With Separable Connector Or Socket Means Patents (Class 361/785)
  • Patent number: 10971464
    Abstract: An electrical connection device and a chip module connection device are disclosed. The electrical connection device includes: an insulating body, provided with multiple accommodating holes; multiple terminals, correspondingly accommodated in the accommodating holes; and multiple solder balls. Each accommodating hole is provided with a stopping portion. Each terminal has two arm portions and a stopping block located lower than the two arm portions, and the stopping block is formed by tearing downward from the accommodating groove. An accommodating groove is formed between the two arm portions and is located higher than the stopping block. The stopping portion is located on an upward moving path of the stopping block. A gap is formed between the stopping block and the stopping portion. The solder balls are correspondingly accommodated in the accommodating grooves of the terminals.
    Type: Grant
    Filed: October 31, 2019
    Date of Patent: April 6, 2021
    Assignee: LOTES CO., LTD
    Inventor: Chien Chih Ho
  • Patent number: 10877078
    Abstract: A voltage determination device includes: a printed wiring board on which first to third substrate terminals are arranged in substantially one line; first and second voltage determination circuits mounted on the printed wiring board and disposed on a first side of the printed wiring board divided by a line passing through the first to third substrate terminals; a first printed wiring connecting the first substrate terminal and the first voltage determination circuit; a second printed wiring connecting the second substrate terminal and the first voltage determination circuit; a third printed wiring connecting the third substrate terminal and the second voltage determination circuit; and a fourth printed wiring connecting the second substrate terminal and the second voltage determination circuit, in which the first to fourth printed wirings are provided without intersecting each other and without bypassing a second side of the printed wiring board divided by the first arrangement line.
    Type: Grant
    Filed: March 14, 2019
    Date of Patent: December 29, 2020
    Assignee: KEIHIN CORPORATION
    Inventor: Yuzuru Takashima
  • Patent number: 10871808
    Abstract: In an example implementation, an expansion card assembly includes a low-profile expansion card, a card cooler attached to the card to force air over the card, and an airflow guide attachable to the card to direct forced air from the card cooler out of a full-height computer enclosure.
    Type: Grant
    Filed: October 11, 2016
    Date of Patent: December 22, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Andrew L. Wiltzius, Robert J. Ebner
  • Patent number: 10847907
    Abstract: The present invention relates to an inner conductor element 10 for a coaxial connector between a first electronic assembly 2 and a second electronic assembly 6. The inner conductor element 10 comprises a first contact region 11 for making contact with the first electronic assembly 2, a second contact region 12 for making contact with the second electronic assembly 6, and a connecting region 13 that connects the first contact region 11 with the second contact region 12. An outer diameter of the first contact region 11 is smaller than an outer diameter of the second contact region 12.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: November 24, 2020
    Assignee: ROSENBERGER HOCHFREQUENZTECHNIK GMBH
    Inventors: Rudolf Weidenspointner, Werner Wild, Franz Schmidhammer, Erich Schwangler, Johannes Heubeck, Michael Wollitzer
  • Patent number: 10826215
    Abstract: An electrical connector includes an insulative housing and a plurality of power contact pairs. The insulative housing has a main section, a mating section extending forwardly from the main section, and a plurality of contact-receiving passageways extending along a front-and-back direction. The power contact pairs are mounted in the corresponding contact-receiving passageways of the insulative housing and divided into two opposite rows in a height direction according to contacting portions, and each power contact pair has two power contacts, each power contact defines a flaky retaining portion held in the relative contact-receiving passageway, a number of contacting portions extending forwards from the retaining portion and a soldering portion extending from a rear end of the retaining portion. The contacting portions of two power contacts in each power contact pair are arranged alternately and cyclically.
    Type: Grant
    Filed: September 13, 2019
    Date of Patent: November 3, 2020
    Assignee: ALLTOP ELECTRONICS (SUZHOU) LTD.
