Abstract: An interposer for use in an external lead or land pattern semiconductor package. The interposer includes an interposer body which is molded from a dielectric material. The interposer body defines opposed top and bottom surfaces, an outer peripheral edge, and an inner peripheral edge. Embedded within the interposer body is a die pad which itself defines opposed top and bottom surfaces and a peripheral edge. The bottom surface of the die pad is exposed in and substantially flush with the bottom surface of the interposer body, with the inner peripheral edge of the interposer body and the top surface of the die pad collectively defining a cavity of the interposer. A plurality of electrically conductive interposer leads are embedded within the top surface of the interposer body and at least partially exposed therein. The interposer body forms a nonconductive barrier between each of the interposer leads and between the interposer leads and the die pad.

Abstract: A BGA package including a substrate, a plurality of solder balls on the semiconductor and an encapsulant, which leaves the solder balls partially exposed on the semiconductor chip, thereby reducing the size of the BGA package. In addition, an edge of the substrate may extend beyond an edge of the semiconductor chip. Stacked BGA packages and methods of manufacturing a BGA (or stacked BGA) package are also disclosed.

Abstract: A packaging structure (10) is provided having a hermetic sealed cavity for microelectronic applications. The packaging structure (10) comprises first and second packaging layers (12, 28) forming a cavity. Two liquid crystal polymer (LCP) layers (16, 22) are formed between and hermetically seal the first and second packaging layers (12, 28). First and second conductive strips (18, 20) are formed between the LCP layers (16, 22) and extend into the cavity. An electronic device (24) is positioned within the cavity and is coupled to the first and second conductive strips (18, 20).

Abstract: Systems and devices are disclosed utilizing a silicon-containing barrier layer. A semiconductor device is disclosed and includes a substrate, a gate oxide, a silicon-containing barrier layer and a gate electrode. The gate oxide is formed over the substrate. The silicon-containing barrier layer is formed over the gate oxide by causing silicon atoms of a precursor layer to react with a reactive agent. The gate electrode is formed over the silicon-containing barrier layer.

Abstract: A semiconductor device is disclosed for preventing contamination on its bonding pads during mounting an electronic component, such as surface mount device (SMD). The semiconductor device includes a semiconductor substrate, a plurality of jointing material and at least an electronic component. A plurality of first bonding pads for wire-bonding and a plurality of second bonding pads for mounting the electronic component are formed on the active surface of the substrate. The substrate includes at least a dam is formed on the active surface to separate the first bonding pads from the second bonding pads. Preferably, the dam surrounds the second bonding pads. The jointing material is disposed on the second bonding pads for bonding the electronic component. Using the dam, there is no flux or tin-lead solder flowing onto the first bonding pads during reflowing the jointing material. In an embodiment, the electronic component can be mounted on the substrate in a wafer level.

Abstract: A thin film transistor (TFT) substrate includes a glass substrate, a thin film transistor, an electrode pad, and a conductive bump. The TFT and the electrode pad are formed on the glass substrate, and the electrode pad is used for electrically connecting with the thin film transistor. The conductive bump includes several insulating bumps and a conductive layer. The insulating bumps are formed on the electrode pad dividedly, and the conductive layer covers the top surfaces of the insulating bumps, the inward surfaces of the insulating bumps, and the electrode pad between the insulating bumps for electrically connecting with the electrode pad. The outward side surfaces of the insulating bumps are exposed out of the conductive layer.

Abstract: A semiconductor component comprises a substrate that includes wiring on a first surface. A chip is mounted on a second surface of the substrate by a die attach, the second surface opposite the first surface. A bond channel in the center of the substrate allows for electrical connection of contact pads on the wiring with bond pads arranged in a center row on the chip by wire loops. A housing made of a mold compound surrounds a backside of the chip and parts of the substrate adjacent to the wiring. The semiconductor component further comprises a rigid prepreg layer covering, as well as the wiring of the substrate and the prepreg layer being provided with openings. Each opening is arranged in such a manner that the contact pads are accessible, and solder balls are mounted on each of the contact pads through the openings.

