Patents Issued in February 20, 2003
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Publication number: 20030034555Abstract: A mold (1) for a semiconductor chip (9) has two mold halves (2, 3). One mold half (3) includes sealing means (10) adapted to exert a sealing pressure between a surface of the mold and a surface (18) of a substrate (8) located in the mold (1) during a molding operation.Type: ApplicationFiled: August 15, 2001Publication date: February 20, 2003Applicant: ASM Technology Singapore Pte. Ltd.Inventors: Shu Chuen Ho, Teng Hock Kuah, Si Liang Lu, Srikanth Narasimulau, Charles J. Vath
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Publication number: 20030034556Abstract: An integrated semiconductor circuit including a substrate and at least one microwave circuit area supported by a substrate is provided, at least one cooling area supported by the substrate being provided for cooling the microwave circuit area, the at least one cooling area having electric contacts and regions having different types of doping so that cooling may be accomplished by the Peltier effect.Type: ApplicationFiled: July 10, 2002Publication date: February 20, 2003Inventors: Klaus Voigtlaender, Michael Thiel
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Publication number: 20030034557Abstract: A chip carrier has a cavity portion for receiving a semiconductor chip and a flange portion along at least a portion of a top perimeter of the cavity portion. The module preferably includes a substrate (e.g., a PCB or chip carrier substrate) having a slot for receiving the cavity portion of the chip carrier, with the flange portion of the chip carrier being supported by the substrate. The flange portion is preferably electrically conductive and grounded, so that appropriate conductive pads on the chip can be wire bonded to the flange, while other on-chip pads can be wire bonded to designated pads on the substrate surface.. The cavity portion is also preferably thermally conductive to provide a thermal path for the semiconductor chip. In another embodiment, a relatively thick flanged chip mounting pad is also received within a substrate slot to provide improved heat dissipation.Type: ApplicationFiled: August 16, 2001Publication date: February 20, 2003Inventors: Prem Swarup Gupta, Edward Curtis Douglas
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Publication number: 20030034558Abstract: An inspection pattern, an inspection method, and an inspection system for detection of a latent defect of a multi-layer wiring structure formed on the semiconductor wafer. The inspection pattern includes lower-layer wiring portions, upper-layer wiring portions, an insulating layer provided between them, contact units connecting them to form a contact chain, and electrode terminals. The inspection method includes the steps of acquiring an applied-voltage versus measured-current characteristic or an elapsed-time versus measured-voltage characteristic of the inspection pattern, and judging presence or absence of a latent defect of the inspection pattern on the basis of the acquired characteristic. The inspection system includes a voltage-applying/current-measuring device or a constant-current-feeding/voltage-measuring device, and a judging device for judging presence or absence of a latent defect of the inspection pattern.Type: ApplicationFiled: August 12, 2002Publication date: February 20, 2003Inventors: Eiichi Umemura, Hiroyuki Fukunaga, Hiroyuki Nakayashiki
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Publication number: 20030034559Abstract: A method for electrically connecting a semiconductor chip to solder balls on a BGA (Ball Grid Array) package is proposed. The proposed method is characterized by the use of an electrically-conductive bridge to span in an overhead manner across a continuous electrically-conductive trace that is interposed between a corresponding pair of bond finger and via. The electrically-conductive bridge can be either a gold wire bonded through existing wire-bonding process, or a zero-resistance chip resistor bonded through existing surface-mount technology (SMT). Conventionally, the interposing trace can be bypassed by using a multi-layer substrate. By the proposed method, however, it can be implemented on existing single-layer substrate without having to use multi-layer substrate, and which can be implemented by using existing technology, such as wire-bonding technology or surface-mounting technology, without having to employ more expensive and advanced technologies.Type: ApplicationFiled: August 14, 2001Publication date: February 20, 2003Applicant: Siliconware Precision Industries Co., Ltd.Inventor: Chih Chin Liao
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Publication number: 20030034560Abstract: A wiring structure of a semiconductor device according to the present invention comprises a first conducting layer for electrically connecting with a semiconductor element or a wiring element formed on a semiconductor substrate, a barrier metal formed on the first conducting layer, and a second conducting layer formed on the barrier metal, for electrically connecting with the first conducting layer via the barrier metal, in which the barrier metal is formed of WNx (tungsten nitride) or WSixNy (tungsten silicide nitride).Type: ApplicationFiled: May 5, 2000Publication date: February 20, 2003Inventors: KIMIHIRO MATSUSE, HAYASHI OTSUKI
