Abstract: A new method is provided for the processing of metals, most notably copper, such that damage to exposed surfaces of these metals is prevented. During a step of semiconductor processing, which results in exposing a metal surface to a wet substance having a pH value, a voltage is applied to the metal that is exposed. The value of the applied voltage can, dependent on the value of the pH constant of the wet substance, be selected such that the exposed metal surface is protected against alkaline effects of the wet substance.

Abstract: A method for forming a self aligned pattern on an existing pattern on a substrate comprising applying a coating of a solution containing a masking material in a carrier, the masking material having an affinity for portions of the existing pattern; and allowing at least a portion of the masking material to preferentially assemble to the portions of the existing pattern. The pattern may be comprised of a first set of regions of the substrate having a first atomic composition and a second set of regions of the substrate having a second atomic composition different from the first composition. The first set of regions may include one or more metal elements and the second set of regions may include a dielectric. The first and second regions may be treated to have different surface properties. Structures made in accordance with the method. Compositions useful for practicing the method.

Abstract: A method for forming a self aligned pattern on an existing pattern on a substrate comprising applying a coating of the masking material to the substrate; and allowing at least a portion of the masking material to preferentially attach to portions of the existing pattern. The pattern is comprised of a first set of regions of the substrate having a first atomic composition and a second set of regions of the substrate having a second atomic composition different from the first composition. The first set of regions may include one or more metal elements and the second set of regions may include a dielectric. The masking material may comprise a polymer containing a reactive grafting site that selectively binds to the portions of the pattern.

Abstract: Provided is a method for manufacturing a semiconductor device, including a dual-stage deposition step including: a first stage for introducing tantalum penta-ethoxide containing tantalum as a material gas into a reaction chamber in which a semiconductor substrate on a surface of which a lower electrode is made of ruthenium is placed to thus form a tantalum oxide film by a vapor-phase growth method such as a chemical vapor deposition method and the following second stage for removing from the reaction chamber the material gas introduced into the reaction chamber at the first stage and a byproduct produced at the first stage by introducing a nitrogen gas, and wherein the tantalum oxide film is formed on the semiconductor substrate, by repeating the dual-stage deposition step two or more times.

Abstract: A method for forming integrated dielectric layers using plasma energy includes (i) depositing a first dielectric layer on a substrate using a first reaction gas comprised of a source gas at a first source gas flow rate and an inert gas at a first inert gas flow rate, wherein the first inert gas flow rate is no more than 40% of the first source gas flow rate, and (ii) continuously depositing a second dielectric layer on top of the first dielectric layer using a second reaction gas comprised of a source gas at a second source gas flow rate and an inert gas at a second inert gas flow rate, wherein the second inert gas flow rate is 40% or higher of the second source gas flow rate.

Abstract: To provide a method for the formation of oxide films to form with advantage a high-quality oxide film having excellent uniformity in film thickness and film quality over the entire wafer. The method for the formation of oxide films comprises: the pretreatment process of forming a protective oxide film on the surface of a wafer positioned in a reaction vessel by performing oxidation treatment with radical oxidative species or an atmosphere containing radical oxidative species under depressurized conditions; and the oxide-film-formation process of forming an oxide film on the wafer by performing oxidation treatment at a predetermined temperature under depressurized conditions. The oxide-film-formation process is preferably performed following the pretreatment process in a continuous manner in the reaction vessel in which the pretreatment process is performed.

Abstract: A multi-layer semiconductor integrated circuits enabling stabilizing photolithography process parameters, the photomask being used, and the manufacturing method thereof is provided, which is to provide a formal pattern layout first, and to layout in coordination with a dummy pattern of the regulations, next combine the dummy pattern layout with the formal pattern layout by utilizing the logic operation so that the dummy pattern layout is added within the informal pattern spacing of the formal pattern layout, next to manufacture the photomask by utilizing the fused pattern layout so that it is applicable to various density change of the pattern structure layer of the multi-layer semiconductor integrated circuits with various logic process and further decrease the density variation between multi-layer pattern structures to simply the control of the photolithography process by utilizing the way of adding the dummy pattern layout as well as stabilizing the process.

