Abstract: Reservoir volume in a drug delivery device is sensed by providing a capacitor, the capacitance of which varies with bellows position or, alternatively, with the amount of propellant liquid absorbed in a dielectric material. In one embodiment, a capacitance is provided between a surface of the bellows, which acts as a first capacitor plate, and a conductive surface disposed proximate the bellows, which acts as a second capacitor plate. As the bellows moves from its extended full position to its collapsed empty position, the area of overlap, and therefore the capacitance between the first and second plates varies from a maximum value to a minimum value. In another embodiment, a variable capacitor is provided with an absorbent material. The absorbent material absorbs the liquid phase of the propellant in the pump housing and acts as a dielectric between two stationary conductive plates provided in the housing. The amount of liquid propellant absorbed in the absorbent material varies with the reservoir volume.

Abstract: In a capacitive structure of an integrated circuit a comb-like configuration or other thin element configuration provides for capacitive coupling between electrode elements in one plane. By forming electrodes in a plurality of planes and selectively shifting the positioning of the electrodes in one plane relative to those in another plane, capacitive coupling between the electrodes in the different planes is achieved. In this way capacitance and stability with process variations can be affected. Furthermore, by using the metal interconnect layers to form the capacitive structures, the need for additional process steps in defining poly-layers, is avoided.

Abstract: A capacitor including at least one interior metallization plane or plate and a multiplicity of vias for forming multiple redundant electrical connections within the capacitor. Series capacitors are provided having at least two interior plates redundantly electrically connected to at least two respective exterior plates. R-C devices are provided having multiple redundant vias filled with resistor material and/or conductor material to provide a resistor either in series with or parallel to a capacitor. Capacitors and R-C devices are provided having end terminations for applying voltage differential. Further, a method for making single capacitors, multiple parallel array capacitors, series capacitors and R-C devices is provided in which the chips are formed from the bottom up.

Abstract: A control panel assembly having a plurality of buttons located in a bezel and supported by a switch mat. A bezel and/or button is formed using a vacuum forming technique and has a transparent inner surface layer and a middle translucent color layer and an opaque outer surface layer. A portion of the opaque outer surface layer is removed to define a desired indicia on an outer surface of the bezel or button. In addition, the bezel or button can be backlit to allow visibility in low light conditions. A method of making a control panel component, such as a bezel or button, is also disclosed.

Abstract: A compact device and method for communication and entertainment needs that include having interchangeable user-interfaces and combining various functions performed by different keypads and units into a single pad or unit. The device includes circuitry with transceiver capabilities, a chassis, a display, at least two Freestyle User-Interfaces (FUI) secured to the chassis that can rotate from an open position to a closed position, and a user-interface that provides the user with navigational control and image conversion. The method of interchanging at least two FUIs includes providing a chassis for securely holding the circuitry, rotatably securing the user-interfaces to the chassis, coupling the user-interfaces to the circuitry, and removably securing opposite ends of an elastic piece to each of the user-interfaces.

Abstract: Disclosed is a waterproof keyboard comprising a membrane made of waterproof material. Membrane is provided under the circuit unit being sealed to elastomer member by ultrasonic bonding or UV adhesive. Thus forms a space enclosed by elastomer member and membrane so as to seal circuit unit, between elastomer member and membrane.

Abstract: A computer enclosure includes a cage (100) defining nicks (142) on opposite sides thereof, a first door (200), a second door (300), and a latch (400). The first door includes a fixing board (210) having pegs (212) and hooks (213). The hooks engage with the nicks. The second door is similar to the first door. The latch includes a shaft (410) defining first notches (424) engagingly and releasably receiving the pegs of the first door, a body (430) defining second notches (444) engagingly and releasably receiving pegs of the second door, and a lock (460). When the lock is rotated from a locked position to a release position, the shaft and the body are moved inwardly to disengage from the pegs. The fixing boards are then moved downwardly to disengage the hooks away from the nicks, thereby disengaging the first and second doors from the cage.

Abstract: An industrial computer having mainly a fastening frame, a computer unit fastened with the fastening frame, a computer unit fastened with the fastening frame, and a control panel openably fastened on one side of the control panel to the fastening frame, wherein the control pane can be opened sidewise to facilitate the repairing and maintenance of the computer unit.

