Abstract: A semiconductor device is provided in the form of a chip carrier (e.g., chip/IC scale carrier for RF applications) that includes an integrated circuit chip attached to a die attach pad. The device has an interconnect substrate having an upper surface and a lower surface, with a plurality of vias passing through the thickness of the interconnect substrate from the upper surface to the lower surface. The die attach pad is located on the upper surface of the interconnect substrate, and a heat spreader is located on the lower surface of the interconnect substrate. A first group of vias is positioned to intersect both the die attach pad and the heat spreader. A second group of vias is positioned away from the die attach pad and the heat spreader. The upper surface has a plurality of bond pads that are abutting the second group of vias and the lower surface has a plurality of lands that are also abutting the second group of vias.

Abstract: A demountable heat spreader assembly utilizing a unique retainer frame for demountably retaining a heat spreader having a flexible thermal interface material disposed in a cavity of the heat spreader is disclosed. The retainer frame allows a substrate having a flip chip IC mounted thereon to be snapped into the retainer frame. The heat spreader also snaps into the retainer frame and is positioned in the retainer frame so that the flexible thermal interface material contacts the IC with a slight interference. The flexible thermal interface material provides effective thermal coupling between the IC and the heat spreader and loose mechanical coupling between the IC and heat spreader. Thermomechanical stress caused by heating or cooling of the IC is reduced by the loose coupling between the IC and the flexible thermal interface material. The retainer frame allows for the heat spreader and the substrate to be removed and can be made from low cost materials such a plastic.

Abstract: A decoupling capacitor structure formed integral with an integrated circuit chip and over top of circuitry defined thereon advantageously provides decoupling capacitance in close electrical proximity to switching circuits of the integrated circuit chip without substantially affecting die footprint. In contrast with on-die gate oxide capacitor configurations, a decoupling capacitor structure formed toward the back end of processing, typically after interconnect metal, allows large area capacitor structures without substantial impact on area available for devices and circuitry. Inductance associated with the intervening portion of a power supply loop circuit between switching circuits of the integrated circuit chip and the decoupling capacitor structure can be extremely low in configurations in accordance with the present invention. In some configurations, connection points, e.g., bonding pads and/or solder bumps for conveying power supply voltages, are defined over top of the decoupling capacitor structure.

Abstract: A ring shaped pressure plate is provided in a socket and land grid array module assembly for urging the module into electrical contact. The ring shaped pressure plate is not only readily removable but it also engages a land grid array module in a fashion which reduces stress to chip, chip underfill, chip lid, and chip thermal paste structures. In an alternate embodiment of the present invention, pressure is applied in a similar manner except that lockably engageable arms supporting pressure rails on opposite sides of the module are employed. Both embodiments reduce stress and provide a land grid array engagement mechanism which is readily removable and which also provide a central opening or central portion access to chip module components for purposes of cooling such as by providing direct attachment to heat sinks or indirect attachment to heat sinks through heat spreaders.

Abstract: Disclosed is a semiconductor integrated circuit device having a plurality of metallization levels of patterned metallization lines that are resistant to electromigration voiding, and methods for making the electromigration void resistant metallization lines. The semiconductor integrated circuit device includes a metallization line having a first end and a second end. Oxide feature regions are defined in the metallization line, and the oxide feature regions are arranged along the metallization line between the first end and the second end. Each one of the oxide feature regions are configured to be separated from a previous oxide feature region by about a Blech length or less, and each of the oxide feature regions are configured to define a region of increased metallization atom concentration and a corresponding increased back-flow force. The oxide feature regions therefore define a composite metallization interconnect line, which is well configured to retard electromigration voiding.

Abstract: A semiconductor chip is mounted on a semiconductor chip carrier through a flip chip bonding technique; the semiconductor chip carrier includes an insulating layer such as synthetic resin having a mounting area assigned to the semiconductor chip and a conductive pattern having pads bonded to bumps of the semiconductor chip, and only the pads are formed in the mounting area so that melted synthetic resin smoothly flows into the gaps between the insulating synthetic resin layer and the semiconductor chip.

Abstract: Thin organic layers are laminated on both the top and bottom of a relatively thin ceramic layer to form a reliable thinner composite substrate for packaging a chip-scale flip-chip die in a thin package. A semiconductor die has a number of solder bump-mounting pads formed thereupon which are connected with solder bumps to mounting pads on the top surface of the thin composite substrate.

