Patents Issued in October 14, 2003
  • Patent number: 6633072
    Abstract: To improve the shape of a gate electrode having SiGe, after patterning a gate electrode 15G having an SiGe layer 15b by a dry etching process, a plasma processing (postprocessing) is carried out in an atmosphere of an Ar/CHF3 gas. Thereby, the gate electrode 15G can be formed without causing side etching at two side faces (SiGe layer 15b) of the gate electrode 15G.
    Type: Grant
    Filed: March 20, 2001
    Date of Patent: October 14, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Kazuo Yamazaki, Shinji Kuniyoshi, Kousuke Kusakari, Takenobu Ikeda, Masahiro Tadokoro
  • Patent number: 6633073
    Abstract: Techniques to isolate noise-sensitive circuits from noise generated by nearby circuits. In one design, a quiet region is formed on a die when surrounded by a deep n-well formed on top of a p-type substrate. The deep n-well is heavily doped n-type and forms a depletion region at the junction with the p-type substrate. The depth and width of the depletion region is dependent on the doping concentration of the deep n-well and the amount of reverse bias voltage applied to the deep n-well. In general, a wider and deeper depletion region may be formed by more heavily doping the deep n-well and applying a higher reverse bias voltage. By properly constructing the deep n-well and applying a high reverse bias voltage, a deep and wide depletion region may be formed to provide a barrier against noise from entering the quiet region.
    Type: Grant
    Filed: June 29, 2001
    Date of Patent: October 14, 2003
    Assignee: RF Micro Devices, Inc.
    Inventors: Ali Rezvani, Douglas Sudjian
  • Patent number: 6633074
    Abstract: The present invention is directed to a semiconductor interconnect structure comprised of a promoter layer defining openings and a metal layer having a portion elevated above the substrate assembly and a portion that fills the openings. The metal layer is in electrical contact with the substrate assembly through the portion of the metal layer that fills the openings. The portion of the metal layer that fills the openings supports the elevated portion of the metal layer. A method of fabricating a semiconductor interconnect structure is also provided. A resist layer is patterned on a substrate assembly to define openings. A metal layer is deposited on the resist layer and into the openings, and the resist layer is removed to form a gap between the metal layer and the underlying substrate assembly.
    Type: Grant
    Filed: June 3, 1999
    Date of Patent: October 14, 2003
    Assignee: Micron Technology, Inc.
    Inventor: Kie Y. Ahn
  • Patent number: 6633075
    Abstract: A heterojunction bipolar transistor includes an emitter layer, a base layer and a collector layer laminated on a top surface of a semiconductor substrate, and a heat sink layer made of a metal and provided on a rear surface of the substrate. A via hole is cut through the emitter layer, the base layer, the collector layer and the substrate. A surface electrode of the emitter layer and the heat sink layer are connected to each other by a metal wiring line running through within the via hole, which is capable of improving the heat radiation and reducing the emitter inductance.
    Type: Grant
    Filed: August 18, 2000
    Date of Patent: October 14, 2003
    Assignee: Sharp Kabushiki Kaisha
    Inventor: Kazuhiko Shirakawa
  • Patent number: 6633076
    Abstract: Methods and apparatus of the present invention deposit fluorinated silicate glass (FSG) in such a manner that it strongly adheres to an overlying or underlying barrier layer or etch stop layer, and has a lower dielectric constant, among other benefits. In one embodiment, silicon tetrafluoride (SiF4), oxygen (O2), and argon (Ar) are used as the reactant gases, with the ratio of oxygen to silicon controlled to be at between about 2:1 to 6:1. Such O2 levels help reduce the amount of degradation of ceramic chamber components otherwise caused by the elimination of silane from the process recipe.
    Type: Grant
    Filed: October 30, 2002
    Date of Patent: October 14, 2003
    Assignee: Applied Materials, Inc.
    Inventors: Padmanabhan Krishnaraj, Robert Duncan, Joseph D'Souza, Alan W. Collins, Nasreen Chopra, Kimberly Branshaw
  • Patent number: 6633077
    Abstract: On a surface of a pair of support leads formed in one piece with a die pad on which a semiconductor chip is mounted, a protrusion is formed on the side that the semiconductor chip is mounted. During a resin-sealing, a lower surface of the die pad is brought into contact with an internal wall surface of a lower die, while a top of the protrusion is brought into contact with an internal wall surface of an upper die. This makes it possible to prevent the displacement of the die pad during sealing, thus causing no residual distortion of the semiconductor chip. As a result, a semiconductor device with a stable quality can be obtained.
    Type: Grant
    Filed: December 14, 2000
    Date of Patent: October 14, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shuichi Ogata, Kenichi Itoh
  • Patent number: 6633078
    Abstract: A semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes.
