Abstract: A high-frequency semiconductor device is provided with a ceramic substrate, an element group including semiconductor elements and passive components mounted onto a bottom portion of the ceramic substrate, and a composite resin material layer formed on the bottom portion of the ceramic substrate so as to bury the element group. The composite resin material layer is formed by a composite resin material including an epoxy resin and an inorganic filler material, and has a flat bottom surface on which electrodes for connecting to the outside are formed. As packaging of a structure in which the receiving system and the transmitting system are formed in a single unit, such as an RF module, the high-frequency semiconductor device achieves a small size, a high mounting density, and excellent heat release properties.

Abstract: The invention relates to a method for fabricating a microcontact spring on a substrate (1) with at least one contact pad (2) and a first insulator layer (13) with a window above the contact pad (2).

Abstract: A polyimide layer is formed over a semiconductor chip, a rewiring to be connected to each of the electrode pads of the semiconductor chip is formed over the polyimide layer, and a post serving as a terminal is connected to each of the electrode pads via the rewiring, thereby redisposing the electrode pads. A resin for encapsulating the rewirings and the posts is formed on the surface of the semiconductor chip to the extent equivalent to the dimension of the semiconductor chip, and in a groove formed in portions of the resin, around the respective posts, the topmost surface and the sidewall face of the respective posts are exposed out of the resin.

Abstract: It is the object of the present invention to provide a semiconductor device capable of ensuring bonding strength without applying an excessive stress to solder balls and having a high degree of reliability. A substrate made of metal for the purposes of making an electric wiring circuit and taking heat radiation into account has recessed portions on one surface opposite to the other surface to which solder balls are bonded.

Abstract: A wafer level chip scale package, having a chip, at least one dielectric layer, a stress buffer layer, multiple first solder balls and multiple second solder balls. By using an upper dielectric layer to cover a lower dielectric layer, the peeling effect between the dielectric layers is mitigated. Further, by forming the stress buffer layer and the chip with a stair-like structure, the peeling effect of the stress buffer layer is also mitigated, while the probability of moisture penetration into the package is minimized. A method for fabricating the above wafer level chip scale package is also introduced.

Abstract: An apparatus including a substrate comprising a device having contact point; a dielectric layer overlying the device with an opening to the contact point; and an interconnect structure disposed in the opening including an interconnect material and a different conductive shunt material.

Abstract: A method of forming a local interconnect includes forming an isolation trench within a semiconductor substrate. A first trench isolation material is deposited to within the trench. First isolation material is removed effective to form a line trench into a desired local interconnect. Conductive material is formed therewithin. A second isolation material is deposited over the first isolation material, over the conductive material within the isolation trench and within the line trench. At least some first and second isolation material is removed in at least one common removing step. Integrated circuitry includes a substrate comprising trench isolation material. A local interconnect line is received within a trench formed within the isolation material. The local interconnect includes at least two different conductive materials. One of the conductive materials lines the trench. Another of the conductive materials is received within a conductive trench formed by the one. Other implementations are disclosed.

Abstract: A method of forming a local interconnect includes forming an isolation trench within a semiconductor substrate. A first trench isolation material is deposited to within the trench. First isolation material is removed effective to form a line trench into a desired local interconnect. Conductive material is formed therewithin. A second isolation material is deposited over the first isolation material, over the conductive material within the isolation trench and within the line trench. At least some first and second isolation material is removed in at least one common removing step. Integrated circuitry includes a substrate comprising trench isolation material. A local interconnect line is received within a trench formed within the isolation material. The local interconnect includes at least two different conductive materials. One of the conductive materials lines the trench. Another of the conductive materials is received within a conductive trench formed by the one. Other implementations are disclosed.

Abstract: A method of depositing a non-conductive barrier layer onto a metal surface wherein the resistance of the metal remains substantially unchanged before and after the non-conductive barrier layer deposition. The deposition process provides a low temperature processing environment so as to inhibit the formation of impurities such as silicide in the metal, wherein the silicide can adversely increase the resistance of the underlying metal.

