Abstract: An assay method is disclosed which isolates and detects the presence of a disease related conformation of a protein (e.g., PrPSc) present in a sample also containing the non-disease related conformation of the protein (e.g., PrPC). The sample is treated (e.g., contacted with protease) in a manner which hydrolyzes the disease related conformation and not the non-disease related conformation. The treated sample is contacted with a binding partner (e.g., a labeled antibody which binds PrPSc) and the occurrence of binding provides and indication that PrPSc is present. Alternatively the PrPSc of the treated sample is denatured (e.g., contacted with guanadine) or unfolded. The unfolded PrPSc is contacted with a binding partner and the occurrence of binding indicates the presence of PrPSc in the sample.

Abstract: A new neuromedin U receptor, designated NMUR2 has been found, which is involved in modulation of feeding behavior in mammals. Ligands of this receptor are able to modulate eating, and weight gain. Amino acid sequences of the human and rat forms, as well as their nucleic acid sequences are given.

Abstract: The methods of the present invention allow the screening of a test composition for non-receptor-specific GPCR desensitization inhibitory activity. The methods involve screening a test composition for an indication of GPCR desensitization inhibitory activity against two or more GPCRs that are different from each other. When there is an indication that a particular test composition has GPCR desensitization inhibitory activity with respect to each of the two or more GPCRs that are different from one another, then, according to the present invention, there is an indication that the test composition has non-receptor-specific GPCR desensitization inhibitory activity.

Abstract: The invention provides methods for determining a prognosis for survival for a cancer patient. One method involves (a) measuring a level of a TUCAN in a neoplastic cell-containing sample from the cancer patient, and (b) comparing the level of TUCAN in the sample to a reference level of TUCAN, wherein a low level of TUCAN in the sample correlates with increased survival of the patient. Another method involves (a) measuring a level of TUCAN in a neoplastic cell-containing sample from the cancer patient, and (b) classifying the patient as belonging to either a first or second group of patients, wherein the first group of patients having low levels of TUCAN is classified as having an increased likelihood of survival compared to the second group of patients having high levels of TUCAN.

Abstract: The present invention provides processes for determining the molecular weight of glatiramer acetate and other copolymers. The present invention further provides a plurality of molecular weight markers for determining the molecular weight of glatiramer acetate and other copolypmers which display linear relationships between molar ellipticity and molecular weight, and between retention time and the log of the molecular weight. The molecular weight markers also optimally demonstrate biological activity similar to glatiramer acetate or corresponding copolymers and can be used for treating or preventing various immune diseases. In addition, the subject invention provides pharmaceutical compositions for the treatment of immune diseases comprising a polypeptide having an identified molecular weight and an amino acid composition corresponding to glatiramer acetate or a terpolymer.

Abstract: Provided is a method for characterizing a polypeptide, which method comprises the steps of: (a) optionally reducing cysteine disulphide bridges in the polypeptide to form free thiols, and capping the free thiols; (b) cleaving the polypeptide with a sequence specific cleavage reagent to form peptide fragments; (c) optionally deactivating the cleavage reagent; (d) capping one or more ?-amino groups that are present with a lysine reactive agent; (e) analyzing peptide fragments by mass spectrometry to form a mass fingerprint for the polypeptide; and (f) determining the identity of the polypeptide from the mass fingerprint.

Abstract: The present invention relates non-toxic, non-toxigenic, non-pathogenic recombinant Fusarium host cells of the section Discolor or a teleomorph or synonym thereof, comprising a nucleic acid sequence encoding a heterologous protein operably linked to a promoter.

Abstract: The present invention provides a human serum albumin-TIMP2 fusion protein having the amino acid sequence set forth in SEQ ID NO. 10, a polynucleotide encoding the same and a vector comprising the polynucleotide, a host cell transformed with the vector, a method for producing the human serum albumin-TIMP2 fusion protein and a pharmaceutical composition comprising the human serum albumin-TIMP2 fusion protein. The human serum albumin-TIMP2 fusion protein is stable and retains the activity of TIMP2, thus it can be used as a pharmaceutical composition to treat diseases related to angiogenesis and/or metastasis of cancer cells.