Abstract: A Lewis acid-base reaction is caused, in a solution, between a first monomer corresponding to a Lewis acid and a second monomer corresponding to a Lewis base, so as to generate a monomer adduct in which the first monomer and the second monomer are bonded to each other through weak electric interaction. Next, the solution including the monomer adduct is applied on a substrate so as to form a supramolecular solid thin film made of the monomer adduct. Then, the supramolecular solid thin film is heated so as to cause a polymerization reaction between the first monomer and the second monomer within the supramolecular solid thin film, thereby forming a polymer thin film.

Abstract: A surface may be selectively coated with a polymer using an induced surface grafting or polymerization reaction. The reaction proceeds in those regions that are polymerizable and not in other regions. Thus, a semiconductor structure having organic regions and metal regions exposed, for example, may have the organic polymers formed selectively on the organic regions and not on the unpolymerizable or metal regions.

Abstract: A process for depositing porous silicon oxide-based films using a sol-gel approach utilizing a precursor solution formulation which includes a purified nonionic surfactant and an additive among other components, where the additive is either an ionic additive or an amine additive which forms an ionic ammonium type salt in the acidic precursor solution. Using this precursor solution formulation enables formation of a film having a dielectric constant less than 2.5, appropriate mechanical properties, and minimal levels of alkali metal impurities. In one embodiment, this is achieved by purifying the surfactant and adding ionic or amine additives such as tetraalkylammonium salts and amines to the stock precursor solution.

Abstract: Upon performing a heat treatment by heating a semiconductor wafer positioned inside a reaction vessel with a heater provided outside the reaction vessel and supplying a processing gas into the reaction vessel, to increase the temperature inside the reaction vessel promptly to reach a processing temperature to be stabilized after the wafer is carried into the reaction vessel, and to reduce the burden to the operator caused in the heating control adjustment.

Abstract: A laser-assisted direct imprint process enables direct transfer of patterns on a contact mold to molten semiconductor material. During the pattern transfer, sonic energy may be applied to improve the efficacy of the pattern transfer.

Abstract: The invention allows a cluster tool to change from a first recipe to a second recipe, while preserving periodicity and ensuring that there are no delays at critical points. This procedure is referred to as recipe cascading. Cascading involves emptying a first lot of wafers off a cluster tool and populating the cluster tool with another lot of wafers, serially and simultaneously. The procedure is performed with no delays incurred at critical process steps; and with no additional robots and process modules other than those called for by the recipe and throughput requirements of the entering and the exiting lots. The entering lot may also have different recipes and throughput requirements from the exiting lot. A program residing on a computer determines a schedule for the cluster tool which enables recipe cascading. The program may use a genetic algorithm to determine the schedule, or any other optimization technique.

Abstract: A connector comprises contact pins, an insulator and a supplementary insulator. Each of the contact pins comprises a supported portion and a contact end. The insulator comprises accommodation portions which accommodate the respective contact pins. Each of the accommodation portions is provided with a supporting portion which includes a supporting surface and supports the supported portion of the corresponding contact pin. The supplementary insulator is fixedly held by the insulator. At least one part of the supported portion of the contact pin is placed between the supporting surface and the supplementary insulator in a Z-direction. Therefore, the supported portion always straightly extends in a Y-direction so that the contact end can be surely positioned at a predetermined position.

Abstract: An area array connector adapted to connect contact pads on a first generally planar circuit element to corresponding contact pads on a second generally planar circuit element is described. The area array connector includes an interposer housing and at least one electrical interconnector positioned within the interposer housing. The at least one electrical interconnector is comprised of a plurality of electrical contacts stacked in a substantially parallel relationship to one another. The at least one electrical interconnector is positioned to make contact with a first contact pad on the first generally planar circuit element and a second contact pad on the second generally planar circuit element to provide an electrical interconnection therebetween.

Abstract: A connector module to be connected to an integrated circuit device having rear electrodes provided on a back surface thereof facing away from a wiring board. The connector module includes: a connector having contacts to be electrically connected to the rear electrodes; and a fixture structure for fixing the connector to the integrated circuit device.