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Publication number: 20030034561Abstract: First, a lower layer wiring is formed on a semiconductor substrate. Then, an interlayer insulating film is formed on the lower layer wiring. Next, a first Ti film is formed on the interlayer insulating film. Thereafter, a TiN film is formed on the first Ti film. Then, a via hole is formed in the TiN film, the first Ti film and the interlayer insulating film such as to reach the lower layer wiring. Then, a second Ti film and an Al or Al alloy film are sequentially formed in the via hole and on the TiN film. Next, a thermal treatment is carried out, thereby allowing Ti in the second Ti film and Al in the Al or Al alloy film to react with each other in a bottom of the via hole.Type: ApplicationFiled: October 21, 2002Publication date: February 20, 2003Inventor: Kazumi Sugai
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Publication number: 20030034562Abstract: A semiconductor device is designed by disposing a plurality of cells. The semiconductor device is equipped with a semiconductor substrate 1, transistors formed in the semiconductor substrate, a first wiring pattern 100 and a second wiring pattern 200 formed respectively in a first cell and a second cell disposed adjacent to each other in a X direction in a wiring layer disposed over the semiconductor substrate in layer, the first wiring pattern 100 and the second wiring pattern 200 having portions extending in parallel with each other in a Y direction perpendicular to the X direction, and an interlayer dielectric layer formed as a lower layer of the wiring layer, the interlayer dielectric layer having openings formed at locations corresponding to a position 11 or 12 of the first wiring pattern and a position 22 or 21 of the second wiring pattern, respectively.Type: ApplicationFiled: July 30, 2002Publication date: February 20, 2003Inventor: Toru Hokari
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Publication number: 20030034563Abstract: An integrated circuit package is constructed by attaching lower dies to a substrate that has bond fingers deposited on its surface. One lower die and its associated bond fingers are located offset from the center of the substrate. The lower dies are electrically coupled to the substrate's bond fingers with lower bond wires. An upper die is stacked on at least one of the lower dies. The upper die is electrically coupled, with bond wires, to the lower die upon which it is mechanically coupled. Each of the lower dies may be coupled to the other lower die with bond wire bridges that span the lower bond wires. The upper die may be electrically coupled, with bond wire bridges, to any or all of the lower dies.Type: ApplicationFiled: August 17, 2001Publication date: February 20, 2003Inventors: Edward Reyes, Fifin Irzhann
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Publication number: 20030034564Abstract: Integrated packages incorporating multilayer ceramic circuit boards mounted on a metal support substrate can be used for temperature control by the metal support substrate. Various electronic components, as well as additional temperature control devices, can be connected to the circuit boards and to the metal support substrate to control or regulate the temperature of operation of the components. The integrated package can be hermetically sealed with a lid.Type: ApplicationFiled: July 19, 2002Publication date: February 20, 2003Inventors: Ponnusamy Palanisamy, Attiganal Narayanaswamysreeram, Ellen Schwartz Tormey, Barry Jay Thaler, John Connolly, Ramon Ubaldo Martinelli, Ashok Narayan Prabhu, Mark Stuart Hammond, Joseph Mazzochette
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Publication number: 20030034565Abstract: The present invention discloses a flip-chip package assembly. The flip-chip package assembly includes a flipped IC chip having a plurality of input/output terminals mounted onto a substrate wherein the substrate includes a plurality of conductive columns disposed on top the substrate with each of the conductive columns disposed at a location corresponding to a location of one of the input/output terminals on the IC chip. The substrate further includes a layer of low-modulus polymer layer disposed on top of the substrate surrounding and bonding to the conductive columns to flexibly yield to bending of the conductive columns.Type: ApplicationFiled: August 19, 2002Publication date: February 20, 2003Inventors: James Jaen-Don Lan, Chien Wei Chang
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Publication number: 20030034566Abstract: A method and structure for reducing chip carrier flexing during thermal cycling. A semiconductor chip is coupled to a stiff chip carrier (i.e., a chip carrier having an elastic modulus of at least about 3×105 psi), and there is no stiffener ring on a periphery of the chip carrier. Without the stiffener ring, the chip carrier is able to undergo natural flexing (in contrast with constrained flexing) in response to a temperature change that induces thermal strains due to a mismatch in coefficient of thermal expansion between the chip and the chip carrier. If the temperature at the chip carrier changes from room temperature to a temperature of about −40° C., a maximum thermally induced displacement of a surface of the chip carrier is at least about 25% less if the stiffener ring is absent than if the stiffener ring is present.Type: ApplicationFiled: September 30, 2002Publication date: February 20, 2003Inventors: Lisa J. Jimarez, Miguel A. Jimarez