    Inventors: Zhihui Zhang, Dingbin Yin
  • Patent number: 10784639
    Abstract: The present disclosure relates to a loop bridge for looping-through an electric signal, comprising: a first electric module comprising a first electrical connection terminal, wherein the electric signal loops through the first electric module to a second electric module comprising a second electrical connection terminal, wherein the first electrical connection terminal and the second electrical connection terminal each have a pressure piece: and a printed circuit board with a comb-like line structure. The comb-like line structure comprises: a first comb tine, wherein the first comb tine is configured to be inserted into the first electrical connection terminal, and wherein the first comb tine comprises a first metal support part configured to support the pressure piece of the first electrical connection terminal: and a second comb tine electrically connected to the first comb tine, wherein the second comb tine is configured to be inserted into the second electrical connection terminal.
    Type: Grant
    Filed: November 15, 2016
    Date of Patent: September 22, 2020
    Assignee: Phoenix Contact GmbH & Co. KG
    Inventor: Elmar Schaper
  • Patent number: 10749817
    Abstract: A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
    Type: Grant
    Filed: September 19, 2018
    Date of Patent: August 18, 2020
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Fuad E. Doany, Shawn A. Hall, Mark D. Schultz, Todd E. Takken, Shurong Tian
  • Patent number: 10727619
    Abstract: In a control unit including a press-fit terminal, a substrate includes: a connected portion into which the press-fit terminal is connected; and a guide member, which surrounds a periphery of the connected portion and extends from the substrate. The press-fit terminal includes: a connecting portion formed on a tip end side of the press-fit terminal; and an enlarged portion formed adjacent to the connecting portion. The guide member includes: an opening portion, which opens in a direction in which the press-fit terminal is positioned; a guide hole extending from the opening portion to the substrate; and a reduced-hole portion formed adjacent to the opening portion. The guide hole is configured such that, when the connecting portion of the press-fit terminal is connected to the connected portion of the substrate, the enlarged portion of the press-fit terminal closes the reduced-hole portion of the guide hole.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: July 28, 2020
    Assignee: Mitsubishi Electric Corporation
    Inventors: Kentaro Urimoto, Takahisa Kawaguchi
  • Patent number: 10559902
    Abstract: Disclosed aspects relate to connector structures and a card. A first connector structure is to join a first subset of a set of electrical connections. A second connector structure is to join a second subset of the set of electrical connections. The card manages the set of electrical connections and is located between the first and second connector structures to connect with the first and second connector structures.
    Type: Grant
    Filed: January 4, 2016
    Date of Patent: February 11, 2020
    Assignee: International Business Machines Corporation
    Inventors: Gerald K. Bartley, Darryl J. Becker, Matthew S. Doyle, Mark J. Jeanson, Mark O. Maxson
  • Patent number: 10554000
    Abstract: Connection system arranged in a rack, for connecting at least one protection board (13a, 13b) of an electrical distribution system of an aircraft with a primary power supply, to at least one powered device (8a, 8b) and to a motherboard arranged in the rack. The connection system includes at least one modular connector on each protection board and, for each protection board capable of being inserted in the rack, at least one additional modular connector attached at least partly on the rack and at least one additional connector connected to the motherboard.
    Type: Grant
    Filed: August 14, 2015
    Date of Patent: February 4, 2020
    Assignee: Zodiac Aero Electric
    Inventors: Jean-Clair Pradier, Frédéric Pinard
  • Patent number: 10506713
    Abstract: Connector receptacles that may be space efficient and provide a direct connection to a flexible circuit board. One example may provide an electronic device having a receptacle including a recess formed in a housing of the electronic device. The recess may have a sidewall and a bottom surface portion, and the bottom surface portion may include one or more openings extending through the bottom surface portion from an external surface to an internal surface. One or more contacts formed on a flexible circuit board may be aligned with the one or more openings in the bottom surface portion. In this way, the receptacle may be space efficient and provide a direct connection to a flexible circuit board inside an electronic device. A cosmetic cap may be placed in the recess to obscure the existence of the connector receptacle.
    Type: Grant
    Filed: August 13, 2018
    Date of Patent: December 10, 2019
    Assignee: Apple Inc.
    Inventors: Dustin J. Verhoeve, Jason C. Sauers, Benjamin J. Kallman
  • Patent number: 10505302
    Abstract: A connector comprises a daughterboard and a metallic shell. The daughterboard has a first edge with first connection pads and a second edge with second connection pads. The first edge is inserted into an on-board connector including first contacts. The on-board connector is mounted on a motherboard and each of the first connection pads is connected to one of the first contacts. The metallic shell has side plates each facing and extending along one of a front board face and a back board face of the daughterboard. Each of the side plates has a base spaced apart from the front board face or the back board face and a retaining portion protruding inward from the base. The retaining portion retains the front board face or a back board face of the daughterboard and has an opening formed around the retaining portion extending through the metallic shell.