Abstract: A package for being electrically connected to an external printed wiring board and an external electronic device comprises a substrate, a semiconductor chip, a mold compound, and a connector. The substrate is electrically connected to the external printed wiring board. The semiconductor chip is disposed on and electrically connected to the substrate. The molding compound is used for encapsulating the semiconductor chip. The connector is disposed on the substrate for electrically connecting the semiconductor chip to the external electronic device.

Abstract: A wiring connection method includes the steps of connecting a bus bar for wiring inside an electronic apparatus and a harness for leading out wiring to outside, placing the bus bar and the harness connected together on a botch portion of a housing, and filling a resin to fix the harness in the notch portion of the housing.

Abstract: A connector coupling mechanism comprises a housing coupled to a first connector; and, a force applying device connected to the housing and being movable between docking and undocking positions; wherein in response to the force applying device moving to the docking position, a mechanical advantage is provided for facilitating a firm coupling of the first and second connector assemblies. In addition, the force applying device provides a mechanical advantage in response to the force applying device moving to undocking position for facilitating easy unplugging. The coupling mechanism provides a latching arrangement for releasable and positive retention of the force applying device in the docked position for preventing against inadvertent unplugging. A connector assembly coupling system is provided as well as a method of coupling connector assemblies.

Abstract: Disclosed is a smart card connector for transmitting signals between a smart card and an external electronic system, wherein the smart card has contacts on one of two major surfaces thereof, the connector comprising: guiding structure defining a storage space having a first end and an opposed second end, through which second end, the smart card may be inserted, and contact terminals in the storage space for connecting with the contacts of the smart card to be inserted in the storage space; and an ejecting mechanism provided on the guiding structure and being operable to eject the smart card from the storage space. Further disclosed is a compound connector that comprises two types of I/O connectors, one of which I/O connectors may be a smart connector for use with an external electronic system.

Abstract: A latch for latching and extracting a board-type device from a housing, wherein the board-type device includes a face, a bottom edge and a top edge and is mounted within a guide in the housing. The latch includes a handle portion, a pivot portion coupled to the handle, and a securement portion coupled to the pivot portion. The securement portion includes an extraction segment and a latching segment. A pivot couples the latch to the board-like device and the latch is coupled to the board-type device along one of the top edge and bottom edge such that it is oriented perpendicular to the face.

Abstract: A connector assembly is provided with opposing and interengageable first and second connector components. Each of the two components preferably includes upper and lower housing formed from an insulative material coated with electrically-conductive material, with cavities formed therein that receive terminal assemblies. The upper and lower housings are formed with internal cavities that extend in orthogonal directions. Each cavity contains a terminal assembly of either plug or receptacle structure and may further include either a plurality of power terminals or differential signal terminals. The terminals have contact portions, tail portions and interconnecting portions that are partially encapsulated by an insulative outer shell. In assembling the first and second components, multiple ground connections are made in sequence before any signal or power supply connections are made.

Abstract: An electrical connector includes at least one body having a passageway for a flow of a conductive fluid. A first conductive pin is in fluid communication with the passageway, and a second conductive pin is in fluid communication with the passageway, wherein a conductive path is established through the conductive ink between the first and conductive pins when the conductive fluid flows through the passageway.

Abstract: An explosion-proof instrument quick disconnect and seal is provided for use in hazardous (e.g., explosive) environments to quickly connect or disconnect energized or de-energized electrical circuits. The quick disconnect and seal includes mating electrical receptacle inserts positioned within a male and a female portion. The male and female portions are connected to one another by a coupling nut having threads that engage mating threads on the male portion, thereby moving the male portion relative the female portion by rotation of the coupling nut, while at the same time preventing the electrical connection of the mating receptacle inserts in the male and female portions before the explosion-proof chamber is secure.

Abstract: A socket assembly is provided having a socket cover slidably mounted to a socket base. The socket cover includes a cam retention area containing a drive plate and a cam lever rotatably engaging the socket cover, socket base and drive plate. The cam rotatably engages, and applies torque forces to, the socket cover, plate, and socket base to slide the socket cover with respect to the socket base. The drive plate and the cam retention area include torque transfer members that engage one another. The torque transfer members are located at intermediate points with the drive plate and the cam retention area.

