Abstract: The present invention is generally directed to various methods of forming conductive through-wafer vias. In one illustrative embodiment, the method comprises providing a layer of semiconducting material, forming a layer of metal on a first side of the layer of semiconducting material, forming an opening in the layer of semiconducting material to thereby expose a portion of the layer of metal, the opening extending from at least a second side of the layer of semiconducting material to the layer of metal, and performing a deposition process to form a conductive contact in the opening using the exposed portion of the metal layer as a seed layer.

Abstract: In some embodiments, laser ablation and imprinting hybrid processing for fabrication of high density interconnect flip chip substrates are presented. In this regard, a substrate in introduced having a dielectric layer wherein material has been removed from a surface and the cavity has been plated with conductive material resulting in a feature width of less than about 10 micrometers. Other embodiments are also disclosed and claimed.

Abstract: A semiconductor-element mounting substrate is a substrate for mounting a semiconductor element, and includes a substrate body. The substrate body has a mounting surface, and the center portion of the mounting surface is provided with a die pattern. Through conductors are provided in a portion of the substrate body located outside the die pattern to penetrate the substrate body in the thicknesswise direction. First terminals and second terminals are connected to the through conductors, respectively. The first terminals each extend toward the outer edge of the mounting surface, and they are electrically connected to the semiconductor element. The second terminals are provided on a surface of the substrate body opposite to the mounting surface.

Abstract: Electronic assemblies and methods for forming assemblies are described. One embodiment includes a method of forming an electronic assembly, including forming a plurality of first solder bumps on one of a substrate and an interposer. The substrate and interposer are positioned so that the first solder bumps are located between the substrate and the interposer. A gap control structure is positioned between the substrate and the interposer. A first reflow operation that reflows and then solidifies the first solder bumps is performed. The first reflow operation couples the interposer to the substrate. A plurality of second solder bumps are formed on one of the interposer and a die. The interposer and die are positioned so that the second solder bumps are located between the interposer and the die. A second reflow operation that reflows and then solidifies the second solder bumps is performed. The second reflow operation couples the die to the interposer.

Abstract: A semiconductor device includes a plurality of semiconductor constructs, each of the semiconductor constructs including a semiconductor substrate and external connection electrodes provided on an upper surface of the semiconductor substrate. The semiconductor substrates of the semiconductor constructs are different in a planar-size. The plurality of semiconductor constructs are stacked from bottom to top in descending order of planar-sizes of the semiconductor substrates included in the plurality of semiconductor constructs. An insulating film at least is provided around one semiconductor construct disposed on the top of the plurality of semiconductor constructs and on another semiconductor construct disposed under the one semiconductor construct. Each of the upper surfaces of the plurality of external connection electrodes is exposed from the one semiconductor construct and from the insulating film.

Abstract: An inter-stacking module system is provided by mounting an integrated circuit on a first substrate, the first substrate having a first bond pad, mounting an inter-stacking module substrate over the integrated circuit, forming an inter-stacking module bonding pad on the inter-stacking module substrate, and connecting bond wires between the inter-stacking module bonding pad and the first bond pad.

Abstract: A power semiconductor module has a ceramic substrate (9) which has on at least one side a patterned metallization (50) with a fineness of pattern of smaller than or equal to 800 ?m, a first semiconductor chip (10) which has a power semiconductor component and which is arranged on the patterned metallization (50), and a second semiconductor chip (30) which has drive electronics for driving the first semiconductor chip (10) and which is arranged on the patterned metallization (50). Furthermore, at least one thin-wire bond (2, 3) with a bonding-wire diameter (d2, d3) of smaller than or equal to 75 ?m is provided which is formed between the patterned metallization (50) and the second semiconductor chip (30).

Abstract: A semiconductor component for radio-frequency applications has at least one substrate and one chip, and with contact pads is disclosed. In one embodiment, bonding wires connect the contact pads on the chip to the contact connecting pads. Signals are passed via these contact pads such that signals at high frequencies are passed via one or more contact pads and signals at low frequencies are passed via one or more contact pads. The chip is shifted on the substrate from a central position with respect to the totality of the contact connecting pads, so that the bonding wires for those contact pads via which signals at a high frequency are passed are shorter than bonding wires for those contact pads via which signals at low frequencies are passed.

