Abstract: An integrated circuit device comprising a partially embedded and encapsulated damascene structure and method for forming the same to improve adhesion to an overlying dielectric layer, the integrated circuit device including a conductive material partially embedded in an opening formed in a dielectric layer; wherein said conductive material is encapsulated with a first barrier layer comprising sidewall and bottom portions and a second barrier layer covering a top portion, said conductive material and first barrier layer sidewall portions extending to a predetermined height above an upper surface of the dielectric layer to form a partially embedded damascene.

Abstract: Metal interconnection lines of semiconductor devices and methods of forming the same are disclosed. Improved reliability is achieved in a disclosed metal line of a semiconductor device by preventing metal layers from eroding and preventing metal lines from being destroyed due to electro-migration (EM) and stress-migration (SM). An illustrated metal interconnection line includes: a semiconductor substrate; a metal pattern on the substrate; a glue pattern under the metal pattern; an anti-reflection pattern on the metal pattern; and dummy patterns surrounding side walls of the metal pattern.

Abstract: A method including forming a intermetallic compound including (1) an interfacial reaction product between a solder and a contact point and (2) a reaction species. A method including doping a solder material with a species; and forming a intermetallic compound including an interfacial reaction product between the solder material and a contact point. A system including a computing device including a microprocessor, the microprocessor coupled to a printed circuit board through a substrate, the substrate including a first set of contact points and a second set of contact points, wherein the microprocessor is coupled to the substrate through the first set of contact points, and the substrate is coupled to the printed circuit board through the second set of contact points, wherein at least one of the first set of contact points and the second set of contact points. Also a substrate.

Abstract: A power feed device for an electrical component which improves the quality of transmission and reduces the mounting density of a printed circuit board in the power feed device or reduces the thickness of the printed circuit board and thereby realizes smaller size, provided with a power supply for supplying power, a printed circuit board having built-in signal line patterns, and a power bar having conductive projections provided in shapes and at positions corresponding to the shapes and positions of electrodes of the electrical component and provided outside of the printed circuit board, power from the power supply being supplied through the conductive projections of the power bar to electrodes of the electrical component.

Abstract: A printed circuit board (PCB) with a differential pair arrangement includes a mounting area for receiving a chip, a plurality of first pads located near one edge of the mounting area, a plurality of second pads located near an opposite edge of the mounting area, the first pads and the second pads are arranged for receiving pins of the chip. A pair of vias is used for connecting layers of the PCB. The second pads are located between the vias and the mounting area. A differential pair includes two signal traces, one of the signal traces is connected to one of the first pads and routed to one of the vias through the mounting area, the other of the signal traces is routed through the mounting area and connected to one of the second pads and then routed to the other one of the vias.

Abstract: A semiconductor device includes a substrate on which a plurality of contact holes, a plane shape of each of which is a oval, are formed and contacts formed in each of the contact holes and having oval-shaped profiles that correspond to each of the holes. The position on the perimeter of each oval at which the separation width with an oval that is adjacent to that oval is a minimum is separated by a prescribed spacing from the intersection of the perimeter of that oval and the minor axis of that oval.

Abstract: The invention relates to a method for producing a PCM memory element and to a corresponding PCM element.

Abstract: On a substrate (2), a first package (4) is mounted through bumps (3), and a second package (6) is stacked on the first package (4). Each of the bumps (3) includes: a resin core (3a) having elasticity; and metal layers formed on an outer surface of the resin core. The bumps (3) are arranged so as to provide an electrical connection between the substrate (2) and the first package (4). With the above structure, a stacked semiconductor device is realized in which an IC chip breaks less likely during a mounting process.

Abstract: A semiconductor chip of the present invention has a wiring substrate and a chip part. The wiring substrate has an insulating resin layer having a first major surface and a second major surface, and a first wiring layer disposed on the insulating resin layer on the second major surface side. The chip part has a projection electrode on the bottom surface. The insulating resin layer holds the chip part such that the bottom and side surfaces of the chip part are in contact with the insulating resin layer, and the top surface of the chip part is exposed on the insulating layer on the first major surface side. The projection electrode of the chip part is connected with the first wiring layer.