Abstract: An electrical connector (1) comprises an insulative base (10), a cover (12) mounted on the base, a plurality of terminals (11), and an actuator (14) actuating the cover to slide over the base. The base defines a plurality of passageways (101) receiving the corresponding terminals therein. The cover comprises a main body (121) defines a plurality of passages (1210) corresponding to the passageways of the base. Four L-shaped standoffs (1212) perpendicularly extend from corresponding four corners of the main body. Each standoff has a same height. A cross sectional area of each of the standoffs is far less than a cross sectional area of the main body. When a CPU (2) is mounted on the electrical connector, it is supported by the standoffs of the cover. This insures stably and securely retention of the CPU on the cover of the connector.

Abstract: The invention includes a plurality of first electrical pads which are supported on a first object which is configured to be supported in a first position, and a plurality of second electrical pads which are supported on a second object which is configured to be supported in a second position and adjacent to the first object. The first electrical pads are configured to electrically contact the second electrical pads while the objects are supported in the respective positions so as to electrically connect the objects together. Each of the objects is configured to be removed from the respective first and second positions by movement along parallel paths of movement in a first direction and are configured to be installed in the respective positions by movement along the paths in a second direction which is opposite the first direction. Furthermore, each object is configured to be installed into, or removed from, its respective supported position while the other object remains supported in its respective position.

Abstract: A slotted guide pin and latch assembly has one or more slotted guide pins that are located on an electrical connector, for example. One or more guide sockets respectively corresponding to the one or more slotted guide pins are located on a mating connector or mating surface. The slotted guide pins and their corresponding guide sockets guide and latch the electrical connector to the mating connector or mating surface.

Abstract: An electrical connector comprises a terminal block and a housing. The terminal block has an electric wire receiving passageway that communicates with a spring receiving passageway. The terminal block moves between a pre-latched position and a locked position. The housing is provided with a contact having a piercing member for piercing a sheathing member of an electric wire. The piercing member urges the electric wire toward the spring receiving passageway when the terminal block is moved to the locked position. A spring member is arranged in the spring receiving passageway. The spring member has a contact retaining portion for urging the electric wire toward the piercing member as the piercing member urges the electric wire toward the contact retaining portion. A support arm additionally presses the electric wire toward the piercing member.

Abstract: A flex circuit strain relief that routes and restrains flex circuits between a movable component and a stationary component. One end of the flex circuit is connected to the movable component that moves linearly up-and-down. The flex circuit strain relief routes the flex circuit away from the movable component and reroutes the flex circuit in a second direction to create a natural bend in the flex circuit as the flex circuit is rerouted for connection to a stationary component. As the movable member moved linearly up-and-down, the natural bend of the flex circuit rolls with the movement to reduce the stressed on the flex circuit during the movement.

Abstract: A testing device for connection to a relay is provided. The testing device comprises a binding post and a test paddle. The test paddle includes a body portion, a stud, a contact and a handle. The body portion has a stud opening, a contact opening associated with the stud opening and a barrier extending from a first end of the body. The contact extends through the contact opening and is electrically coupled to the stud. The handle is coupled to the body and configured for grasping by an individual's hand to promote insertion and removal of the test paddle from the relay. The binding post includes a cover configured for rotating the binding post, the cover having an inner chamber for receiving an insert of the binding post. The insert is configured to couple test equipment to the stud on the test paddle for testing relay switches.

Abstract: An electrical connector assembly is provided, including a connector position assurance device (CPA) movable between locked and unlocked positions along a longitudinal axis of the CPA. The CPA includes rails. The connector assembly also includes first and second connector housings having mating ends configured to mate with one another. A CPA guide assembly is mounted to at least one of the first and second connector housings. The CPA guide assembly includes CPA guide rails slidably accepting the guide rail of the CPA. The CPA permits engagement and disengagement of the first and second connector housings when in the unlocked position. The CPA prevents disengagement of the first and second connector housings when in the locked position. When the first and second connector housings are disengaged, the CPA can not move to the locked position. The connector assembly further includes a sweeping element mounted to the CPA.

