 | August 20, 1991 | Haitmanek |
5043775 | August 27, 1991 | Lee |
5044982 | September 3, 1991 | Bertini |
5045635 | September 3, 1991 | Kaplo et al. |
5045971 | September 3, 1991 | Ono et al. |
5046955 | September 10, 1991 | Olsson |
5047835 | September 10, 1991 | Chang |
5057025 | October 15, 1991 | Klatt et al. |
5060373 | October 29, 1991 | Machura et al. |
5071219 | December 10, 1991 | Yurtin et al. |
5076656 | December 31, 1991 | Briggs et al. |
5076688 | December 31, 1991 | Bowen et al. |
5082344 | January 21, 1992 | Mulholland et al. |
5084802 | January 28, 1992 | Nguyenngoc |
5086422 | February 4, 1992 | Hagiya et al. |
5091991 | February 1992 | Briggs et al. |
5093879 | March 3, 1992 | Bregman et al. |
5094623 | March 10, 1992 | Scharf et al. |
5099307 | March 24, 1992 | Go et al. |
5101463 | March 31, 1992 | Cubukciyan et al. |
5104243 | April 14, 1992 | Harding |
5107404 | April 21, 1992 | Tam |
5108294 | April 28, 1992 | Marsh et al. |
5109453 | April 28, 1992 | Edwards et al. |
5109454 | April 28, 1992 | Okuno et al. |
5111363 | May 5, 1992 | Yagi et al. |
5113317 | May 12, 1992 | Howe |
5113466 | May 12, 1992 | Acarlar et al. |
5113467 | May 12, 1992 | Peterson et al. |
5116239 | May 26, 1992 | Siwinski |
5117476 | May 26, 1992 | Yingst et al. |
5118362 | June 2, 1992 | St. Angelo et al. |
5118904 | June 2, 1992 | Nguyenngoc |
5120578 | June 9, 1992 | Chen et al. |
5122893 | June 16, 1992 | Tolbert |
5124885 | June 23, 1992 | Liu |
5125849 | June 30, 1992 | Briggs et al. |
5127071 | June 30, 1992 | Go |
5132871 | July 21, 1992 | Densham et al. |
5134677 | July 28, 1992 | Leung et al. |
5134679 | July 28, 1992 | Robin et al. |
5136063 | August 4, 1992 | O'Lenick, Jr. |
5136152 | August 4, 1992 | Lee |
5136603 | August 4, 1992 | Hasnain et al. |
5138537 | August 11, 1992 | Wang |
5138678 | August 11, 1992 | Briggs et al. |
5140663 | August 18, 1992 | Edwards et al. |
5150280 | September 22, 1992 | Arai et al. |
5155786 | October 13, 1992 | Ecker et al. |
5157769 | October 20, 1992 | Eppley et al. |
5167139 | December 1, 1992 | Lafargue et al. |
5168537 | December 1, 1992 | Rajasekharan et al. |
5170146 | December 8, 1992 | Gardner et al. |
5171167 | December 15, 1992 | Kosmala |
5173059 | December 22, 1992 | Sato et al. |
5183404 | February 2, 1993 | Aldous et al. |
5183405 | February 2, 1993 | Elicker et al. |
5195911 | March 23, 1993 | Murphy |
5202536 | April 13, 1993 | Buonanno |
5202943 | April 13, 1993 | Carden et al. |
5202949 | April 13, 1993 | Hileman et al. |
5207597 | May 4, 1993 | Kline et al. |
5212752 | May 18, 1993 | Stephenson et al. |
5212754 | May 18, 1993 | Basavanhally et al. |
5218519 | June 8, 1993 | Welch et al. |
5225760 | July 6, 1993 | Leiserson |
5228188 | July 20, 1993 | Badihi et al. |
5233674 | August 3, 1993 | Vladic |
5233676 | August 3, 1993 | Yonemura et al. |
5234353 | August 10, 1993 | Scholz et al. |
5238426 | August 24, 1993 | Arnett |
5241614 | August 31, 1993 | Ecker et al. |
5243678 | September 7, 1993 | Schaffer et al. |
5247532 | September 21, 1993 | Levinson |
5259052 | November 2, 1993 | Briggs et al. |
5259054 | November 2, 1993 | Benzoni et al. |
5262923 | November 16, 1993 | Batta et al. |
5271079 | December 14, 1993 | Levinson |
5274729 | December 28, 1993 | King et al. |
5276756 | January 4, 1994 | Chambers et al. |