    Type: Grant
    Filed: November 20, 2001
    Date of Patent: October 14, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Tsuneo Hamaguchi, Kenji Kagata
  • Patent number: 6633079
    Abstract: RF MicroElectroMechanical Systems (MEMS) circuitry (15) on a first high resistivity substrate (17) is combined with circuitry (11) on a second low resistivity substrate (13) by overlapping the first high resistivity substrate (17) and MEMS circuitry (15) with the low resistivity substrate (13) and circuitry (11) with the MEMS circuitry (15) facing the second circuitry (11). A dielectric lid (19) is placed over the MEMS circuitry (15) and between the first substrate (17) and second substrate (13) with an inert gas in a gap (21) over the MEMS circuitry (15). Interconnecting conductors (25,31,35,37,39,41) extend perpendicular and through the high resistivity substrate (17) and through the dielectric lid (19) to make electrical connection with the low resistivity substrate (13).
    Type: Grant
    Filed: September 10, 2002
    Date of Patent: October 14, 2003
    Assignee: Raytheon Company
    Inventors: James L. Cheever, Charles L. Goldsmith, John C. Ehmke, Billy D. Ables
  • Patent number: 6633080
    Abstract: A transistor (200) is provided with a semiconductor chip (1) inside a resin package (20). An outer lead (41, 42, 43, 44) is arranged on a first side surface (23) of the resin package (20) to serve as an external drain electrode. A lead frame (5) includes the outer lead (41, 42, 43, 44) and a sheet-like portion (51). The sheet-like portion (51) is connected to a first surface (1a) of the semiconductor chip (1) for holding a drain electrode. An outer lead (45, 46, 47, 48) is arranged on a second side surface (24) of the resin package (20) to serve as an external source electrode. The outer lead (45, 46, 47, 48) is connected by a wire (4) to a second surface (1b) of the semiconductor chip (1) for holding a source electrode. An ejector pin site (22) formed on a top surface (21) of the resin package (20) is located on the side of the first side surface (23).
    Type: Grant
    Filed: March 27, 2002
    Date of Patent: October 14, 2003
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventor: Hiroaki Hamachi
  • Patent number: 6633081
    Abstract: A semiconductor device is to be mounted on a packaging substrate. The semiconductor device includes a first semiconductor chip, a plurality of first electrode pads provided on a surface of the first semiconductor chip on a side of the packaging substrate, for electrically connecting the first semiconductor chip to the packaging substrate, a second semiconductor chip mounted on the first semiconductor chip so as to be surrounded by the plurality of first electrode pads, and protruding electrodes respectively provided so as to protrude from the first electrode pads toward the packaging substrate so that their surfaces are substantially flush with a surface of the second semiconductor chip on a side of the packaging substrate.
    Type: Grant
    Filed: May 29, 2002
    Date of Patent: October 14, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Ryuiti Sahara, Nozomi Simoishizaka
  • Patent number: 6633082
    Abstract: A semiconductor device is provided and contains a substrate, a first wiring layer, a first oxide film, a dielectric film, a first nitrogen layer, a second wiring layer, a via hole, and a second nitrogen layer. The first wiring layer is formed on the substrate, and the first oxide film formed on the first wiring layer. The dielectric film has a low dielectric constant and is disposed between the first and second wiring layers. The first nitrogen layer contains nitrogen and is formed in the first oxide film. The via hole is formed through the dielectric film and is disposed between the first wiring layer and the second wiring layer for electrically connecting the first wiring layer and the second wiring layer. The second nitrogen layer contains nitrogen and is formed on a side wall of the via hole. Since the first and second nitrogen layers prevent moisture from spreading to various portions of the semiconductor device, leak current between adjacent wirings of the wiring layers is prevented.
    Type: Grant
    Filed: June 1, 1998
    Date of Patent: October 14, 2003
    Assignee: NEC Corporation
    Inventors: Noriaki Oda, Akira Matsumoto
  • Patent number: 6633083
    Abstract: A structure and method for determining barrier layer integrity for multi-level copper metallization structures in integrated circuit manufacturing. Novel testing structures prevent any conducting residues of the copper CMP from diffusing into the dielectric layer. Barrier layer integrity is tested by performing CV or IV measurements between the copper lines and the silicon wafer.
    Type: Grant
    Filed: February 28, 2000
    Date of Patent: October 14, 2003
    Assignee: Advanced Micro Devices Inc.
    Inventors: Christy Mei-Chu Woo, Young-Chang Joo, Todd Lukanc
  • Patent number: 6633084
    Abstract: The present invention is a semiconductor wafer, and a method of fabricating the semiconductor wafer, that reduces dishing over large area features in chemical-mechanical polishing processes. The semiconductor wafer has a substrate with an upper surface, a large area feature formed on the substrate, and a separation layer deposited on the substrate. The separation layer has a top surface and a cavity extending from the top surface towards the upper surface of the substrate. The large area feature is positioned in the cavity of the separation layer, and a support pillar is positioned in the cavity. In one embodiment, the pillar has a base positioned between components of the large area feature and a crown positioned proximate to a plane defined by the top surface of the separation layer. In operation, the pillar substantially prevents the polishing pad of a polishing machine from penetrating into the cavity beyond the top surface of the separation layer.