Abstract: An electrical extension lead comprising: an electrical cable having a first end connected to a plug socket arrangement for supplying electrical to electrical devices, and a second end connected to an electrical plug for connection to an electrical mains supply, a battery pack charging assembly also connected to the first end of the cable and a battery pack for use with an electrical devices is removably connectable to the battery pack charging assembly for charging, and wherein the plug socket arrangement and the battery pack charging assembly are mounted within a common housing

Abstract: A mainboard having a selective connection COM/VGA jack layout includes a specific area for connecting different jack terminals to connect peripheral devices. The specific area includes two different sets of jack layouts to form a COM port jack layout and a VGA port jack layout laid in a juxtaposed manner. Manufacturers or designers may select to connect a COM port jack terminal or a VGA port jack terminal based on requirements (such as whether with VGA ONBOARD or not) so that only one type of mainboard is needed. Production cost may be reduced and production process is simpler.

Abstract: A connector housing has a terminal insertion opening (32) formed on a front wall (30) of a cavity (23) formed in a tower part (21). A tapered guide surface (33) is formed on a front peripheral edge of the terminal insertion opening (32). An open groove (35) is formed forward of the lance (27) on a lower portion of the peripheral edge of the terminal insertion opening (32). A retainer (40) for unremovably doubly locking a female terminal can be mounted in the tower part (21). An auxiliary plate (60) projects from a lower portion of a peripheral edge of each window hole (43) of the retainer (40). A supplementary tapered guide surface (33A) is formed on a surface of an upper end of the auxiliary plate (60). A jig insertion hole (64) is formed on the auxiliary plate (60). When the retainer (40) is mounted in a main locking position, the auxiliary plate (60) fits into a cut-off portion of the peripheral edge of the terminal insertion opening (32).

Abstract: An apparatus includes an electrical component with internal circuit, and a tether for keeping the electrical component in an easily-found position close to a location of future use. The tether has a first end attached to the electrical component with an adhesive first patch, a length wound around the electrical component, and a second end with an adhesive second patch, such as for adhering it to a vehicle body or headliner. The first and second patches include mating hook and loop material for releasable engagement to retain the tether in a wound storage position. In another form, the length is releasably held to permit sections of the tether to be pulled loose one at a time.

Abstract: A connector for connecting, to a mounting wiring board, a flash memory card having a signal connecting portion in the vicinity of its one edge is provided. The connector includes a connector main body having a card mounting space formed therein, a cover member, rotatably attached to one end of the connector main body, for restricting one end of the flash memory card in the card mounting space, a locking mechanism for locking the cover member in a closed state, a signal connection contact pressed against the signal connecting portion of the flash memory card and electrically connected to the mounting wiring board, and a restriction member for restricting the other end of the flash memory card in the card mounting space in the vicinity of the other end of the connector main body.

Abstract: If a PC card is inserted into a card slot for the PC card, both of button portions are pressed by the PC card. When the both of the button portions are pressed outwardly in the Z-direction, both of engagement portions are released from engagement recesses, respectively, so that a stopper is allowed to move in a space to permit the PC card to be inserted into the card slot. Otherwise, the stopper is still locked at a position shown in the drawing, by at least one of the engagement portions to prevent an erroneous card having a thickness smaller than the PC card from being inserted into the card slot.

Abstract: A plug used for connection with a USB receptacle. The plug contains a plurality of metal contacts, which is used for contacting metal contacts of the USB receptacle when the plug is connected to the USB receptacle. It also contains a loader, which is used for loading the metal contacts of the plug. The plug has a thickness that is smaller than an ordinary USB plug, so it can be utilized by electronics that have a thickness less than an ordinary USB plug.

Abstract: A network adapter device such as a modulation bridge is provided for establishing a home network. The device comprises a modulation bridge including a control chip assembly complied with HomePlug, a plurality of device ports wherein one is adapted to connect to a computer via a network line and the other one is adapted to connect to a peripheral via a USB line, a coaxial cable jack, a modular telephone jack, and a power cord jack. Thus, the invention can connect to a power cord, telephone line cord, or coaxial cable for effecting a data transmission between a computer and a peripheral or between computers in the home network.