Abstract: The invention describes the application of copper damascene connectors to a double level metal process. A dual damascene copper connector whose upper surface is coplanar with the upper surface of the insulating layer in which it is embedded is described. Out-diffusion of copper from the connector is prevented by at least two barrier layers. One or two barrier layers are located at the interface between the connector and the insulating layer while another barrier layer comprises conductive material and covers the upper surface of the connector. When a second damascene connector is formed above the first connector the conductive barrier layer facilitates good contact between the two connectors. It also acts as an etch stop layer during the formation of the second connector. A process for manufacturing this structure is also described. It involves over-filling a trench in the surface of the insulator with copper and then removing the excess by chem.-mech. polishing.

Abstract: A method and structure for a device with a signal line over a semiconductor structure where the signal line is formed over the ground plane, passivation layer, and polyimide layer. We provide a semiconductor structure comprising a substrate having devices formed thereover and a plurality of insulating and conductive layers thereover. Next, we form ground plane over the semiconductor structure. The ground plane is the top metal layer over an inter metal dielectric layer. We then form a passivation layer over the ground plane. We form a first dielectric (e.g., polyimide) layer over the passivation layer. Subsequently, we form a signal line over the first dielectric layer. The signal line is formed by a plating or printing. We form a second dielectric layer (e.g., polyimide over the signal line and the first dielectric layer.

Abstract: A method and structure for the electrical characterization of a semiconductor device comprising, first, forming a hole having a diameter less than 0.15 &mgr;m, wherein the hole is created using focused ion beam (FIB) etching, and through at least a protective cap layer formed over the device. The FIB etching occurs in an electron mode using a beam current less than 35 &rgr;A with an aperture size less than 50 &mgr;m, and at an acceleration voltage of about 50 kV. Second, the surface of the hole is coated with a metal, preferably using chemical vapor deposition (CVD) and preferably using a FIB device. Third, a metal pad is deposited, preferably by FIB CVD, over the hole. Fourth, the pad is probed to determine characteristics and/or detect defects of the electrical device. The present invention allows for electrical characterization without causing damage to the device or its features.

Abstract: A method for assembling semiconductor devices includes providing a first semiconductor device, applying a volume of adhesive material to at least a surface of the first semiconductor device, and positioning a second semiconductor device over the first semiconductor device and a portion of at least one discrete conductive element protruding thereabove. The adhesive material may be applied to a surface of the first semiconductor device prior to positioning the second semiconductor device thereover, or introduced between the first and second semiconductor devices. Upon curing, the predetermined volume of adhesive material spaces the first and second semiconductor devices a predetermined distance apart from one another. Additional semiconductor devices may also be added to the assembly. The first semiconductor device may be associated with a substrate. Semiconductor device assemblies and packages that are at least partially fabricated in accordance with the method are also disclosed.

Abstract: A semiconductor device comprises a semiconductor chip which has a first surface, a pad which is formed directly on the first surface, an oxide film which is formed on the first surface, an insulating film which is formed on the oxide film and a part of the pad, a conductive film which is formed on the insulating film and the pad, a sealing material which covers a part of the conductive film and the insulating film and a bump which is formed over the conductive film, wherein the bump is exposed from a surface of the sealing material.

Abstract: A semiconductor package of this invention comprises an electrode pad arranged on a semiconductor chip, a bonding wire, an end of which is coupled to the electrode pad, and a connection pad arranged parallel to a direction of arrangement of the bonding wire, to which another end of the bonding wire is coupled, and a pitch of the connection pad is wider than that of the electrode pad.

Abstract: A fabrication method for an electronic device includes four steps. The first step is for preparing a leadframe with first and second conductive members. The second step is for connecting a first and a second electronic chips to the first and the second conductive members, respectively. For the third step, the first chip is enclosed by a first resin package allowing partial exposure of the first conductive member, while the second chip by a second resin package spaced from the first package. For the fourth step, the exposed part of the first conductive member is cut. The cutting is performed using first and second tools, where the first tool makes an indentation in the exposed part on a first side. On another side opposite to the first side, the second tool makes a full cut to be linked with the indentation.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one silicone epoxy resin, (B) at least one hydroxyl-containing compound, (C) at least one anhydride curing agent, (D) at least one ancillary curing catalyst, and optionally at least one of thermal stabilizers, UV stabilizers, cure modifiers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip (4), and an encapsulant (11) comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) at least one anhydride curing agent, (C) at least one a boron containing catalyst that is essentially free of halogen, (D) at least one cure modifier, and, optionally (E) at least one ancillary curing catalyst. The encapsulant may also optionally comprise at least one of thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: Epoxy resin compositions are disclosed which comprise (A) at least one cycloaliphatic epoxy resin, (B) a curing agent comprising hexahydro-4-methylphthalic anhydride, (C) at least one a boron containing catalyst that is essentially free of halogen, and (D) at least one cure modifier. The encapsulant may also optionally comprise at least one of ancillary curing catalysts, thermal stabilizers, UV stabilizers, coupling agents, or refractive index modifiers. Also disclosed are packaged solid state devices comprising a package, a chip, and an encapsulant comprising an epoxy resin composition of the invention. A method of encapsulating a solid state device is also provided.