Abstract: The present invention comprises a method for producing mammalian therapeutics free from prion contamination and cells for use in such methods. Such therapeutics are produced in somatic cells having a genome with an artificially altered PrP gene. The PrP gene in these cells may be ablated, or replaced by an exogenous inducible form of the PrP gene. The endogenous gene in the host cells may be disrupted, or disrupted and replaced by an exogenous PrP gene.

Abstract: The present invention relates to genes expressing an alkaline protease having a prepro sequence, vectors containing the same, and transformants containing said vector. The present invention also relates to a method for producing an alkaline protease.

Abstract: Arterial and venous smooth muscle cells are molecularly distinct from the earliest stages of angiogenesis through to adulthood. This distinction is revealed by expression on arterial cells (e.g., arterial endothelial cells, arterial smooth muscle cells) of a transmembrane ligand, called EphrinB2 whose receptor EphB4 is expressed on venous cells. Targeted disruption of the EphrinB2 gene prevents the remodeling of veins from a capillary plexus into properly branched structures. Moreover, it also disrupts the remodeling of arteries, suggesting that reciprocal interactions between pre-specified arterial and venous cells are necessary for angiogenesis. Expression of EphrinB2 in arterial cells (e.g.

Abstract: A method is provided for producing a library of mutagenized polynucleotides from a target sequence comprising (a) taking a sample comprising: (i) a target sequence including a section to be mutagenized, (ii) a library of first primers where the first primers include a first fixed sequence and a first unknown sequence 3? to the first fixed sequence, the first unknown sequence varying within the library of first primers, and (iii) a library of second primers where the second primer include a second fixed sequence that differs from the first fixed sequence, and a second unknown sequence 3? to the second fixed sequence, the second unknown sequence varying within the library of second primers; (b) performing one or more cycles of primer extension amplification on the sample in the presence of at least one polymerase such that a member of the library of the first primers is extended relative to the target sequence; and (c) performing one or more additional cycles of primer extension amplification on the sample such

Abstract: In a method for producing a target substance by using a microorganism comprising culturing a microorganism having an ability to produce the target substance in a medium to produce and accumulate the target substance in the medium or cells of the microorganism and collecting the target substance from the medium or the cells of the microorganism, there are used, as the microorganism, a microorganism to which a methanol dehydrogenase gene is introduced, of which activities of hexulose phosphate synthase and phosphohexuloisomerase are enhanced and which is modified so that an ability to utilize methanol should be imparted or enhanced, and there is used a medium containing methanol as a carbon source.

Abstract: Methods for production of highly unsaturated fatty acids by marine microorganisms, including the heterotrophic marine dinoflagellate Crypthecodinium, using low levels of chloride ion are disclosed. Specifically, methods of increasing production of highly unsaturated fatty acids by marine microorganisms while growing in low chloride media by manipulating sodium ion and potassium ion levels. The invention also relates to methods of production of highly unsaturated fatty acids by marine organisms at low pH levels, and includes methods for generation of low pH tolerant strains.

Abstract: An Actinobacillus succinogenes plasmid vector which provides a means to overexpress proteins in A. succinogenes. The plasmid can be transformed efficiently by electroporation, and replicates in a stable manner in A. succinogenes. The plasmid comprises at least one marker gene, operably linked to a first promoter functional in Actinobacillus succinogenes, an origin of replication functional in Actinobacillus succinogenes, a second promoter isolated from Actinobacillus succinogenes, and a cloning site downstream from the second promoter. Plasmids pLGZ901, pLGZ920, pLGZ921, and pLGZ922 are disclosed. The pckA gene polypeptide sequence and nucleic acid sequence of Actinobacillus succinogenes, including the promoter and ribosome binding site, is disclosed. Furthermore, a method for producing a recombinant Actinobacillus succinogenes is described, including a method of transformation.