    Type: Grant
    Filed: November 28, 2018
    Date of Patent: December 10, 2019
    Assignee: Tyco Electronics Japan G.K.
    Inventors: Tatsuki Watanabe, Katsuhiko Kobayashi
  • Patent number: 10459496
    Abstract: A modular computer system, comprises a casing, wherein the casing is an enclosed structure having an exterior and an interior; at least one slide groove, wherein the slide groove is integrated into the interior of the casing; a motherboard, wherein the motherboard is secured within the at least one slide groove; an opening in the exterior permitting a hard drive to be inserted through the opening so that the hard drive extends into the interior and electrically connects it with the motherboard via a Serial ATA (SATA) connector positioned to permit the connection; and a power supply electrically connected to the motherboard. The at least one slide groove permits the motherboard to slide out from the interior during servicing.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: October 29, 2019
    Inventors: Magdi Hanna, David Mason
  • Patent number: 10438867
    Abstract: An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: October 8, 2019
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Martin Brokner Christiansen, Leonard George Chorosinski, Harlan Craig Heffner, Stanley Katsuyoshi Wakamiya, Keith R. Kirkwood
  • Patent number: 10389654
    Abstract: A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.
    Type: Grant
    Filed: February 13, 2017
    Date of Patent: August 20, 2019
    Assignee: International Business Machines Corporation
    Inventors: Paul W. Coteus, Fuad E. Doany, Shawn A. Hall, Mark D. Schultz, Todd E. Takken, Shurong Tian
  • Patent number: 10367302
    Abstract: A cable retention subsystem includes a frame member and at least one board coupling member that is located on the frame member and couples the frame member to a board. A frame alignment member is located on the frame member and aligns a cable connector included on a cable subsystem with a board connector included on the board when the frame alignment member is engaged with a cable alignment member included on the cable connector. The cable retention subsystem also includes at least one frame retention member located on the frame member that engages with the cable connector when the cable connector is coupled with the board connector, and resists movement of the cable connector in a direction that is substantially perpendicular to the board.
    Type: Grant
    Filed: November 1, 2017
    Date of Patent: July 30, 2019
    Assignee: Dell Products L.P.
    Inventors: Darren Burke Pav, James Trevor Goulding
  • Patent number: 10295766
    Abstract: The present disclosure provides an optical module, including: an optical sub-module and a first housing; where a first sub-surface of the optical sub-module is provided with a first boss, and the first housing is provided with a first opening corresponding to the first boss. The improved structure of the optical module can greatly increase heat conduction efficiency of the optical module.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: May 21, 2019
    Assignee: HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD.
    Inventors: Biao Chen, Liuyin Yang
  • Patent number: 10276961
    Abstract: A printed circuit board (PCB) device is provided, which includes a base board, a part, and a conductive elastic member configured to electrically connect the base board with the part. The conductive elastic member comprises a non-conductive body and at least one conductive interconnect port provided on the non-conductive body and configured to electrically connect an interconnect terminal of the base board with an interconnect terminal of the part.
    Type: Grant
    Filed: January 20, 2015
    Date of Patent: April 30, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Jung-Eun Han, Yun-Sung Shin, Ho-Chul Hwang
  • Patent number: 10251296
    Abstract: A clip is provided with a base portion, at least one holding portion, and a guiding portion. The holding portion includes spring pieces including a first and second spring pieces connected to the base portion and facing each other, and sandwiches an insert inserted between these spring pieces. The guiding portion includes a contact surface that guides the insert toward a position between the first and second spring pieces when the insert moves in an insertion direction and the guide portion comes into contact with the insert. The contact surface is at least partially in a position farther away from the base portion than the second portion of at least one of the first or second spring pieces. The contact surface is at least partially, in relation to a facing direction, in a position farther away from the corresponding spring piece than the second portion of the one spring piece.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: April 2, 2019
    Assignee: Kitagawa Industries Co., Ltd.