5280191 | January 18, 1994 | Chang |
5285466 | February 8, 1994 | Tabatabaie |
5285511 | February 8, 1994 | Akkapeddi et al. |
5285512 | February 8, 1994 | Duncan et al. |
5286207 | February 15, 1994 | McHugh |
5286247 | February 15, 1994 | Weder et al. |
5288247 | February 22, 1994 | Kaufman |
5289345 | February 22, 1994 | Corradetti et al. |
5289347 | February 22, 1994 | McCarthy et al. |
5295214 | March 15, 1994 | Card et al. |
5296813 | March 22, 1994 | Holmes et al. |
5299089 | March 29, 1994 | Lwee |
5304069 | April 19, 1994 | Brunker et al. |
5305182 | April 19, 1994 | Chen |
5311408 | May 10, 1994 | Ferchau et al. |
5315679 | May 24, 1994 | Baldwin et al. |
5317663 | May 31, 1994 | Beard et al. |
5321819 | June 14, 1994 | Szczepanek |
5325454 | June 28, 1994 | Rittle et al. |
5325455 | June 28, 1994 | Henson et al. |
5329428 | July 12, 1994 | Block et al. |
5329604 | July 12, 1994 | Baldwin et al. |
5333221 | July 26, 1994 | Briggs et al. |
5333225 | July 26, 1994 | Jacobowitz et al. |
5337391 | August 9, 1994 | Lebby |
5337396 | August 9, 1994 | Chen et al. |
5337398 | August 9, 1994 | Benzoni et al. |
5340340 | August 23, 1994 | Hastings et al. |
5345524 | September 6, 1994 | Lebby et al. |
5345530 | September 6, 1994 | Lebby et al. |
5353364 | October 4, 1994 | Kurashima |
5353634 | October 11, 1994 | Baba et al. |
5356300 | October 18, 1994 | Costello et al. |
5357402 | October 18, 1994 | Anhalt |
5361244 | November 1, 1994 | Nakamura et al. |
5361318 | November 1, 1994 | Go et al. |
5366664 | November 22, 1994 | Varadan et al. |
5372515 | December 13, 1994 | Miller et al. |
5375040 | December 20, 1994 | Cooper et al. |
5375182 | December 20, 1994 | Chambers et al. |
5383793 | January 24, 1995 | Hsu et al. |
5388995 | February 14, 1995 | Rudy, Jr. et al. |
5390268 | February 14, 1995 | Morlion et al. |
5393249 | February 28, 1995 | Morgenstern et al. |
5397242 | March 14, 1995 | Laisne et al. |
5398154 | March 14, 1995 | Perkins et al. |
5398295 | March 14, 1995 | Chang et al. |
5408384 | April 18, 1995 | Gannyo et al. |
5414787 | May 9, 1995 | Kurata |
5416668 | May 16, 1995 | Benzoni |
5416870 | May 16, 1995 | Chun et al. |
5416871 | May 16, 1995 | Takahashi et al. |
5416872 | May 16, 1995 | Sizer, II et al. |
5419717 | May 30, 1995 | Abendschein et al. |
5422972 | June 6, 1995 | Chambers et al. |
5424573 | June 13, 1995 | Kato et al. |
5428703 | June 27, 1995 | Lee |
5428704 | June 27, 1995 | Lebby et al. |
5432630 | July 11, 1995 | Lebby et al. |
5434747 | July 18, 1995 | Shibata |
5443390 | August 22, 1995 | Kokkosoulis et al. |
5446814 | August 29, 1995 | Kuo et al. |
5452387 | September 19, 1995 | Chun et al. |
5452388 | September 19, 1995 | Rittle et al. |
5454080 | September 26, 1995 | Fasig et al. |
5455703 | October 3, 1995 | Duncan et al. |
5463532 | October 31, 1995 | Petitpierre et al. |
5469332 | November 21, 1995 | Alvite |
5470257 | November 28, 1995 | Szegda |
5470259 | November 28, 1995 | Kaufman et al. |
5475518 | December 12, 1995 | Karaki |
5475734 | December 12, 1995 | McDonald et al. |
5475783 | December 12, 1995 | Kurashima |
5477418 | December 19, 1995 | MacGregor et al. |
5478253 | December 26, 1995 | Biechler et al. |
5478259 | December 26, 1995 | Noschese |
5478260 | December 26, 1995 | Kaufman et al. |
5479288 | December 26, 1995 | Ishizuka et al. |