Abstract: The present invention relates to pharmaceutical compositions and dietary supplement comprising yeast cells that can produce a healthful benefit in a subject inflicted with colorectal cancer. The biological compositions can be used to retard the growth of colorectal cancer cells and/or prolonging the time of survival of the subject. The invention also relates to methods for manufacturing the biological compositions.

Abstract: There is provided a reductase characterized by (i) an amino acid sequence of SEQ ID NO:1 having a substitution at amino acid position 54 or 104 or at both of the amino acid positions 54 and 104, or (ii) an amino acid sequence defined in (a) having further deletion, substitution, or addition of an amino acid or acids and the like, which reductase is provided with good heat stability and selectivity.

Abstract: The present invention is directed to compositions and methods comprising NAD(P)H oxidases, particularly bacterial oxidases, nucleic acids, recombinant plasmid vectors and recombinant proteins therein encoded, and host cells comprising the oxidases and nucleic acids. The present invention also comprises an isolated bacterial oxidase that oxidizes both NADH and NADPH. Methods for producing the enzymes and enzymatic reactions comprising use of NAD(P)H oxidases and products of such reactions are also disclosed.

Abstract: The present invention relates to a method of constructing a variant of a parent Termamyl-like alpha-amylase, which variant has alpha-amylase activity and at least one altered property as compared to the parent alpha-amylase, comprising i) analyzing the structure of the parent Termamyl-like alpha-amylase to identify at least one amino acid residue or at least one structural part of the Termamyl-like alpha-amylase structure, which amino acid residue or structural part is believed to be of relevance for altering the property of the parent Termamyl-like alpha-amylase (as evaluated on the basis of structural or functional considerations), ii) constructing a Termamyl-like alpha-amylase variant, which as compared to the parent Termamyl-like alpha-amylase, has been modified in the amino acid residue or structural part identified in i) so as to alter the property, and iii) testing the resulting Termamyl-like alpha-amylase variant for the property in question.

Abstract: The invention disclosed herein provides clot specific streptokinase proteins possessing altered plasminogen characteristics, including enhanced fibrin selectivity. The kinetics of plasminogen activation by these proteins are distinct from those of natural streptokinase, in that there is a temporary delay or lag in the initial rate of catalytic conversion of plasminogen to plasmin. Also disclosed are processes for preparing the proteins.

Abstract: The present invention discloses compositions and methods for the prophylaxis and treatment of bacterial infections by the use of polyvalent bacteriophage having multiple host range.

Abstract: Genes encoding bacterial oxygen binding proteins are provided. Recombinant expression of at least one of the present bacterial hemoglobin genes increased the growth characteristics and/or carotenoid production levels in microbial host cells grown under microaerobic conditions.

Abstract: The invention relates to a strain suitable for producing a live, orally applicable Escherichia coli vaccine for the prevention of post-weaning diarrhoea in pigs, and the procedure suitable for producing that strain. The essence of the strain is that the enterotoxin-free and originally wild-type Escherichia coli strain simultaneously produces two adhesive fimbriae (F4 and F18), whereas the essence of the procedure is that the enterotoxin-producing ability if the wild, pathogenic, enterotoxigenic Escherichia coli strain originally capable of producing enterotoxins and F18 fimbriae is abolished by a genetic intervention while retaining the ability of the strain to produce F18 fimbria facilitating adhesion to the small intestinal wall of weaned piglets, and subsequently the strain thus modified is rendered capable of producing a further surface adhesion fimbria (F4).

Abstract: In an application apparatus of a klinostat, an object is encapsulated in a vessel. A rotating unit rotates the vessel around n axes (n is an integer more than 1) such that gravity is equally applied to the object. A fluid supply unit supplies fluid into the vessel, while the vessel is rotated.

Abstract: A small sized, cost-effective genetic testing apparatus that provides high sensitivity testing, for performing genetic testing simply and at low cost. An optical sensor array for the apparatus and method for luminometric assay comprises a means that simultaneously selects 2 pixels and detects minute amounts of chemiluminescence by obtaining the differential output of the respective signals.