Abstract: A semiconductor light emitting apparatus includes a non-conductive sub mount; a metal layer provided on the sub mount; a solder material member provided on the metal layer; and a semiconductor light emitting device die-bonded to the metal layer by the solder material member. A surface of the metal layer includes a solder material attachment area having the solder material member attached thereto, and a metal layer exposed area where the surface of the metal layer is exposed. The solder material attachment area is electrically connected to the metal layer exposed area. The solder material attachment area is larger than a die-bond area of the semiconductor light emitting device. The metal layer exposed area has a metal layer removed area therein where the sub mount is exposed.

Abstract: In a display apparatus, a display panel receives a driving signal from a driving chip through a pad and displays an image in response to the driving signal. The driving chip includes a terminal outputting the driving signal. The driving chip is mounted on the display panel using the anisotropic conductive film and electrically connected to the display panel. A lubricant layer is formed on a surface of the anisotropic conductive film to prevent an electrical defect in the connection between the driving chip and the display panel. Thus, the display apparatus may have improved yield.

Abstract: A circuit layout structure for a chip is provided. The chip has a bonding pad area, a nearby device area, and a substrate. The circuit layout structure essentially comprises a plurality of circuit layers, a plurality of dielectric layers and a plurality of vias. The circuit layers are sequentially stacked over the substrate. Each dielectric layer is sandwiched between a pair of adjacent circuit layers. The vias pass through the dielectric layers and electrically connect various circuit layers. The farthest circuit layer away from the substrate has pluralities of bonding pads within the bonding pad area. The bonding pads near the device area overstrides at least one non-signed circuit layer through the furthest circuit layer away from the substrate and electrically connects to a circuit layer nearer the substrate with vias. The circuit layout structure can avoid a direct conflict of signals between the power/ground circuits and the signal circuits.

Abstract: The liquid discharge head has a three-dimensional structure which defines a space including a pressure chamber filled with liquid and a flow channel for supplying the liquid to the pressure chamber, the three-dimensional structure being formed by depositing a composition material on a substrate according to a deposition method, and a drive element which causes discharge of the liquid from the pressure chamber through a nozzle.

Abstract: A semiconductor device having good TFT characteristics is realized. By using a high purity target as a target, using a single gas, argon (Ar), as a sputtering gas, setting the substrate temperature equal to or less than 300° C., and setting the sputtering gas pressure from 1.0 Pa to 3.0 Pa, the film stress of a film is made from ?1×1010 dyn/cm2 to 1×10 dyn/cm2. By thus using a conducting film in which the amount of sodium contained within the film is equal to or less than 0.3 ppm, preferably equal to or less than 0.1 ppm, and having a low electrical resistivity (equal to or less than 40 ??·cm), as a gate wiring material and a material for other wirings of a TFT, the operating performance and the reliability of a semiconductor device provided with the TFT can be increased.

Abstract: In a method of manufacturing a semiconductor device having a first wiring extending in a first direction and a second wiring connected to the first wiring through a connection and extending in a second direction orthogonal to the first direction, the second wiring having a surplus portion projecting from the connection in a direction opposite to the second direction, the first and second wirings are arranged such that a center of the connection is offset in the second direction from a center of the first wiring, and a projecting portion of the first wiring is disposed under the connection.

Abstract: The present invention provides an apparatus for vertically interconnecting semiconductor die, integrated circuit die, or multiple die segments. Metal rerouting interconnects which extend to one or more sides of the die or segment can be optionally added to the die or multi die segment to provide edge bonding pads upon the surface of the die for external electrical connection points. After the metal rerouting interconnect has been added to the die on the wafer, the wafer is optionally thinned and each die or multiple die segment is singulated from the wafer by cutting or other appropriate singulation method. After the die or multiple die segments are singulated or cut from the wafer, insulation is applied to all surfaces of the die or multiple die segments, openings are made in the insulation above the desired electrical connection pads, and the die or multiple die segments are placed on top of one another to form a stack.

Abstract: Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.

Abstract: A semiconductor chip assembly includes a semiconductor chip that includes a conductive pad, a conductive trace that includes a pillar and a routing line, a solder joint and a ground plane. The pillar extends into an opening in the ground plane, the solder joint contacts and electrically connects the pillar and the ground plane, and the ground plane is electrically connected to the pad.