Abstract: A relay board provided in a semiconductor device includes a first terminal, and a plurality of second terminals connecting to the first terminal by a wiring. The wiring connecting to the first terminal is split on the way so that the wiring connects to each of the second terminals.

Abstract: A package board for flip-chip packaging on whose one surface an element is mounted in a facedown manner is provided. The package board has: an interconnection provided on the one surface; a bump formation region in which a bump electrically connecting the interconnection with an electrode pad of the element is provided; and an insulating film covering a part of the one surface outside of the bump formation region. The insulating film includes a girdle-shaped insulating film that is provided around a region and along a side of the bump formation region opposite to an edge of the package board. The insulating film further has an opening section formed within the region.

Abstract: A circuit board including a flexible insulating substrate, a plurality of conductive wirings placed in line on the flexible insulating substrate, and bumps provided at end portions of the respective conductive wirings positioned in a region for mounting a semiconductor chip is provided. The circuit board further includes an auxiliary conductive wiring positioned at an outermost corner of the region for mounting the semiconductor chip, being adjacent to and an outside the outermost conductive wiring, and an auxiliary bump formed on the auxiliary conductive wiring in line with the bumps on the conductive wirings.

Abstract: A semiconductor device includes a semiconductor chip having at a center area thereof first and second pad rows which include a plurality of first pads and a plurality of second pads, respectively. A package substrate is bonded to the semiconductor chip. The package substrate includes a substrate opening corresponding to a region including the first and second pad rows, first and second wiring positioned at opposite sides of the substrate opening, respectively, and a ball land disposed in the first wiring area. A bridge section is provided over the substrate opening to mutually connect the first and second wiring areas. The ball land is electrically connected to at least one of the second pads through the bridge section by a lead.

Abstract: A chip package structure including a chip, a carrier, a plurality of bonding wires and a molding compound is provided. The chip has an active surface, a back surface opposite to the active surface, a plurality of side surfaces, and a plurality of flash-preventing surfaces located between the active surface and the side surfaces. The carrier is connected to the back surface of the chip to carry the chip. The chip is electrically connected to the carrier via the bonding wires. The molding compound is disposed on the carrier and encapsulates the bonding wires, a portion of the active surface, the side surfaces, and at least a portion of the flash-preventing surfaces. The flash-preventing surfaces prevent excess molding compound from contaminating the active surface of the chip.

Abstract: One embodiment of the present invention provides a system that facilitates precise inter-chip alignment for proximity communication and power delivery. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit chip, whose surface has corresponding etch pit wells configured to align with the etch pit wells of the first integrated circuit chip. A shaped structure is placed in an etch pit well of the first integrated circuit chip such that when the corresponding etch pit well of the second integrated circuit chip is substantially aligned with the etch pit well of the first integrated circuit chip, the shaped structure mates with both the etch pit well of the first integrated circuit chip and with the corresponding etch pit well of the second integrated circuit chip, thereby precisely aligning the first integrated circuit chip with the second integrated circuit chip.

Abstract: An assembly comprising first and second electronic devices and an optical resonator that optically couples an optical waveguide on the first electronic device to an optical waveguide on the second electronic device. In this way, optical proximity communication between the devices is possible. The electronic devices may be integrated circuit chips. A first portion of an optical resonator is disposed in a pit of the first device to optically couple the optical resonator to the first optical waveguide. A second portion of the optical resonator is disposed in a pit of the second device to optically couple the optical resonator to the second optical waveguide. Thus, the optical resonator optically couples the first optical waveguide to the second optical waveguide.

Abstract: An assembly comprising first and second electronic devices and an optical coupling device that optically couples an optical waveguide on the first electronic device to an optical waveguide on the second electronic device. In this way, optical proximity communication between the devices is possible. The electronic devices may be integrated circuit chips. The first optical waveguide is positioned relative to the optical coupling device to direct an optical signal to the optical coupling device. Further, the second optical waveguide is positioned relative to the optical coupling device to receive the optical signal, which is directed from the optical coupling device to the second optical waveguide. Thus, the optical coupling device optically couples the first optical waveguide to the second optical waveguide.