5481634 | January 2, 1996 | Anderson et al. |
5482658 | January 9, 1996 | Lebby et al. |
5487678 | January 30, 1996 | Tsuji et al. |
5488705 | January 30, 1996 | LaBarbera |
5491613 | February 13, 1996 | Petitpierre |
5491712 | February 13, 1996 | Lin et al. |
5494747 | February 27, 1996 | Rha |
5497289 | March 5, 1996 | Sugishima et al. |
5499311 | March 12, 1996 | DeCusatis |
5499312 | March 12, 1996 | Hahn et al. |
5504657 | April 2, 1996 | Stocco et al. |
5506921 | April 9, 1996 | Horie |
5506922 | April 9, 1996 | Grois et al. |
5507668 | April 16, 1996 | Lambrinos et al. |
5515468 | May 7, 1996 | DeAndrea et al. |
5526160 | June 11, 1996 | Watanabe et al. |
5526235 | June 11, 1996 | Beason et al. |
5527991 | June 18, 1996 | Sadowski et al. |
5528408 | June 18, 1996 | McGinley et al. |
5534662 | July 9, 1996 | Peacock et al. |
5535034 | July 9, 1996 | Taniguchi |
5535296 | July 9, 1996 | Uchida |
5535364 | July 9, 1996 | Resman et al. |
5545845 | August 13, 1996 | Flores |
5546281 | August 13, 1996 | Poplawski et al. |
5547385 | August 20, 1996 | Spangler |
5548641 | August 20, 1996 | Butler et al. |
5548677 | August 20, 1996 | Kakii et al. |
5550941 | August 27, 1996 | Lebby et al. |
5554031 | September 10, 1996 | Moir et al. |
5554037 | September 10, 1996 | Uleski |
5561727 | October 1, 1996 | Akita et al. |
5567167 | October 22, 1996 | Hayashi |
5577064 | November 19, 1996 | Swirhun et al. |
5580269 | December 3, 1996 | Fan |
5588850 | December 31, 1996 | Pan et al. |
5598319 | January 28, 1997 | Lee |
5599595 | February 4, 1997 | McGinley et al. |
5600470 | February 4, 1997 | Walsh |
5604831 | February 18, 1997 | Dittman et al. |
5606161 | February 25, 1997 | Schulz |
5613860 | March 25, 1997 | Banakis et al. |
5629919 | May 13, 1997 | Hayashi et al. |
5631998 | May 20, 1997 | Han |
5644668 | July 1, 1997 | Chambers et al. |
5653596 | August 5, 1997 | Banakis et al. |
5659459 | August 19, 1997 | Wakabayashi et al. |
5675428 | October 7, 1997 | Henmi |
5687267 | November 11, 1997 | Uchida |
5717533 | February 10, 1998 | Poplawski et al. |
5724729 | March 10, 1998 | Sherif et al. |
5726864 | March 10, 1998 | Copeland et al. |
5734558 | March 31, 1998 | Poplawski et al. |
5736782 | April 7, 1998 | Schairer |
5747735 | May 5, 1998 | Chang et al. |
5767999 | June 16, 1998 | Kayner |
5779504 | July 14, 1998 | Dominiak et al. |
5797771 | August 25, 1998 | Garside |
5836774 | November 17, 1998 | Tan et al. |
5684468 | November 4, 1997 | Poplawski et al. |
5864468 | January 26, 1999 | Poplawski et al. |
5879173 | March 9, 1999 | Poplawski et al. |
5993074 | November 30, 1999 | Chambers et al. |
RE36886 | October 3, 2000 | Ishibashi et al. |
G 84 22 793 | January 1984 | DE |
84 22793.091 | December 1984 | DE |
A 36 40 099 | January 1988 | DE |
3701788 | August 1988 | DE |
3735038 | April 1989 | DE |
37 35 038 | April 1989 | DE |
37 43 483 | July 1989 | DE |
3743483 | July 1989 | DE |
4013630 | December 1990 | DE |
A 39 27 752 | January 1991 | DE |
42 39 124 | May 1991 | DE |
42 09 253 | February 1993 | DE |
4209253 | February 1993 | DE |
A 43 33 387 | January 1994 | DE |
4303780 | August 1994 | DE |
0 228 278 | July 1987 | EP |
0 232 792 | August 1987 | EP |
0 305 112 | March 1989 | EP |
0 305 112 | March 1989 | EP |
0 314 651 | May 1989 | EP |
0 314 651 | May 1989 | EP |