Abstract: A method is provided for forming planar multilevel metallization of a semiconductor integrated circuit, and an integrated circuit formed according to the same. Multilevel metallization is achieved through a planar process at each layer to allow for minimum widths of lines and vias and minimal lateral spacing between lines. Conductive lines and contacts are formed before planarization to further achieve good step coverage. A first metallization layer is formed by depositing aluminum over the integrated circuit, patterning and etching to form metal interconnect lines. Regions of planar insulating material are then formed between the metal lines. Another layer of aluminum is deposited and etched to form metal vias over selected portions of the metal lines. This layer of aluminum is patterned with a reverse pattern of that used to pattern the metal lines. Again, regions of planar insulating material are formed between the metal vias.

Abstract: In a semiconductor device having a laminated metal layer in which a metal layer whose main component is aluminum and a metal layer whose main component is nickel are laminated on each other, the ratio (tAl/tNi) of the thickness (tAl) of the metal layer whose main component is aluminum to that (tNi) of the metal layer whose main component is nickel is controlled to 5 or larger, so that part of the metal layer whose main component is aluminum remains even if an Al—Ni intermetallic compound is formed.

Abstract: Conductive links are provided between conductive materials, e.g., metals, separated by a non-conductive material, e.g., a silicon based glass material. In a preferred embodiment a single pulse of laser energy is applied to at least one of the conductive materials to produce mechanical strain therein which strain initiates a fracturing of the non-conductive material so as to provide at least one fissure therein extending between the conductive materials. The laser energy pulse further causes at least one of the conductive materials to flow in such fissure to provide a conductive link between the conductive materials. Preferably, the non-conductive material is formed in layers such that an interface between the layers controls the fissures.

Abstract: A semiconductor chip package having a back side connection and method of manufacture. The semiconductor chip package can combine industry standard die having conductive back sides with flip chip bump bonding to provide discrete and integrated devices that require less space on a printed circuit board. The chip packages can include a die connected by front side bond pads to a substrate. The substrate includes terminals opposite the side facing the die that electrically connect to contact pads on the opposite side of the substrate by way of vias. In one embodiment, the vias are buried in the substrate. The substrate contact pads connect to bond pads on the front side of the die. The back side of the die is electrically connected to a bond pad (and thereby to the terminal through the via) using a conductive substance that can cascade from the back side of the die to the bond pad. Solder balls can be attached to the terminals to provide solder connections to a printed circuit board.

Abstract: A semiconductor package including a sealing resin between a substrate and a semiconductor chip, wherein a concavity portion is defined in the surface of the substrate. The concavity facilitates spreading of the resin when the latter is injected between the substrate and the chip to connect them in a sealed manner.

Abstract: A process is provided for manufacturing a layer arrangement (1) having a bump for a flip chip or similar connection. The layer arrangement has a plurality of layers (2, 3, 4, 5, 6, 7, 11) made of solid material and stacked into a layer stack (8). A recess (10) that extends over several layers (2, 3, 4, 5, 6, 7, 11) is made in the layer stack (8) transverse to the coating planes of the layers (2, 3, 4, 5, 6, 7, 11). A bump material (14) is placed in the recess (10). A profiling is created on the lateral boundary wall of the recess (10) by removal of layer material of different layers (2, 3, 4, 5, 6, 7, 11) of the layer stack (8). The profiling, starting from the surface (9) of the layer stack (8) and progressing in layers to the inside of the recess (10), has at least two indentations (12) and at least one projection (13) located between them. After the production of the profiling, a bump material (14) is brought into the recess (10) in such a way that it grasps behind the indentations (12).

Abstract: This invention relates to a semiconductor package having a separated die pad, which is comprised of an integrated circuit chip having a plurality or bonding pads mounted on its surface; a die pad providing its upper surface for the chip to be attached to, which comprises the first plate and second plates disposed a space apart, and an adhesive film attached to the under surface of the first and second plates; a plurality of leads, the near end portions of the leads which can be electrically connected to the bonding pads of the chip, wherein the far end portions are exposed to the exterior surface of the semiconductor package; and a package body made of insulating material, wherein the chip, the die pad and the leads including parts of their near end portions are encapsulated.

Abstract: A semiconductor integrated circuit device has a semiconductor chip having a plurality of input/output circuits and input/output pads connected individually thereto by metal conductors, and also has a frame on which the semiconductor chip is mounted. The pads of the semiconductor chip and a plurality of inner leads arranged on the frame are connected by wires that are wire-bonded thereto. The pads are arranged in two rows along each edge of the semiconductor chip. In the outer row, the pads are grouped into groups each consisting of pads arranged as close as possible to one another; spaces are secured between those groups and wires are arranged through those spaces. In the inner row, the pads are arranged in such positions where they can be connected to the wires arranged through the spaces secured between the groups of pads.