Abstract: A retractable platform allows communication to be established with an electronic device, such as a computer expansion card. The retractable platform is preferably slidably attached to the electronic device and retractable platform includes a wireless interface that allows the communication between the platform and the electronic device to be established. The wireless interface may use an optical coupling, inductive coupling, capacitive coupling or other suitable wireless or non-mechanical interface to allow communication between the retractable platform and the electronic device. Advantageously, the retractable platform can be removed and replaced, which virtually eliminates breakage, and it allows the platform to be easily repaired, replaced, upgraded, and the like. The retractable platform can also include electronic circuitry and other suitable components that process or condition the incoming and outgoing signal.

Abstract: A computer comprises a chassis having an inner surface and an outer surface and a processing device contained within the chassis. A portion of the chassis inner surface is positioned proximate to the processing device, and a sheet of thermally conductive interface material is positioned between and contacts the processing device and the inner surface portion to thermally couple the processing device to the chassis so that the heat generated by the processing device is delivered to the chassis. The outer surface of the chassis is configured, such as with fins, for dissipating heat from the chassis. A phase-change material is positioned on the inner surface of the chassis and absorbs heat to further assist the chassis in heat dissipation.

Abstract: An electronic apparatus has a housing that includes a bottom wall with a communication hole formed therein, and also has an extension apparatus on which the housing is removably mounted. The housing contains a heat generating component and a heat sink thermally connected thereto. The communication hole is opened and closed by a lid, which is always urged toward a position for closing the communication hole. The extension apparatus has operation members for forcibly opening the lid when the housing is mounted thereon.

Abstract: A computer cooling system adapted to be installed in a drive bay of an existing computer casing to cool the inside of the casing. The cooling system includes a thermo-electric heat exchanger defining first and second superposed air channels respectively in heat transfer communication with the hot and cold sides of Peltier devices. The cooled ambient air is discharged into the computer casing while the heated ambient air is directed into an evaporator for evaporating the condensate formed during cooling of the air discharged into the computer casing.

Abstract: A computer system housing with a curved bezel that forms one or more sideways gap between a side of the computer housing chassis and the bezel attached to that side. Typically, the curved bezel is attached to the front of the chassis with each sideways gap extending perpendicularly from the front of the chassis to a predetermined width and stretching to predetermined length along the front of the chassis. The sideways gaps facilitate increased air inlet from the sides and allow efficient cooling of various system components that are mounted on the chassis and housed within the housing. One or more cooling fans may be mounted at different locations within the housing to optimize air circulation and, hence, cooling within the housing. The chassis may be partitioned into two separate sub-chassis for proper positioning of the cooling fans as well as to accommodate changes in computer system configurations with minimized retooling of the chassis.

Abstract: A self-actuating damper for each slot of a multi-slot printed circuit board assembly cage allows proper air-cooling without regard to the presence or non-presence of card board assemblies in the slots. The damper of each slot is automatically held in the closed position when the respective slot is empty. An actuation hook implemented on each of the card board assemblies engages the actuator of the damper as card board assembly is aligned with the slot and automatically actuates the damper to an open position as the cell board assembly is inserted into the slot.

Abstract: A heat dissipating assembly (1) includes a pair of concertinaed heat pipes (10), a plurality of fins (20), a shell (30), a heat-conductive block (40) and a fan (50). The fins are spaced and stacked one above the other. A plurality of channels (22) is defined through opposite sides of the fins, for insertion of the heat pipes thereinto. The shell includes a frame (32) and a cover (34) mounted to a top side of the frame, thereby defining a space for accommodating the fins and the heat pipes therein. A plurality of openings (362, 342) is defined in a bottom plate (36) of the frame and in the cover, for extension of bottommost and topmost portions of the heat pipes therethrough. A horizontal end portion (12) of each heat pipe extends over the cover and engages with the block. The fan is mounted to one end of the shell.

Abstract: A coolant cooled type semiconductor device capable of achieving a superior heat radiation capability is provided, while having a simple structure. While a plurality of semiconductor modules are arranged in such a manner that main surface directions of these semiconductor modules are positioned in parallel to each other in a interval along a thickness direction thereof. These semiconductor modules are sandwiched by coolant tube having folded portions with fixing members. As a consequence, both surfaces of the semiconductor module can be cooled by a single coolant tube with a uniform pinching force.