0 413 489 | February 1991 | EP |
0 413 489 | February 1991 | EP |
0 437 141 | July 1991 | EP |
437161 | July 1991 | EP |
0 442 608 | August 1991 | EP |
0 530 791 | March 1993 | EP |
0 535 473 | April 1993 | EP |
A 630 174 | January 1994 | EP |
0 588 014 | March 1994 | EP |
0 588 014 | March 1994 | EP |
0 662 259 | March 1994 | EP |
0 600 645 | June 1994 | EP |
0 613 032 | August 1994 | EP |
0 613 032 | August 1994 | EP |
624962 | November 1994 | EP |
0 652 696 | May 1995 | EP |
0 656 696 | June 1995 | EP |
0 456 298 | October 1996 | EP |
2087681 | May 1982 | GB |
2194700 | March 1988 | GB |
2087681 | July 1991 | GB |
2253317 | September 1992 | GB |
A-61-158046 | July 1986 | JP |
A-61-188385 | August 1986 | JP |
U-61-158046 | September 1986 | JP |
U-61-188385 | November 1986 | JP |
A-63-16496 | January 1988 | JP |
A-63-009325 | January 1988 | JP |
U-63-16496 | February 1988 | JP |
A-63-65967 | March 1988 | JP |
A-63-65978 | March 1988 | JP |
U-63-65967 | April 1988 | JP |
U-63-65978 | April 1988 | JP |
A-63-82998 | April 1988 | JP |
U-63-82998 | May 1988 | JP |
A-1-237783 | September 1989 | JP |
A-2-151084 | June 1990 | JP |
A-4-165312 | June 1990 | JP |
A-2-181710 | July 1990 | JP |
A-2-278212 | November 1990 | JP |
A-3-20458 | January 1991 | JP |
U-3-20458 | February 1991 | JP |
A-3-94869 | April 1991 | JP |
3-157606 | July 1991 | JP |
U-3-94869 | September 1991 | JP |
3218134 | September 1991 | JP |
3-218134 | September 1991 | JP |
A(U)-3-116669 | December 1991 | JP |
A-4-50901 | February 1992 | JP |
A-4-87809 | March 1992 | JP |
4-42756 | April 1992 | JP |
A-4-109593 | April 1992 | JP |
A-4-122905 | April 1992 | JP |
U-4-87809 | July 1992 | JP |
A-4-211208 | August 1992 | JP |
A-4-221207 | August 1992 | JP |
A-4-229962 | August 1992 | JP |
A-4-230978 | August 1992 | JP |
A-4-234715 | August 1992 | JP |
A-4-270305 | September 1992 | JP |
A(U)-4-116372 | October 1992 | JP |
A-5-70955 | March 1993 | JP |
A-5-052802 | March 1993 | JP |
A-5-134147 | May 1993 | JP |
A-5-152607 | June 1993 | JP |
5-52802 | July 1993 | JP |
U-5-052802 | July 1993 | JP |
A-5-188250 | July 1993 | JP |
A-5-211379 | August 1993 | JP |
A-5-218581 | August 1993 | JP |
U-5-70955 | September 1993 | JP |
A-5-290913 | November 1993 | JP |
7-225327 | August 1995 | JP |
7-225328 | August 1995 | JP |
A-2-87837 | March 1999 | JP |
WO 94/12900 | June 1994 | WO |
WO95/20845 | August 1995 | WO |
- German Office Action cited 1-6 pubs AB-AG and translation dated Aug. 7, 1996 (no date).
- German Opposition Statement cited pubs AH-AJ and translation dated Jul. 10, 2002 (no date).
- Japan Office Action citing pubs AK-AL and JP-A-3-218134 of record (see IDS filed May 15, 2000).
- AMP, “Optimate Transceivers Application Note,” Publication #4661-8, Oct. 1989. (no date).
- N. Yoshizawa et al., “1.25 Gb/s Transceiver with SC Duplex Optical Raceptacle,” Spring Conference in 1993 of The Institute of Electronics, Information and Communication Engineers, pp. 4-146, 1993 (and translation). (no date).
- Japan Office Action citing JP-A-3-218134 and JP-A-5-215943 of record, and translation, dated Oct. 29, 2002.
- Japan Office Action citing JP-A-3-218134 of record and documents AA and AE, and translation, dated Oct. 29, 2002.
- Japan Office Action citing JP-A-3-218134 and JP-A-5-215943 of record, and translation, dated Oct. 29, 2002.