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Publication number: 20030034567Abstract: A semiconductor device 1000 in accordance with the present invention has a structure having multiple wiring layers, and includes a bonding pad 40a, dummy wiring forming regions 35 including dummy wirings 30, and dummy wiring prohibiting regions 15 where dummy wirings are not formed. The dummy wiring prohibiting regions 15 are provided at least below a region where the bonding pad 40a is formed.Type: ApplicationFiled: July 31, 2002Publication date: February 20, 2003Inventors: Hisakatsu Sato, Tomoo Takaso
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Publication number: 20030034568Abstract: A semiconductor package and a fabricating method thereof are proposed, in which a substrate is prepared for having at least one flash preventing mechanism disposed on a surface of the substrate corresponding to a position in front of an entry of an air vent in a mold. After a semiconductor chip is mounted on the substrate by a plurality of conductive elements, a molding compound having high fluidity and fine filler particles is used to encapsulate the chip and the flash preventing mechanism. As the flash preventing mechanism is disposed in a manner of reducing the entry space of the air vent, the flow of the molding compound is impeded by the flash preventing mechanism, making the molding compound rapidly absorb heat of the mold and accordingly increased in viscosity. This helps prevent flash of the molding compound from occurrence, and assure the semiconductor package in quality and profile.Type: ApplicationFiled: August 18, 2001Publication date: February 20, 2003Applicant: Siliconware Precision Industries, Co., Ltd.Inventors: Ting Ke Chai, Po Hauu Yuan, Han Ping Pu
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Publication number: 20030034569Abstract: An electronic package and method of making same in which a thermally conductive member is in thermally conductive communication with a semiconductor chip encapsulated within a dielectric material that surrounds portions of a thermally conductive member, semiconductor chip, and a predefined portion of a circuitized substrate. The present invention's thermally conductive member includes two portions of different bending stiffness to assure reduced interfacial stresses between the semiconductor chip and the circuitized substrate.Type: ApplicationFiled: October 18, 2002Publication date: February 20, 2003Applicant: International Business Machines CorporationInventors: David V. Caletka, Eric A. Johnson
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Publication number: 20030034570Abstract: Methods of correcting for overlay error, wherein the methods account for relative offset across the field of exposures of more than one photolithography projection system, as well as systems to perform the methods and apparatus produced therefrom. The methods include defining at least two zones within a field of a mask having substantially similar overlay error values. The methods further include modifying the coordinates of a feature of the mask in response to a correction for the zone to which the feature is mapped, where the correction corresponds to a nominal overlay error value for that zone.Type: ApplicationFiled: August 26, 2002Publication date: February 20, 2003Applicant: Micron Technology, Inc.Inventor: Bill Baggenstoss
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Publication number: 20030034571Abstract: With a P well region being divided, NMOS transistors N1 and N3 are formed in the first P well region, and NMOS transistors N2 and N4 in the second P well region. Alternatively, with a N well region being divided, PMOS transistor P1 is formed in the first N well region, and PMOS transistor P2 in the second N well region.Type: ApplicationFiled: August 5, 2002Publication date: February 20, 2003Inventor: Koji Nii
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Publication number: 20030034572Abstract: N well contact area 13 is integrally formed with second diffused area 12 within the upper parts of a N well and a P well, and P well contact area 14 is integrally formed with first diffused area 11 in the upper parts of the P well and the N well.Type: ApplicationFiled: August 5, 2002Publication date: February 20, 2003Inventors: Koji Nii, Yoshiki Tsujihashi, Hisashi Matsumoto
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Publication number: 20030034573Abstract: A humidifier includes a housing, a fan assembly, a wick assembly, a first humidity sensor, a second humidity sensor, and a controller. The housing has an air inlet, an air outlet, and a reservoir for holding water. The fan assembly creates an airflow through the housing from the inlet to the outlet. The wick assembly is in fluid communication with the water in the reservoir and extends into the airflow within the housing for adding moisture to the airflow. The first humidity sensor measures an ambient air relative humidity and produces a first signal corresponding to the ambient air relative humidity. The second humidity sensor measures an outlet air humidity and produces a second signal corresponding to the outlet air humidity. The controller is in electrical communication with the first and second humidity sensors. The controller receives the first and second signals and performs calculations to produce an output signal.Type: ApplicationFiled: August 13, 2002Publication date: February 20, 2003Applicant: Hamilton Beach/Proctor-Silex, Inc.Inventor: Patrick T. Mulvaney
