Abstract: The present invention provides a conventional cable connector, such as a UMTR (Universal Male Terminator type connector), that further comprises an element for protecting the electrical components positioned within the connector from high voltage surges. The surge protection element comprises a ring that is positioned in circumferentially surrounding relation to the input pin that carries the signal being transmitted by the coaxial cable. The ring includes at least one, and preferably three prongs that extend radially inwardly therefrom and terminate in close, but non-contacting relation to the pin. If a high voltage surge of electricity is carried by the coaxial cable transmission line, such as might occur if it is struck by lightening, a spark will be formed in the gap between the prongs and the cable due to the conductive composition of the surge protection element.

Abstract: A welding apparatus having a metal enclosure and a plastic end panels affixed to the enclosure to contain therein the various electrical components of the welding apparatus. There is an internal negative electrical stud within the metal enclosure that has a high voltage applied to the stud. A protective, non-conductive electrical shield is located between the electrical stud and other conductive components within the welding apparatus to prevent arcing between the electrical stud and those conductive components as well as to prevent arcing between the electrical stud and the metal enclosure itself.

Abstract: This invention relates to technologies, including Direct E×B, Magnetohydrodynamic, and Plasmadynamic, for the conversion of plasma energy into electrical energy.

Abstract: Flow through capacitors are described herein having improved capabilities. In general, asymmetric flow through capacitors are formed, increasing overall capacitance. The asymmetry may be accomplished by utilizing electrodes of different materials, different dimensions, or the same materials with different capacitance properties.

Abstract: A capacitor with low inductance connection terminals and having a first surface, includes a first electrode of porous metal, a dielectric layer formed on the porous metal, a second electrode formed on the dielectric layer, and a plurality of connection terminals electrically coupled to the first electrode on the first surface and a plurality of connection terminals electrically coupled to the second electrode on the first surface.

Abstract: An electrolyte for an electrolytic capacitor which is high in electrolytic conductivity, excellent in heat stability and high in withstand voltage. An electrolyte for an electrolytic capacitor comprising a tetrafluoroaluminate ion; and an electrolyte for an electrolytic capacitor containing a salt and a solvent, characterized in that electrolytic conductivity X (mS·cm−1) at 25° C. and withstand voltage Y (V) of a capacitor satisfy the relationships of formulae (I): Y≧−7.5X+150, and X≧4, Y>0.

Abstract: The present invention aims to address a problem of contact failure likely to occur in the joint between an internal lead and an external terminal and to provide a reliable aluminum electrolytic capacitor. To this end, an aluminum electrolytic capacitor of the present invention is structured so that a through-hole provided through an internal lead has a diameter smaller than the outer diameter of an aluminum rivet and the peripheral edge of this through-hole is drawn to provide a cylindrical portion integral with the through-hole.

Abstract: The present invention aims to provide a circuit module that includes a sheet-like solid electrolytic capacitor and reduces an area and volume required for mounting electronic components. In the sheet-like solid electrolytic capacitor, valve metal sheet 11 has dielectric layer 13 and current collector layer 12 formed on the surface thereof, and is packaged by insulators 14 and 15. The circuit module is structured to embed the sheet-like solid electrolytic capacitor in a circuit board.

Abstract: A compact and economical gas-insulated switchgear is provided. The gas-insulated switchgear includes: a grounding metal housing 1 filled with insulating gas, and in which the disconnector part 2 having a moving side electrode part 2a and a stationary side electrode part 2b is accommodated; and composite insulating shields 17a, 17b integrally formed into one metal-dielectric member in which surface of a high electric field part located in the vicinity of ends of openings is coated with a dielectric so as to cover the moving side and stationary side electrode parts 2a and 2b with the dielectric. To form the composite insulating shields 17a, 17b, a metal shield of less than 0.6 in non-uniform constant before coating with the dielectric is coated with dielectrics 18a, 18b having a thickness of not more than approximately 30% of an interelectrode distance from a facing electric-field relaxation shield.