    Type: Grant
    Filed: November 12, 1999
    Date of Patent: October 14, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Gurtej Singh Sandhu, Chris Chang Yu
  • Patent number: 6633085
    Abstract: A metal interconnect structure and method of making the same implants ions of an alloy elements into a copper line through a via. Then ion implantation of the alloy elements in the copper line through the via provides improved electromigration properties at the copper line at a critical electromigration failure site, without attempting to provide alloy elements throughout the entire copper line.
    Type: Grant
    Filed: June 20, 2001
    Date of Patent: October 14, 2003
    Assignee: Advanced Micro Devices, Inc.
    Inventors: Paul R. Besser, Larry Zhao, Donggang David Wu
  • Patent number: 6633086
    Abstract: The present invention provides a stacked chip scale package structure, wherein a lower chip and an upper chip are stacked on a substrate. Two rows of bonding pads are disposed on each of the upper and lower chips. The bonding pads on the upper and lower chips are parallel arranged. At least a dummy die is disposed below the suspended portion of the upper chip and at the side of the lower chip as a support during wire bonding. A gap is reserved between the dummy die and the lower chip. The present invention utilizes the design of dummy die to resolve the problem of die crack caused by wire bonding of suspended chip. Therefore, the present invention can flexibly adjust the size and installation direction of the upper chip to meet the requirement of substrate layout, and can also shorten the trace length on the substrate to enhance the electric performance thereof.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: October 14, 2003
    Assignee: Vate Technology Co., Ltd.
    Inventors: Yi-Liang Peng, Kai-Chiang Wu
  • Patent number: 6633087
    Abstract: A low-capacitance bonding pad for a semiconductor device. A diffusion region is formed in a substrate, and a bonding pad is formed on the substrate and aligned with the diffusion region. The bonding pad is made from a stacked metal layer and a metal layer. The stacked metal layer is made from a plurality of metal layers and a plurality of dielectric layers, and the metal layers and the dielectric layers are stacked alternately. The metal layers stacked in the stacked metal layer are formed with small areas. Each of the metal layers stacked in the stacked metal layer is coupled with the adjacent metal layer by via plugs.
    Type: Grant
    Filed: March 27, 2001
    Date of Patent: October 14, 2003
    Assignee: Industrial Technology Research Institute
    Inventors: Ming-Dou Ker, Hsin-Chin Jiang
  • Patent number: 6633088
    Abstract: A drive circuit for an AC ignition circuit, which has at least one capacitor and at least one trigger element, which is used to deploy a restraint system in a motor vehicle, has a bridge circuit with four electronically controllable switches, of which two switches are connected in series between a supply voltage and ground, and the ignition circuit forms a bridge shunt between both pairs of switches connected in parallel. If a fault occurs in the bridge circuit, the individual switches are triggered so that charging and discharging of the capacitor in the ignition circuit is guaranteed in spite of the fault.
    Type: Grant
    Filed: March 20, 2001
    Date of Patent: October 14, 2003
    Assignee: Robert Bosch GmbH
    Inventors: Bernhard Mattes, Hartmut Schumacher, Klaus Ringger
  • Patent number: 6633089
    Abstract: An engine room harness routing structure is provided that allows a harness trunk line to be routed without imposing restrictions on the design of the vehicle body. The harness trunk line is housed in an upper position inside a cowl box having a relatively large amount of leeway in its cross sectional area and is routed in the widthwise direction of the vehicle inside the cowl box. Consequently, there is no need to secure space for mounting the harness between the under surface of the cowl box and the upper surface a brake master cylinder back installed there below. As a result, the problem of the height of the cowl box from the ground increasing and affecting the design of the vehicle body can be avoided and the layout of harness trunk line can be established so as not to restrict the vehicle model.
    Type: Grant
    Filed: January 22, 2002
    Date of Patent: October 14, 2003
    Assignee: Nissan Motor Co., Ltd.
    Inventor: Fumikazu Kimura
  • Patent number: 6633090
    Abstract: A starting system for an engine of an automotive vehicle having an ignition system includes a fingerprint sensor (26) that generates a fingerprint signal. A memory has a plurality of authorized fingerprint signals stored therein. A switch (28) is used to generate a start signal. A controller is coupled to the ignition system (20), the fingerprint sensor (26), the memory (18), and switch (28). The controller compares the fingerprint signal with the authorized fingerprint signal stored in the memory and enables the ignition system in response to the start signal and the fingerprint signal being substantially equal to an authorized fingerprint signal.