Abstract: High contrast alignment marks that can be flexibly located on a semiconductor wafer are disclosed. The wafer has a first layer and a second layer. The first layer has a light-dark intensity and a reflectivity. The second layer is over the first layer, and has a light-dark intensity substantially lighter than that of the first layer, and a higher reflectivity than that of the first layer. The first layer may be patterned to further darken it. The second layer contrasts visibly to the first layer, and is patterned to form at least one or more alignment marks within the second layer. The first layer may be a metallization layer, such as titanium nitride, whereas the second layer may be a metallization layer, such as aluminum or copper.

Abstract: Method of and mechanism for regulating fuel feed from a rotary valve type carburetor to an associated engine. A carburetor bypass air passage variably communicates the throttle valve hole with a bypass air source at engine idle setting of the throttle valve. The bypass air passage outlet is closed by movement of the throttle valve out of idle setting toward high speed. At an initial carburetor-to-engine set-up and calibration, a bypass regulating valve is maintained open while the engine is running at idle speed. Then the fuel-regulating needle is adjusted to maximum fuel to air (F/A) mixture ratio permitted by applicable engine exhaust quality regulations, and then is permanently set and sealed. During subsequent end user operation of the engine, the bypass valve is closed only when preparing to crank the engine for starting to thereby provide an enriched fuel-to-air mixture for starting of the engine. When the engine is running under its own power the bypass valve is maintained open.

Abstract: A carburetor throttle control device is provided having a positive feel and ability to precisely position a throttle valve. The lever includes an annular rim that has a plurality of notches corresponding to the angular positions of the throttle plate. A detent is piloted over the throttle shaft and is fixed or captured relative to the carburetor body between the carburetor body and the throttle lever, received in the annular recess of the hub. The detent includes a flexible or spring-type arcuate arm attached to and extending about a portion of the hub and having a protrusion extending therefrom. As the lever is rotated, the protrusion mates with the throttle position notches in the hub of the lever. The protrusion thus positively indexes the lever between positions. A throttle adjustment mechanism is also provided for manually adjusting the position of the detent, and thus the idle speed of the engine.

Abstract: Apparatus and process for aerating a liquid with gas, the apparatus comprising a pressure vessel including a lower section containing the liquid and an upper section containing a volume of the gas. A pressure connection in the upper section of the pressure vessel adapted receives the gas. A nozzle in the upper section of the pressure vessel receives the liquid. An injector extends from the upper section of the pressure vessel to the lower section of the pressure vessel and has a head in fluid communication with the nozzle. Part of the gas volume is sucked in by the vacuum generated by the liquid injected, carried along together with the liquid and mixed intimately with the liquid at the same time.

Abstract: Heat exchanger packs having a first set of passageways for receiving a stream of ambient air and a second set of passageways for receiving a stream of warm water laden air is disclosed. The first set of passageways and second set of passageways being separate and permitting the warm water laden air stream to be cooled by the stream of ambient air so that water can condense out of the warm water laden air stream. Cooling tower configurations including the heat exchanger pack are disclosed for achieving effluent plume abatement, and capture of a portion of the effluent for replacement back into the cooling tower reservoir or as a source of purified water.

Abstract: The present invention involves a fill consisting of a plurality of plates that are pre-assembled into fill packs for application as fill media in cooling towers. A unique spacing and fastening system is employed to assemble individual plates into fill packs. The spacing system of the current invention utilizes a tube or rod which traverses apertures in the plates of the fill pack. The tube or rod is flattened or expanded in the area between the fill plates, thus locking the fill plates in place. The spacing system of the current invention provides substantially complete adjustability of the pitch of the fill plates. Alternatively, plate spacing can be effected by employing integral protrusions which bond to adjacent plates. The plates are designed to deploy a large amount of surface area in a compact volume and to allow free flow of fluids through the media. The plates utilize a ribbed structure which creates a relatively high strength-to-weight ratio for the individual plates.