Abstract: An electronic assembly includes a substrate and at least one surface mounted electronic component. The substrate includes a first side and a second side opposite the first side. The first side of the substrate includes a plurality of conductive traces formed thereon. The plurality of conductive traces includes a first conductive trace and a second conductive trace. The electronic component is electrically coupled between the first and second conductive traces. A component body of the electronic component is subject to interaction with a flux, which is utilized during electrical coupling of the electronic component to the first and second conductive traces, to form a current leakage path. The substrate is configured to prevent the formation of the current leakage path.

Abstract: A structure and a method of forming the structure. The structure including: an integrated circuit chip having a set of wiring levels from a first wiring level to a last wiring level, each wiring level including one or more damascene, dual-damascene wires or damascene vias embedded in corresponding interlevel dielectric levels, a top surface of a last damascene or dual-damascene wire of the last wiring level substantially coplanar with a top surface of a corresponding last interlevel dielectric level; a capping layer in direct physical and electrical contact with a top surface of the last damascene or dual-damascene wire, the last damascene or dual-damascene wire comprising copper; a dielectric passivation layer formed on a top surface of the last interlevel dielectric level; and an aluminum pad in direct physical and electrical contact with the capping layer, a top surface of the aluminum pad not covered by the dielectric passivation layer.

Abstract: A configuration and method for contacting a circuit is described. A carrier is disposed adjacent a circuit, and a setting element at which an electrical connection formed of a conductive material is disposed, so that the electrical connection connects the circuit to the carrier in a bonding process. In this manner an efficient and cost effective method for connecting the circuit to carrier is performed.

Abstract: A device and method for layout and fabrication of power supply bus lines in an integrated circuit such as a memory circuit are described. In accordance with the present invention, power bus lines and bonding pads of the circuit are not necessarily formed in both edge regions and center regions of the device. The bonding pads are formed in the region according to the package being used, and the power bus lines are formed in the other region. This is accomplished by forming the bonding pads over landing pads. Landing pads are formed in both the center region and the edge region under the top surface of the device. If the device is to be packaged in an edge pad configuration, the bonding pads are formed over the landing pads in the edge region, and power supply bus lines can be formed over the landing pads in the center region.

Abstract: A control pad is split into two sections for output one of three signals selected from the group consisted of 00, 01, and 11 on an integrated circuit. Each section is internally connected to different voltage sources, say Vdd which represents logical “1”, or Vss which represents logical “0”, so that a default output is 1,0. When the split control pad is bonded with outside Vdd or Vss, both sections output “1,1” or “0,0” respectively. One of three possible logic word combinations can be selected to use for an IC.

Abstract: To easily determine an orientation of a semiconductor device, a semiconductor device includes a substrate including electrode electrically connected to an integrated circuit, an external terminal electrically connected to the electrode, and a light transmissive insulation layer provided on the external terminal side of the substrate, and a mark provided on the substrate and covered by the insulation layer and recognizable through the insulation layer.

Abstract: An electrical power generating apparatus (20) may include a housing (22), an electrical generator (24) within the housing, and a step-up transformer (30) within the housing and connected to the electrical generator. A turbine (26) may be provided exterior the housing (22) to drive the electrical generator (24). A barrier wall (38) may be provided within the housing and (22) between the electrical generator (24) and the step-up transformer (30), and a fire extinguishing system (40) may be installed within the housing (22). The step-up transformer (30) may be connected to the electrical generator (24) without use of an isolated phase bus.

Abstract: A generator having electronic circuit breakers as circuit breakers, whereby circuits comprising thyristors, IGBT elements and/or GTO thyristors are used, and whereby the circuit breakers are integrated into the generator, preferably in that the circuit breakers are distributed on parallel winding branches of the stator. Such power electronics can also be used for switching generators having a power above 50 MV with very short switching times of a few milliseconds.

Abstract: The present invention is a mobile-energy generating system capable of providing redundant direct current power. It comprises a reciprocating engine and generator having dual fuel capability, a fuel cell, commercial electrical power hookups, and capacitors used for bridging purposes. Back-up fuel for the engine and fuel for the fuel cells are stored in propane and hydrogen storage tanks, respectively.

Abstract: There is disclosed a system comprising a compact, AC operated auxiliary heating and air conditioning unit operable in the cabin of a transport vehicle and powered by the an auxiliary power unit (“APU”). The system includes control means coupled to the auxiliary heating and air conditioning unit and the APU, and harness means for coupling the auxiliary heating and air conditioning unit, the APU, and the control means together.

