Abstract: A semiconductor device includes: a semiconductor substrate; a base member; a tin-based solder layer; a first metal layer; and a first alloy layer. The semiconductor substrate is bonded to the base member through the first metal layer, the first alloy layer and the tin-based solder layer in this order. The first alloy layer is made of a first metal in the first metal layer and tin in the tin-based solder layer. The first metal layer is made of at least one of material selected from the group consisting of titanium, aluminum, iron, molybdenum, chromium, vanadium and iron-nickel-chromium alloy.

Abstract: A through wiring board provided with through wiring extending through the through hole of the board. The through wiring board comprises a through hole made through the board, through extension wiring provided in the through hole and extending on one side of the through wiring board up to a position at a predetermined distance from the through hole, and a conductive bump formed on the through extension wiring except the through hole position.

Abstract: A contact via scheme with staggered contact vias to, interalia, increase current density of a resistor by mitigating electromigration and reducing the resistive heating of each contact via is disclosed. The contact via scheme increases the current density of a thin film resistor by increasing the number of current carrying contact vias and by arranging the contact vias in staggered arrangement, which redistributes the current at the ends of the resistor. Hence, the contact via scheme decreases the current density per contact via and enables a higher maximum current density for the resistor. A method and a semiconductor device are also disclosed.

Abstract: Disclosed herein is a semiconductor device and method of manufacturing the same. A step between a memory cell formed in a cell region and a transistor formed in a peripheral circuit region is minimized, and the height of a gate in the memory cell is minimized. Accordingly, subsequent processes are facilitated and the electrical property of the device is thus improved.

Abstract: A stacked semiconductor chip assembly utilizing different bonding materials is disclosed. The assembly preferably includes a plurality of units being disposed one above the other, with each unit including at least a semiconductor chip and an interposer. Conductive joining elements are preferably disposed between adjacent units and between one unit and a circuit panel. At least some of the conductive joining elements have lower melting temperatures, than other units so as to allow mounting or rework by melting the lower-melting conductive joining elements while leaving the other conductive joining elements solid.

Abstract: Heating elements different in heat generating timing are laminated in a stacked state, and the heating element close to a wiring substrate is allowed to function as a heat diffusion plate for another heating element.

Abstract: A power semiconductor component (2) has a chip stack, which contains a first chip (10), a second chip (6) and a third chip (8), where at least the second chip (6) and the third chip (8) are the same height. The power semiconductor component (2) also has a package in which the first chip (10), the second chip (6) and the third chip (8) are placed. The second chip (6) and the third chip (8) are mounted side by side on a lead (4), and the first chip (10) rests both on the second chip (6) and on the third chip (8).

Abstract: A wiring board of the present invention includes a dummy wiring in a semiconductor-chip mount area on which a semiconductor chip is to be mounted. The dummy wiring is arranged in a manner such that all wiring-lines included in the dummy wiring each have a free end within the semiconductor-chip mount area. This prevents a defect due to vaporization and expansion of moisture inside a semiconductor apparatus, with a simple structure and without raising costs.

Abstract: A metal structure for a contact pad of a wafer or substrate (101), which have copper interconnecting traces (102) surrounded by a barrier metal layer (103). The wafer or substrate is protected by an insulating overcoat (104). In the structure, the barrier metal layer is selectively exposed by a window (110) in the insulating overcoat. A layer of copper (105), adherent to the barrier metal, conformally covers the exposed barrier metal. Preferably, the copper layer is deposited by sputtering using a shadow mask. A layer of nickel (106) is adherent to the copper layer and a layer of noble metal (106) is adherent to the nickel layer. The noble metal may be palladium, or gold, or a palladium layer with an outermost gold layer. Preferably, the nickel and noble metal layers are deposited by electroless plating.

Abstract: An LTCC module includes an LTCC substrate and a pad part formed on an undersurface of the LTCC substrate for mounting the LTCC substrate to an external substrate. The pad part includes a metal pad layer formed on an undersurface of the LTCC substrate and a solder layer formed on an undersurface of the metal pad layer.