Abstract: A semiconductor package with build-up layers formed on a chip and a fabrication method of the semiconductor package are provided. A chip with a plurality of conductive bumps formed on bond pads thereof is received within a cavity of a carrier, and a dielectric layer encapsulates the conductive bumps whose ends are exposed. A plurality of conductive traces are formed on the dielectric layer and electrically connected to the ends of the conductive bumps. A solder mask layer is applied over the conductive traces and formed with openings via which predetermined portions of the conductive traces are exposed and bonded to a plurality of solder balls. Thereby, positions of the bond pads are easily recognized and distinguished by the exposed ends of the conductive bumps, making the conductive traces capable of being well electrically connected through the conductive bumps to the bond pads to improve yield of the fabricated packages.

Abstract: A memory device having a vacuum jacket around the first electrode element for improved thermal isolation. The memory unit includes a first electrode element; a phase change memory element in contact with the first electrode element; a dielectric fill layer surrounding the phase change memory element and the first electrode element, wherein the dielectric layer is spaced from the first electrode element to define a chamber between the first electrode element and the dielectric fill layer; and wherein the phase change memory layer is sealed to the dielectric fill layer to define a thermal isolation jacket around the first electrode element.

Abstract: A laminate structure and method of manufacture, such as a processed silicon wafer with an overlying layer or cover, includes a first layer or substrate which has a generally-planar region and a peripheral contoured region with falloff from a planar region of the first layer, and a second layer which overlies the first layer and is spaced from the planar region of the first layer a uniform distance by a plurality of uniform spacers, and peripheral spacers located in the peripheral contoured region which extend from the first layer to the second layer to maintain the second layer in the same plane as it extends over the falloff of the peripheral contoured region of the first layer to increase the useable area of the laminate structure. Spherical, deformable and fixed dimension spacers are used.

Abstract: The present invention relates to a device for manufacturing an optical preform by means of an internal vapour deposition process, said device comprising an energy source and a substrate tube, which substrate tube comprises a supply side for supplying glass-forming precursors and a discharge side for discharging constituents that have rot been deposited on the interior of the substrate tube, said energy source being movable along the length of the substrate tube between a point of reversal at the supply side and a point of reversal at the discharge side.

Abstract: The invention provides an improved process for manufacturing silicone-hydrogel contact lenses. The improvement includes use of a vacuum force to transport lens molds to and from a hot water deblocking process.

Abstract: A nanoimprinting system incorporates a patterned media contact architecture to provide a uniform imprinting pressure across the target imprinting area on a disk substrate. The system leverages the unique disk substrate characteristic of an inner diameter hole by incorporating a membrane suspension, gel-pad buffering, and air cushion loading that exploits the inner diameter hole characteristics of the disk substrate. This design dramatically increases the uniformity of the pressing pressure across the target imprinting area. As a result, a simple and effective improvement of the quality of the patterns imprinted on the recording disk substrate is realized.

Abstract: The invention relates to a production machine with a hydraulic and/or electric drive and also measured data acquisition for at least one positional determination and at least two measured variables dependent on the latter in the production machine. If a further setpoint profile is exceeded, a setpoint input is corrected directly in the form of a substitutional open-loop or closed-loop control.

Abstract: Method to recover resin used in an optical disk in high purity. The method includes an abrading step and a peripheral face removing step. The abrading step abrades a recording surface, opposite to a reading surface where a substrate of the optical disk is exposed, until the substrate becomes exposed. Further, the peripheral face removing step removes portions adjacent to an outer peripheral face and an inner peripheral face.

Abstract: A process for producing an adhesive film includes laminating an adhesive layer containing thermoplastic polyimide onto at least one surface of a highly heat-resistant polyimide layer by coextrusion casting method, wherein a chemical dehydrator and a catalyst are contained in a precursor solution of the highly heat-resistant polyimide and/or a solution containing either the thermoplastic polyimide or a precursor of the thermoplastic polyimide.

Abstract: A process for producing a resin model for use in lost wax precious casting, comprising at least a hardened resin layer forming step of injecting two-pack reaction hardening type urethane resin solution (A) of 1 to 3 minutes of a working life, through a casting port (4) of a resin model forming mold (2) furnished with internal space (3) whose configuration is identical with that of product, into the internal space (3) in a volume amounting to 5 to 20% of the volume of the internal space (3), closing the casting port (4) and rotating the resin model forming mold (2); a resin model forming step of repeating the hardened resin layer forming step 3 to 6 times at intervals of 3 to 4 minutes so as to effect laminating of hardened resin layers (11), thereby obtaining resin model (12) having internal space (30) provided at a core region thereof; and a demolding the resin model (12) from the resin model forming mold (2).