Abstract: According to one aspect of the present invention, a method is provided for forming a microelectronic assembly. The method comprises forming first and second trenches on a semiconductor substrate, filling the first and second trenches with an etch stop material, forming an inductor on the semiconductor substrate, forming an etch hole in at least one of the etch stop layer and the semiconductor substrate to expose the substrate between the first and second trenches, isotropically etching the substrate between the first and second trenches through the etch hole to create a cavity within the substrate, and forming a sealing layer over the etch hole to seal the cavity.

Abstract: A freestanding humidifier is provided with a movable base tray which is adapted to slide into and out of the bottom rear portion of the humidifier housing. The base tray is contoured to receive a pair of large volume water tanks which can be easily removed, refilled and reinstalled on the base tray. A large diameter fan is mounted in the humidifier and positioned to exhaust air in a substantially horizontal flow path from the humidifier into the ambient surroundings.

Abstract: A method and system are disclosed for dispersing gas bubbles in a multiphase mixture in a production tubing in an crude oil production well or in a riser connected to such a well, by means of one or more bubble breaker assemblies in which a plurality of orifices are arranged that are located in a substantially eccentric position relative to a central axis of the tubing. The use of eccentric orifices promotes the breaking up of large gas bubbles into a large amount of smaller gas bubbles, which are finely dispersed in the fluid stream and only re-coalesce slowly into larger bubbles.

Abstract: An apparatus for directing a vaporized substance into a space. The apparatus has a base with operating components capable of converting a liquid substance into a vapor, and a substance supply container that is separable from the base. The substance supply container in an operative state in relationship to the base delivers a supply of a substance therein in liquid form to the operating components on the base to be vaporized thereby. Vapor generated by the operating components is directed into a space within which the apparatus is located. The base and substance supply container cooperatively simulate the appearance of at least one of an animate or inanimate object.

Abstract: In a method of manufacturing an optical film by a casting apparatus which comprises a support, a casting die provided at a casting section of the support and a pressure reducing device provided at the casting section, a temperature T of the support at the casting section is set to satisfy the formula (1): ?0.01CS+0.005?P+5?T??0.125CS+0.04?P+17??(1) where CS represents the moving speed (m/min) of the support and ?P is a reduced pressure (Pa) at the back side of the dope ribbon by the reducing device.

Abstract: A method of generating a topology for a material includes parametrizing one or more material properties of the material using virtual testing and generating a topology for the material based on the parametrizing.

Abstract: A process is specified for producing a radiation-emitting component comprising a housing body and a carrier for a radiation-emitting semiconductor body, in which the carrier is produced in an injection molding process from a molding compound containing a metal.

Abstract: Coated devices for introduction into bodies and methods for making and using them are provided, such as delivery sheaths, guidewire lumen cores, and elongate leads. In one embodiment, a tubular device includes a proximal end, a distal end sized for introduction into a body lumen, and a lumen extending between the proximal and distal ends. The tubular device includes a relatively thin inner polyurethane liner including a coating on an inner surface thereof, e.g., providing a lubricious and/or hydrophilic lumen, and an outer layer surrounding the liner. In another embodiment, a lead is provided that includes a proximal end, a distal end, and at least one electrode on the distal end. A polyurethane cover surrounds at least a portion of an outer surface of the lead that include a coating, e.g., including a lubricious and/or hydrophilic material. Optionally, the cover may be removable from around the lead body.

Abstract: The invention comprises a shaping process for making pellets of a thermoplastic extrudable resin composition. The resin composition comprises a thermoplastic polymer, plasticiser and optionally further additives. The plasticiser comprises a component which is solid at room temperature. The process is run at a temperature above the melting point of the plasticiser and below the melting/plastification temperature of the thermoplastic polymer.

Abstract: In at least certain embodiments, the present invention relates to a trim panel made by providing a molding tool system comprising a first mold half, a second mold half, and a third mold half and positioning the first mold half and the second mold half proximate each other to form a first mold cavity. In certain embodiments, the method further comprises introducing a first resin into the first mold cavity to form a trim panel skin and positioning the first mold cavity with the trim panel skin and the third mold half with a trim panel substrate spaced from the trim panel skin to form a second mold cavity. In this embodiment, the method further comprises introducing a second resin into the second mold cavity to form a resilient layer extending between and connecting the trim panel skin and the trim panel substrate.