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Publication number: 20030034574Abstract: A cutting method for cutting an optical lens and/or a molding die therefor includes rotating the optical lens and/or the molding die about the optical axis, moving a cutting blade in a direction perpendicular to an optical axis to cut the optical lens and the molding die, and varying the feed pitch of the cutting blade in the direction perpendicular to the optical axis in accordance with the position of the optical lens and/or the molding die in the radial direction.Type: ApplicationFiled: July 16, 2002Publication date: February 20, 2003Applicant: Asahi Kogaku Kogyo Kabushiki KaishaInventors: Takashi Tohara, Takashi Numao
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Publication number: 20030034575Abstract: A process for producing solid, porous graphites which provides a more uniform density gradient throughout the ultimate product. The process utilizes a pressure drop during processing in order to induce boiling and varies the processing pressure between an initial pressure which exceeds 1000 psig and a final processing pressure which generally exceeds the initial pressure. The particular processing techniques employed allow additional viscosity manipulation as well as improved density gradient characteristics in the ultimate product. The final products have bulk thermal conductivities in the range from 90-300 W/mK with apparent densities ranging from about 0.678 g/cc-1.Type: ApplicationFiled: August 9, 2001Publication date: February 20, 2003Inventors: Leland A. Hardcastle, Rex G. Sheppard, David F. Dingus
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Publication number: 20030034576Abstract: An apparatus for forming concrete structures includes a first truss module and a second truss module, as well as a first and a second concrete form. The apparatus further includes a first and a second actuator device. Each first and second actuator device is mounted on the respective first and second truss module, and each first and second actuator device can move the respective first and second form translationally with respect to the respective first and second truss module. A yoke connects the first truss module to the second truss module to thereby place the concrete forms in generally parallel, spaced-apart relationship. A climbing device attached to the yoke can engage a climb rod and can move the apparatus upward along the climb rod.Type: ApplicationFiled: April 25, 2002Publication date: February 20, 2003Inventor: Matthew Russell
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Publication number: 20030034577Abstract: An injection molding machine includes a plasticating unit for plasticating a thermoplastic resin, and an injecting unit connected to the plasticating unit through a connecting passage to inject the plasticated resin into a mold. The injecting unit A includes a rotary pump having a suction port connected to the plasticating unit through the connecting passage and a discharge port connected to the mold. The plasticated resin is intermittently injected into the cavity of the mold through the injection port by means of the rotary pump. In the connecting passage, an accumulator is provided which reserves the resin plasticated in the plasticating unit in an amount equal to or more than the shot capacity, and feeds the resin to the rotary pump.Type: ApplicationFiled: September 30, 2002Publication date: February 20, 2003Inventors: Kunihito Seta, Takeshi Takeda
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Publication number: 20030034578Abstract: A manufacturing method of a polyurethane foam injected with strand mats and a device for increasing the volume of the strand mats. The method comprises the steps of: increasing the volume of each of the strand mats to weaken the cohesion between glass fibers in each of the strand mats; continuously supplying and transferring the volume-increased strand mats; spraying a polyurethane foam solution on the continuously transferred strand mats; and foam molding the polyurethane foam solution in which the strand mats are immersed, into a polyurethane foam. Because the cohesion between the glass fibers in the strand mat is weakened and the volume of the strand mat is increased, the polyurethane foam solution uniformly permeates into the strand mats. As a result, the productivity of the polyurethane foam is improved and the variations in a variety of the mechanical properties are minimized.Type: ApplicationFiled: July 2, 2002Publication date: February 20, 2003Applicant: HAN KUK FIBER GLASS CO., Ltd.Inventors: Jong Sik Kim, Young Soo Kwon, Jung Meung Roh
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Publication number: 20030034579Abstract: A method and an apparatus for manufacturing a polyurethane foam injected with strand mats. After a polyurethane foam solution is sprayed on the strand mats, the strand mats are moved upward and downward by prominences and depressions and then intermittently pressed by a pressing device, thereby the air in the strand mats being exhausted to the outside. Therefore, the polyurethane foam solution uniformly permeates into the strand mats. As a result, the insulating effect and mechanical strength of the polyurethane foam are increased, uniform surface with no air spaces is obtained, the mechanical properties are made uniform, and shrinkage, cracking, distortion and the like are prevented under a super-low temperature such as less than −165° C.Type: ApplicationFiled: July 2, 2002Publication date: February 20, 2003Applicant: HAN KUK FIBER GLASS CO., LTD.Inventors: Jong Sik Kim, Young Soo Kwon, Jung Meung Roh