Abstract: The invention provides a press-molding apparatus, a mold, and a press-molding method, which can shorten a molding cycle and enhance productivity. There are provided a first mold; a second mold disposed to face the first mold and including a substrate (14), a heat insulating member (21) disposed on a side of the substrate (14) facing the first mold, and a machining member disposed on a side of the heat insulating member (21) facing the first mold and having irregularities on a surface facing the first mold; a loading processing section for loading a to-be-machined member on the first mold; a heating processing section for heating the to-be-machined member to a molding temperature higher than a state change point of a material which constitutes the to-be-machined member; and a transfer processing section for pressing the machining member against the to-be-machined member so as to transfer the irregularities to the to-be-machined member.

Abstract: The present invention relates to a micro/nano imprint lithography technique and in particular, to a stamp that is used in an UV-micro/nano imprint lithography process or thermal micro/nano imprint lithography process and a method for fabricating the stamp. The method for fabricating a stamp for micro/nano imprint lithography of the present invention includes i) depositing a thin film of diamond-like carbon on a substrate, ii) applying resist on the diamond-like carbon thin film, iii) patterning the resist, iv) etching the diamond-like carbon thin film by using the resist as a protective layer, and v) removing the resist.

Abstract: A process for producing an inner sole including a sole base and a plurality of blisters integrally formed on the sole base and extending away from the sole base, the process comprising the steps of preparing a mold with a recess for forming the sole base and the blisters, the recess having a number of projections on a first area and clearances for forming hollow spaces on an opposite second area, preparing a flexible elastic material, introducing material into the mold to form the sole base with integral blisters, and removing the inner sole from the mold.

Abstract: A method for the manufacture of a plastic product, wherein a reinforcement package (2) is placed against a molding wall (1), an air extraction and a supply (5) for liquid plastic material (6) are installed, and the reinforcement package is covered by an air-tight covering (3), on which, non-detachably, channel parts (7) are fixed. The pressure in the reinforcement package is adjusted to a value d1, lower than the ambient pressure, after which the pressure within the channel parts is adjusted to a value d2, lower than d1, so that runner channels are formed on the reinforcement package. After the liquid plastic material has soaked the reinforcement package to a sufficient extent, the pressure in the channel parts is adjusted to a value d3, greater than d1, so that the runner channels are pushed away. After curing of the plastic material, the air-tight covering—if desired reusable and premodeled—and the channel parts connected therewith are released.

Abstract: An object is to provide a mold-clamping apparatus (10) in which the number of parts to be moved in adjusting mold thickness is reduced to thereby exhibit enhanced accuracy in adjusting mold thickness. The mold-clamping apparatus (10) includes a first stationary member to which a stationary mold (15) is attached; a first movable member disposed in opposition to the first stationary member and to which a movable mold (16) is attached; and a second movable member to be advanced and retreated in association with advancement and retreat of the first movable member. Mold thickness is adjusted by means of changing relative positions of the first movable member and the second movable member; thus, the number of parts to be moved in adjusting mold thickness can be reduced, whereby accuracy in adjusting mold thickness can be enhanced.

Abstract: Method and apparatus for controlling the stacking height of stackable products during compression molding off stops includes slides that are movable into and out of an end of blind pockets in a compression mold in which the stack height surfaces are formed during the molding cycle. The slides are held in a retracted position until after the mold is closed and the molding compound flows to the shape of the molding cavity inside the mold including the blind pockets. Then the slides are extended into the ends of the respective blind pockets the same distance to compress the molding compound and obtain the desired height of the stack height surfaces formed by the blind pockets.

Abstract: A method for producing dimensionally accurate metal foam from a foamable, powder metallurgically produced metal semifinished product having a melting point >200° C. involving: the introduction of material, which is capable of foaming above 200 ° C., into a mold which has a coefficient of expansion of less than 3 K?1 Controlled heating of the foamable material inside the mold is performed while radiators foam the material, and the foamed product formed thereby removed from the mold. A device for producing dimensionally accurate thermally foamed metal foam parts that is has a thin-walled mold, which is stable at the melting temperature of the metal foam and which has a coefficient of expansion of <3K?1; a controllable irradiating device, and; a controller that controls the irradiating device based on the measurement given by a radiation measuring device.

Abstract: A mat is used in a method for the manufacture of glass fiber reinforced plastics or carbon fiber reinforced plastics as a layer for the absorption of excess resin expelled during the manufacturing process. The mat consists of thermally bonded plastic fibers, with at least one side of the mat having a solidified surface with a smaller pore size. Various methods are described for the manufacture of glass fiber reinforced plastics or carbon fiber reinforced plastics.