Abstract: An electronic device comprising a substrate having a frame, a metal lead and an electronic parts in a bonding structure, and a molding of an organic resin formed on the substrate, wherein the surface of the organic resin is provided with a hardened water-resistant or carbonaceous film or wherein pores at the surface of the organic resin are filled within an inactive gas such as argon because of a plasma treatment of the resin surface with the inactive gas whereby impurities are prevented from entering into the organic resin through the pores.

Abstract: Bonding pads are formed on a main surface of a semiconductor chip. An insulating layer having openings located on the bonding pads is formed on the main surface of the semiconductor chip. Base metal layers are formed on the bonding pads. A buffer coat film having a portion laid on a periphery of the base metal layer is formed on the insulating layer. Connection layers are formed on the base metal layers. First conductors are formed on the connection layers. A seal resin exposing only top surfaces of the first conductors is formed. Lumpish second conductors are formed on the top surfaces of the first conductor. Thereby, a resin seal semiconductor package can be made compact and it has improved electrical characteristics and high reliability.

Abstract: A semiconductor device and a method of producing the same are provided. The semiconductor device includes: a semiconductor chip; a resin package which seals the semiconductor chip; signal passages which guide the signal terminals of the semiconductor chip outward from the resin package; a grounding metal film in contact with the bottom surface of the semiconductor chip; and a grounding passage which is connected to the grounding metal film and guided outward from the resin package.

Abstract: For use with an integrated circuit having a substrate and an insulator coupled to the substrate, a micromagnetic device and method of manufacturing therefor. In one embodiment, the micromagnetic device includes an adhesive coupled to the insulator and a ferromagnetic core, coupled to the adhesive that forms a bond between the insulator and the ferromagnetic core, having an anisotropic property.

Abstract: The present invention relates to a wind turbine used to convert wind energy into mechanical energy, more specifically, a long axis type of vertical-axis turbine allowing large columns of air to be harnessed. These devices differ from horizontal-axis (propeller) type windmills which typically rotate about a vertical axis in order that they may face directly into a wind. The present invention is designed to be employed as a cost effective alternate power source in any wind condition from a breeze to a gale wind. To increase the structural integrity, the torque generating elements, namely, the rotor blades, are not directly attached to the shaft but rather, they attach to the round top and bottom rotor cage plates through which torque forces generated can be transfered to the shaft. The unique design of an open cover on the top of the wind turbine allows wind from the direction above the wind turbine to be harnessed.

Abstract: A single switch is utilized within a common ground line to control the current flow through a plurality of loads, whereby power to all of these loads may be interrupted by opening the system ground return so that power can be supplied to a particular component of the circuit, a microprocessor, to the exclusion of all remaining components by the operation of a single switch.

Abstract: A power-supplying device is adapted to generate different voltage outputs, and includes an input power providing unit for providing an input power signal, a selector unit operable so as to generate a voltage select signal corresponding to a selected one of the voltage outputs, a processor unit connected to the selector unit so as to receive the voltage select signal therefrom and so as to generate a converter control signal corresponding to the voltage select signal, and an adjustable dc-to-dc converter connected to the input power providing unit and the processor unit so as to receive the input power signal and the converter control signal respectively therefrom. The converter is controlled by the converter control signal so as to process the input power signal in order to generate the selected one of the voltage outputs.

Abstract: A voltage regulation system, method of operation and multiple processor apparatus employing the system or method. The voltage regulation system includes a plurality of voltage regulation modules (VRMs) coupled to a plurality of processors, each one of the VRMs is dedicated to only one of the plurality of processors wherein a processor is powered down in response to a failure of its respective dedicated VRM.

Abstract: A system and method for providing an uninterrupted supply of power to a critical load includes at least two uninterruptible power supply UPS modules that receive power from separate utility sources. A controller controls the UPS modules so that the output power from one UPS module is substantially in-phase with the output power from the other UPS module. As a result, the output powers from the UPS modules can be combined with one another to provide a sufficient source of uninterruptible power to the critical load regardless of the phase difference in the power provided by the separate utility sources.

Abstract: Use of prepayment mechanisms for alternative energy supply systems and monitoring connected devices. An energy supply system is, for instance, an alternative energy source, such as a photovoltaic array (320) and an overriding prepayment mechanism (312) adapted to control the supply of useable energy (electricity) to a point of use in accordance with predetermined prepayment criteria. The photovoltaic array (320) incorporates, integral therewith, an energy source controller (318) that is in communication with a corresponding controller (316) forming part of the prepayment mechanism (312).