Abstract: A liquid/gas contacting apparatus is provided wherein the perforated trays comprise an upper liquid repellent layer of a fluorocarbon polymer, to increase, and spread, liquid flow over the tray, and a rough underside for bursting any bubbles of any spray there against. Ridges are provided forming a chevron-like patterns between perforations in the trays to deflect liquid towards the casing sides and remove sediment therefrom.

Abstract: A carbonation system comprises a vessel for carbonating a liquid, a CO2 supply connected to the vessel so as to create a CO2 atmosphere in the vessel, an inlet diffuser through which the liquid enters the vessel, and an outlet pipe through which the carbonated liquid exits the vessel. The inlet diffuser comprises a plurality of openings arranged on its vertical face, such that when the liquid exits the inlet diffuser through the plurality of openings, the liquid is substantially atomized and the atomized liquid is ejected in a direction that is substantially parallel to the longitudinal axis of the vessel. The plurality of openings can be arranged in horizontal rows so that openings in adjacent rows are not in vertical alignment with each other. In addition, the atomized liquid can be ejected at an upward angle relative to the longitudinal axis of the vessel.

Abstract: A fine bubble diffuser membrane used in the aeration of wastewater is treated with biocide to inhibit growth and accumulation of biological materials on the membrane. The membrane may be constructed of EPDM rubber or urethane. The biocide may be carbolic acid either dispersed throughout the membrane or applied as a coating on the surface of the membrane exposed to the wastewater. The membrane is a flexible and elastic structure impervious to liquid and provided with slits that close to prevent wastewater inflow in the absence of aeration and open in response to aeration pressure to discharge air into the wastewater.

Abstract: A system for reducing the temperature of exhaust gas in an incinerator or boiler equipment having an exceedingly small size and avoiding any difficulties caused by damage to the wall surface of a gas cooling chamber due to adherence of sprayed water droplets and deposition of dust. More specifically, pressurized thermal water with a temperature higher than a boiling point of water under atmospheric pressure is sprayed as temperature reduction water into high temperature exhaust gas Gh in a gas cooling chamber or an exhaust gas duct. The temperature reduction of exhaust gas and the removal of acidic gas in the exhaust gas are simultaneously achieved by spraying pressurized thermal water Wt containing an alkaline solution as temperature reduction water into high temperature exhaust gas Gh in the gas cooling chamber or the exhaust gas duct.

Abstract: The method for fabricating a multi-colored ball comprises the steps of: applying to a resin sheet 14 having a first color and a first charge characteristic a solution 16 containing at least a resin and/or a monomer which is a precursor of a resin, and a coloring agent having a second color and a second charge characteristic; polymerizing or drying the solution to thereby form a resin sheet 18 having the second color and the second charge characteristic on the resin sheet 14; cutting or milling a laminate of the resin sheet 14 and the resin sheet 18; and sphering the cut or milled laminate by heating to form multi-colored ball having a first region having the first color and the first charge characteristic and a second region having the second color and the second charge characteristic. Whereby the resin sheet 18 is formed on the resin sheet 14 without rolling, so that the resin sheet 18 can be easily formed in a uniform thickness.

Abstract: This invention provides a method of preparing microsphere composite of collagen and bioceramic powder. This method first mixes a collagen solution with bioceramic powder and alginate, and squeezes the mixture solution to spherical droplets being discharged into a divalent cation solution undergoing gelling to form microspheres. Next, the microsphere is coated with a chitosan solution. Then, interior alginate and surface chitosan of the microsphere are liquefied and washed out with an aqueous buffer solution such as phosphate based buffer, and collagen in the microsphere is reconstituted to fiber network at the same time. The prepared microsphere composite has similar composition components of bone tissue, and the collagen thereof has a network of reconstituted fibers. The microsphere composite of this invention provides a similar growth environment of bone tissue cells, is used as a carrier to carry cells, coat and fix bone growth factors, and is applied in bone repair.