Abstract: An in-plane fuse adapter provides a thin housing that may be received by a standard terminal block to present side surfaces conforming substantially to the width of the terminal block relay allowing other terminal blocks to be closely abutted to the left and right side of the terminal block relay when it is attached to a connector rail.

Abstract: An electrical adapter is provided including a board having first and second planar surfaces, a male electrical socket coupled to the first planar surface of the printed circuit board and a female electrical socket coupled to the second planar surface of the printed circuit board. The board includes electrical connectors electrically coupling the male and female electrical sockets. The male electrical socket of the adapter is suitable for temporary connection to a female electrical interface of a first electrical device, and the female electrical socket is suitable for temporary connection to a male electrical interface of a second electrical device. The opposing socket is suitable for temporary connection to a printed circuit board. In one embodiment, the electrical device is an optoelectronic device.

Abstract: An electrical connector (100) for being mounted on a main PCB comprises an insulative housing (1) having a plurality of cavities (11, 12) and a rear opening (13), a plurality of insert module (3) received in the rear opening of the housing, and a shell member (21, 22) substantially surrounding the housing. Each insert module includes a plurality of contacts (31, 32) including contact portions (312, 321) extending into a corresponding cavity of the housing, and a power module (9). Each power module includes a hole (93) in a rear portion thereof. The shell member includes retaining tabs (213) in a rear portion for engaging with the openings of the power modules.

Abstract: In order to be able simply and inexpensively to fabricate a plug-in connector consisting of a housing (1) and a spring basket (2) with longitudinal slots (3), the housing (1) and the spring basket (2) are fabricated from one piece by injection molding using the metal injection molding process. The longitudinal slots (3) are also formed at the time of injection molding.

Abstract: A battery terminal connector having a body portion, and an intermediate aperture for engaging a battery post. The size of the intermediate aperture is variable from a size well in excess of the diameter of the battery post to which it is to be connected, to a size somewhat smaller than the diameter of the battery post to which it is to be connected. A base plate is positioned along a line extending generally from one side surface of the connector to the other side surface of the connector. A threaded rod extends upwardly from the base plate. The connector further includes at least one vertically-movable element, including an upper and a lower wedge-shaped element. A threaded nut is preferably rotatably secured to the threaded rod. The threaded nut is positioned above and abuts against the upper of the two wedge-shaped elements. As the threaded nut is moved downward along the threaded rod, the nut pushes upon that upper wedge-shaped element.

Abstract: The disclosed electrical connector, which connects a terminal stud to multiple branch-circuit wires, comprises two primary components of extruded metal: (A) a conductor having a first portion providing branch-circuit securing devices, and a second portion providing one or more stud-contacting areas; and (B) a clamp for securing a stud against a contact area; the clamp and said second portion provide a slip-fit stud-receiving passage.

Abstract: An electrical connector may be utilized to connect bus bars having a wide variety of configurations to a wide variety of electrical equipment, without modification to the bus bars, electrical equipment, or connector, with the exception of cutting the electrical connector to a desired length.

Abstract: An engine output control device is configured to detect an actual engine speed and to determine a modified engine speed based on the actual engine speed that is more in proportion to the speed of the watercraft than the actual engine speed. The modified engine speed can be used to control the output of the engine so as to provide a more natural feeling for the operator of the watercraft. The modified engine speed can also be used as an indication of the speed of the watercraft. As such, the modified engine speed can also be used to determine the extent to which the output of the engine can be raised to provide additional thrust for steering purposes.

Abstract: This is a vibrational water mover, the vibration is caused by the off set shaft on the motor, a rod connecting the the motor to the elements set the elements into vibration, causing large amounts of water to be set into motion, with a minimal amount of effort, the elements can range in design from flat to tubular that set in the water, to angled, flat pieces that set on the waters surface.

Abstract: A pedal-powered aquatic vehicle is a positively buoyant aquatic vehicle with a lightweight frame and driven flotation wheels on either side of the occupant(s) seat. A pedal drive is incorporated into the lightweight frame to produce propulsion through a chain driven multi-geared system coupled with a drive shaft. Outer drive wheels rotate the flotation driven wheels to propel across water and level ground. Paddles are affixed to the driven flotation wheels. Steering linkages disengage drive wheels independently to provide steering.