Abstract: An apparatus and method for DNA hybridization is provided. The apparatus and method work in conjunction with a substrate comprising an upper surface having probes. The apparatus may comprise a material which abuts the substrate, with at least a portion of the material being pliable. The material and the substrate form a plurality of chambers, each chamber having a bottom including at least a portion of the upper surface, at least one sidewall, and an opening. The apparatus further comprises a mechanism for closing the openings of the chambers, thereby sealing the chambers.

Abstract: The present invention provides methods for modulating expression of endogenous cellular genes using recombinant zinc finger proteins.

Abstract: The invention relates to a reactor for cell and tissue culture particularly suited to the culture of cells or tissues in the form of thin layers, and comprises the means for ensuring a physiological stimulation and supply of nutrients in culture medium adapted to the reduced thickness of the culture. The reactor can be used for the preparation of an implant and also includes the means of ensuring a mechanical stimulation of tissues or cells and supplying nutrients in culture medium suitable for structural tissues. The reactor also comprises, in an advantageous way, the means or a form that allows easy introduction of the tissue or the solid part of an implant into the culture chamber and, for example, a wall or an elastically deformable element. In addition, the reactor can include means of temperature regulation. The reactor can be used for the culture of different types of cells and the preparation of implants in a variety of forms, compositions and applications.

Abstract: A method for fabricating multi layer devices on a substrate with a buried oxide layer is disclosed. Multi layer microelectromechanical, microfluidic, and integrated circuit devices are fabricated on a substrate with layers of predetermined weak and strong bond regions with deconstructed layers of devices at or on the weak bond regions. The layers are then peeled and subsequently bonded to produce a multi layer microelectromechanical and microfluidic devices. An arbitrary number of layers can be bonded and stacked to create either microelectromechanical or microfluidic device or a hyrbid type of device.

Abstract: A compound represented by formula I is used as a marker for organic products. wherein Ar1 and Ar2 each independently represent a substituted or unsubstituted phenylene group or a substituted or unsubstituted naphthylene group; R1 represents a straight or branched chain alkyl group having 1 to 22 carbon atoms; R2 represents a hydrogen atom or a group of the formula C(O)R4 where R4 is a hydrogen atom or a straight or branched chain alkyl group having 1 to 22 carbon atoms; and R3 represents a hydrogen atom, a straight or branched chain alkyl group having 1 to 12 carbon atoms, a straight or branched chain alkoxy group having 1 to 12 carbon atoms, a hydroxyl group, or a substituted or unsubstituted phenyl group or a substituted or unsubstituted naphthyl group; and Z represents a hydrogen atom or a group of atoms that combine with Ar2 or R3 to form a lactone ring.

Abstract: The present invention relates to a method of manufacturing an electrode which includes forming an electrode over a substrate. Initial crystal nuclei of an electrode material are formed over the substrate in an island pattern, and then grown layers of the electrode material are formed by causing the initial crystal nuclei to be grown. A substrate temperature when forming the initial crystal nuclei is higher than a substrate temperature when forming the grown layers.

Abstract: A method of integration testing for packaged electronic components is capable of improving a conventional testing for packaged electronic components. In this method, non-tested sides of the packaged electronic components are stuck with a downward exposure onto a testing carrier board so that conductive pins are oriented to test spaces to test the plurality of packaged electronic components stuck onto the testing carrier board according to testing steps for convenient classification packaging, advanced testing efficiency, economical working hours and costs. Programmable features and man-hour saving are provided for easy mass production and testing.

Abstract: An electronic socket is described for providing either or both temporary and permanent attachments of electronic components to a substrate having interconnection circuits. The socket includes wells filled with a conductive fluid or paste for temporary attachment to the mesas of an electronic circuit. The wells are connected to selected traces of the substrate having interconnection circuits. The temporary connection may be used to produce known good die (KGD), including support of burn-in and high-speed functional test. The mesas can be filled with a material that is hardened after insertion of the mesas for permanent connection of the electronic circuit to the interconnect circuit.

Abstract: The present invention provides an light-emitting element in which an organic compound layer containing a carbonate, for example Cs2CO3 and Li2CO3, as a dopant is in substantially electrical contact with a cathode by providing an organic compound layer having a dopant easy in handling so as to bring the organic compound layer into contact with the cathode. The light-emitting element includes a pair of electrodes sandwiching the organic compound layer, which is a co-evaporation layer of an organic compound and the carbonate.