Abstract: A method and apparatus are provided for forming a sheet of polymeric material, such as polycarbonate. A forming mold is provided having halves that engage for forming a heated sheet therebetween. Each of the halves defines an interior cavity having a peripheral edge. The sheet is retained between the peripheral edges of the halves and a vacuum is generated within one of the cavities for drawing the sheet therein, whereby a sensing mechanism detects a draw depth for initiating a cooling mechanism to cool the sheet to a temperature below a glass transition temperature of the material. A series of retention mechanisms are provided about the peripheral edge of one of the halves, for biasing the sheet into engagement with the peripheral edge of the opposing half. A trimming mechanism is further provided for trimming the perimeter of the sheet to a desired form.

Abstract: A method for injection molding a layer of phase change material around a surface of a plurality of identical motor components or hard disc drive components which includes providing a plurality of motor components or hard disc drive components; placing a motor component or hard disc drive component in a mold cavity of an injection molding machine having a controllable fill rate and a controllable injection pressure; closing said mold cavity; injecting a molten phase change material into said mold cavity at a fill rate and injection pressure; monitoring pressure in the mold cavity; controlling the fill rate of molten phase change material to obtain said motor component or hard disc drive component with the phase change material thereon, having a reproducible resonance spectrum; and repeating the above steps to produce a plurality of motor components or hard disc drive components each having a substantially uniform resonance spectrum.

Abstract: A method for preparing a highly porous, high surface area non-degradable material, comprises the steps of mixing a non-degradable polymer with a solvent or mixture of solvents; gelling the mixture; and treating the gel under conditions whereby a substantially solvent free porous structure is created having a porosity greater than about 80%. The resultant material is mechanically strong and has an architecture comprising at least one of nano fibrous, micro fibrous, non fibrous, complex porous structure with nano fibrous architecture, and mixtures thereof.

Abstract: Petroleum or coal tar pitch-based cellular or porous products having a density of preferably between about 0.1 g/cm3 and about 0.8 g/cm3 are produced by the controlled heating of mesophase carbon materials derived from coal tar or petroleum pitch having a softening point in excess of about 300° C. and preferably between about 300 and about 400° C. in a “mold” and under a non-oxidizing atmosphere. The porous product thereby produced, preferably as a net shape or near net shape, can be machined, adhered and otherwise fabricated to produce a wide variety of low cost, low density products.

Abstract: A method of producing a vehicle steering wheel including a steering wheel rim comprises the following steps: A foaming mold with a top part and a bottom part is used; two different foam components, namely, a central carrier component as well as a soft component surrounding the latter, are injected into the bottom part which is not closed by the top part; the foaming mold is closed by closing the bottom part with the top part, and; the foaming mold is heated.

Abstract: A method of forming a part with a solid urethane elastomer skin is provided, wherein the mold is moved by a mold manipulation tool to present differently oriented surfaces of the mold in a horizontal orientation when the urethane elastomer is sprayed on each of the differently oriented surfaces. A multi-axis robot is provided with a spray head that sprays the urethane elastomer onto a mold surface. A mold manipulator moves the mold that has a plurality of differently oriented mold surfaces so that the surface to be sprayed is held in a horizontal orientation as they are coated with the urethane elastomer and for a predetermined time period after spray coating until the urethane elastomer sets up.

Abstract: A series of three-dimensional burls are formed in a filled-acrylic solid surface material by curing partially mixed steams of acrylic resin casting compositions with defined parameters of viscosity, density and surface tension.

Abstract: The present invention is a hollow article with an integral impact absorbing rib and the method of manufacturing the same. The apparatus is a hollow article made of thermoplastic resin and integrally formed by blow molding, comprising a first wall and a second wall confronting across a spacing. There is an integral rib between the first wall and the second wall, wherein the integral rib comprises a flat rib between the walls and one or more hollow ribs adjacent to each of two side ends of the flat rib. The impact absorbing rib is disposed at intervals and in an impact action direction. The rib is uniform in shape, dimensions and wall width, and free from reduction of wall width of the inner rib, yet possessing proper structural support and mechanical strength, and excellent in impact absorbing performance.

Abstract: Lignocellulosic-based woodfiber-plastic composite products containing a pesticidal amount of calcium borate is resistant to attack by wood destroying fungi and insects. The preferred calcium borates are the calcium polytriborates having a CaO:B2O3 molar ratio of about 2:3 and calcium hexaborates, having a CaO:B2O3 ratio of 1:3. Composites can be produced by combining the calcium borate with particles of the lignocellulosic material and the thermoplastic resin binder, and heating and extruding the resultant mixture through a die to form the composite product.