Abstract: A highly reliable circuit device is provided at low cost. The circuit device includes a semiconductor element electrically connected to a wiring layer (copper plate and plating film) and passive parts sealed by a molded resin layer. The wiring layer has a predetermined pattern formed by a conductive member. The molded resin layer has projections protruding from gaps in the adjacent wiring layer toward an underside of the wiring layer. Thereby, the drop of yield is prevented and the highly reliable circuit device is provided at low cost.

Abstract: A nano-structured material comprising a depression/projection-patterned substrate and a sol-gel film having at least one group selected from the group consisting of an alkyl group, a phenyl group, an epoxy group and an amino group in the depressions of the patterned substrate, wherein polystyrene particles having a particle size of from 10 to 200 nm, or holes having a hole size of from 10 to 200 nm that may be filled with nanoparticles are regularly aligned in the depressions of the patterned substrate.

Abstract: An alignment mark is formed on an underlying layer and disposed on a region in which a semiconductor device is not formed. The alignment mark includes a plurality of strip-shaped patterns detectable by an optical imaging device. The patterns have long axes and short axes. The patterns are arranged in a matrix of rows and columns in such a manner that the long axes are substantially perpendicular to the direction of the alignment adjustment.

Abstract: A safety device for a humidifier includes a housing, a water tank, a nozzle, a vapor producer and a water feeder. The water tank is positioned in the housing, and the nozzle is positioned above the water tank. The housing has a water intake connected with the water feeder. A sphere holder for holding a sphere is assembled between the water tank and the nozzle and the sphere can exactly clog the nozzle. When the water tank is collapsed, the sphere will disengage from the sphere holder to clog the nozzle. A hollow space is formed between the water feeder and the water tank and provided with a sluice gate, and a stop plate is provided for controlling water to pass through the sluice gate and for sealing up the sluice gate, able to prevent the water in the water tank from overflowing and flowing reversely.

Abstract: A wastewater treatment system, comprising a tank and an elongate draft tube. The tank comprises a bottom and at least one partition wall extending short of a tank curved turning wall to form at least a pair of channels for movement of a volume of a liquid. The elongate draft tube is at least partially submerged beneath the liquid and is rotated about its longitudinal axis for orbitally moving the liquid through the at least a pair of channels of the tank in a fixed direction. A process for treating wastewater is also provided.

Abstract: A slat fill apparatus includes a hanger and at least one slat. The hanger includes a first plurality of support members oriented in a first direction; a second plurality of support members oriented in a second direction; and at least one slat retainer projecting from, and integrally formed with, one of the support members. The first and second pluralities of support members define at least one slat receiving channel into which the at least one slat retainer projects. The at least one slat is installed in a corresponding one of the slat receiving channels of the hanger.

Abstract: A method for manufacturing the following device is provided: an electro-optical device which includes a pair of substrates holding a display material having optical properties varied by electric stimulation and which has a curved shape. The method includes covering the front and rear faces of a display with a pair of protective films and then bonding end portions of the protective films to each other with an adhesive containing a thermoplastic resin, the end portions being located outside the display; heating the bonded end portions to melt the adhesive and then bending the display depending on applications; and solidifying the melted adhesive by cooling to allow the protective films to hold the display bent.

Abstract: The invention provides methods of manufacturing toric lenses, apparatuses useful in the method of the invention, and lenses produced according to the method in which method the position of one mold half in relation to its complementary mold half is more precisely controlled so that tilting and rotation of the mold halves in relation to each other is substantially eliminated.

Abstract: A mold for molding a disk and a method of molding a disk substrate which can enhance flatness and thus quality of a molded product are provided. The mold for molding a disk includes a first mirror-surface disk; a stamper (29) attached to the first mirror-surface disk; a second mirror-surface disk disposed in opposition to the first mirror-surface disk and forming a cavity therebetween at the time of mold clamping; and an adjustment member having a surface allowing the stamper (29) to slide thereon, formed near an outer circumference of the first mirror-surface disk, extending radially outward, and projecting toward the cavity. Even when, during the entire disk substrate being cooled, shrinkage of the disk substrate near the outer circumference thereof is small, whereas shrinkage of the remaining portion thereof is large, an increase in thickness of the disk substrate near the outer circumference thereof can be prevented.