Abstract: An energy generating system for a telecommunications facility includes a hydrogen fuel supply system. The hydrogen fuel supply system includes a source of liquid hydrogen which uses a high pressure expansion tank along with additional storage tanks. The system also incorporates first and second stage heat exchangers. The first stage exchanger is used to benefit from the endothermic reaction created when liquid hydrogen transforms into vapor. The cooling provided from this state change is transferred into a second medium which is delivered into a second stage heat transfer device and then used for air conditioning purposes. The system also includes a hydrogen generator which may be used to create AC power by combusting vaporous hydrogen.

Abstract: The system comprises a main combined generating module which can be supplied with a flow of a fuel and which can generate electrical energy and thermal energy in the form of a flow of at least a first hot fluid, preferably water. The main module has an electrical output terminal or node which can be connected directly to electrical user appliances and which can also be connected in parallel with an external electrical generating and distribution network by means of a controlled switching device.

Abstract: An inverter controlled generator set including: a power supply unit that uses a generator driven by an engine as a power supply to output a DC voltage; an inverter device that converts the output voltage of the power supply unit into an AC voltage; and a rotational speed control unit that controls a rotational speed of the engine so as to be kept at a target rotational speed suitable for a load applied to the inverter device, wherein the rotational speed control unit is comprised so that a settling time when the rotational speed of the engine is caused to converge to the target rotational speed in a state where the load is above a set value is longer than a settling time when the rotational speed is caused to converge to the target rotational speed in a state where the load is below the set value, in order to minimize an operation sound of the engine when the load is intermittently driven.

Abstract: An electric network for generation and transmission of electric power, including a power generating part, a point of common connection for the power generating part, a transmission link, a load network, and a reactive power compensator. The transmission link is coupled between the point of common connection and a grid connection point at the load network. The reactive power compensator is coupled to transmission link. The power generating part includes at least one wind turbine with an electric generator of induction type, coupled to the point of common connection. The reactive power compensator includes a capacitor bank and in parallel coupling to the capacitor bank a controllable inductor having a magnetic core, a main winding for alternating current, and a DC-control winding for direct current. The DC-control winding for control of the magnetic flux is set up by the main winding via orthogonal magnetization of the core.

Abstract: An engine control system for controlling engine operation in high-output (HO) and fuel-economy (FE) modes in a gasoline direct injection (GDI) engine includes an alternator that is driven by the engine and that is regulated by a load control signal. An alternator load control module generates the load control signal based on an engine torque to regulate a load of the alternator on the engine to maintain the engine torque below a threshold level and maintain engine operation in the FE mode.

Abstract: This invention teaches an apparatus, method, means, and computer readable media to address the problem of the inconsistent, unreliable nature of wind, and in particular low-wind speeds, through utilizing a blower and/or startup assist to aid in turning an electricity generating electrical generator during periods of low-wind speed. This generator provides electrical power for an electrolyzer used to generate hydrogen gas from water. Some embodiments include wind speed and direction sensors and control programming and/or circuitry that tracks trends in direction and speed, and anticipate the need to move the direction of the wind-collecting funnel to best take wind into the funnel, and to provide a start-up assist to the wind-powered turbine at a wind speed that is lower than could start rotation of the turbine without assist, or to maintain rotation when the wind temporarily slows below the speed needed to maintain rotation.

Abstract: Methods for maintaining a constant electrical output frequency in a turbogenerator with increased electrical loads are provided. The methods comprise biasing adjustable guide vanes of a compressor and/or a compressor bleed valve in response to the increased electrical load. A dual schedule system for carrying out the methods of the present invention is also provided.

Abstract: A long cylinder shaped beam is submerged in the ocean and suspended horizontally by multiple floats for converting ocean wave energy. The long length (at least the distance of the crest of two waves) and heavy weight of the beam, give the floats something stable to pull against. The weight of the beam pulling at the floats is transferred back and forth, as the ocean swells move over the beam, which activate machine components that may be installed in the beam, the floats or with rods connecting the floats to the beam. An individual float will not lift the beam except when the tide raises all the floats. The floats will pull and release the tension of the weight of the beam at randomly different times. The shape of the beam is straight. The ocean surface is continuously curving up and down and the beam will not bend to the shape of the ocean surface, but the floats will mimic the undulating or curvy shape of the ocean surface, and that motion actives the machine.