    Inventor: Tatsuya Nakamura
  • Patent number: 10193249
    Abstract: In one example in accordance with the present disclosure, a connector component is provided. The connector component includes a first connector portion comprising a plurality of contacts to couple with a printed circuit board, and a second connector portion comprising a plurality of contacts to couple with an M.2 form factor module. The second connector portion is to receive the M.2 form factor module in an upright orientation such that neither a front surface nor a rear surface of the M.2 form factor module substantially faces the printed circuit board. In addition, the second connector portion is to retain the M.2 form factor module in the upright orientation without a retention mechanism external to the connector component.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: January 29, 2019
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chi So, Robert C Brooks, Bruce Trevino
  • Patent number: 9995638
    Abstract: Input terminal of a thermocouple (TC) instrument. The input terminal may include a printed circuit board (PCB), including an input portion configured to receive signals from a thermocouple, and an output portion configured to communicatively connect to the instrument. The input terminal may further include a sensor mounted on the PCB, configured to measure temperature at or near a cold junction of the input terminal. The PCB may include first traces connecting the input portion of the PCB to the output portion of the PCB, and configured to send TC signals to the TC instrument and second traces connecting the sensor to the output portion of the PCB, and configured to send temperature signals to the instrument. The traces may be configured to provide the TC signals and the temperature signals to the TC instrument without using metal pins.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: June 12, 2018
    Assignee: National Instruments Corporation
    Inventors: Daniel H. Ousley, Shaun M. Stelley, David R. Pasternak
  • Patent number: 9950717
    Abstract: There is described a peripheral post of railway field devices, comprising: a plurality of control modules operatively connected or connectable by electric cables to respective railway field devices; —a rack housing said plurality of control modules, wherein said rack comprises: —a wiring frame adapted to be permanently attached to a support surface or to an installation wall, comprising a front side and an opposite rear side and comprising on the rear side first connectors adapted to be electrically connected to end portions of said cables; —a support and containment frame of the modules adapted to house said modules and adapted to be coupled to the wiring frame by drawing said support and containment frame near the wiring frame from said front side so as to reach a coupling position.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: April 24, 2018
    Assignee: ECM S.p.A.
    Inventor: Alessandro Santi
  • Patent number: 9939855
    Abstract: A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: April 10, 2018
    Assignee: SMART Modular Technologies, Inc.
    Inventors: Victor Mahran, Robert S. Pauley, Jr.
  • Patent number: 9913389
    Abstract: Tamper-respondent assemblies, electronic packages and fabrication methods are provided which incorporate a vent structure. The tamper-respondent assembly includes an electronic enclosure to enclose, at least in part, an electronic component(s) to be protected. The electronic enclosure includes an inner surface, and an air vent. A tamper-respondent electronic circuit structure is provided which includes a tamper-respondent sensor disposed to cover, at least part, the inner surface of the electronic enclosure, and define, at least in part, a secure volume about the electronic component(s). The vent structure includes at least one air passage coupling in fluid communication the secure volume and the air vent of the electronic enclosure to allow air pressure within the secure volume to equalize with air pressure external to the tamper-respondent assembly.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: March 6, 2018
    Assignee: INTERNATIONAL BUSINESS CORPORATION CORPORATION
    Inventors: Michael J. Fisher, David C. Long, Michael T. Peets, Robert Weiss, Thomas Weiss, James E. Tersigni
  • Patent number: 9894037
    Abstract: A method and a network device are provided to transmit network packets through a network security device. The method, performed by the network device, receives a request to send a network packet from a first computing device to a second computing device over a network that includes the network device and the network security device. The network packet includes a first network interface identifier for identifying the first computing device and a second network interface identifier for identifying the second computing device. The method identifies third and fourth network interface identifiers that cause the network packet to be transmitted through the network security device. The method transmits the network packet over the network through the network security device using the third and fourth network interface identifiers. The method transmits the network packet to the second computing device using the first and second network interface identifiers.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: February 13, 2018
    Assignee: Juniper Networks, Inc.