Abstract: An electronic apparatus includes a housing, a circuit unit, and an external power supply module. The housing is formed with a circuit receiving space and a module receiving space. The circuit unit is disposed in the circuit receiving space. A set of first contacts is disposed in the module receiving space, and is coupled electrically to the circuit unit. The external power supply module is removably disposed in the module receiving space, and is provided with a set of second contacts to connect electrically with the first contacts so as to enable the external power supply module to supply electric power to the circuit unit when the external power supply module is disposed in the module receiving space.

Abstract: An external power supply module includes a module case adapted to be disposed in a portable electronic apparatus, an adapter circuit disposed in the module case and adapted to convert AC power to DC power that is to be supplied to the portable electronic apparatus, a set of contacts provided on the module case and adapted to establish electrical connection between the adapter circuit and the portable electronic apparatus, and a heat-dissipating unit mounted on the module case for dissipating heat generated during operation of the adapter circuit.

Abstract: The invention is to provide a snapping device comprising an elongated clinging mechanism including a pivotal lever at either end wherein centers of rotation of the pivotal levers and the clinging mechanism are at different horizontal levels; and two post-shaped resilient elements disposed adjacent ends of the clinging mechanism wherein each resilient element passes through a support of a cooler and a circuit board to secure to an abutment plate at the other opposite side of the circuit board, the resilient elements will be expanded if the pivotal levers are rotated, and the clinging mechanism is mounted on the cooler by a stored returning force of the expanded resilient elements, thereby stably resting the cooler one a chip member on the circuit board.

Abstract: A portable electrical control and display device is described, having an indicator panel, a keyboard with at least one key pad, and a single housing designed as a single piece and made of a temperature-resistant material, which seals the control and display device in a water-tight manner.

Abstract: A flexible drive carrier is disclosed. The drive carrier includes flexible elements that accommodate variations in sizes of hard drives as well as variations in computer chassis. The drive carrier forms a precise fit within a computer chassis. A drive carrier that does not accommodate a hard drive is also disclosed.

Abstract: A drive bracket assembly includes a bracket (30) for receiving a disk drive (70) therein, an operating member (40) and a cover (60). The bracket includes first and second side panels (31), a pair of slots (36) is defined in the first and second side panels respectively, for slidably receiving respective screws (80) of the disk drive. An upper hook (34) is outwardly formed on the first side panel. A lower hook (48) is outwardly formed on the operating member. A spring (50) is engaged with the upper hook and the lower hook respectively. The operating member includes a concavity (49) adjoining the slot of the first side panel, for securely receiving one rear screw of the disk drive thereby the disk drive is securely retained in the bracket. The disk drive is withdrawn from the bracket by pressing the operating member to disengage said screw from the concavity.

Abstract: A latch and ejector system utilized in an electronic device. The latch and ejector system allows for the tool-less release and removal of various components, such as drives, from various electronic devices. The latch system secures the component within the electronic device during use but provides for the ready release and movement of the component to an ejected position. Once the component is at the ejected position, a user may readily remove the component.

Abstract: A miniaturized computer that rearranges each component in a computer housing to form a miniaturized computer comprising a motherboard, a low-speed interface, a high-speed interface and an input/output interface, and alters the design of conventional heat-dissipating mechanisms by separately allocating a heat-dissipating device and a fan for achieving the object of miniaturizing the size of computers, and by having an air-channeling device in accordance with the separate allocation, the heat-dissipating problem after computers being miniaturized is solved.

Abstract: In a heat dissipating internally fan-less housing (20) for electronic circuits and components (28), the housing has an assembly of two container (10) parts comprising heat-sink fins (12). Each part has a substantially diagonal (14) shaped profile. In the housing, a circuit-board (29) is mounted along the diagonal (14) profile thus providing that the long-side ends of the circuit-board (29) on each side of the board are covered by a greater mass of heat-sink fins (12) compared to a horizontally mounted circuit board for a better cooling of components.