Abstract: A system and method of mass-producing a bait station of wax matrix material for pesticide or insecticide delivery is disclosed. The apparatus and method includes a water-heated vat 110 which supplies liquid wax matrix material to molds which may be of various forms in accordance with the desired bait station to be manufactured. A fluid pump 120 pumps the wax matrix material from the vat through a tube 130 into molding tubes 140. At a molding tube station 140 the molds are filled and then carried by a conveyer belt 100 to a cooling tunnel 160. The wax-containing molds may be shaken by an in-line shaker in order to reduce air bubbles in the wax matrix. After the wax-containing molds are cooled by the cooling tunnel 160 the conveyer carries them to a labeling station 170, after which the finished bait stations are removed from their molds and packaged.

Abstract: A process for rendering films, film composites, and articles made therefrom less resistant to passage of water vapor by passing a filled precursor film or film composite through the nip of interdigitating grooved rollers. The films or film composites are generally formed using a precursor film of a film forming polyolefin or polyolefin blend, with a relatively high filler loading and optionally an elastomer. A process is disclosed for making diapers or other disposable items where a relatively high water vapor is coupled with a resistance to liquid strikethrough.

Abstract: A binder for hydraulic compositions comprises a water-soluble cellulose ether and a long-chain alkylbenzenesulfonic acid or a neutralization salt thereof. The presence of the long-chain alkylbenzenesulfonic acid compound as a binder component provides hydraulic compositions with a better plasticity at a lower water-soluble cellulose ether content than when the cellulose ether is used alone as the binder.

Abstract: The cure rate of phenol-aldehyde resins is accelerated by conjoint use of a cyclic carbonate cure accelerant and an amine cure accelerant. The cure rate is accelerated still further by addition of a resorcinol source to resin comprising a cyclic carbonate and an amine cure accelerator. Also, cured resins made in accordance with the method.

Abstract: Poly(trimethylene terephthalate) tetrachannel cross-section staple fibers, as well as yarns, fiberfill webs, batts and products, and fabrics made therewith. Also, the process of making such staple fibers, yarns, fiberfill webs, batts and products, and fabrics.

Abstract: Conformal-coated devices packaged to be compatible with automated handling equipment. In one arrangement, open-sided, injection-molded shells are mounted around conformal-coated devices to provide dimensionally stable packaging that is compatible with device carriers and automated packaging tool heads that are indexed to select and place the devices. In another arrangement, the coating is heated and additional material is added and re-flowed to define unique surface regions compatible with automated handling equipment.

Abstract: A mold for casting a cover for a golf ball is disclosed herein. The mold is composed of a first mold half and a second mold half. Each mold half has an internal hemispherical cavity and a plurality of recesses in flow communication with the internal hemispherical cavity. The recesses are preferably concave on one side of the parting line and convex on the opposing side of the parting line. Preferably, the mold assembly is utilized to mold a polyurethane cover on a golf ball precursor product.

Abstract: Disclosed is a device for the identification marking of a workpiece which is made of a deformable material. The workpiece identification marking has a plurality of identification elements, each of which comprises elevations that project out of the surface of the workpiece. For each of the plurality of identification marking elements there is an opening in the workpiece identification marking mold of the device, through which thermal radiation can be applied to the surface of the workpiece to generate an image point, so that material that extends through the opening extends into the opening.

Abstract: A cutting torch guide is described in which a block is formed with a torch tip stop flange that defines a torch tip abutment plane and that is shaped to abut with and angularly position a torch tip with respect to a workpiece plane. An angle iron edge receiving and guiding surface is formed in the block and defines a guide plane that intersects the torch tip abutment plane. The guide plane and torch tip abutment plane are oriented to angularly position a cutting torch tip at an acute angle with respect to the workpiece.

Abstract: A process and apparatus for supplying solid feed materials for a direct smelting process to solids injection lances of a direct smelting vessel is disclosed. The feed materials supply apparatus includes a supply line (L) for conveying iron-containing material and solid carbonaceous material under pressure to solids injection lances (7), and the supply line includes a main feeder line section (15) and a plurality of branch line sections (17) extending from the main feeder line section. Each branch line section is connected to one solids injection lance for supplying iron-containing material and carbonaceous material to that lance. The apparatus further includes an assembly for dispensing iron-containing material under pressure into the main feeder line section of the supply line and an assembly for dispensing carbonaceous material under pressure into the main feeder line section of the supply line.