Abstract: A method of coating an edge surface (30) of an anisotropic ceramic matrix composite material (10) for use in a high temperature environment is disclosed where the edge surface (30) has exposed reinforced fiber layers (20). A laser beam may be used to melt a portion of the ceramic matrix composite material (10) on the edge surface (30) forming a melt layer. The melt layer is retained proximate the edge surface and the laser beam is controlled to form an isotropic protective coating (32, 34) on a portion of the edge surface (30). A method may be used to form a component for use in a high temperature environment that includes directing a laser beam toward a ceramic matrix composite material (10), controlling the laser beam to melt a portion of the ceramic matrix composite material (10) and forming a homogeneous protective coating (32, 34) from a melt layer that exerts compression on at least a portion of the ceramic matrix composite material (10) when the melt layer is cooled.

Abstract: A method is provided for curing an endless track belt comprising the steps of providing an upper and lower heated mold assembly having outer tread lug cavities in one half of a mold assembly, inner guide lug cavities in the other half of the mold assembly; placing a green uncured track belt carcass in between the mold halves; closing the mold halves and heating the uncured track belt carcass in a first heat cycle; opening the mold halves and indexing the track belt a distance x; sliding one of the mold halves relative to the other mold half a distance T; and closing the mold halves and heating the track belt carcass in a second heat cycle.

Abstract: A mold portion of a molding tool for making plastic articles includes a base body defining a cavity surface and having formed therein at least one heating channel, and at least one cooling channel separated from the heating channel and having a cross section which is smaller than a cross section of the heating channel. The cooling channel is positioned hereby closer to the cavity surface than the heat channel and thus is in an area between the heat channel and the cavity surface, thereby defining a cavity-proximal cooling channel and a cavity-distal heat channel. Before the injection process, the cavity surface is heated by the heat channel to a higher temperature than the demolding temperature of the plastic article to be formed. At the end of the injection process, the cavity surface is cooled by the cooling system.

Abstract: A stereolithography apparatus having a resin vat with resupply containers in one-way flow communication and a leveling container in two-way flow communication, an automatic offload cart to remove and replace build support platforms, an elevator assembly for supporting and releasably retaining a build platform removably attached to the stereolithography apparatus frame such that elevator forks supporting the build platform can be released into the vat and removed from the stereolithography apparatus with the vat, and a recoater assembly and recoater blade for mapping the resin surface in the vat and applying a fresh coating of resin to a cross-section being built in the vat.

Abstract: A stereolithography apparatus having a resin vat with resupply containers in one-way flow communication and a leveling container in two-way flow communication, an automatic offload cart to remove and replace build support platforms, an elevator assembly for supporting and releasably retaining a build platform removably attached to the stereolithography apparatus frame such that elevator forks supporting the build platform can be released into the vat and removed from the stereolithography apparatus with the vat, and a recoater assembly and recoater blade for mapping the resin surface in the vat and applying a fresh coating of resin to a cross-section being built in the vat.

Abstract: A stereolithography apparatus having a resin vat with resupply containers in one-way flow communication and a leveling container in two-way flow communication, an automatic offload cart to remove and replace build support platforms, an elevator assembly for supporting and releasably retaining a build platform removably attached to the stereolithography apparatus frame such that elevator forks supporting the build platform can be released into the vat and removed from the stereolithography apparatus with the vat, and a recoater assembly and recoater blade for mapping the resin surface in the vat and applying a fresh coating of resin to a cross-section being built in the vat.

Abstract: A stereolithography apparatus having a resin vat with computer controlled heating elements responsive to thermistors for controlled preheating of the resin vat, an elevator assembly for supporting and releasably retaining a build platform removably attached to the stereolithography apparatus frame such that elevator forks supporting the build platform can be released into the vat and removed from the stereolithography apparatus with the vat, and a recoater blade that can be removed and accurately installed by hand, thus providing that all wetted components can be quickly and efficiently removed and installed and enabling rapid changeover from spent resin to fresh resin and minimizing apparatus downtime between stereolithography operations.