Abstract: A wind energy generator has a generator having a shaft extending therefrom, a plurality of blades interconnected to the shaft so as to be rotatable by the action of wind energy, and an elongate chamber cooperative with the shaft such that the chamber rotates relative to a rotation of the shaft. The elongate chamber has a coil extending therearound. A magnet is positioned within chamber such that a movement of the magnet interacts with an electrical field of the coil so as to produce electrical energy therefrom. Separate elongate chambers are associated with each of the blades of wind energy generator.

Abstract: Apparatus for securing a motor vehicle against theft uses a vehicle control device connected by a signaling link to a first control node of a vehicle module essential to mobilization of the vehicle, the essential module further having a power node connected to a power supply source. The apparatus comprises: an enable/disable control for conditionally disabling signaling along the signaling link, a user interface code input device communicating with the enable/disable control via a secure command link, and an armored encapsulation encapsulating the disable control and the control node and physically configured to render inoperable any of the disable control, the signaling link and the control node upon being tampered with.

Abstract: An electrical system comprised of at least two control modules as well as at least one power supply module. The present invention improves functional reliability of electrical systems by configuring a power supply module as a smart device and connecting it to at least one of the control modules for the purpose of data exchange and, in case of a malfunction, transforming the control module(s) to one of a stand-alone operating mode and a cut-off state.

Abstract: An active filter (4) for compensation of variations in an apparatus' (3) current consumption from a power grid (1) as a cause of variations in the apparatus electrical load, through active frequency filtering and dynamic compensation of reactive energy/current. For each of the power grid's phases (a, b, c) the active filter includes a transistor bridge (Ta, Tb, Tc) connected between each phase and a DC-link (7). The active filter includes a filter circuit of LCL-type, arranged to reduce disturbances on the power grid caused by the active filter itself. The active filter further includes a control device (9) for calculating, with a given working frequency (f), points in time at which the transistor bridges are set to reverse the current direction through the DC-link, and the filter circuit is preferably adjusted to that working frequency.

Abstract: System and method for re-routing internal power for reducing voltage requirements of a submarine transmission system. A power supply supplies power to a bridge rectifier circuit (10) the latter biasing a plurality of Zener diodes (11; 12; 13; 14; 15; 16) which are connected in parallel arrangement with respective optical amplifiers (21; 22; 23; 24; 25; 26). The bridge rectifier circuit (10) is arranged such that a first predetermined number of Zener diodes (23; 24; 25; 26) are biased in forward bias direction thus operating as normal diodes with a low voltage drop, whereas a second predetermined number of Zener diodes (21; 22) are biased in reverse or powering direction thus powering respective optical amplifiers.

Abstract: A lithographic projection apparatus includes a conduit shuttle used to at least partly support conduits which provide utilities to moveable objects. The conduit shuttle has an actuator which is positionable with six degrees of freedom. The actuator comprises a 2-phase or 3-phase motor with one degree of freedom and a Lorentz actuator with five degrees of freedom.

Abstract: A tactile panel includes a vibration panel, a yoke provided to face the vibration panel, drive coils secured on a circumference of the vibration panel, and a set of permanent magnets arranged between the vibration panel and the yoke. The vibration panel is held by panel holding members, into which both sides of the vibration panel are inserted in a direction substantially perpendicular to a vibration direction of the vibration panel.

Abstract: A vibrator of the present invention comprises a coreless coil (2), a driver (4) including a magnet (4a) inserted in the coreless coil (2), a yoke (4b) for pinching the coreless coil (2) and facing the magnet (4a), and a top plate (4c), suspensions (6 and 8) for carrying resiliently the driver (4). The driver (4) is reciprocated in an axial direction of the coreless coil (2) by applying an alternate current to the coreless coil (2) to generate vibrations. The vibrator can be miniaturized without increasing a cost and has a good rising of vibrations.