Abstract: A ceramic honeycomb structure comprising a ceramic honeycomb body comprising axial grooves on its periphery and cell walls constituting a larger number of flow paths inside the grooves, and a peripheral wall layer covering the grooves, wherein there are stress release portions at least partially in the peripheral wall layer and/or between the peripheral wall layer and the grooves. The thermal expansion coefficient of the peripheral wall layer is preferably smaller than those of the cell walls in a radial direction. The peripheral wall layer is preferably formed on the ceramic honeycomb body formed by removing a peripheral wall from a ceramic green body, before or after firing the ceramic honeycomb body.

Abstract: A bioabsorbable drug delivery device and various methods of making the same. The devices are preferably formed from bioabsorbable materials using low temperature fabrication processes, whereby drugs or other bio-active agents are incorporated into or onto the device and degradation of the drugs or other agents during processing is minimized. The method includes preparing a solution of at least one bioabsorbable polymer and a solvent. The solution is then deposited onto a mandrel and converted into a tube. The solvent is evaporated from the tube in a nitrogen rich environment. The tube is removed from the mandrel and further dried before being stored in an inert environment.

Abstract: Thus, as shown by an exact electrodynamic computation of EMBF and the estimations described above of the velocity of turbulent flows arising due to their effect, application of amplitude- and frequency-modulated helically traveling (rotating and axially traveling) electromagnetic fields in metallurgical and chemical technologies and foundry can considerably increase the hydraulic efficiency of MHD facilities, intensify the processes of heat and mass transfer in technological plants, significantly increase their productivity, considerably decrease energy consumption for the production of metals, alloys, cast articles, and chemical products, and improve their quality.

Abstract: Thus, as shown by an exact electrodynamic computation of EMBF and the estimations described above of the velocity of turbulent flows arising due to their effect, application of amplitude- and frequency-modulated helically traveling (rotating and axially traveling) electromagnetic fields in metallurgical and chemical technologies and foundry can considerably increase the hydraulic efficiency of MHD facilities, intensify the processes of heat and mass transfer in technological plants, significantly increase their productivity, considerably decrease energy consumption for the production of metals, alloys, cast articles, and chemical products, and improve their quality.

Abstract: An apparatus and method for quick quenching liquid slag, which includes a bay area for receiving the liquid slag and a water supply system for spraying, or quick quenching, the liquid slag provided on the bay area with water to cool the liquid slag and turn it into a crystalline form. The bay area includes an angled and generally flat surface provided between first and second ends, with the first end defining a high end and the second end defining a low end, such that liquid slag provided to the bay area adjacent the first end will run down the bay area toward the second end. The water supply system is provided operatively above the bay area and applies water to the liquid slag on the bay area such that the liquid slag cools and turns into a crystalline form. Additional amounts of liquid slag may be poured on top of previous cooled and quenched crystalline slag and quick quenched with water in a similar manner.

Abstract: An immersion nozzle for continuous casting which enables improvement in quality of a slab surface and increase in the efficiency of casting by suppressing the self-excited oscillation of a flow in a mold without using a complicated mechanism such as a swirl flow generating immersion nozzle is to be provided. A first immersion nozzle for continuous casting is a nozzle comprising a cylindrical body and a pair of outlet ports formed to face each other in a side wall in the vicinity of a bottom part of the cylindrical body, wherein a ridge-shaped projection extending parallel with the discharge direction projected on a cross section of the nozzle is formed on an inner surface of the bottom part, which is formed in a waterfall basin-like recessed shape having a maximum depth of 5 mm to 50 mm.

Abstract: The invention is a fluidic damper which comprises a closed cylinder (100) containing a valve mechanism. The valve mechanism is attached to a piston rod (110), a portion of which (the piston rod) emerges through an opening in one end wall of the cylinder (100). The valve mechanism (90) comprises a disc (10) with an axle (15), a rotable annular cover piece (20) and an annular turning piece (40). A spring (30) is disposed between the cover piece (20) and the turning piece (40).

Abstract: A spring element (2) consists essentially of an elastic spring body (4) which is fixed between two rigid end parts (6, 8) arranged at a variable spacing from each other. The spring body (4) consisting of rubber or a rubber-type plastic has a rotationally symmetrical cross section, the longitudinal section shows a biconvex surface line. A U-shaped cross section is formed as a result of a cavity (10). The abrasion caused by the introduction of vertical and horizontal forces is to be reduced and an easy, horizontal slide is to be made possible. The surface (12) of the spring body (4) is provided with ribs (14; 14a, . . . ) that are arranged at spacings (A) from each other and are intersected by ribs (16; 16a, . . . ) or groups of ribs (16, . . . ) also arranged at spacings (A) from each other. Polygonal fields (18a, . . . ) are formed on the surface (12) of the spring body (4) in the gaps between the ribs (14,. . . ; 16, . . . ) according to the angle of intersection.