Abstract: A method for fabrication of an optical transparency, that includes electrospinning of an Indium Tin Oxide sol polymer solution such that nanofibers are formed, heat treating the electrospun nanofibers such that the Indium Tin Oxide is in a conductive form, and dispersing the heat treated nanofibers into a substantially optically clear polymer.

Abstract: The method and apparatus of the invention is used to heat the surface of the mold insert or cavity by high frequency current. There are holes near the heated surface in the mold and the coils can be installed into the holes. The coils surround the heated surface and are conducted with high frequency current. Due to the directional change of the current, the blocks that are surrounded by the coils will be heated by the hysteresis losses and the eddy-current losses. The surface of the mold insert or cavity will be heated rapidly. There are cooling holes set near the heated surface or beside the coil-pipe. The cooling liquid or air can flow in the holes to carry out extra energy and the temperature of the mold will be decreased. The position of the cooling holes, the flow speed and temperature deviation of the liquid and air will influence the temperature of the mold. The method and apparatus will improve the quality of the thermal-plastic products and elevate the number of the cavity.

Abstract: An in-die cover forming method for integrally forming a cover member with a surface of a base member in a die is provided. The die including an upper die half and a lower die half. The upper die halves are movable relative to each other. The base member is set on the lower die half such that its back is opposed to the lower die half. Using position determining mechanisms located between the lower die half and the back of the base member, the position of the surface of the base member in relation to the lower die half in the die moving direction is determined. The cover member is placed between the base member and the upper die half. The cover member is integrated with the surface of the base member by closing the upper die half with respect to the lower die half while pressing the cover member against the base member through vacuuming.

Abstract: The invention is directed to a method for manufacturing a thin-wall, single-piece optical obturator having an integral tip and shaft. The invention includes providing an injection mold defining a mold cavity having a core pin positioned within the mold cavity. The mold includes at least one gate and multiple core support pins between the core pin and the mold cavity walls, with at least one primary core support pin positioned on a side opposite the at least one gate. The method also includes injecting a transparent molten polymeric material having high flow properties into the injection mold such that the polymeric material flows between the surface of the mold cavity and the core pin. The core support pins substantially prevent the core pin from shifting while the polymeric material is injected into the mold. The high-flow nature of the polymeric material allows for complete filling of the mold cavity.

Abstract: A technical problem of this invention is to create a method for thermal crystallization by means of a jig of the inverted support type that enables a preform neck to be obtained with high dimensional accuracy. The object of this invention is to provide a highly productive thermal crystallization method for the bottle neck and an efficient biaxial drawing and blow molding process for the bottle. The means of carrying out this object comprises that the thermal crystallization of the neck is carried out by installing an inverted preform on the jig while the top neck surface is spaced from the top jig surface and utilizing the method for thermal crystallization under the conditions that the jig of the inverted support type is loaded with a synthetic resin preform for use in the biaxial drawing and blow molding process.

Abstract: A canopy is removably secured to the container body, is respectively fitted with: a base of a water level indicator for detecting a remaining amount of liquid reducing agent; a base of a densitometer for detecting a concentration of a liquid reducing agent; and a heat exchanger which surrounds detection portions respectively suspended from the bases of the water level indicator and the densitometer, and through which is circulated engine coolant, to perform heat exchange with the liquid reducing agent, and a supply port and a return port for the liquid reducing agent are respectively formed in the canopy. The water level indicator, the densitometer, the heat exchanger, and the supply port and the return port for the liquid reducing agent are formed integrally with the canopy, so that the water level indicator and the densitometer can be dismounted together with the canopy at the same time.

Abstract: In combination with a furnace having a top from which very hot gases are exhausted, a cooling system has an outwardly open collar fixed to the top of the furnace and open inward into the furnace, a tubular exhaust stack adjacent the furnace, a connecting duct extending from the stack and fitted concentrically to the collar, a network of heat-exchange tubes lining the top of the furnace. The collar, and the connecting duct, and means for circulating through all of the tubes a coolant at generally the same temperature.