    Type: Grant
    Filed: September 7, 2001
    Date of Patent: October 14, 2003
    Assignee: Delphi Technologies, Inc.
    Inventors: Joseph E. Harter, Gregory K. Scharenbroch, Gerald J. Witt, David E. Schnelker
  • Patent number: 6633091
    Abstract: The storage module comprises a plurality of storage means Ca-Cd for storing electric energy and energy transfer means 2a-2d and Sa-Sd for transferring stored energy among the plurality of storage means Ca-Cd so that the charging voltage Vca-Vcd across each of the storage means Ca-Cd can be kept at a value according to a prescribed ratio.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: October 14, 2003
    Assignee: Nagano Japan Radio Co., Ltd.
    Inventor: Seiichi Anzawa
  • Patent number: 6633092
    Abstract: A short circuit within the dynamic voltage restorer (1) is immediately detected by a short circuit detection units (9) which permanently monitors currents and voltages in the voltage source converter (3) and energy storage capacitor bank (2). Upon detection a fast discharge of the capacitor bank (2) including firing of all available semiconductors of the voltage source converter (3) and distributing the resulting current stress as evenly as possible within the voltage source converter (3) is initiated. Instead of letting costly fuses interrupt the high short circuit currents, these currents are detected and evenly distributed within the converter.
    Type: Grant
    Filed: June 27, 2001
    Date of Patent: October 14, 2003
    Assignee: ABB Industrie AG
    Inventors: Peter Dähler, Gerold Knapp
  • Patent number: 6633093
    Abstract: The present invention is a device using a non-linear capacitor and voltage amplification effect, which can generate a pulse having a short pulse width at high voltage. The device comprises a rectification circuit for rectifying the AC input power supply, a semiconductor switch connected to one output terminal of said rectification circuit, a primary coil connected between an output of said semiconductor switch and the other output terminal of said rectification circuit, a diode in which the cathode thereof is connected to the output of said semiconductor switch, a capacitor connected between an anode of said diode and the other output terminal of said rectification circuit, a secondary coil in which one terminal thereof is connected to the anode of said diode, a non-linear capacitor connected between the other terminal of said secondary coil and the other output terminal of said rectification circuit, and a load connected in parallel across two terminals of said non-linear capacitor.
    Type: Grant
    Filed: March 26, 2001
    Date of Patent: October 14, 2003
    Assignee: Korea Electrotechnology Research Institute
    Inventors: Guen Hie Rim, Chu Hyun Cho, Ju Won Baek, Evgueni P. Pavlov
  • Patent number: 6633094
    Abstract: Disclosed is a speed regulator for an automatically closing slide door for regulating a closing speed of an automatically closing slide door which is closed automatically, comprising; a generator associated with said slide door; an one-way clutch means for converting a linear movement caused during a closing motion of said slide door into a rotational movement and for transmitting said rotational movement to said generator; a resistor connected to an output of said generator; and a speed change means for changing said closing speed of said slide door, at a predetermined position before the closed position of said slide door, from a first predetermined speed to a second predetermined speed slower than said first predetermined speed by changing a resistance value of said resistor.
    Type: Grant
    Filed: October 10, 2000
    Date of Patent: October 14, 2003
    Assignee: Howa Corporation
    Inventor: Kazuaki Andou
  • Patent number: 6633095
    Abstract: A motion device (100) includes a shape memory transducer (110) having a preset memory state and logically divided into first and second portions (116, 118). A coupled electrical circuit (130) is operable to selectively energize the first portion (116) to create a force that moves the first portion (116) toward its memory state which moves the second portion (118) in a first direction out of its memory state, and to selectively energize the second portion (118) to create a force that moves the second portion (118) towards its memory state which moves the first portion (116) away from its memory state in a second direction different from the first direction. A feedback system (120) is preferably included to provide for precise motion control.
    Type: Grant
    Filed: March 1, 1999
    Date of Patent: October 14, 2003
    Inventors: Charles B. Swope, Patrick D. Koskan, Jorge L. Garcia
  • Patent number: 6633096
    Abstract: A brushless generator is composed of a front bracket, a rear bracket, a stator, a rotary shaft, a core, poles, a ring, a field core, a field winding bobbin, and a field winding. Air gaps are defined by facing surfaces between the field core and the core, between the poles and the stator, between one side of a pole and the field core, and between the core and another side pole. Magnetic coating made of magnetic particles and a binding material is applied to the surfaces which face the air gaps. A tensile strength of the magnetic coating is set smaller than a bonding strength of the same. Thus, in case that the surfaces to which the magnetic coating is applied is damaged by an external force, the magnetic coating does not peel but rather the breaking of the base material occurs.