Abstract: The present invention is directed to an improved circuit board support. The present invention provides for quick-assembly, limits circuit board flex, and supports a heat sink. In one aspect of the present invention, an apparatus suitable for supporting a circuit board, includes a support suitable for attachment to a chassis of an information handling system, wherein a heat sink may be attached through a printed circuit board to the support so as to enable the heat sink to be supported by the chassis.

Abstract: A heat sink retention frame is disposed about an electronic package, and a heat sink is disposed within the heat sink retention frame above the electronic package. A clip is mounted across a lateral edge surface of the heat sink and fastened to the heat sink retention frame. The clip can help hold the heat sink in place during normal operation and can retain the heat sink in the retention frame during mechanical shocks.

Abstract: A heat sink and a power source unit employing the same can minimize leakage of plosive outside of the power source unit upon failure of semiconductor parts and can restrict leakage of flashing, odor, smoke and so forth which is possibly caused upon occurrence of failure of the semiconductor parts. The heat sink has a heat radiating casing housing therein a semiconductor part forming a power source unit therein and whereby sealing the semiconductor part within the casing.

Abstract: This invention provides a combined base frame for supporting and fixing a CPU heat sink. The base frame has a left-side frame body and a right-side frame body. The buckling pieces are integrally formed under the base frame. The base frame can be efficiently mounted on a circuit board by the engagement between the left-side frame body and a right-side frame body. When an operator needs to install a CPU onto the circuit board, the base frame can be disassembled in a short time.

Abstract: A heat dissipating device has a conductor holder and a heat conductor. The conductor holder is securely attached to the CPU base and has a through hole. The heat conductor is securely connected to the through hole in the conductor holder and contacts with the CPU. The heat conductor comprises multiple heat conductive elements made of a material with good heat conductivity. One end of the heat conductive elements are twisted together to form a bound section on the first end of the heat conductor. The other end of each heat conductive element is far away from the other element so as to form an expansion section on a second end of the heat conductor. In such an arrangement, the heat generated by the CPU can be efficiently dissipated from the expansion section of the heat conductor.

Abstract: A thermal pad for use in facilitating heat flow between a heat source surface and a heat sink surface includes a carbon fiber fabric that is impregnated with a thermal substance.

Abstract: An spacer assembly for spacing a circuit board from a chassis includes a plug that is adapted to extend through a mounting aperture in the chassis and a cap that is adapted to receive the plug in locking engagement for sandwiching the chassis therebetween. The cap has an upper wall that supports the circuit board and a skirt that extends from the upper wall to form a hollow interior that is sized to receive the plug. First cooperating structure on the plug and cap hold the plug within the hollow interior of the cap, while second cooperating structure on the plug and cap hold the chassis therebetween.

Abstract: In a memory module arranged with the connection terminals located on both sides of the circuit board, the connection terminals for transmitting a common signal to all memory modules conducts with the connection terminals that are directly facing each other on the opposite sides of the circuit board, and the connection terminals for transmitting an intrinsic signal to the respective memory modules conduct with connection terminals that are not directly facing each other through the circuit board.

Abstract: A FPC board 400 is manufactured by patterning copper foils which are bonded onto both sides of a base film 410 having insulation and flexibility without an adhesive layer, and forming an input wiring 420a and an output wiring 420b on a mounting surface of an electronic component while forming a dummy wiring layer 422 on the surface opposite the mounting surface. A dummy wiring layer 422 is set to be slightly larger than an area where an IC chip 450 is mounted, and has moisture resistance and light shielding properties. An input electrode 450a of the IC chip 450 is electrically connected to the input wiring 420a and an output electrode 450b is electrically connected to the output wiring 420b through electrically conductive particles 460a dispersed into an adhesive agent 460, such as an epoxy resin, at an appropriate ratio, and the adhesive agent 460 encapsulates the connection regions.

Abstract: The present invention relates to a method for providing non-contact power/current sensing in an electronic circuit. Specifically, the method provides an electronic coupler in the form of an integrated circuit microstrip mounted in close proximity to a current-carrying microstrip on a printed circuit board. The integrated circuit is mounted on and electronically coupled to electronic components of said printed circuit board with the microstrip on the printed circuit board side of the integrated circuit substrate, and the integrated circuit microstrip is positioned in such a way as to effect electromagnetic coupling to an electronic microstrip on the printed circuit board.