- Japan Office Action citing JP-A-3-218134 of record and Japanese patent document corresponding to document AB, and translation, dated Nov. 5, 2002.
- Japan Office Action citing JP-A-5-215943 of record, Japanese patent documents corresponding to documents AC and AD, and documents AF and AG, and translation, dated Nov. 19, 2002.
- BT&D Technologies, “Preliminary DLX2000,” Feb. 1989. (no date).
- BT&D Technologies, “Products from BT&D; Datacommunications,” Jan. 1990. (no date).
- AT&T Microelectronics, “1408-Type ODL Transceiver”, Feb. 1994 preliminary data sheet, p. 2-10.
- Ronald L. Soderstrom et al., “An optical Data Link using a CD laser”, SPIE vol. 1577 High Speed Fiber Networks and Channels, pp. 163-173, 1991.
- BCP, Inc. “Gigabits Over Multimode Optical Fiber” no date.
- Ronald L. Soderstrom et al., “CD laser optical Data Links for Workstation and Midrange Computers”, IEEE pp. 505-509, 1993.
- FDDI Low-Cost Fiber Physical Layer Medium Dependent (LCF-PMD) Common Receiver Footprint, no date.
- HP Module HFBR-5103, FDDI Data Sheet, http://www.hp.com/HP-COMP/fiber/hfbr5103.html, Jun. 11, 1998.
- IBM, Technical Disclosure Bulletin “Optical Link Card Guide/Retention System”, www.patents.ibm.com/tdbs/tdb?&order=93A+60964, Apr. 1993.
- IBM, “A Proposal for a New High Performance . . . ” OptoElectronics Enterprise Oct. 1992 ANSI Meeting Oct. 13, 1992.
- IBM et al., “GLM Family”, FCSI-301-Rev. 1.0, Feb. 16, 1994.
- Methode Electronics, Inc., “DM 1063-DBLM9 Copper Gigabit Link Module” data sheet (no date).
- “Raylan Joins Low-Wavelength Push—850 nm Transceiver”, Electronic Engineering Times, Aug. 1993.
- Sumitomo Electric Fiber Optics Corp, “Transceiver Manufacturers to Support Common Footprint for Desktop FDDI Applications,” Jun. 23, 1992.
- Sun Microsystems Computer Co. et al., Gigabit Interface Converter (GBIC), Rev 4.4, Dec. 1, 1997.
- Siemens, “Who provides Low-Cost Transceivers for all Standards?” no date.
- AMP “PC Board Connectors”, Product Guide 82759, pp. 7104-7108, Catalog E2750 issued Jun. 1991.
- AMPHENOL Engineering News, vol. 7 No. 6, pp. 241, 264-265, Nov. 1994.
- Baldwin and Kellerman, “Fiber Optic Module Interface Attachment” Research disclosure, Kenneth Mason Publication Ltd, England, Nov. 1991.
- Block and Gaio “Optical Link Card guide/Retention Sys” Research Disclosure Kenneth Mason Publications Ltd., England, Apr. 1993.
- Cinch Hinge Connectors Catalog CM-16, Jul. 1963.
- Martin H. Weik, “Communication Standard Dictionary” p. 454. definition of LED, Van Nostrand Reinhold Co.
- Edward R. Salmon, Encapsulation of Electronic Devices and Components, Marcel Deckker Inc., New York, 1987.
- Dieter Gwinner, Conductive Coatings: Vacuum Evaporated Aluminum for Selective Shielding of Plastic Housings, no date.
- HEADSUP—Sumitomo Electric Lightwave Joins Others in Announcement, May 11, 1995.
- Robert C. Herron, High Density Input/Output Connector Systems, 3M Electronic Products Division, 1990.
- Shortwave Opto Assembly, IBM OptoElectronic Enterprises; IBM/OEE Market Survey Only, Rev. 1, Jan. 6, 1993.
- “Minimizing Electrostatic Discharge Damage to a Cartridge”, IBM Technical Disclosure Bulletin, vol. 29 No. 10, Mar., 1987.
- Japanese Standards Association “F04 Type Connectors for Optical Fiber Cords JIS C 5973” Japanese Standards Association, 1990.
- Ronald L. Soderstrom et al., A Miniaturized Fiber Optic Laser Receptacle Using a Compact Disk (CD) . . . FOC/LAN '87 & MFOC-West, pp. 383-385, no date.