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Publication number: 20030034580Abstract: A method for producing expanded polypropylene resin particles wherein polypropylene resin particles impregnated with a physical blowing agent are heated along with an aqueous medium and a dispersant and are released and expanded at reduced pressure from the interior of a pressure-tight vessel, wherein the aforementioned aqueous medium has an electrical conductivity of from not less than 0.00 ms/m to not more than 20.00 mS/m. The resulting particles obtained are without inconsistencies caused by differences in the amount of dispersant adhering to the particles or the amount of dispersant added to prevent the particles from fusing together during the heat treatment step of the method.Type: ApplicationFiled: June 7, 2002Publication date: February 20, 2003Applicant: JSP CORPORATIONInventors: Hidehiro Sasaki, Kazuya Ogiyama, Akinobu Hira, Keiichi Hashimoto, Hiroki Yanagisawa, Hisao Tokoro
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Publication number: 20030034581Abstract: A method and equipment for making plastic floor tiles of different thickness includes polyvinyl chloride (PVC) of one color or different colors heated first and then moved to a first press roller unit of a compress extending machine to be compressed into a first half-finished product. Then this first half-finished product get through a second and a third press roller units to be respectively compressed into a second half-finished product and a third half-finished (or finished) product. Further, a heating device is provided respectively beside the second and the third press roller units for heating the half-finished products with balanced temperature. Thus, the half-finished product is properly fused to make finished plastic floor tiles with different thickness from 0.5 mm to 3 mm.Type: ApplicationFiled: August 17, 2001Publication date: February 20, 2003Applicant: DELIGHT PLASTIC CO., LTD.Inventor: Kuang Pao Lo
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Publication number: 20030034582Abstract: This invention relates to methods for manufacturing large PTFE parts by compression molding followed by sintering. The method comprises layering modified and unmodified PTFE in a mold, and compressing the layers to form a preform part. Once the preform parts are formed, they are assembled such that the areas of preform parts which are to be bonded together are the modified PTFE sections. The parts are then sintered and the modified PTFE sections bond together creating a strong, durable, bond.Type: ApplicationFiled: August 5, 2002Publication date: February 20, 2003Inventors: Roxanne Dittrich, Taggart William Albert Mills
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Publication number: 20030034583Abstract: Stretchable fastener products are formed by providing a sheet-form fastener tape, slitting the fastener tape to form longitudinally extending bands of fastener tape and separating the longitudinally extending bands to space the fastener tape bands transversely apart. The spaced bands are attached to a sheet form elastic web to form a stretchable fastener product. In some examples, the stretchable fastener product is formed continuously in conjunction with manufacture of the sheet-form fastener tape.Type: ApplicationFiled: September 13, 2002Publication date: February 20, 2003Applicant: Velcro Industries B.V.Inventor: George A. Provost
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Publication number: 20030034584Abstract: Disclosed is to provide generally to a microfiber substrate of improved carding ability and its manufacturing method, and more particularly to a micro-fiber spun by conjugated melting of crystallization difference of high crystallization polymer and low crystallization polyester, drawn to form an unsplit microfiber staple having a layer of thin film in its surrounding, the said microfiber staple which is still kept in unsplitting state during opening , carding and lapping treatment, will be split just at the layer of thin layer of its surrounding of the said microfiber staple by spunlace to completely split from the said microfiber, knitted to form water-jet punch web, then subject to hot water to shrink to densification. The microfiber nonwoven web excellent in the wiping effect, cleaning effect and microfiber artificial leather excellent in the hand feeling and fluff compaction without environment pollution is enabled to offer the artificial leather more cheaply and easily finished.Type: ApplicationFiled: July 31, 2001Publication date: February 20, 2003Applicant: San Fang Chemical Industry Co., Ltd.Inventors: Ching-Tang Wang, Lin Mong-Ching, Cheng Kuo-Kuang, Lin Chin-Yi