Abstract: The present invention discloses a method for manufacturing an image sensor which makes the boundaries between microlenses clear by forming a guide layer in advance and can increase the focal distance of light and the quantity of light by forming the spheres of the microlenses to have a constant height.

Abstract: An array test is performed during the process of panel formation, such as at a stage where a driving TFT which supplies a drive current for an organic EL element is completed and an anode of the organic EL element has been formed on the TFT. Then, with regard to a defective pixel, a line connecting the driving TFT and the anode is disconnected using a laser. After the line has been thus disconnected, a planarization insulating film is formed, and this film fills the holes caused by the laser irradiation. It is thus possible to suppress deterioration of pixels and also effectively darken a defective pixel using laser.

Abstract: A complementary metal-oxide semiconductor (CMOS) image sensor and a method of fabricating the same are disclosed. In a complementary metal-oxide semiconductor (CMOS) image sensor including a photodiode receiving irradiated light and generating electric charges, a plurality of conductive circuits each formed in different layers, a plurality of interlayer dielectrics insulating the conductive circuits, and a micro-lens formed of the interlayer dielectrics and focusing the irradiated light to the photodiode, the CMOS image sensor includes a lens formed in a dome shape on any one of the interlayer dielectrics and re-focusing the light focused by the micro-lens to the photodiode.

Abstract: A method is described for producing thin semiconductor films on a substrate by contacting a substrate with a solution containing a metal salt, a source of a Group VIa element, and chelating agent, and a noble metal in its elemental form. The resulting semiconductor films are useful for electronic and photovoltaic applications.

Abstract: A method of manufacturing a light emitting device is provided which requires low cost, is easy, and has high throughput. The method of manufacturing a light emitting device is characterized in that: a solution containing a light emitting material is ejected to an anode or cathode under reduced pressure; a solvent in the solution is volatilized until the solution reaches the anode or cathode; and the remaining light emitting material is deposited on the anode or cathode to form a light emitting layer. A burning step for reduction in film thickness is not required after the solution application. Therefore, the manufacturing method, which requires low cost and is easy but which has high throughput, can be provided.

Abstract: A method for controlling silver doping of a chalcogenide glass in a resistance variable memory element is disclosed herein. The method includes forming a silver layer over a chalcogenide glass layer. Processing the silver layer via heat treating, light irradiation, or a combination of both to form a layer comprising silver interstitially formed in a chalcogenide glass layer; silver-selenide formed in a layer comprising silver interstitially formed in a chalcogenide glass layer; or a silver doped chalcogenide glass layer having silver-selenide formed therein.

Abstract: An improved method for fabricating a window frame/window piece assembly is disclosed in this application. A window frame having an opening in its inner portion is provided. According to one aspect, the window frame can be formed from a unitary piece of sheet metal. A transparent piece is attached to the inner portion of the window frame through a molding process. According to one embodiment, the window frame is placed within a mold such that the inner portion of the window frame projects into an inner cavity inside the mold. After the mold has been closed, a transparent material is injected into the inner cavity so that it bonds with the inner portion of the window frame. After the bond of between the transparent material and the window frame is set, the window frame/window piece assembly is removed from the mold. According to another embodiment, a plurality of window frames may be loaded into a single mold so that a plurality of window frame/window piece assemblies can be fabricated in a single batch.

Abstract: A multi-chip module and a method for manufacturing the multi-chip module. A first semiconductor chip is mounted to a support substrate and a second semiconductor chip is mounted to the first semiconductor chip. The second semiconductor chip has a smaller dimension than the first semiconductor chip. A spacer is coupled to the second semiconductor chip. Bonding pads on the first and second semiconductor chips are wirebonded to bonding pads on the support substrate. A third semiconductor chip is mounted to the spacer and bonding pads on the third semiconductor chip are wirebonded to bonding pads on the support substrate.