Abstract: A hybrid cooling system is provided which is particularly useful for cooling electronic circuit components disposed on circuit boards arranged in a plurality of drawers within a cabinet or frame. Air cooling is provided locally with a supplementary, auxiliary, or secondary cooling system being provided at more distant frame level locations. This configuration permits optimal sizing of the respective hybrid cooling system components without negatively impacting the coefficient of performance (COP). Hybrid heat sinks are employed to accommodate the hybrid cooling system design.

Abstract: A method for computer host heat dissipation, a heat-dissipating device being mounted on a CPU utilized for partially or wholly conducting heat generated by said CPU to said heat-dissipating device, a fan being mounted on a north bridge chipset utilized for partially or wholly dissipating heat generated by said north bridge chipset, said fan having an air outlet utilized for blowing air flow towards said heat-dissipating device in an air-blowing direction, characterized in that a channeling device is disposed at the periphery of both said fan and said heat-dissipating device; said channeling device is utilized for directing an air-channeling direction, with such air-channeling direction being substantially parallel to the air-blowing direction by said fan, and said air-blowing direction by said fan is in said air-channeling direction, and said heat-dissipating device is in said air-blowing direction.

Abstract: An internal heat sinks construction for CPU cabinet at least comprises the cooling fans installed on the front wall and the rear wall of the cabinet casing. The front wall provides an air intake under the hard disk rack. The rear wall provides an air guide shield including one air intake and two air vents. There mounts a cooling in the vicinity of the air vents. The air guide shield further provides the air vent for the CPU heat fins and slots respectively so the airflow will cool them down independently. The cooling devices so arranged on the front wall and the rear wall offer a cooling airflow to effectively disperse the heat generated within CPU. The rear wall will produce air convection. This cooling system renders powerful and energetic airflow and convection to cool down the internal parts inside CPU rapidly.

Abstract: A heat dissipation device for a server is provided, composed of a fan body and a guide cover for concentrating airflows. The guide cover concentrates heat flows from a server computer and directs the heat flows to the fan body connected with the guide cover. The fan body includes a housing and at least a fan set, wherein the fan set is inserted into a passage formed by the housing, and a fan of the fan set operates to dissipate heat flows directed by the guide cover to outside of the server computer so as to enhance heat dissipation performances. Moreover, the fan set can be easily assembled or disassembled, and optionally replaced or altered in number thereof provided for the fan body, thereby attaining to flexibly in the use of the heat dissipation device.

Abstract: A fan housing of a fan unit includes a housing wall standing from the surface of a printed circuit board. The printed circuit board serves to establish the fan housing in cooperation with the housing wall. The fan housing further includes a ceiling wall connected to the housing wall. The ceiling wall extends along a datum plane parallel to the surface of the printed circuit board. A high speed airflow can be generated within the fan housing. The airflow promotes the heat radiation from the printed circuit board. An electrically conductive wiring pattern extending over the surface of the printed circuit board may further promote the heat radiation from the printed circuit board.

Abstract: The capability of an assembly to transfer heat from a semiconductor package source is enhanced while a reduction in the space required for effective operation is achieved. Bodies of fins defining tubular channels are affixed to oppositely facing surfaces of a rectilinear body which is adapted to receive heat from a semiconductor package.

Abstract: A heat spreader, comprising a metal body with attached standoffs located approximately above the integrated circuit, is described. The standoffs should improve bond layer thickness control between the integrated circuit and the heat spreader, leading to a lower cost and lower mass package, as well as a more reliable device with increased thermal performance.

Abstract: The invention provides a heat sink assembly having a positionable heat sink permitting the heat sink to be mounted to a substrate in more than one configuration. Various features are described for permitting multiple degrees of freedom in the arrangement of the heat sink assembly. Such features permit the heat sink assembly to be adapted to different environments. The heat sink assembly also has features such as a vane for directing air flow relative to the heat sink. Features for varying and maintaining pressure between the heat sink and a component to be cooled are also included.