    Inventor: Moshe Litvin
  • Patent number: 9877405
    Abstract: An electronic device includes a housing; a plug-in unit that is inserted into the housing and electrically connected to a connection substrate within the housing; a guiding member that includes a retention portion retaining the plug-in unit, the guiding member being moved between a protruding position protruding from the housing to a front side of an insertion direction of the plug-in unit and a retracting position retracting to the housing side, the guiding member being electrically connected to the housing; a biasing member that biases the guiding member to the protruding position; and a conductive member that is positioned between the plug-in unit and the guiding member, the plug-in unit and the guiding member being in a conduction state by the conductive member.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: January 23, 2018
    Assignee: FUJITSU LIMITED
    Inventor: Yoshiyuki Sato
  • Patent number: 9870680
    Abstract: A communication light visualization structure includes a duplex LC communication light visualization adapter including an opening portion connected to a first light extraction space and a second light extraction space, and a guide groove formed in the opening portion; and a duplex LC communication light detector including a base portion that has the same cross-sectional shape as the opening portion, a first light receiver that receives first leakage light, a second light receiver that receives second leakage light, a light blocking wall that shields the first light extraction space and the second light extraction space from each other, and a display portion that individually displays a communication status of a first communication path and a second communication path. The guide groove is formed at a position such that cross sections of the opening portion and the base portion fit together in only one direction.
    Type: Grant
    Filed: September 2, 2016
    Date of Patent: January 16, 2018
    Assignee: HITACHI METALS, LTD.
    Inventors: Kanako Suzuki, Mikio Ohkoshi
  • Patent number: 9785207
    Abstract: A server includes a main board, a plurality of first expanding modules, a plurality of second expanding modules, a plurality of third expanding modules and a management controlling board. The main board has a first edge, a second edge corresponding to the first edge, a first plane, a second plane corresponding to the first plane. The main board includes a plurality of hardware connectors disposed on the first plane and between the first edge and the second edge. The plurality of first expanding modules, the plurality of second expanding modules and the plurality of third expanding modules are all disposed on the second edge and on the first plane. Each of the first expanding modules has a first Ethernet connector and a plurality of first ports configured to connect to a first external server. Each of the second expanding modules has a plurality of second ports configured to connect to a second external server. The management controlling board is disposed on the second edge and on the second plane.
    Type: Grant
    Filed: September 20, 2016
    Date of Patent: October 10, 2017
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventors: Ji-Peng Xu, Jia-Bin Wang, Hui Zhu, Shu-Min Wang
  • Patent number: 9781858
    Abstract: An orthogonal coupling mechanism includes a threaded rod, a pair of travelers engaging the threaded rod, and an actuator. The actuator is disposed on the threaded rod, such that the actuator translates a first axial force along the axis of the threaded rod into a rotational movement of the threaded rod about its axis. The rotational movement created by the actuator causes the pair of travelers to travel along the axis of the threaded rod, moving a sliding board into engagement with a first connector in a direction orthogonal to a direction of the first axial force.
    Type: Grant
    Filed: October 24, 2014
    Date of Patent: October 3, 2017
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Jean-Philippe Fricker, Donald C. Lewis
  • Patent number: 9766177
    Abstract: Light source for an inline sensor having one or more solid state UV emitters for emitting light at single wavelengths in the range of 240 to 400 nm. The light emitted by each of the emitters has a bandwidth on the order of 10-20 nm and is directed toward a measurement detector in the inline sensor. The UV emitters are enclosed in a housing which can be attached to the inline sensor, with a reference detector and a regulator for the UV emitters also within the housing, and an aperture through which the light passes from the emitters to the measurement detector.
    Type: Grant
    Filed: September 14, 2010
    Date of Patent: September 19, 2017
    Assignee: Endress+Hauser Conducta Inc.
    Inventor: William H. Wynn
  • Patent number: 9618968
    Abstract: Mobile computing devices that include an exterior housing and a port. The housing is configured to form a guide portion of the port. More particularly, the port includes a cavity formed in the housing. The cavity includes interior walls that extend inward from an exterior wall of the housing. The port further includes a connector that is positioned in the cavity. The connector is positioned such that the walls of the cavity form the guide of the connector. The port is further constructed to prevent the ingress of water and/or debris into an interior of the housing.
    Type: Grant
    Filed: October 31, 2013
    Date of Patent: April 11, 2017
    Assignees: Sony Corporation, Sony Mobile Communications Inc.