Abstract: Disclosed is an electronics packaging system, which provides for a high density assembly of groups of similar solid state part packages. The system provides a novel method for interconnecting the signal paths, structurally assembling and supporting the parts, and removing heat generated within the components. The system approach disclosed typically starts at the level of assembling pre-packaged parts into modules, and permeates through to the printed circuit board and box levels of assembly. The system is applicable, but not limited to, solid state memory device packaging, which typically consists of many similar parts interconnected in a matrix bus type configuration. The assembly of a building block of numerous memory components allows for the modular construction of large amounts of solid state memory.

Abstract: A computer system including a microprocessor and a system memory coupled t provide storage to facilitate execution of computer programs by the microprocessor. An input is coupled to provide input to the microprocessor. A display is coupled to the microprocessor by a video controller and a mass storage is coupled to the microprocessor. A printed circuit board is electrically coupled to the microprocessor. The printed circuit board includes a circuit substrate having two spaced apart major surfaces and a plurality of rows of interconnect assemblies. Each row of interconnect assemblies includes a first and a second interconnect pad on a major surface of the circuit substrate. The first and the second interconnect pads are positioned on a respective reference axis. The first interconnect pad is spaced apart from the second interconnect pad by a first distance. A first and a second conductive via extend through the circuit substrate.

Abstract: The frequency converter for an electrical motor essentially consists of power part integrated in a common semiconductor component, of a component accommodating at least the intermediate circuit electronics and of a component accommodating the control and regulation electronics. The electrical connections from the semiconductor component of the power part to the intermediate circuit component and from the semiconductor component of the power part to the control and regulation component are formed by sheet metal connections which are positioned and mechanically connected to one another by way of a common cast body.

Abstract: Passive electrical components such as capacitors, resistors, inductors, transformers, filters and resonators are integrated in to electrical circuits utilizing a process which maximizes the utilization of the planar surfaces of the substrates for high density placement of active components such as logic or memory integrated circuits. The passive components are integrated into a conventional circuit board utilizing a photoimageable dielectric material. The dielectric is photoimaged and etched to provide one or more recesses or openings for the passive devices, and photovias interconnecting the inputs and outputs of the integrated circuit board. The electronic structure comprising at least one of the passive devices integrated into a photoimaged dielectric is described as well as the method of manufacturing the same.

Abstract: A Method and system of routing noise current from noise generating devices in an electronic or electrical system is disclosed. The method and system includes dielectric structures that route noise current from noise generating devices back to the noise generating device in which the noise originates by way of a return path. The dielectric structures provide for the return paths.

Abstract: Vibrator attaching structure is provided in which the working efficiency at the assembly time and the disassembly time is good, the required arrangement space is made small, and a device can be miniaturized. A vibrator-attaching base (20) has at its lower portion a shield case (22) that is a box-shaped base member functioning also as a shield member on a print circuit board (10). At the upper portion of this shield case (22), a holder (26) that is a holding member is integrally formed.

Abstract: An apparatus for supporting a plurality of densely arranged electrically shielded communication panels includes a rack that supports at least two panels. The panels are supported adjacent to each other by the rack, and each panel includes at least two sides with a printed circuit on one side and a conductive sheet on the other side. In addition, the conductive sheet on each of the panels is coupled to an electrical connection point on the rack when the panel is placed in the rack. The two panels are placed in the rack such that the printed circuit of one of the panels is electrically shielded by the conductive sheet on another, closely aligned other one of the panels.

Abstract: Systems for mounting electronic components are provided. An exemplary system includes a module that is configured to mount to a chassis at a first pitch. The module incorporates a housing, which is adapted to at least partially encase an electronic component, and spring fingers that are arranged at least partially about an exterior of the housing. The spring fingers are configured to deflect in response to a displacement force so that the module can be mounted to a chassis. The module can be mounted to a first chassis that accommodates a predetermined pitch of modules. In some embodiments, the module also can be mounted at a different pitch. Other systems also are provided.