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Publication number: 20030034585Abstract: A stretching device and method of manufacturing stretched synthetic filaments (2, 3) includes a spinning device (1) and a pneumatic drawing-off device (10). A heating device (5) is situated between the spinning device (1) and the drawing-off device (10) which heats the filaments (2, 3) to a temperature between their glass-transition temperature and their melting temperature.Type: ApplicationFiled: August 5, 2002Publication date: February 20, 2003Inventors: Engelbert Locher, Helmut Leiner, Robert Groten, Peter Dengel, George Riboulet
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Publication number: 20030034586Abstract: A process for producing a ceramic structure, which comprises adding an organic assistant to a ceramic raw material mixture, kneading them to obtain a readily formable bullet, and extruding the readily formable bullet to obtain a ceramic structure, wherein the organic assistant is composed mainly of an organic compound giving a haze of 10 to 90% when made into a 5 weight % aqueous dispersion. According to the process, the load to the extruder is small and a ceramic structure can be produced at high shapability and a high productivity.Type: ApplicationFiled: August 14, 2002Publication date: February 20, 2003Inventors: Kyoko Makino, Yasushi Noguchi
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Publication number: 20030034587Abstract: A resin molded article and a production method thereof, including the processes of heat-molding a molding material containing a biodegradable resin and a reinforcing fiber or a biodegradable resin, a reinforcing fiber after controlling a water content thereof, or non-controlling. The resin molded article according to the present invention has sufficient heat resistance so that they are not deformed even after being temporarily left in a high temperature environment such as that in an automobile in the daytime in summer seasons and being heated to a high temperature, without deteriorating the properties thereof as members for recording materials, and therefore cause no environmental problems when left in nature since they can be finally decomposed by microorganisms.Type: ApplicationFiled: August 1, 2002Publication date: February 20, 2003Applicant: FUJI PHOTO FILM CO., LTD.Inventors: Fumiyuki Suzuki, Tadashi Mochizuki
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Publication number: 20030034588Abstract: There is provided a method for manufacturing a structural body comprising: a structural body formation step of forming the structural body by combining a plurality of constituent members through a bonding adhesive; a closed space formation step of disposing the structural body into a pressurizing or heating unit, forming a closed space with at least one of the structural body and the pressurizing or heating unit, and charging an elastic body into the closed space; a hardening step of fixing or hardening the bonding adhesive through the elastic body by the pressurizing or heating unit; and a discharge step of discharging the elastic body from the closed space.Type: ApplicationFiled: July 30, 2002Publication date: February 20, 2003Applicant: Fuji Jukogyo Kabushiki KaishaInventors: Junji Miura, Atsushi Harada, Seiji Maruyama, Eikatsu Yamaguchi, Yasushiro Toi
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Publication number: 20030034589Abstract: A method for processing a film. The method impressing the whole surface or a selected surface of the film to form protuberant structures on the film by using a transfer and an impresser which has grain projections formed thereon, wherein the protuberant structures have a protuberant shape with an opening hole on the tip or without an opening hole on the tip.Type: ApplicationFiled: February 25, 2002Publication date: February 20, 2003Inventors: David Lin, K. M. Chang, Chi-Ping Chang
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Publication number: 20030034590Abstract: A method and apparatus for compacting particles or granules in discrete cavities spaced along an article or articles such as a cigarette filter rod moved underneath the compacting system. The compacting system can be provided with spaced lugs or other protrusions that selectively compact particles within cavities, or a smooth outer periphery that results in progressive compaction of the entire article being moved underneath the compaction system. The article having cavities with particles that need to be compacted can be supported on a support rail with side support rails that maintain the shape of the article during the compaction process.Type: ApplicationFiled: August 17, 2001Publication date: February 20, 2003Inventors: Ahmet Ercelebi, Martin T. Garthaffner, Janet L. Thompson, Steven Frederick Spiers
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Publication number: 20030034591Abstract: A perovskite feedstock (powder or preform) is placed in a high-pressure cell of a high pressure/high temperature (HP/HT) apparatus and subjected to pressures in excess of about 2 Kbar and temperatures above about 800° C. for a time adequate to increase the density of the preform.Type: ApplicationFiled: August 16, 2001Publication date: February 20, 2003Inventors: Suresh S. Vagarali, John W. Lucek