Abstract: A journal of a crankshaft is rotatably supported by a journal-supporting portion of a cylinder block and a bearing cap. An arcuate oil guide groove is defined in a side face of the bearing cap, and coils which are portions of a stator of a generator or motor are fitted into an oil guide groove. Oil flowing down from an oil return passage provided in the cylinder block and oil flowing down from a blow-by gas passage, flow downwards from an upper end of the oil guide groove and return through an opening to an oil pan. In this process, the oil is brought into contact with the coils to cool the stator. Therefore, even if the stator is located above the oil stored in the oil pan, the stator having a raised temperature can be cooled efficiently, to thereby prevent degradation of the performance of the generator or motor.

Abstract: A three-phase brushless motor in one mode of the present invention is comprised of a rotation axis, a rotor yoke rotating around said rotation axis, a drive magnet formed into a ring shape and attached on said rotor yoke, said drive magnet having a plurality of magnetized poles at an equal magnetization pitch angle Pm, a plurality of drive coils disposed so that the center of each said drive coil is at angular intervals of a predetermined arrangement angle Pc, the angle Pc being 4/3 times said magnetization pitch angle Pm, a rotation detecting magnet attached on said rotor yoke, and a magnetic sensor attached opposing said rotation detecting magnet so as to detect a magnetic flux of said rotation detecting magnet, wherein said magnet sensor is disposed at a position in which a magnetic flux from said drive magnet and a magnetic flux from said drive coils are canceled with each other.

Abstract: A wheel hub drive for a running wheel (10) is described. The drive having a transmission (7), a motor (8) and a brake (11), such that the enveloping circle (9) of the wheel hub drive is determined by the running wheel and the transmission (7), motor (8) and brake are located within a circle whose radius is determined by the running wheel (10).

Abstract: The invention provides an electric motor assembly having an electric motor with a first end and a second end spaced from the first end. The electric motor also includes a motor shaft extending along a first axis between a first tip cantilevered from the second end and a second tip spaced from the first tip along the first axis. The electric motor assembly also includes a worm gear disposed on the motor shaft between the second end and the first tip for rotation with the motor shaft about the first axis. The electric motor assembly also includes a housing having an internal surface with a first portion correspondingly shaped with respect to the first end to locate the electric motor in the housing. The housing also includes a second portion disposed along the first axis spaced from the first tip. The electric motor assembly also includes a first thrust bearing disposed between the first tip and the second portion.

Abstract: A permanent magnet electric machine includes a stator with salient stator poles. A rotor includes two or more axial rotor sections that are rotationally offset by an offset angle equal to the cogging angle divided by the number of axial rotor sections. The axial rotor sections include rotor poles with permanent magnets. In one embodiment, the permanent magnet electric machine has a 12/10 slot/pole combination. The permanent magnets have a magnet dimension angle between 31 and 35 degrees. An air gap ratio of the electric machine is between 1.35 and 2.5. A slot opening ratio of the electric machine is less than or equal to one. In another embodiment, the permanent magnet electric machine has an 18/12 slot/pole combination. The permanent magnets have a magnet dimension angle that is between 25 and 28 degrees. An air gap ratio of the electric machine is between 1.35 and 2.5. A slot opening ratio of the electric machine is less than or equal to one.

Abstract: A stator core for an electrical machine and a method for producing the same. Said stator core comprising a core back and a plurality of teeth arranged circumferentially at the core back and extending radially there from. The core back being made of at least one sheet of electrically insulated soft magnetic material arranged as a spiral. Said method comprising the acts of winding a sheet of electrically insulated soft magnetic material into a spiral in order to form a core back and attaching a plurality of teeth to the core back so that the teeth are circumferentially separated and extends radially from the core back.

Abstract: Disclosed is an axial fan motor for air-cooling a heat sink of a heating element and thermally connected to the heat sink. The casing of the axial fan motor is formed of a plurality of laminated metal plates. The plurality of metal plates include a single first metal plate and a plurality of second metal plates. The single first metal plate, which is an outermost layer located at the air exhaust side of the fan, has a peripheral portion, a central portion, and a plurality of arm portions for connecting the peripheral portion and the central portion. A bearing holder for supporting a rotary shaft of the fan is attached to the central portion.

Abstract: The invention relates to a microbeam oscillator. Tuning of the oscillator is carried out by addition or subtraction of material to an oscillator member in order to change the mass of the oscillator member.