Abstract: A shielded riser card assembly for reducing electromagnetic radiation from a computer enclosure is disclosed. The riser card assembly comprises a four-layer riser card having a connector adjacent its lower edge, such as a connector for an NLX system board. A cable connection socket is on the riser card a first distance away from the connector, and a plurality of traces on a surface of the riser card run between the cable connection socket and the connector. A sheet of conductive material covers the plurality of traces and is spaced a second distance apart from the surface of the riser card. At least one fastener connected is to the sheet and attached to the riser card. The fastener conductively connects the sheet of conductive material to a ground layer of the riser card. A plurality of non-conductive spacers are disposed between and in contact with both of the sheet and the riser card, for maintaining the sheet a predetermined distance away from the riser card.

Abstract: A switching DC-DC converter unit is disclosed that includes an input for receiving a first DC voltage from a DC power source and switching circuitry coupled to the input to generate a switched alternating voltage from the first DC voltage. The switching circuitry includes a plurality of semiconductor switches having respective gate, source and drain leads, and further including noise suppression elements disposed on the drain leads. The unit further includes transformer circuitry coupled to the output of the switching circuitry and conversion circuitry disposed at the output of the transformer circuitry to convert the switched alternating voltage to a second DC voltage.

Abstract: The present invention relates to a switched-mode power supply comprising a transformer (T1) having an additional control winding (N2). This control winding (N2) forms part of an over power protection system by providing information relating to the line voltage Vline. Additionally, the control winding (N2) forms part of an over voltage protection system by monitoring the output voltage, Vout, of the switched-mode power supply. The sensing of Vline and the monitoring of Vout is performed in a time phased way so that the same control winding (N2) may be used to provide a plurality of information relating to the performance/status of the switched-mode power supply.

Abstract: In a switching power supply device, LATCHs (1-5) count a bottom-number, namely, the number of occurrences of a bottom of a ringing generated, FFs(1-4) store the bottom-number, EXNORs (1-4) and AND(1) compare the previous bottom-number stored in FFs(1-4) with a current bottom-number counted by LATCHs(1-5), and the OFF-period of a switching element (Q1) is maintained until the current bottom-number is reached to the bottom-number of the ringing stored in the FFs (1-4).

Abstract: An intermittent switching power supply circuit prevents excessive output power on a secondary side of a circuit. An intermittent oscillator is alternately switched on and off to maintain output voltage and/or current roughly constant. An output power monitoring circuit monitors output power from a rectifying/smoothing circuit. A control circuit outputs a stop control signal to an control terminal of the intermittent oscillator when the output power monitoring circuit determines that the output voltage and/or current exceeds a reference value. The protection circuit and a photocoupler receiver element are connected in parallel with the control circuit. Where a circuit error occurs and the photocoupler receiver element fails to cycle the intermittent oscillator between active and inactive conditions for a predetermined time, the protection circuit provides a backup which outputs a stop control signal to stop oscillation of the intermittent oscillator element.

Abstract: The voltage pump for generating a boosted output voltage has a switch-on control circuit. The switch-on control includes a transistor that is connected between a terminal for feeding in a supply voltage and the terminal for tapping off the boosted output voltage. After the voltage pump has started to operate, the boosted output voltage is decoupled from the supply voltage by the transistor. A changeover switch forwards the respective higher of the output voltage or supply voltage to the substrate terminal and gate terminal of the transistor. The switch-on control enables early provision of a boosted output voltage in conjunction with reliable start-up operation of the voltage pump, while the additional outlay on circuitry is minimized.

Abstract: A power conversion system for driving a load is provided. The power conversion system comprises a power transformer having at least one primary winding circuit and at least one secondary winding circuit, the primary winding circuit being electrically connectable to an AC power source. The system further comprises at least one power cell, each of the at least one power cell having a power cell input connected to a respective one of the at least one secondary winding circuit. Each power cell also has a single phase output connectable to the load. An SCR arrangement including a gate drive and at least one SCR is connected to the power cell input and a DC bus. An SCR controller is connected to the SCR arrangement and the power cell input. The power cell also has a PWM output stage having a plurality of PWM switches connected to the DC bus and the single phase output. A local modulation controller is connected to the PWM output stage.

Abstract: A content addressable memory (CAM) device having a plurality of CAM blocks and a block selection circuit. Each of the CAM blocks includes an array of CAM cells to store data words having a width determined according to a configuration value. The block selection circuit includes an input to receive a class code and circuitry to output a plurality of select signals to the plurality of CAM blocks. Each of the select signals selectively disables a respective one of the plurality of CAM blocks from participating in a compare operation according to whether the class code matches a class assignment of the CAM block.