    Type: Grant
    Filed: October 10, 2001
    Date of Patent: October 14, 2003
    Assignee: Denso Corporation
    Inventor: Tooru Ooiwa
  • Patent number: 6633097
    Abstract: A stator frame for an electric motor including a substantially cylindrical shaped body section having opposed ends, a cooling passageway extending through at least a portion of the body section, and at least one spacer bar. The cooling passageway includes a cooling conduit having an inlet port and an outlet port in flow communication with the cooling passageway. The spacer bar has a notched side and at least one finger extending therefrom such that the finger mechanically couples the spacer bar to the cooling conduit.
    Type: Grant
    Filed: September 10, 2001
    Date of Patent: October 14, 2003
    Assignee: General Electric Company
    Inventors: Robert A. Dunlap, James R. Crowell
  • Patent number: 6633098
    Abstract: An alternator for use in an automobile includes brackets for supporting a rotation shaft at both sides of a rotor, being thermally connected to a stator for supporting the stator, while one side of the rotor is closed by a bracket. A cooling water passage is provided in the bracket, a cooling fan is provided on the closed side of the rotor, and a cooling fin provided opposing to the cooling fan and in vicinity of the cooling water passage, thereby enabling cool down of the stator and the rotor, effectively, with low noises, and thereby obtaining a high power output.
    Type: Grant
    Filed: January 25, 2002
    Date of Patent: October 14, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Toru Inaba, Hideaki Mori, Keizou Kawamura, Susumu Sasaki, Masami Takano, Susumu Tajima, Susumu Terumoto
  • Patent number: 6633099
    Abstract: A coaxial starter motor assembly that includes a housing. An electrical motor is provided in the housing that has a rotatable armature shaft that is linked with a drive shaft. A pinion assembly is provided that is engageable at one end with the drive shaft and includes a pinion at the other end engageable with a flywheel of an engine. A solenoid assembly is provided for selectively energizing the electrical motor. The solenoid assembly is coaxial with the drive shaft. The solenoid assembly includes a plunger having a bore. The plunger is engageable with the pinion assembly to move the pinion assembly including the pinion into engagement with the flywheel. The plunger is also engageable with a moveable contact to move the moveable contact to electrically connect with a pair of fixed contacts. A return spring is provided that is positioned at least in part within the bore of the plunger of the solenoid assembly for moving the pinion assembly including the pinion away from engagement with the flywheel.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: October 14, 2003
    Assignee: Delco Remy America, Inc.
    Inventors: David A. Fulton, James D. Stuber
  • Patent number: 6633100
    Abstract: Disclosed is a permanent magnet motor consisting of a rotor which is a multi polar-magnetized cylindrical permanent magnet such as a neodymium/iron/boron magnet, and a stator having a plurality of stator teeth. Different from conventional but expensive multi-radial orientation of the magnetic anisotropy, the cylindrical permanent magnet has a direction of orientation along a single diameter of the cylinder that is perpendicular to the cylinder axis when a definite relationship is held between the number of the multipolar magnetic poles and the number of the stator teeth. Even when using such a simple and inexpensive cylindrical permanent magnet as the rotor, high performance of the permanent magnet motor can be ensured with regard to a large induced voltage and small torque ripples.
    Type: Grant
    Filed: April 6, 2001
    Date of Patent: October 14, 2003
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Koji Sato, Takehisa Minowa, Koji Miyata
  • Patent number: 6633101
    Abstract: A torque motor configuration that minimizes off-axis magnetic forces emanating from adjacent energized coils acting on a magnet. The motor includes a stator comprising a sleeve with conductive coils disposed thereon, and the stator further defining a rotor opening, and a rotor disposed in the rotor opening comprising a magnet disposed on a shaft with the sleeve being shorter than the magnet and the coils including turn around zones beyond respective ends of the sleeve. The motor may be incorporated into an optical scanning system including optical elements for detecting light from a light source.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: October 14, 2003
    Assignee: Nutfield Technology, Inc.
    Inventor: Brian P. Stokes
  • Patent number: 6633102
    Abstract: An armature for a rotating electrical machine and more particularly to an insulating cover for the pole teeth around which the windings are formed that has good strength against the winding without risk of damage of the insulator due to increased thickness in the highly stressed areas.
    Type: Grant
    Filed: August 29, 2002
    Date of Patent: October 14, 2003
    Assignee: Kabushiki Kaisha Moric
    Inventors: Kenji Nagai, Hiroaki Kondo, Hisanobu Higashi, Takahiro Matsumoto
  • Patent number: 6633103
    Abstract: A stator (1) and sleeve (5) are secured to one another by means of nonpositive engagement in the form of a bayonet mount (30). The apparatus is employed in particular in electric motors.