- “Transceiver Module Assembly”, IBM Technical Disclosure Bulletin, Oct. 1979, https://www.delphion.com/tdbs/tdb?0=79A+06370, last visited Mar. 3, 2005.
- Ronald L. Soderstrom et al., Optical Components and Electronic Packaging for High Performance Optical Data Links, The Research Investment, p. 19-28 (no date).
- Thomas & Betts, Info-Lan Modem, 1998.
- “Active component manufacturers lower the cost of fiber to the desktop”, Lightwave, Feb. 1994 pp. 58, 67.
- Fibre Distributed Data Interface (FDI)—Token Ring Low-Cost Fibre Physical Layer Medium Dependent (LCF-PMD), American National Standards Institute, 1996.
- Communications Standard Dictionary; p. 454, definition of inhomogeneous fiber, Van Nostrand Reinhold Publishing, 1983.
- “Transmitter/receiver assembly simplifies use of fibre optics”. Design Engineering, p. 19, Button Press, Ltd. Apr. 1980.
- Ronald L. Soderstrom et al., “CD laser as a fiber optic source for computer data links”, Fiber Optic Datacom and Computer Networks, SPIE—The International Society for Optical Engineering Proceedings, vol. 1577, pp. 174-181, 1988.
- David A. Knodel et al., “Open Fibre Control, a laser safety interlock technique”, High-Speed Fiber Networks and Channels, SPIE—The International Society for Optical Engineering Proceedings, vol. 991, pp. 179-182,1992.
- IBM Technical Disclosure Bulletin, “Electrostatic Dissipative Enclosed Connector”, vol. 34, No. 7B, Dec. 1991.
- “High Reliability SW Laser For Optical Data Links”, LEOS '93 Conference Proceedings, IEEE Lasers and Electro-Optics Society 1993 Annual Meeting.
- Minimizing Electrostatic Discharge to a Cartridge, IBM Technical Disclosure Bulletin, Mar. 1987, https://www.delphion.com/tdbs/tdb?o=87A%2060509, last visited Mar. 8, 2005.
- K.P. Jackson et al., “High-Density, Array, Optical Interconnects for Multi-Chip Modules”, 1992 IEEE Multi-Chip Module Conference MCMC-92 Proceedings, IEEE Computer Society Press.
- TDB: Stackable Circuit Card Packaging within a Logic Cage, IBM Technical Disclosure Bulletin, Dec. 1992, https://www.delphion.com/tbds/tdb?o=92A%2063485, last visited Mar. 8, 2005.
- Jeff Hecht, The Laser Guidebook, 2nded., McGraw Hill Inc., 1992.
- Hewlett-Packard, “Optoelectronics Designer's Catalog, ” 1990.
- Sumitomo Electric Fiber Optics Corp., “Product Bulletin, FDDI Optical Transceiver, ES-9217-XC,” publication date unknown.
- Sumitomo Electric, “Technical Specification for FDDI Optical Transceiver Module ES-9217-XC, SC Duplex FDDI PMD, ES-9210-XC, SC Duplex LCF PMD,” Mar. 25, 1993.
- Proposal for Multi-Chip Integration submitted to the Advanced Research Projects Agency dated May 11, 1993, publication date unknown.
- Thomas & Betts, “INFO-LAN Fiber Optic Map Network (IEEE 802.4) Users Manual,” Aug. 1988.
- IBM Opto-Electronics Enterprise, “RCL-2000 LCF-PMD FDDI, Preliminary Specifications,” Jan. 7, 1993.
- Hewlett-Packard, “FDDI 1300 nm Transceiver, Technical Data, HFBR-5125,” 1991.
- Daniel J. Wasser, “Optical Datalinks,” AT&T Technical Journal, pp. 46-52, Jan./Feb. 1992.
- IBM “Fiber Channel 266 Mb/s Optical Links Cards,” Nov. 1992. (no date).
- Thomas & Betts, “INFO-LAN™Transceiver,” 1988. (no month/date).
Type: Grant
Filed: May 15, 2000
Date of Patent: Mar 11, 2008
Assignee: Matsushita Electric Industrial Co., Ltd. (Osaka)
Inventors: Shin Ishibashi (Fukuoka), Hideyuki Nagao (Dazaifu), Tomiya Miyazaki (Fukuoka)
Primary Examiner: Hemang Sanghavi
Attorney: Venable LLP
Application Number: 09/571,334
International Classification: G02B 6/255 (20060101); G02B 6/00 (20060101); G02B 6/36 (20060101);