Abstract: power module including a power circuit having heat generating power devices including one or more heatsinks not isolated from the power devices by an insulating body.

Abstract: A heat dissipation system for a semiconductor device having a plurality of semiconductor chips, includes a heat dissipation member which cools the semiconductor chips, an exterior heat dissipation member which is provided opposite to the heat dissipation member, engaged to the semiconductor device and connected to an electrical ground, an electric conductor member which is provided between the heat dissipation member and the exterior heat dissipation member, and electrically connects the heat dissipation member and the exterior heat dissipation member to each other, and a thermal conductivity insulating member which is inserted between the heat dissipation member and the exterior heat dissipation member. Accordingly, the resistance against common mode noise is increased. Furthermore, the heat dissipation efficiency of the semiconductor device is also increased. The head dissipation system improves the heat dissipation efficiency of the semiconductor device to control noise.

Abstract: A cam groove provided in a chassis is furnished with a first cam portion permitting an eject button to move only forward from being depressed, and a second cam portion permitting the button to shift between its depressed and protruding states. A slide unit interlocks with a switching lever spring-urged toward a push-out plate and moves away from a recording-medium travel path by being pushed by a recording medium when plugged into the chassis. In standby, the switching lever interlocks with the first cam portion, advancing into the travel path. With a recording medium bieng plugged into the chassis, by the eject button being pushed a first time the switching lever withdraws from the travel path and shifts into the second cam portion, permitting the eject button to protrude backward. By the eject button being pushed a second time, the push-out plate and slide unit are put into cooperation.

Abstract: A housing structure for vehicle-mounted electronic equipment according to the present invention is superior in heat dissipation, water resistance, heat resistance and vibration resistance. An electronic substrate is temporarily fixed onto an annular circumferential wall part of a cover made of fire retardant resin, and connector contact pins are soldered to the electronic substrate. The electronic substrate is fixed and held between a heat-transfer base and the annular circumferential wall part with screws, and heat generated by a heating part on the electronic substrate is transferred to the base and dissipated. The annular circumferential wall part has an annular groove in which a sealant is inserted, and the base has an annular protrusion snapped into the annular groove.

Abstract: A set of fasteners is adapted to fasten a motherboard on a computer housing. The motherboard has a first side, a second side, and a fastener slot that extends through the first and second sides. Each of the fasteners includes a positioning member and a spring arm. The positioning member permits movement of the motherboard from an unlocking position, where a periphery of the fastener slot is disengaged from the positioning member, and a locking position, where the periphery of the fastener slot is engaged within a groove in the positioning member. The spring arm is connected to the positioning member so as to be adapted to abut against the motherboard to urge the motherboard to engage the positioning member when the motherboard is at the locking position.

Abstract: A high capacitance substrate. The substrate includes a core tolerant to sintering thereon of a high k material to provide increased capacitance. The core may be non-ceramic. The material sintered thereon may have a dielectric constant in excess of about 4. The substrate may be a package substrate electrically coupled to a die.

Abstract: A tooling fixture that holds one or more electronic devices. The fixture has one or more cavities formed in the top surface of a substrate. Each cavity has a pair of spring fingers integrally formed in the substrate. The spring fingers bias the electronic device into a pair of locator edges of the cavity, insuring a repeatable accurate placement of the device. Forming the spring fingers within the substrate eliminates external parts and thus reduces the cost of producing the tool. Additionally, the integrally formed spring fingers allow minimal spacing between cavities and increase the number of devices that can be loaded onto a fixture.