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: October 14, 2003
    Assignee: Robert Bosch GmbH
    Inventors: Wolf Joachim Eggers, Johannes Pfetzer
  • Patent number: 6633104
    Abstract: An apparatus for estimating DC motor brush wear comprising: a wear element calculator adapted to calculate a plurality of wear elements from at least one environmental variable; a wear element multiplier adapted to multiply the wear elements by respective ones of a plurality of wear coefficients to yield a plurality of weighted wear elements; and a summer adapted to sum the weighted wear elements to yield a brush wear estimate.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: October 14, 2003
    Assignee: General Electric Company
    Inventors: John Erik Hershey, Brock Estel Osborn, Deniz Senturk, Howard Daniel Koontz, Brian Joseph McManus, Edward James Lewandowski
  • Patent number: 6633105
    Abstract: A permanent magnet motor having a stator and a permanent magnet rotor facing the stator with a gap therebetween, the stator having a plurality of stator magnetic poles extending radially toward a peripheral surface of the rotor, s number of small stator teeth formed on a tip end of each of the magnetic poles, and exciting windings of m phases wound around the stator magnetic poles. The rotor having a cylindrical permanent magnet having pieces of N pole and pieces of S pole arranged alternately in a peripheral direction thereof at equal pitches, wherein a pitch of the small stator teeth is 1±1/(2ms) times larger than a pitch of the rotor magnetic pole pairs. The width of the small stator tooth is 37˜47% of the magnetic pole pitch. A depth of the groove formed between the adjacent small stator teeth is more than 15 times larger than the length of the air gap between the stator and the rotor.
    Type: Grant
    Filed: March 22, 2002
    Date of Patent: October 14, 2003
    Assignee: Japan Servo Co., Ltd.
    Inventors: Kazuo Ohnishi, Masafumi Sakamoto, Noriyoshi Kikuchi
  • Patent number: 6633106
    Abstract: An axial gap motor-generator of the type coupled to a shaft having an axis of rotation. The motor-generator comprises a rotor having a rotor body rotatably disposed about the shaft and having an outer region. The rotor includes a plurality of openings disposed in the outer region and spaced from one another. Each of the openings includes an outer edge. The motor-generator also includes a plurality of magnets equal in number to the openings. Each of the magnets includes an outer edge corresponding to the outer edge of a corresponding one of the openings. The outer edge of the magnets generally is non-conformal to and is slightly smaller than the outer edge of the openings, and each of the magnets is shaped to be inserted into the corresponding one of the openings. The motor-generator further includes a stator assembly positioned adjacent to the rotor. The stator assembly includes windings positioned to be adjacent to the magnets when the rotor is rotated.
    Type: Grant
    Filed: May 8, 2000
    Date of Patent: October 14, 2003
    Inventor: Dwight W. Swett
  • Patent number: 6633107
    Abstract: An electrical transformer including a tank containing transformer fluid, a transformer core and winding subassembly disposed in the transformer fluid within and spaced apart from the tank. An active device, disposed in the transformer fluid within the tank, various the volume of the transformer fluid in order to reduce pressure waves generated by the vibration of the core and winding subassembly during electromagnetic operation. The active device includes at least a cell having a main body and a corrugated membrane connected to the main body in order to realize a sealed container able to maintain a low pressure atmosphere inside, and an actuator placed inside the sealed container and solidly connected to the corrugated membrane.
    Type: Grant
    Filed: October 12, 2001
    Date of Patent: October 14, 2003
    Assignee: ABB T & D Technology Ltd.
    Inventors: Stefano Calabro', Franco Moriconi
  • Patent number: 6633108
    Abstract: A piezoelectric actuator, e.g., for actuating a mechanical component, is proposed, in which a piezoelectric element (2) for acting on an actuating element (9) with a pulling or pushing force, and a compensating element (3; 20) are provided, wherein the piezoelectric element (2) and the compensating element (3; 20) basically have the same temperature expansion coefficients. The compensating element (3; 20) is mechanically coupled to the piezoelectric element (2) in such a fashion that the temperature-induced expansions of the piezoelectric element (2) and the compensating element (3; 20) cancel each other out in the effective direction in such a fashion that the actuating element (9) remains in its position. A heat transfer compound (12) is located between the piezoelectric element (2; 21) and the compensating element (3; 22).
    Type: Grant
    Filed: March 25, 2002
    Date of Patent: October 14, 2003
    Assignee: Robert Bosch GmbH
    Inventor: Friedrich Boecking
  • Patent number: 6633109
    Abstract: The present invention provides a DBD lamp used in fluid treatment systems, where the irradiated fluid is used as a low voltage outer electrode instead of a metallic wire mesh. This fluid is in direct contact with the lamp envelope which acts as a two-fold advantage. First, the fluid acts as a strong built-in cooling source. This allows the lamp to be driven at high voltage without forced cooling. Second, the replacement of the wire mesh as the outer electrode by fluid as well as the sleeve eliminates the absorption of radiation from the outer surface of the DBD-driven light source which more than doubles the efficiency of the DBD-driven light source. The inner high voltage electrode remains in the center of the coaxial tube assembly and provides high voltage across the gas to generate excimer formation.