    Inventor: Olof Simonsson
  • Patent number: 9515398
    Abstract: A spacer and electrical connector assembly for printed circuit boards includes a first member to be placed between two of the printed circuit boards to provide a required spacing between the printed circuit boards. The assembly also includes at least one second member disposed adjacent to the first member, the second member extending along a length of the first member and at least partially bracketing an upper surface and a lower surface of the first member, thereby providing an electrical connection between the printed circuit boards. A plurality of contact portions that respectively receive the second member may be disposed on at least one of the upper and lower surfaces.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: December 6, 2016
    Assignee: Robert Bosch GmbH
    Inventors: Ligor Manushi, John Janson, Keith Gerber, Hiram Avalos
  • Patent number: 9454191
    Abstract: The ATCA backplane of the present invention comprises a front backplane and a rear backplane. The front backplane and the rear backplane are interconnected through a connector; each backplane at least comprises slots of a node board, and each rear backplane at least comprises slots of a node board. Furthermore, slots of a switch board could be arranged on at least one backplane of the ATCA backplane. Therefore, it is guaranteed by the ATCA backplane of the present invention that node boards could be inserted into both the front backplane and the rear backplane included in the ATCA backplane. Therefore, the number of slots of node boards is increased, slot resources are extended and system processing capability is improved.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: September 27, 2016
    Assignee: ZTE Corporation
    Inventors: Hao Ji, Shan Zhao, Bin Zhang
  • Patent number: 9204531
    Abstract: Methods and structures are provided for implementing feed-through and domain isolation using ferrite and containment barriers. A vertical isolator is provided between a first domain and a second domain on a printed circuit board with signals passing between the first domain and the second domain. The vertical isolator is placed over a domain separation gap between the first and second domains in the printed circuit board, the vertical isolator having a vertical isolation barrier between a first vertical plate coupled to the first domain and a second vertical plate coupled to the second domain. The vertical isolation barrier is formed of a unitary ferrite block or a non-conductive magnetic absorber material. A plurality of capacitance feed-through plates and a dielectric material are provided within the vertical isolator.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: December 1, 2015
    Assignee: International Business Machines Corporation
    Inventors: Don A. Gilliland, Dennis J. Wurth
  • Patent number: 9166403
    Abstract: A serial advanced technology attachment dual in-line memory module device includes first and second electronic switches, a voltage detecting circuit, a power circuit, and an edge connector. The edge connector includes first to third power pins and first and second notches. The first power pins are connected to an input terminal of the voltage detecting circuit. An output terminal of the voltage detecting circuit is connected to first terminals of the first and second electronic switches. The second power pins are connected to the second terminal of the first electronic switch. The third power pins are connected to the second terminal of the second electronic switch. The third terminals of the first and second electronic switches are connected together and also connected to the power circuit.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: October 20, 2015
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Meng-Liang Yang
  • Patent number: 9155205
    Abstract: An electronic device is disclosed. The electronic device includes at least an electronic element; and a circuit board having a base with at least a block, wherein the at least a block is used as a replaceable carrying portion for carrying the electronic element, and the electronic element is electrically connected to the circuit board. As such, when a defect occurs to the replaceable carrying portion, the replaceable carrying portion as well as the defective electronic element can be removed and replaced with good ones.
    Type: Grant
    Filed: December 19, 2013
    Date of Patent: October 6, 2015
    Assignee: National Taipei University of Technology
    Inventors: Chien-Yi Huang, Pin-Jou Liao
  • Patent number: 9089051
    Abstract: A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.
    Type: Grant
    Filed: June 27, 2013
    Date of Patent: July 21, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shidong Li, Gregg B. Monjeau, Kamal K. Sikka, Hilton T. Toy, Thomas Weiss
  • Patent number: 9089052
    Abstract: A multichip module includes a carrier, a stiffening frame, a plurality of semiconductor chips, and a plurality of covers. The carrier has a top surface and a bottom surface configured to be electrically connected to a motherboard. The stiffening frame includes a plurality of openings that accept the plurality of semiconductor chips and may be attached to the top surface of the carrier with an adhesive that absorbs dimensional changes between the stiffening frame and the carrier. The semiconductor chips are concentrically arranged within the plurality of openings of the stiffening frame and the plurality of covers are attached to the stiffening frame so as to enclose the plurality of openings.