Abstract: In an apparatus for tapping current from a busbar by means of a roller which is arranged, for example, on a trolley, the one roller is also intended to have associated with it at least one further roller, adjacent to it and at a distance from the same busbar. In addition, at least one further busbar is provided parallel to said busbar on which further rollers for tapping current roll. In addition, each roller is assigned a connection to an electrical load and a contact spring leads from the connection to the roller circumference and makes contact at the roller circumference.

Abstract: A computer, or other electrical component, having an electrical switch adapted to open when the cover of the chassis of the component covers the chassis and close when the cover is removed from the chassis. A mechanism is provided that turns on, and stays turned on, in response to the closing of the switch for providing an output. An indication device is connected to the mechanism and is adapted to provide a corresponding indication when the mechanism turns on.

Abstract: A system and method for reduced standby power consumption in a display device. In one embodiment, a circuit for power mode switching between a main mode and a standby mode of a display device is provided. In this embodiment, the circuit includes a power supply unit coupled to a power source for receiving an input power signal and for generating output power signals when the display device is in the main mode. The circuit also includes an opto coupler coupled to a computer and responsive to a sync signal therefrom. The opto coupler is also coupled to the power supply unit for selectively sending an OFF signal thereto when the opto coupler does not detect the sync signal from the computer. Moreover, in this embodiment, the power supply unit shuts down and stops generating the output power signals in response to the OFF signal, thereby switching the display device to the standby mode.

Abstract: A voltage detection circuit 2 detects a voltage of a battery 1 and, when the voltage thus detected is within a tolerable input voltage of a power source unit 5, an on/off signal transmitter circuit 4 allows an on/off signal generator circuit 3 to transmit an on/off signal S2 to the power source unit 5. When the voltage of the battery 1 becomes lower than a lower limit of the tolerable input voltage range of the power source unit 5 due to increase of a power consumption of a load 6 thereof, the on/off signal transmitter circuit 4 transmits an off signal S3 to the power source unit 5 regardless of the on/off signal S2 from the on/off signal generator circuit 3. Thus, it is possible to prevent an erroneous operation of the load due to abnormal operation of the power source unit.

Abstract: A dynamoelectric machine includes a stator having a stator core. A winding is provided on the stator core and the stator core has a stator bore. A rotor including a rotor core is received in the stator bore. A permanent magnet is mounted on the rotor core periphery and a rotor shaft is mounted on the rotor core. Bearing means are provided for supporting the rotor shaft for rotation relative to the stator. A first circuit board having electrical components thereon is used in operating the dynamoelectric machine, and a second circuit board having an electrical component in the form of a sensing device thereon is used in determining the position of the rotor. The first circuit board is constructed for mounting the second circuit board thereon so that the second circuit board projects axially inwardly from the first circuit board and the sensing device is disposed in an axial position overlapping the axial position of the permanent magnet.

Abstract: The modular conveyor system comprises N interconnected track sections, forming a continuous track, wherein each track section features a plurality of individually controlled coils stretching along the length thereof. Plural pallets, each having thrust producing magnets, travel independently alone the track. The track also comprises multiple linear encoder readers spaced at fixed positions therealong, and each pallet includes a linear encoder strip having a length R greater than the spacing E between the readers. Track section controllers associate the encoder strips with only one reader at any time in order to resolve the position of the pallets based on the fixed position of the readers and the relative positions of the strips in relation thereto. The section controllers also regulate and commutate the coils of the corresponding track sections in order to independently control each pallet. Communication links interface adjacent section controllers situated in adjacent track sections.

Abstract: In an insulation structure of a rotary electric machine, a stator winding has connection portions covered with reliable insulation resin coating. The modulus of elasticity of the insulation resin is less than a value which may not cause the insulation resin coating to peel off. The modulus of elasticity changes with the thickness of the insulation resin coating.

Abstract: A permanent magnet type stepping motor capable of exhibiting increased rotational angle accuracy and static angle accuracy. Claw pole type yoke units each include two yokes each provided with n (n: a positive integer of 4 or more) pole teeth. One of the yokes includes n/m pole teeth arranged in each of angular ranges of 360° /m (m: a divisor of n other than 1 and n). Pitches a between pole teeth positioned in each angular range are set to be within a range of (90° /n) [4−m/(n−m)] <a<(360° /n). A pitch b between two pole teeth positioned on both side of a boundary between each adjacent two angular ranges is set to be within a range of (360° /n)<b<(450° /n). The other yoke has pole teeth arranged between the pole teeth of the one yoke.