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Publication number: 20030034592Abstract: A carriage assembly is shown for moving equipment for testing or other functions along a wall surface. The carriage assembly includes a main frame for supporting the equipment in relationship to other equipment and to the wall surface, and a sub-frame that supports service lines such as wires and hoses, while isolating loads created by moving the service lines with the carriage from the main frame and the mounted equipment and providing an unobstructed field of view of the subject area under examination. Wheels mounted on the carriage assembly for providing the interface with the wall surface include fixed position wheels and adjustable wheels to compensate for irregularities along the wall surface. At least one of the fixed position wheels or the adjustable wheels are magnetic for holding the carriage against a ferrous or magnetic wall surface.Type: ApplicationFiled: August 20, 2001Publication date: February 20, 2003Inventors: Thomas L. Reilly, A. Ronald Jacobstein
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Publication number: 20030034593Abstract: The present invention provides an effective method for mechanically removing iron oxide films formed on surfaces of a hot rolled steel strip with a high temperature.Type: ApplicationFiled: August 26, 2002Publication date: February 20, 2003Inventor: Jae-Kon Lee
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Publication number: 20030034594Abstract: A spring bushing, in particular for prestressing a piezoelectric actuator in a valve for controlling fluids, is disclosed, which is a one-piece deep-drawn part, which is hollow and at least approximately cylindrical. The one-piece body is provided with a number of openings distributed over the circumference and length of the body.Type: ApplicationFiled: August 16, 2002Publication date: February 20, 2003Applicant: Robert Bosch GmbHInventors: Dietmar Schmieder, Uwe Bruetsch
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Publication number: 20030034595Abstract: An air bearing regulated load-dependent for use in automotive engineering is formed by a central plate through which a freely movable, rigid coupling pin passes axially and is rigidly connected to both a support connector member on the support side and a counterplate on the opposite side. An air spring hose ring that can be variably charged with compressed air or gas is arranged between the support connector member and the central plate and an absorber hose ring is inserted on the opposite side of the central plate between the central plate and a counterplate. The two hose ring systems are directly connected to one another via one or more throttle nozzles. The absorber hose ring has a nozzle or a regulating valve that variably opens the absorber hose ring to the ambient air.Type: ApplicationFiled: August 1, 2002Publication date: February 20, 2003Inventor: Franz Josef Wolf
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Publication number: 20030034596Abstract: A seat post for a cycle has inner and outer members that are slidably mounted together forming a variable volume chamber. The variable volume chamber communicates with a fixed volume chamber in the inner member through orifices and a check valve. Slots are formed in the inner member, and a pin extends from the outer member through the slots. A cushion at one end of the slots prevents hard top-out.Type: ApplicationFiled: August 20, 2002Publication date: February 20, 2003Inventors: Darek C. Barefoot, David R. Warnick, Thomas A. Hochanadel, Timothy A. Fry
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Publication number: 20030034597Abstract: Passive shock filtering apparatus that filters shock waves experienced by structural systems, such as spacecraft and its structures and components, for example. The shock filtering apparatus reflects energy back to a shock source, and generally reflects a propagating shock wave within the boundary of the apparatus. In general, the apparatus comprises a member disposed adjacent to the shock source that has a plurality of slots disposed therethrough that are configured to reflect energy back to the shock source. The plurality of slots typically comprise a set of partially-overlapping slots formed through the member. The apparatus may further comprise a reinforcing layer of material affixed to the member that has slots that overlay and match the slots the formed through the member. The apparatus may have a cylindrical or rectangular cross section and may include a raised rim disposed around the periphery thereof.Type: ApplicationFiled: August 20, 2001Publication date: February 20, 2003Inventors: Andrew R. Wallach, Gerrit Van Ommering
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Publication number: 20030034598Abstract: A vibration absorber for absorbing a vibration between first and second members each of which is connected to the vibration absorber, includes a movable member adapted to contact with a fluid, and including a portion connected mechanically to one of the first and second members so that a movement of the fluid and a movement of the portion of the movable member correspond to each other, and a fluid moving member for flowing the fluid in either of an extension direction in which the portion of the movable member moves to increase a distance between the first and second members and a contraction direction in which the portion of the movable member moves to decrease the distance between the first and second members in such a manner that the vibration is restrained by a change of the distance between the first and second members from being transmitted between the first and second member.Type: ApplicationFiled: October 16, 2002Publication date: February 20, 2003Inventors: Keiji Miyoshi, Tatsuo Suzuki, Norihiro Yamada