Abstract: A flip chip package structure and manufacturing method thereof is provided. A chip is electrically connected to a substrate. A heat sink is attached to the backside of the chip. The heat sink has at least a through hole located at a peripheral region and laterally adjacent to the chip. A dispensing process is carried out to deliver an underfill material via the through hole such that the space between the chip and the substrate is filled. The underfill material also extends to cover a portion of the heat sink so that the heat sink and the substrate are connected together. The underfill material is cured to fix the heat sink, the substrate and the chip in position.

Abstract: To provide a method of manufacturing a highly reliable circuit device realizing a smaller, thinner and lighter configuration. In the method of manufacturing a circuit device according to the invention, a resin sealed body is separated from a supporting substrate, after the resin sealed body containing a circuit device is formed on a top surface of the supporting substrate. Therefore, manufacture of a circuit device having no substrate becomes possible and it realizes a thinner and lighter circuit device with improved heat dissipation. Moreover, since sealing with a sealing resin can be performed on the supporting substrate, warps, caused by the differences in thermal expansion coefficients between the sealing resin and conductive patterns and between the sealing resin and circuit components, can be prevented.

Abstract: A semiconductor multi-package module has stacked first and second packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the first and second substrates are interconnected by wire bonding, and in which the first package includes a flip-chip ball grid array package having a flip-chip in a die-up configuration. Also, a method for making a semiconductor multi-package module, by providing a lower molded package including a lower substrate and a flip-chip in a die-up configuration, affixing an upper molded package including an upper substrate in inverted orientation onto the upper surface of the lower package, and forming z-interconnects between the upper and lower substrates.

Abstract: A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the semiconductor component that are arranged in the manner of a flip-chip on its active upper side. The semiconductor chip can be encapsulated by a plastic compound at least on its rear side and its side edges. The outer contacts, which can be arranged on external contact connecting areas, can project from the active upper side.

Abstract: A common carrier for forming multiple printheads thereon and method of forming thereof is described. The common carrier includes a carrier substrate for adhering a plurality of unprocessed, integrateable semiconductor chips. Once adhered, the carrier substrate is lithographically processed to form a plurality of integrated circuit (IC) printhead chips such that alignment of the IC chips on the carrier substrate has the precision of lithographic alignment tolerances which is well within printhead alignment requirements.

Abstract: A technique is provided for dissipating heat from an integrated circuit within a package. A thermally conductive strip may be disposed adjacent to an integrated circuit die before packaging. The package is formed around the integrated circuit and the thermally conductive strip such that a portion of the thermally conductive strip extends through the package. Heat is conducted from the integrated circuit through the thermally conductive strip to the environment surrounding the package. A thermally conductive strip may be installed within a package by an adhesive or other mechanical means. A thermally conductive strip may be comprised of a metallic foil or other thermally conductive material.

Abstract: In order to prevent, in a resin sealing step, a conductive foil 10 from locally rising because of concentration of air intervening between the conductive foil 10 and lower mold 28A due to the charged pressure, a method for manufacturing circuit devices is provided. The method for manufacturing circuit devices includes the step of forming conductive patterns 21, which form a plurality of mounting portions 15 of a circuit element 22 on a conductive foil 10, in each block 12, the step of disposing the circuit element 22 on each mounting portion 15 of the conductive pattern 21 in each block 12, the step of performing resin sealing by bringing the lower mold 28A having an air vent 30 into contact with the backface of the conductive foil 10 in each block 12 and by performing transfer molding with an insulating resin 20 while disposing each mounting portion 15 of the block 12 in the same cavity, and the step of separating each mounting portion 15 by dicing.

Abstract: A method of making a circuitized substrate in which the substrate's commoning bar, used during the plating of the circuitry on the substrate, is terminated from the various conductors using a laser. In a preferred embodiment, the laser acts through a dielectric layer (soldermask) which is applied over the circuitry, including the commoning bar and connected parts. The laser may also be used to expose selected ones of the circuit's other parts, including various pads used to accommodate a wirebond (from a chip) and also solder balls for eventual placement of the substrate on a larger circuit board.