    Type: Grant
    Filed: November 25, 2014
    Date of Patent: July 21, 2015
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Shidong Li, Gregg B. Monjeau, Kamal K. Sikka, Hilton T. Toy, Thomas Weiss
  • Publication number: 20150146399
    Abstract: An embodiment of a method of attaching a semiconductor die to a substrate includes placing a bottom surface of the die over a top surface of the substrate with an intervening die attach material. The method further includes contacting a top surface of the semiconductor die and the top surface of the substrate with a conformal structure that includes a non-solid, pressure transmissive material, and applying a pressure to the conformal structure. The pressure is transmitted by the non-solid, pressure transmissive material to the top surface of the semiconductor die. The method further includes, while applying the pressure, exposing the assembly to a temperature that is sufficient to cause the die attach material to sinter. Before placing the die over the substrate, conductive mechanical lock features may be formed on the top surface of the substrate, and/or on the bottom surface of the semiconductor die.
    Type: Application
    Filed: November 25, 2013
    Publication date: May 28, 2015
    Inventors: LAKSHMINARAYAN VISWANATHAN, L.M. Mahalingam, David F. Abdo, Jaynal A. Molla
  • Publication number: 20150131256
    Abstract: The present invention is a backplane board including a first circuit board, a second circuit board, a first slot in which a first connector is connected with the first circuit board, and a second slot in which a second connector is connected with the second circuit board. The first connector and the second connector are arranged so that pin arrangement of the first connector may be shifted by at least one column in a longitudinal direction against pin arrangement of the second connector.
    Type: Application
    Filed: March 13, 2013
    Publication date: May 14, 2015
    Inventor: Kazuhiro Kashiwakura
  • Patent number: 9029713
    Abstract: A printed wiring board including a rigid multilayer board, a first substrate having multiple conductors, and a second substrate having multiple conductors electrically connected to the conductors of the first substrate. The conductors of the second substrate have an existing density which is set higher than an existing density of the conductors of the first substrate, and the first substrate and/or the second substrate is embedded in the rigid multilayer board.
    Type: Grant
    Filed: March 28, 2013
    Date of Patent: May 12, 2015
    Assignee: Ibiden Co., Ltd.
    Inventor: Michimasa Takahashi
  • Patent number: 9007784
    Abstract: A device and/or method mount and affix a microchannel plate in a micro system. The device and/or method has at least one conductive spring structure, formed to accept a microchannel plate, for aligning, fixing and making electrical contact with the microchannel plate. The device and/or method also has at least one stop against which the microchannel plate is pushed or pressed when affixed by at least one conductive spring structure, wherein the at least one conductive spring structure and the at least one stop are being applied on a non-conductive substrate.
    Type: Grant
    Filed: February 17, 2009
    Date of Patent: April 14, 2015
    Assignees: Bayer Intellectual Property GmbH, Krohne Messtechnik GmbH
    Inventors: Jan-Peter Hauschild, Eric Wapelhorst, Jörg Müller
  • Patent number: 9007783
    Abstract: A random access memory (RAM) memory module has a compact form factor and is removable from a corresponding socket assembly to allow easy replacement of the memory module or reconfiguration of the memory module during development of an electronic device that includes the memory module.
    Type: Grant
    Filed: July 6, 2011
    Date of Patent: April 14, 2015
    Assignees: Sony Corporation, Sony Mobile Communications AB
    Inventors: Wladyslaw Bolanowski, Peter Aberg
  • Patent number: 8995147
    Abstract: A connection assembly includes a connection member and a switch. The connection member includes a serial attached small computer system interface (SAS) connector electronically connected to the switch. When the switch is electronically connect to the motherboard, the switch transmits signals from the motherboard to a hard disk drive backplane via the SAS connector. When the switch is electronically connect to the hard disk drive backplane, the switch transmits signals from the hard disk drive backplane to the motherboard via the SAS connector.
    Type: Grant
    Filed: June 13, 2012
    Date of Patent: March 31, 2015
    Assignee: Zhongshan Innocloud Intellectual Property Services Co., Ltd.