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Publication number: 20030034599Abstract: This invention mainly relates to resilient return means having a fixing seat, and to an elongate body fitted with such resilient return means.Type: ApplicationFiled: February 20, 2001Publication date: February 20, 2003Inventor: David Devambe
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Publication number: 20030034600Abstract: A telescopic leg bearing has an inner connector part and an outer connector part arranged on both sides of the inner connector part, which parts are configured for connecting the telescopic leg head and provide for fastening to a chassis of a vehicle. To provide a structure-borne sound insulation between the connector parts, at least two resilient supporting hoses are arranged on both sides of the inner connector part and at least one throttling port is provided that connects the inside volumes of the supporting hoses to one another in a communicating fashion.Type: ApplicationFiled: August 1, 2002Publication date: February 20, 2003Inventor: Franz Josef Wolf
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Publication number: 20030034601Abstract: In order to improve a clamping and spreading device for the relative movement of two workpieces which have surfaces lying essentially parallel to a common plane, comprising a first holder, to which the first workpiece can be fixed, and a second holder, to which the second workpiece can be fixed, wherein the two holders are movable relative to one another, in such a manner that this can be used in a simple manner comfortable for the operator it is provided for the first holder and the second holder to be connected to one another via a guiding device so as to be displaceable and for the guiding device to comprise an actuating element which is mounted not only on the first holder so as to be movable but is also mounted on the second holder so as to be movable and via which a relative movement of the two holders can be actuated.Type: ApplicationFiled: December 28, 2001Publication date: February 20, 2003Applicant: Bessey & Sohn GmbH & Co.Inventors: Gerhard Kloepfer, Karl Philipp
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Publication number: 20030034602Abstract: Universal holding fixtures or tools for holding oddly shaped objects or workpieces. The universal holding fixtures hold an object or workpiece having any shape and allows orientation of the object or workpiece so that all sides may be easily viewed and worked on. The universal holding fixtures comprise a plurality of dual axis clamps that are interconnected by way of rods to form an articulated structure. The dual axis clamps are individually moveable along the rods, are rotatable with respect to the rods, and are lockable to the rods to which they are connected. A preferred embodiment of the universal holding fixture has a base to which a plurality of clamps are secured that are interconnected by a fixed rod. The articulated structure is rotatably coupled to the fixed rod and is articulated relative to the fixed rod and the base so that distal ends of selected rods secured by the dual axis rotatable clamps are positioned to hold and/or support the object or workpiece.Type: ApplicationFiled: August 18, 2001Publication date: February 20, 2003Inventor: Chris J. Kavanaugh
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Publication number: 20030034603Abstract: A method and apparatus for folding a single sheet of paper into a booklet. The method includes depositing adhesive along a linear path on the single sheet of paper and folding the sheet by making a plurality of folds parallel to a first direction, thereby forming a plurality of interconnected panels. The lateral edges of the panels are cut off so that the panels are no longer interconnected. A fold is made along a line coincident with the linear path to form the booklet. The booklet may be further folded with close folds to obtain a compact outsert. Apparatus for performing the folding patterns is also provided.Type: ApplicationFiled: October 17, 2002Publication date: February 20, 2003Applicant: Vijuk Equipment, Inc.Inventor: Joseph M. Vijuk
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Publication number: 20030034604Abstract: In a sheet finisher having a stacker for sheets conveyed from an image forming apparatus and a stapler for stacked sheets, the sheet finisher further has a conveying timing adjustment section arranged upstream of the stacker including: a conveying-in section for a sheet from the image forming apparatus; a conveying-out section separately provided from the conveying-in section; and a reversal conveying section for reversing a conveying direction of the sheet conveyed in one direction from the conveying-in section and for conveying-out from the conveying-out section. A controller controls the reversal conveying section such that at least a second bundle or a bundle after the second bundle of sheet bundles to be stapled by the stapler, in which a plurality of sheets having at least a top sheet and a succeeding sheet to the top sheet are overlapped each other, is conveyed-out from the reversal conveying section.Type: ApplicationFiled: August 8, 2002Publication date: February 20, 2003Inventors: Toshio Shida, Hiroyuki Wakabayashi, Tsuyoshi Tsuchiya, Mikihiro Yamakawa