    Type: Grant
    Filed: January 8, 2001
    Date of Patent: October 14, 2003
    Assignee: Ushio America, Inc.
    Inventor: Zoran Falkenstein
  • Patent number: 6633110
    Abstract: A lamp assembly comprised of a waterproof casing, a lamp disposed within the casing, and a source of electrical current electrically connected to the lamp, from the source to the lamp. The lamp, when operated with a 12 volt power supply, consumes less than 40 watts The preferred lamp used in the assembly is described and claimed in U.S. Pat. No. 5,418,419.
    Type: Grant
    Filed: June 7, 2001
    Date of Patent: October 14, 2003
    Assignee: Tailored Lighting Inc.
    Inventors: Kevin P. McGuire, Albert Honegger, Felix Kessler
  • Patent number: 6633111
    Abstract: An electrodeless lamp is disclosed. The electrodeless lamp according to the present invention is characterized in that SnI2 is used as a major component filled into a bulb as a filler, and the filler is excited by applying a microwave or high frequency to the bulb for thereby generating a visual ray for thereby obtaining a certain color temperature proper as a light source and implementing a faster light emission start-up at a lower cost without an additive.
    Type: Grant
    Filed: February 9, 2000
    Date of Patent: October 14, 2003
    Assignee: LG Electronics Inc.
    Inventors: Han Seok Kim, Joon Sik Choi, Hyung Joo Kang, Yong Seog Jeon, Hyo Sik Jeon
  • Patent number: 6633112
    Abstract: A filament array for an incandescent lamp comprises at least five filament sections (10) having their longitudinal axes parallel with one another and, when viewed in plan, being arranged substantially symmetrically in a polygonal configuration around the lamp axis. The filament sections are wound from a single wire and are electrically connected together in series by means of linking sections (18, 19, 20) of said wire extending between corresponding ends of the filament sections, with alternate linking sections being positioned at opposite ends of the filament sections. The linking sections at the two ends of the array are supported by a set of support members (30, 31) extending from respective frame members (34, 35). The electrical input and output (14, 15) of the array are through terminal wire sections on opposite or substantially opposite sides of the array.
    Type: Grant
    Filed: June 4, 2001
    Date of Patent: October 14, 2003
    Assignee: General Electric Company
    Inventors: Andrew Davies, Roger Alan Hume
  • Patent number: 6633113
    Abstract: A high resolution field emission display includes a faceplate and a baseplate. The faceplate includes a transparent viewing layer, a transparent conductive layer formed on the transparent viewing layer and intersecting stripes of light-absorbing, opaque insulating material formed on the transparent conductive layer. The insulating material defines openings less than one hundred microns wide between the intersecting stripes. The faceplate also includes a plurality of localized regions of cathodoluminescent material, each formed in one of the openings. The cathodoluminescent material includes a metal oxide providing reduced resistivity in the cathodoluminescent material. Significantly, the reduced resistivity of the cathodoluminescent material together with the focusing effect of the insulating material provide increased acuity in luminous images formed on the faceplate.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: October 14, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Zhongyi Xia, Jimmy J. Browning, Charles M. Watkins, David A. Cathey
  • Patent number: 6633114
    Abstract: A mass spectrometer includes an ion source which generates a beam including positive ions, a sampling interface which extracts a portion of the beam from the ion source to form a sample beam that travels along a path and has an excess of positive ions over at least part of the path, thereby causing space charge effects to occur in the sample beam due to the excess of positive ions in the sample beam, an electron source which adds electrons to the sample beam to reduce space charge repulsion between the positive ions in the sample beam, thereby reducing the space charge effects in the sample beam and producing a sample beam having reduced space charge effects, and a mass analyzer which analyzes the sample beam having reduced space charge effects.
    Type: Grant
    Filed: January 12, 2001
    Date of Patent: October 14, 2003
    Assignee: Iowa State University Research Foundation, Inc.
    Inventors: Robert S. Houk, Narong Praphairaksit
  • Patent number: 6633115
    Abstract: A shadow mask comprises a frame member, a mask body formed in a plate shape as a grid element and mounted to the frame member and a plurality of slits formed to the mask body. The mask body is composed of an iron-based alloy containing 31.0-38.0 weight % of nickel and 1.0-6.5 weight % of cobalt and the iron-based alloy contains 0.01-0.10 weight % of carbon.