Abstract: The present invention provides a viscous fluid-sealed damper which makes it possible to reduce the size of the disk device and to prevent air from entering a closed container to achieve a sufficient vibration damping effect. A closed container is reduced in thickness in comparison with the closed container according to the conventional example. Thus, the space for mounting the viscous fluid-sealed damper is reduced. Therefore, it is possible to reduce the size of the disk device. When a mechanical chassis moves relative to a chasing, an inner cylinder portion which is formed at a center, and an inner edge region of the lid portion which is in contact with the inner cylinder portion also move to three-dimensional direction. In accordance with this movement the bottom portion 16b and the lid portion which is opposite to the bottom portion move in an interlocking manner. Consequently, the viscous fluid sealed up within the closed container is stirred.

Abstract: A fluid filled type vibration-damping device including: an elastic body connecting a first and second mounting member and sealing off one opening of the second mounting member; a flexible film fluid-tightly scaling off an another opening of the second mounting member; a partition member firmly fitted into the second mounting member thereby forming a pressure-receiving chamber partially defined by the rubber elastic body and an equilibrium chamber partially defined by the flexible film, which communicate together via an orifice passage; a short circuit passage is formed to connect the two chambers, and a valve body placing the short circuit passage in a communicating state on a basis of elastic deformation of the elastic body when an excessive pressure differential arises between the two chambers.

Abstract: The present invention is a torsion spring assembly. Further, the present invention is a torsion spring assembly having a preload. The spring assembly has a spring and two rotatably coupled components disposed within the spring, wherein the two components cannot rotate a full 360 degrees in relation to each other, thereby allowing the assembly to be placed in a preload state.

Abstract: A clamp includes a body, a lead pin moveable relative to the body and an actuator supported by the body. The actuator is axially moveable between an extended position and a retracted position. The actuator includes a camshaft drivingly coupled to the lead pin. Axial movement of the camshaft causes the lead pin to rotate between a first positioned aligned with a first longitudinal axis and a second position aligned with a second longitudinal axis laterally offset from the first longitudinal axis.

Abstract: A machine for working on glass sheets, comprising, on a frame for supporting a sheet to be worked, an upper working head and a lower working head. A sheet locking assembly is provided that is constituted by an upper pressing surface and a lower pressing surface, the lower pressing surface being disengaged from the lower working head.

Abstract: An automatic machine for arrissing the edges of glass sheets, comprising devices that allow to work glass sheets by way of rigid tools, such as diamond grinding wheels, by acting simultaneously on the two face edges along the perimeter of the sheet. The machine comprises at least one working head, provided with a tool with a probe and feedback circuits for grinding symmetrically the glass sheet and following the perimetric profile of the sheet by a combined action of moving the glass sheet and at least one working head.

Abstract: A collating apparatus and method to merge different types of document sets into a single collated packet prior to a mail processing insertion operation. The collating device utilizes a synchronous conveyor pathway for conveying different types of document sets serially down the pathway and merging them into a single collated packet. The document sets are delivered downstream with a combination of pivotable and fixed position pusher members and are combined into a single collated packet in any desired order.

Abstract: A sheet feeder includes a first sheet-feeding cassette capable of accommodating a stack of recording medium and a second sheet-feeding cassette capable of accommodating a stack of recording medium smaller than the recording medium accommodated in the first sheet-feeding cassette. The second sheet-feeding cassette is disposed on the first sheet-feeding cassette so as to be movable with respect to the first sheet-feeding cassette. The second sheet-feeding cassette includes a first accommodating section and a second accommodating section. The second accommodating section is displaceable relative to the first accommodating section between a closed position and an open position. The second accommodating section exposes an accommodating section of the first sheet-feeding cassette wider in the open position than in the closed position.

Abstract: A sheet feeder includes a first sheet-feeding cassette capable of accommodating a stack of recording medium and a second sheet-feeding cassette capable of accommodating a stack of recording medium smaller than the recording medium accommodated in the first sheet-feeding cassette. The second sheet-feeding cassette is disposed on the first sheet-feeding cassette so as to be movable with respect to the first sheet-feeding cassette. The second sheet-feeding cassette includes a first accommodating section and a second accommodating section. The second accommodating section is displaceable relative to the first accommodating section between a closed position and an open position. The second accommodating section exposes an accommodating section of the first sheet-feeding cassette wider in the open position than in the closed position.