Abstract: A stack type multi-chip package with an increased reliability is provided. The stack type multi-chip package comprises a first semiconductor chip which shows good results when tested for reliability after being assembled at the package level, at least one second semiconductor chip which is in the wafer level and is stacked on the first semiconductor chip via stacking means, a first connecting unit for electrically connecting the first semiconductor chip to an external system, and a second connecting unit for electrically connecting the second semiconductor chip to the external system. The first connecting unit is different from the second connecting unit. Since the stack type multi-chip package comprises the semiconductor chip which shows good results when tested for reliability after being assembled at the package level, the reliability of the stack type multi-chip package can be effectively increased.

Abstract: A packing structure of an electronic device by interconnecting a frame and frame leads with an insulating block is provided. The packing structure has the advantage of measuring the electrical characteristics of the semi-product before being subject to a plastic molding. The packing structure includes a frame having a package area where an electronic device is disposed, an insulating block disposed on one side of the package area and connected to the frame, and a plurality of frame leads aligned in parallel and connected to the insulating block and the electronic device.

Abstract: A base plate for a light emitting diode chip mainly including a base plate pressed and laminated with a circuit board is characterized that the base plate is made of an aluminum or copper plate; a printed circuit layer is disposed on the surface of the circuit board fixedly pressed on the base plate; at least one concave cup is disposed in the proper area on the surface of the circuit board; the concave cup penetrates from the printed circuit layer to the base plate. When applying the abovementioned assembly, it is necessary to fix a light emitting diode inside the concave cup; traces connect the light emitting diode chip to the printed circuit layer on the surface of the circuit board and are sealed firmly by a transparent adhesive. When the light emitting diode chip illuminates, the heat generated therefrom transmits directly from the bottom side of the concave cup to the base plate for dissipation.

Abstract: Light emitting panel assemblies include in one form of the invention a light emitting panel member made of a transparent resiliently deformable elastomeric material that absorbs impact without breakage for use in automotive lighting applications of various types. In another form of the invention, a rigid light emitting panel member may be used with dome switches for switch area lighting or to backlight control buttons/key pads. Also, a rigid light emitting panel member may be used as a structural member, and two or more such light emitting panel members may be stacked together and used to light an instrument panel or the like.

Abstract: A plane lighting structure for dual displays includes two light sources and a light guide plate. The light guide plate has two light-transmissive surfaces that can guide the light rays emitted from two light sources toward two light-emitting surfaces at the opposite ends of the guide plate located between two light sources. There are two different transparent media in the light guide plate, one is located between two light-transmissive surfaces and the other is located between two light-emitting surfaces and two light-transmissive surfaces.

Abstract: A structure of an advertisement board is disclosed. The advertisement board comprises a case, a display module, two illumination modules and a power supply module. The display module comprises a transparent element having the advertisement pattern and/or letters thereon, and a reflection layer positioned on a back surface of the transparent element. The light from the illumination modules and/or an external source such as, sunlight, enters the transparent element from the sides and get reflected by the reflection layer to clearly display the advertisement pattern and/or letters. Thus the advertisement board of the present invention not only has a capability to perform excellent display functions but also has the capability to reduce the power consumption.

Abstract: A plane lighting structure includes a light source and a wedge light guide plate having a light-transmissive surface that can guide the light rays emitted from the light source toward the direction which is about perpendicular to the connecting line from the light source to the wedge light guide plate, wherein the wedge light guide plate has two different materials and the light-transmissive surface is located between the two different materials.

Abstract: A light guide plate (20) includes a light input end (21), a light output face (23) adjacent the light input end, and a back face (22) opposite to the light output face. A plurality of fine dots (26) are formed on the back face arranged in a uniform, rectangular array. The dots in a same column have a same size. The dots in a same row increase in size. A radius r of the dots in each row thereof varies as a function of a column number X of a given dot, in accordance with the formula: r=A+BX+CX2+DX3+EX4+FX5, wherein: the column number X varies in consecutive whole numbers from a value of one for the column nearest the light input end to a maximum value for the column most distal from the light input end; and A, B, C, D, E, and F are constants.