    Type: Grant
    Filed: October 27, 2000
    Date of Patent: October 14, 2003
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Akira Makita, Yutaka Matsumoto, Takahito Aoki
  • Patent number: 6633116
    Abstract: Deflection yoke for a cathode ray tube including horizontal and vertical deflection coils for deflecting electron beams emitted from an electron gun in a horizontal or vertical direction, a ferrite core for reducing a loss of a magnetic force generated at the horizontal and vertical deflection coils to enhance a magnetic efficiency, and a holder for fixing the horizontal and vertical deflection coils and the ferrite core to preset positions, and insulating between the horizontal deflection coils and the vertical deflection coils, wherein the ferrite core includes a main ferrite core with a curved surface and supplementary ferrite cores each with a planar surface fitted to the main ferrite core, thereby maintaining advantages of the rectangular core of improving a deflection sensitivity compared to the circular ferrite core, and permitting easier grinding on an internal surface compared to the rectangular ferrite core, to improve a distribution of inside surface dimensions.
    Type: Grant
    Filed: November 17, 2000
    Date of Patent: October 14, 2003
    Assignee: LG Electronics Inc.
    Inventor: Seok Moon Lee
  • Patent number: 6633117
    Abstract: A display device is provided in which a structure of a display tube is simplified so as to achieve a cost reduction and electric connection to a driving circuit is made easy. In the display device including a group of display tubes arranged in parallel for emitting light by gas discharge, plural transparent auxiliary electrodes for display are arranged in the length direction on the outer surface of the tubular vessel that defines a discharge gas space of each of the display tubes, so that the position of a discharge portion is determined. The auxiliary electrodes at the same position in the length direction of the vessel are connected to one another electrically via a band-like power supplying conductor provided on a front substrate, and a back substrate is arranged on which a band-like conductor is provided along each of the display tubes at the back side of the group of display tubes.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: October 14, 2003
    Assignee: Fujitsu Limited
    Inventors: Tsutae Shinoda, Akira Tokai, Hitoshi Yamada, Manabu Ishimoto
  • Patent number: 6633118
    Abstract: An electron-emitting device includes, a pair of electroconductors disposed on a substrate so as to face each other, and a pair of deposit films connected to the pair of electroconductors, respectively, disposed with a gap therebetween and mainly containing carbon. Lead is contained in the deposit films in a rate of from 1 mol % to 5 mol %% with respect to carbon.
    Type: Grant
    Filed: February 25, 2000
    Date of Patent: October 14, 2003
    Assignee: Canon Kabushiki Kaisha
    Inventors: Keisuke Yamamoto, Tamaki Kobayashi, Satoshi Mogi
  • Patent number: 6633119
    Abstract: A field emission display (100, 200) includes a cathode plate (102, 302), an anode plate (104, 204, 304), and a hydrogen source (146, 148, 129, 150, 246, 346, 270), which is preferably disposed on cathode plate (102, 302) or anode plate (104, 204, 304). Hydrogen source (146, 148, 129, 150, 246, 346, 270) is distributed over the active area of field emission display (100, 200) and is made from a metal hydride, which is selected from the group consisting of titanium hydride, vanadium hydride, zirconium hydride, hafnium hydride, niobium hydride, and tantalum hydride. The metal hydride can be activated to provide an isotope of hydrogen in situ.
    Type: Grant
    Filed: May 17, 2000
    Date of Patent: October 14, 2003
    Assignee: Motorola, Inc.
    Inventors: Babu R. Chalamala, Robert H. Reuss
  • Patent number: 6633120
    Abstract: A high power LED lamp has a GaN chip placed over an AlGaInP chip. A reflector is placed between the two chips. Each of the chips has trenches diverting light for output. The chip pair can be arranged to produce white light having a spectral distribution in the red to blue region that is close to that of daylight. Also, the chip pair can be used to provide an RGB lamp or a red-amber-green traffic lamp. The active regions of both chips can be less than 50 microns away from a heat sink.
    Type: Grant
    Filed: March 30, 2001
    Date of Patent: October 14, 2003
    Assignee: Unisplay S.A.
    Inventor: Hassan P. A. Salam
  • Patent number: 6633121
    Abstract: An organic electroluminescent device including a lower electrode, an organic light-emission medium, and an upper electrode on a support substrate, wherein the water content of the organic light-emission medium does not exceed 0.05 wt. %. By so controlling the water content of the organic light-emission medium, it is possible to prevent shrinkage of a light-emission area based on production of non-emission parts or non-emission spots for a long time at both high temperature and room temperature conditions. A method of making the organic electroluminescent device is disclosed also.
    Type: Grant
    Filed: January 23, 2001
    Date of Patent: October 14, 2003
    Assignee: Idemitsu Kosan Co., Ltd.
    Inventors: Mitsuru Eida, Hiroshi Tokailin, Yoshikazu Nagasaki, Toshio Sakai