Abstract: The present invention provides internally damped stators, rotors, and transformers; internally damped cores from which they may be made; and a method of making the aforementioned.

Abstract: In order to assure efficient cooling and a temperature balance between the stator and the rotor, an asynchronous electric motor is provided containing a closed cooling liquid circuit which passes successively into the stator (1) and into the shaft (3) of the rotor, over the entire length of the stator and the rotor. A pump (15) is incorporated in the rotor shaft. The liquid is injected into the pump by a stationary axial tube (16) and comes out again between the shaft and this tube. The pump includes a centrifugal pumping member (20) fixed to the bottom of the bore of the shaft, and longitudinal-blades (21) fixed to the shaft facing an external helicoid rib (17) of the injection tube. The liquid is cooled by the ambient air along the periphery of the stator.

Abstract: A motor including a motor unit (2) has at least one plastics material portion (4). A two-part casing (5) receives at least one electronic circuit card. The casing is formed of two complementary portions (5a, 5b) joining on a plane (P) passing through a diagonal plane of the casing and provided with means (7) to receive the circuit card and complementary fixing means (9, 10, 11). One portion (5a) of the casing is in one piece with the plastics material (4) of the motor unit and the other portion (5b) includes an envelope (8) for a connector for connecting the motor to the remainder of the circuits of the vehicle.

Abstract: A magnetic bearing wherein a stator is magnetically interacted with a rotor and is movable in response to feed-back of rotor position to thereby use the magnetic interaction between the stator and rotor to effect movement of the rotor toward a predetermined rotor position for bearingly controlling the rotor position. The bearing may be a radial or thrust bearing.

Abstract: A motor assembly that is useful for operating various devices on a vehicle includes a unique arrangement for securing a detector arrangement within the motor assembly. The detector arrangement includes a first portion that is supported on a shaft associated with the rotor portion of the assembly. A second portion of the detector arrangement is supported by a flange, which is associated with the stator of the assembly. The second portion of the detector assembly includes a printed circuit board that is received within a recessed housing formed on the flange. The recessed housing includes at least one surface that abuts the circuit board into a position where cooperating locking features operate to secure the printed circuit board in a desired position on the flange.

Abstract: A magnetic bearing system contains magnetic subsystems which act together to support a rotating element in a state of dynamic equilibrium and dampen transversely directed vibrations. Mechanical stabilizers are provided to hold the suspended system in equilibrium until its speed has exceeded a low critical speed where dynamic effects take over, permitting the achievement of a stable equilibrium for the rotating object. A state of stable equilibrium is achieved above a critical speed by use of a collection of passive elements using permanent magnets to provide their magnetomotive excitation. In a improvement over U.S. Pat. No. 5,495,221, a magnetic bearing element is combined with a vibration damping element to provide a single upper stationary dual-function element.

Abstract: An electric motor, including at least two permanent magnet segments disposed around a motor longitudinal axis, in which each permanent magnet segment has end faces extending in the direction of the motor longitudinal axis and is encompassed by two independent yoke ring segments that have a gap between them parallel to a symmetry plane extending through the motor longitudinal axis and the center of the permanent magnet segments in order to reduce the armature transverse field. In addition to the reduction of the armature transverse field, a weight reduction of the electric motor is also achieved. To this end, in a first region close to the end faces of the permanent magnet segments, the one-piece magnetically conductive yoke is provided with a larger cross section than in a second region close to the symmetry plane extending through the center of the permanent magnet segments. The construction is particularly suited for small electric motors, in particular d.c. motors that are excited by permanent magnets.

Abstract: A brushless synchronous electrical machine includes a rotor rotating about a rotor axis, and a stator that includes at least one set of magnetically active stator cores projecting radially outward from the axis, and that also includes magnetically interactive crossbars on the radially outward ends of the stator cores. The rotor includes one or more magnetically active projections that sweep past the radially inward facing surfaces of the crossbars as the rotor rotates. Preferably, there are two sets of stator cores, displaced axially and staggered azimuthally with respect to each other. Stator windings are wound toroidally about the stator cores. The rotor is provided with a magnetic field, preferably by electrical current in one or more axial windings wound toroidally with respect to the rotor axis.