Abstract: A backlight system of the present invention includes a light guide plate (300) and a light source (310) disposed at one side of the light guide plate. The light guide plate has an incident surface (321) for receiving light from the light source, a bottom surface (323), and a light emitting surface (322) for emitting light therethrough. A plurality of prisms (350), each in a shape of a pyramid, are formed on the light emitting surface. A plurality of diffusion dots (324) are formed on the bottom surface.

Abstract: Multi-face lighting electro-luminescent cell includes a transparent substrate and two lighting units disposed on the substrate at intervals. The transparent substrate is made of soft material and has a flexible section between the two lighting units. By means of bending the flexible section, the two lighting units can be positioned on the same plane or on different planes. The front electrode layer and the back electrode layer of the lighting unit control the lighting layer to emit light. The light beams emitted from the lighting layers are projected out through the transparent substrate.

Abstract: An illumination apparatus configured to generate multi-color light in a pleasing fashion and that may be operated in a variety of visual modes. The illumination apparatus may further include one or more speakers that may operate in a variety of audio modes. The illumination apparatus may further produce light that is suitable for treating light-deficiency disorders and/or for reducing eyestrain.

Abstract: An environmentally controlled appliance enclosure includes an enclosed spacer and a heater assembly positioned within the spacer. A heater unit and a fan are secured to the heater assembly. A mounting plate is positioned on the assembly mount and an appliance is secured to the mounting plate. A cover is secured to the spacer to enclose the appliance. Once sealed, the heater unit and fan of the heater assembly operate to maintain a uniform temperature within the enclosure.

Abstract: The present invention is to provide a waterfall lampshade comprising a shroud, a liquid supply unit provided at a first end of the shroud, and a liquid collection unit provided at a second opposite end of the shroud so that liquid may flow cyclically through the surface of the shroud, the liquid supply unit, and the liquid collection unit. When the shroud in mounted on a support mechanism of the lamp, a light emitting element on the support mechanism may project light onto the surface of the shroud. At the same time, liquid continuously flows down along the surface of the shroud. As a result, a continuous change of brightness and darkness is shown on the shroud.

Abstract: A lighting structure is removably attached to the pole of a patio umbrella. The lighting structure has a battery housing, a hollow support having a first end attached to the battery housing, a light bulb removably attached to the second end of the hollow support, wiring extending through the hollow support and having a first end positioned in the battery housing and a second end coupled to the light bulb, and a collar for removably attaching the battery housing to the pole.

Abstract: A flashlight having a light-emitting diode light source with first and second leads extending therefrom, a power source, a power source frame enclosing at least a portion of the power source; a housing containing the light source and power source, a switch located adjacent the power source and operable to close a circuit including the light source and the power source, and wherein one or all of the following may be included 1) a keyring extension extending from a power source frame or the housing with the keyring extension having an opening whereby an article can be attached to the keyring extension and includes a keyring lock wherein upon exerting a force against the keyring lock, the keyring lock is opened to permit the article to be attached to the keyring extension; 2) the housing is comprised of translucent material; and 3) the housing includes at least one side cover which is not integral with the housing and the at least one side cover being selected from anodized aluminum, anodized metal, anodized met

Abstract: A net-shaped framework for three-dimensional decorative lightings comprises a structural body being assembled by a net support member. A net member formed by a group of cross-layout grid net, which is attached to said net support member, and at least one illumination element mounted in said structural body, whereby the different model of the net-shaped framework, the three-dimensional decorative lightings can further produce lifelike aspects, brilliant lights and visual effect which is more attractive than the conventional decorative lightings.

Abstract: An improved ceiling feature and particularly a ceiling feature that can be installed easily to anchor a holding dish. It mainly includes a ceiling plate fastened to the ceiling for engaging with a bolt. A holding dish may be coupled with the bolt in the direction of the ceiling. The holding dish has elastic plates which may be depressed to wedge in the screw thread pitches of the bolt to anchor the holding dish. Then a glass shade and a cap may be coupled and a nut may be fastened to complete the installation.