Abstract: A vibration-shock absorbing mechanism that protects an object disposed in a housing includes a shock-absorbing member that is disposed in the housing and absorbs a shock, and a resonance-damping member that is disposed between the object and the shock-absorbing member and dampens a vibration and shock in a predetermined frequency range including a resonant frequency of the object.

Abstract: Isolator assemblies and isolators between separate parts or components, and, particularly, multi stage isolators, especially, isolators useful in automotive applications are described. The isolators have a tubular cross section, made of the same material as the isolator body, which can flex when in a deflection stage, or can compress in a compression stage, thus allowing for reduced wear and/or longer life for both the isolator and the parts and components separated thereby.

Abstract: A hydraulically damped mounting device has a first anchor part; a second anchor part in the form of a hollow sleeve containing the first anchor part, such that the first anchor part extends axially of the sleeve; first and second resilient walls interconnecting the first and second anchor parts, the first and second resilient walls being spaced apart so as to define an enclosed space within the sleeve extending circumferentially around the first anchor part and axially bounded by the first and second resilient walls; first and second deformable walls, each extending axially between the first and second resilient walls at circumferentially spaced locations, so as to divide the enclosed space into first and second chambers for hydraulic fluid; a passageway interconnecting the first and second chambers, the passageway being for flow of hydraulic fluid therethrough.

Abstract: The drive device for actuating a linearly movable operative member, comprises a box-shaped body for supporting a linearly movable operative member, actuating means for actuating the operative member, and a first and a second toggle-lever systems for connection between the operative member and the actuating means. The second toggle-lever system comprises a master lever, pivoted onto the box-shaped body and connected to the actuating means, and an intermediate connecting link, articulated to the master lever and operatively connected to the first toggle-lever system, the first toggle-lever system being in turn connected to the linearly movable operative member.

Abstract: A quick-action clamping cylinder is described which has a housing and a cover which covers the housing and has a center opening for receiving a retractable nipple that is arranged on the lower side of a workpiece pallet. The retractable nipple is locked in a spring-loaded manner in the housing by means of a plurality of locking balls that are spring-loaded in the locked position on the outer periphery of the retractable nipple. The locking balls are disengaged from the retractable nipple in the unlocked position by displacing a piston actuated by a pressurized medium. The aim of the invention is to obtain a simple, small clamping system. To this end, the locking balls convert the spring force exerted by the springs into a multiple of the retraction force acting on the retractable nipple, by means of a lever arm transmission.

Abstract: An apparatus for collecting sheets into sets, having a main supply station (16) and at least two attachment supply stations (17-20). A first one of the attachment supply stations (17-19) is arranged for supplying sheets to a first position on a conveyor track (5) and a second one of the attachment supply stations (18-20) is arranged for supplying sheets to a second position on the conveyor track (5) downstream of the first position on the conveyor track (5). The attachment supply stations (17-20) each comprise a stacking position (46) arranged for collecting sheets, received piece by piece, into a stacked set and for feeding the set. At least the sheet supply track (6, 53-67) of the second attachment supply station is provided with a waiting position, which is arranged for receiving a set coming from the stacking position (46) and holding the received set in readiness while in the stacking position (46) a next set (2) is being collected.

Abstract: A paper sheet processing apparatus includes a plurality of bundling devices, and a plurality of chute devices which temporarily hold bundles, which are bundled by the bundling devices. A second transfer conveyor, which is slower than a first transfer conveyor, is disposed on a downstream side of the first conveyor. A transmission sensor, which detects abnormality in length of the bundle, is provide along the second conveyor. The distance from a release position of the bundle from the chute device, which is located on a most downstream side, to a terminal end of the first conveyor and the length of the second conveyor are set such that a time until the bundle, which is released from the most downstream chute device, is transferred onto the second conveyor is longer than at least a time until the bundle, which is transferred from the first conveyor, passes through the second conveyor.