    Inventors: Lei Liu, Guo-Yi Chen
  • Patent number: 8995141
    Abstract: An electronic device includes a first component electrically coupled to a second component. The first component and the second component are coupled by the base of a spring loaded connector.
    Type: Grant
    Filed: July 27, 2012
    Date of Patent: March 31, 2015
    Assignee: Amazon Technologies, Inc.
    Inventors: Nidhi Rathi, Edward A. Lilgegren
  • Publication number: 20150049451
    Abstract: An interconnection system includes a first board group, a second board group orthogonal to the first board group, and a center backplane arranged between the first board group and the second board group. The first board group includes a number of first boards parallel to each other and the second board group includes a number of second boards parallel to each other. Curved male connectors re arranged on each of the first boards and curved female connectors are arranged on each of the second boards. The curved male connectors and the curved female connectors directly cooperate and are connected in one-to-one correspondence.
    Type: Application
    Filed: November 3, 2014
    Publication date: February 19, 2015
    Inventors: Baoqi Wang, Guodong Zhang, Fangming Liu
  • Patent number: 8947888
    Abstract: A substantially cable-free board connection assembly may include a plurality of printed circuit boards (PCBs) forming an interconnect plane for a plurality of electronic devices respectively attached to a plurality of plane boards included in the interconnect plane. An insertion direction for substantially all connectors is substantially perpendicular to a face of the interconnect plane. At least a portion of the board connection assembly is mounted to a support structure via a flexible connection.
    Type: Grant
    Filed: December 17, 2012
    Date of Patent: February 3, 2015
    Assignee: Microsoft Corporation
    Inventors: Eric C. Peterson, David T. Harper
  • Patent number: 8939774
    Abstract: In exemplary implementations of this invention, electrical connections are fabricated between two orthogonal surfaces by electroplating. The two surfaces are separated (except for the electrical connections) by a gap of not more than 100 micrometers. Multiple electrical connections may be fabricated across the gap. In preparatory steps, conductive pads on the two surfaces may be separately electroplated to build up “bumps” that make it easier to bridge the remainder of the gap in a final plating step. Alternately, electroless deposition may be used instead of electroplating. In exemplary implementations, a 3D probe array may be assembled by inserting array structures into an orthogonal base plate. The array structures may be aligned and held in place, relative to the base plate, by mechanical means, including side hooks, stabilizers, bottom hooks, alignment parts and a back plate.
    Type: Grant
    Filed: November 12, 2012
    Date of Patent: January 27, 2015
    Assignee: Massachusetts Institute of Technology
    Inventors: Jorg Scholvin, Anthony Zorzos, Clifton Fonstad, Edward Boyden
  • Patent number: 8934257
    Abstract: In some embodiments, an apparatus includes a first substrate, a second substrate, a first coupler, and a second coupler. The first substrate is formed from a first material and includes an electrical pad. The second substrate is formed from a second material and includes an electrical pad. The first coupler is configured to mechanically couple the first substrate to the second substrate without a soldered connection. The second coupler includes a first end portion, configured to be soldered to the electrical pad of the first substrate, and a second end portion, configured to be soldered to the electrical pad of the second substrate. The second coupler configured to electrically couple the first substrate to the second substrate.
    Type: Grant
    Filed: May 30, 2012
    Date of Patent: January 13, 2015
    Assignee: Juniper Networks, Inc.
    Inventors: Boris Reynov, Jack Kohn, Victor Mei, Shreeram Siddhaye, Ben Nitzan, Venkata Penmetsa
  • Patent number: 8934256
    Abstract: One exemplary object of the present invention is to provide a card device which can be shared in main body devices employing different power supply systems, and a power supply method of the card device. The card device according to the present invention includes a flat rectangular card base body (101), an internal circuit (301), an external connector (102), and a main body connector (103). The external connector (102) is provided on an edge (202) positioned on an opening side (201) of a card slot (21) in a state in which the card device is inserted into the card slot (21), and is adapted to be supplied with power from an external power supply. The main body connector (103) is provided on the innermost side of a card slot (200) in a state in which the card device is inserted into the card slot (200), and is supplied with power from a main body device.
    Type: Grant
    Filed: April 20, 2010
    Date of Patent: January 13, 2015
    Assignee: NEC Corporation
    Inventor: Motohiro Mukouyama