Abstract: A content addressable memory device which determines the top priority entry data without assigning priorities to addresses. If ternary data stored in a cell is invalid data, and other cell at the same bit position stores valid data of entry data identical to an entry key, the entry data is determined not to be a candidate of the top priority entry data. The last entry data which has not determined not to be a candidate is determined to be the top priority data. Compared to the conventional technology which relied on the relationship between a memory address and a priority, the performance of memory system is significantly improved.

Abstract: A memory module has memory chips in stacks. The lower memory chip in a stack has pins that are soldered to pads on the module substrate. A hollowed printed-circuit board (PCB) has a hollow opening on the bottom with about the same width, length, and depth as the top cap of the lower memory chip. The hollowed PCB fits over the top cap of the lower memory chip and has lower pads on its lower surface but outside of the hollow opening. The lower pads are soldered to the top shoulders of the pins of the lower memory chip. An upper memory chip has pins that are soldered to pads on the upper surface of the hollowed PCB. The hollowed PCB has a metal trace that re-routes a second bank-select signal from a no-connect pin of the lower memory chip to a bank-select pin of the upper memory chip.

Abstract: An integrated circuit has a field programmable circuit region arranged as a generally rectangular array of rows and columns of circuit areas. Some of the circuit areas each provide a respective processing unit for performing operations on data on at least one respective input signal path to provide data on at least one respective output signal path. Others of the circuit areas each provide a respective switching section; and the processing units and the switching sections are arranged alternately in each row and in each column. Each of a substantial proportion of the switching sections provides a programmable connection between at least some of the signal paths of those of the processing units adjacent that switching section in the same column and in the same row.

Abstract: The integrated DRAM memory module has sense amplifiers which are each formed, in the integrated module, from a multiplicity of transistor structures that are arranged regularly in cell arrays and include amplification transistors for bit line signal amplification. The amplification transistors lie opposite one another in pairs, are structurally identical, and are arranged equally spaced apart in rows. Voltage equalization transistors ensure voltage equalization between sense amplifier drive signals. The cell array order provides for each row with amplification transistors situated in a structurally identical transistor environment to be interrupted in a predetermined period by voltage equalization transistors.

Abstract: A metal programmable ROM is disclosed that includes a memory cell array having a depth that is defined by a plurality of wordlines and a width that is defined by a plurality of bitlines. In addition, a group of memory cells are coupled between a bitline and ground, with each memory cell in the memory cell group coupled to at least one other memory cell in the memory cell group. Finally, a programmed memory cell is included that is defined by a memory cell transistor having its terminals shorted together.

Abstract: An apparatus including at least one designated memory cell of a plurality of memory cells. Disposed within each designated memory cell is a resistance-altering constituent. Consequently, a first binary value is recognoized in each designated cell and at least a second binary value is recognized in each remaining cell.

Abstract: A magnetic random access memory (MRAM) is disclosed. In order to achieve high integration, the MRAM includes a word line formed in an active region of a semiconductor substrate, and used as a read line and a write line; a ground line and a lower read layer positioned on opposite sides of the active region of the semiconductor substrate; a seed layer contacting the lower read layer, and being overlapped with the upper portion of the word line; an MTJ cell contacting the upper portion of the seed layer at the upper portion of the word line; and a bit line contacting the MTJ cell, and crossing the word line in a vertical direction.

Abstract: An apparatus (and method) is provided that pumps (up or down) the voltage on a memory cell thereby increasing (above the logic one voltage value) or decreasing (below the logic zero voltage value) the voltage stored in the memory cell, and providing an increased differential on the bit lines during a subsequent read operation of the memory cell. When a logic one or zero voltage is coupled to the first plate of the memory cell for storage, the second plate is held at a voltage that is lower or higher, respectively (preferably a voltage that is the complement logic value of the value being stored). After the word line is deactivated (thereby decoupling the memory cell from the bit line and storing a logic one voltage value or logic zero voltage value), the voltage on the second plate is correspondently either raised or lowered. In the present invention, the second plate is raised or lowered to the precharge and equilibrate value (usually Vdd/2).