Abstract: A microactuator includes a stationary element, a movable element, and a first microstructure. The stationary element is fixed on a substrate and has a plurality of stationary element electrodes arranged at a predetermined pitch. The movable element has a plurality of movable element electrodes opposing to the stationary element electrodes. The movable element is moved by applying a voltage across the stationary element and the movable element. The first microstructure is formed on at least one of the opposing surfaces of the movable element and the stationary element to prevent the movable element from attaching to the stationary element.

Abstract: Modular control patches including assemblies of sensors and actuators are provided to impart or control vibration of foundation members such as struts in aerospace apparatus. Local analog electronic control means is associated with each control patch assembly. Patches are attached mechanically or by chemical bonding to the outside of the struts. The corresponding electronics can be selectively removed and replaced. The patch being the sensors and actuators may also be attached or embedded with a composite structure.

Abstract: A stacked type electro-mechanical energy conversion element for use with a vibration driven device and a power supply includes a surface layer, a first surface electrode made of conductive material formed in the surface layer, for receiving a driving electrical signal from the power supply, and a second surface electrode formed in the surface layer that defines an index, where the second surface electrode is formed of the same material as the first surface electrode.

Abstract: A vibration damper assembly for a ring resonator of a vibrating structure gyroscope has a female portion attachable to a body of the gyroscope so as to have limited resiliency with respect to the body in a direction substantially perpendicular to the body. A male portion is fixedly attachable at one end to a resonator of the gyroscope, projectable into the female portion and fixedly attachable at its other end in and to the female portion. The assembly permits damping of vibratory movement of the resonator in a direction substantially perpendicular thereto whilst retaining stiffness and freedom to vibrate for the resonator in the plane thereof.

Abstract: The present invention relates to a piezo-electric torque actuator with low stress electrodes. The present invention is specially used to produce tilting motions in high frequency ranges. The invention provides for forming a piezo-electric stack element with required external electrical connection contacts with a substantially reduced mechanical load and which direct tilting motions without required additional means for motion transformation. The present invention is formed of at least two areas of piezo-electric stacks, and an area arranged there between which contains segments that are affect only partially or are unaffect by an electrical field generated by the flat laminate contacts. This is accomplished by disposing external electrode connections of the two areas as far as possible in the direction of field-reduced or field-free areas, wherein the in between area is connected with the two areas (1 and 2) at least in positive fit.

Abstract: A piezoelectric ceramic-polymer composite is made of a substantially two-dimensional polymer matrix and a monolayer of sintered piezoelectric ceramic granules dispersed throughout the matrix so that each granule has an upper portion protruding from one side of the matrix and a lower portion protruding from the opposite side of the matrix. The composite is formed by partially embedding a monolayer of sintered piezoelectric ceramic granules in a pliable material, then partially covering the granules with a polymer resin, curing the resin to form a matrix and removing the pliable material. A transducer is formed by flattening the upper and lower portions of the granules to form coplanar top and bottom surfaces parallel to, but not coplanar with the surface of the matrix, then electroding the granule surfaces, attaching top and bottom cover plates, and sealing the transducer around the edges.

Abstract: A piezoelectric vibrator using thickness mode as the primary vibration and having a cross section of a bevel or convex configuration is provided which is superior in mechanical strength, easy to steadily mount, and has a small dispersion of characteristic. By employing a structure in which a vibrator 1 and a support section 2 are composed of the same material, the end portions of the vibrator section are integrated with the support section on the periphery of the vibrator, and the configuration of the cross section of the vibrator 1 is such that the thicknesses of the end portions of the vibrator are smaller than that of the central portion of the vibrator, a superior mechanical strength without chipping or cracking at the end portions of the vibrator is obtained allowing easy mounting while keeping the vibrator size small.

Abstract: In a spark plug, a resistor is placed between a terminal and a center electrode within a through hole of an insulator. The through hole of the insulator has a first portion which allows the center electrode to be inserted therethrough, and a second portion which is formed on a rear side of the first portion so as to be larger in diameter than the first portion and which accommodates the resistor therein, where the second portion is connected to the first portion via a connecting portion including a two- or more-stepped reduced-diameter portion. Then, an electrically conductive glass seal layer is placed at a position corresponding to the connecting portion between the resistor and the center electrode.

Abstract: The invention relates to the fastening of incandescent coil filaments to current lead-in wires in electric lamps. One end (41) of the current lead-in wires is flattened and U-shaped. The U-shaped segment (41) of the current lead-in wire forms a gap-like seat (45) for a coiled incandescent coil-filament end (3a), the gap width of which is smaller than the outside diameter of the incandescent coil-filament end (3a).