Abstract: A closing type fence 9 is disposed at the downstream side leading end of a sheet table 5 of a punching device 1. Jogging rollers 12 having a torque limiter are arranged just upstream of a punching unit 6. The sheet, as fed into the sheet table by feed rollers 3, is pushed onto the closing type fence by the jogging rollers and is interposed between right and left positioning plates so that it is precisely positioned. When the punching treatment by the punching unit is executed, the closing type fence is opened so that the sheet is discharged by the jogging rollers and discharge rollers 4.

Abstract: An image forming apparatus includes a sheet mounting part for mounting plural sheets thereon, a sheet feeding part having a sheet feeding roller for feeding one of the plural sheets mounted on the sheet mounting part to a sheet conveying path by rotating the sheet feeding roller, a sheet detecting part for detecting the sheet fed by the sheet feeding part on the sheet conveying path, and a control part for controlling the rotation of the sheet feeding roller. The sheet feeding roller repeats an operation of rotating and stopping in a predetermined interval in accordance with the control of the control part during a period which begins when starting the feeding of the sheet and ends when detecting the sheet on the sheet conveying path.

Abstract: A feeding roller is configured to be driven to rotate both in a forward direction for conveying the recording medium to an image forming position along a conveying path and in a reverse direction opposite to the forward direction. A conveying roller is configured to driven to rotate both in a forward direction for allowing passage of the recording medium conveyed by the feeding roller and in a reverse direction for preventing the passage of the recording medium. A transmitting unit is capable of transmitting a rotational driving force to the feeding roller and the conveying roller, in such a manner that either one of the feeding roller and the conveying roller rotates in the forward direction and that the other one of the feeding roller and the conveying roller rotates in the reverse direction. The feeding roller has a predetermined play in a rotational direction.

Abstract: Sheet separation, feeding and printing with reduced image deletions of various types of print media sheets from a stack thereof, especially coated print media sheets with high humidity adhesion difficulties, is assisted by a sheet air puffer for a sheet separator/feeder having an automatically variably heated air supply. This may be accomplished by electronically obtaining information on the selected type of print media sheets to be fed from the sheet separator/feeder, and the ambient conditions, including at least the humidity, and by combining that information in an electronic look-up table additionally provided with set points to produce a control signal for variable air puffer temperature and strength.

Abstract: A sheet-feeding apparatus with a paper stopper includes a sheet-feeding base having a sheet-placing stand for placing sheets, a roller shell located on the sheet-feeding base having two side walls, a preliminary feeding roller unit and a feeding roller unit contained in the roller shell, a stopper member rotationally attached to the side wall of the roller shell and a follower member rotationally attached to the feeding roller unit and located at the downstream side of the stopper. Before starting a feeding operation, the stopper member is pushed by a sheet in the sheet-feeding base to move forward and presses on the follower member. The follower member would not move any further because the follower member is restricted by an upright wall of the sheet-feeding base.

Abstract: A paper storage box capable of dispensing paper without requiring a user to contact the paper includes a housing, a pickup roller installed in the housing in a rotatable manner, a protection plate installed on the housing above the pickup roller, an elastic device installed on the protection plate facing the pickup roller, a driving device installed outside the housing for driving the pickup roller, a paper outlet installed on the housing corresponding to the pickup roller, and a paper inlet installed on the housing facing the paper outlet.

Abstract: A paper feed cassette capable of obtaining a printed material without a margin portion easily while inhibiting the number of components from increase. This paper feed cassette includes a paper feed cassette body storing a paper and a cover member detachably mounted on the paper feed cassette body. The cover member is integrally formed with a press portion pressing a margin portion of the paper when the margin portion of the paper having been printed is cut off.

Abstract: A document feeder of an image forming apparatus includes a guide that arranges a width of a recording medium. A recording medium pickup module picks up the recording medium. A recording medium pickup module shifting unit shifts the recording medium pickup module in association with the movement of the guide. The recording medium pickup module includes a guide rack connected to the guide at one end. A pinion unit supports reciprocating motion of the guide rack. A pickup rack engaged with the pinion unit linearly reciprocates in parallel with the guide rack, and is connected to the recording medium pickup module.

Abstract: A printer is provided with a printing means for effecting printing on a sheet material, and a temporary stocking mechanism for temporarily stocking the sheet material on which printing is effected. The temporary stocking mechanism is provided with a temporary stocking member having a cylindrical take-up space in which the sheet material is taken up, for temporarily stocking the sheet material on which printing is effected by a printing means, a take-up roller provided in the take-up space, for taking up the sheet material, a driving means for rotationally driving the take-up roller, and a press-contact means for bringing a peripheral surface of the take-up roller into press contact with an inner peripheral surface of the temporary stocking member.