Abstract: Defects within structures formed by deposition processes can be relatively expensive, particularly as previously non-destructive testing was performed only once the component had been formed. By in-situ continuous or intermittent sequential non-destructive testing, early notice of defects can be provided. Such early notice may allow rejection of the part-formed component, correction of the errors causing the defect, or through an auto-correction process adjustment of the deposition devices or otherwise to improve component quality. Generally, deposition processes provide for provision of a layer of material which is consolidated in order to form an object component through use of a consolidation device. By providing a non-destructive testing device which either continuously inspects the layers of consolidated component or sequentially inspects the object component, it is possible as indicated to provide an early identification of defect problems within a formed object component.

Abstract: In a molding method of a fiber filler reinforced resin molded article, in which a reinforcement fiber and a resin are plasticized and kneaded in a material supply cylinder including a screw with an anti counterflow portion, and the resin with the reinforcement fiber mixed therewith is injected into a cavity of a mold, the reinforcement fiber is mixed with the resin in the cylinder at a portion downstream of the anti counterflow portion of the screw, and a physical foaming agent is supplied into the cylinder at a portion downstream of the anti counterflow portion. Accordingly, there can be provided a molding method or apparatus of a fiber filler reinforced resin molded article that can improve properties by preventing the reinforcement fiber from being broken.

Abstract: A method of manufacturing a display device according to an exemplary embodiment of the present invention includes applying an organic material onto a substrate that is mounted on a supporting plate, contacting a surface of the mold on which a predetermined pattern is formed with the organic material, disposing the supporting plate an at angle, and pressing the mold while rotating the pressure roller. Therefore, the apparatus and method for manufacturing a display device according to the embodiment of the present invention have advantages that bubbles generated from the organic material are removed by using an inclined supporting plate and rotating the pressure roller in a direction opposite to the moving direction, thereby suppressing the formation of the bubbles.

Abstract: A method is provided for manufacturing a molded woody article. The method includes compression molding a base material containing wood fibers, polylactic acid fibers and an inorganic filler at a temperature not less than a melting point of said polylactic acid fibers, and maintaining said molded base material at a temperature close to a crystallization temperature of said polylactic acid fibers for a desired period of time, thereby crystallizing the polylactic acid fibers. In the molding step, the base material is entirely deformed and molded into a desired shape while the polylactic acid fibers are melted, and in the crystallizing step, the polylactic acid fibers are solidified, thereby producing the molded article. In the crystallizing step, polylactic acid crystallizes rapidly and reliably utilizing the inorganic filler as a crystal nucleating agent. Polylactic acid crystallizes from portions contacting the wood fibers.

Abstract: Apparatus producing superheated water and/or steam for weed (36) killing, etc. has diesel fired boiler (30), which, via pump (32), generates hot water at a pressure of 40-52 bar and temperature of 90-115° C. This passes down tube (12) and encounters the constriction provided by nozzle (14). Passing through nozzle (14) into depressurisation chamber (16), which is at atmospheric pressure, the water boils. When the super heated water exits ports (20) of distribution pipe (18) it encounters ambient temperature and is transformed into high temperature water vapour and/or water droplets. The apparatus controls or kill weeds (36) using a smaller volume of water and less energy.

Abstract: A method of manufacturing a semiconductor device sealed with silicone rubber, characterized by 1) placing an unsealed semiconductor device into a mold, 2) thereafter filling in spaces between the mold and the semiconductor device with a sealing silicone rubber composition, and 3) subjecting the composition to compression molding. By the utilization of this method, a sealed semiconductor device is free of voids, and a thickness of a sealing silicone rubber can be controlled.

Abstract: A mold equipped with a core having a plurality of columnar distal portions branched at a downstream side in the extrusion direction and arranged on a surface and a die having an aperture surrounding the distal portions as a whole with a distance with respect to the distal portions and used in the case where a softened flexible resin is injected from one end of a resin flow path formed between the core and the die and a pipe material having a plurality of liquid flow paths which are mutually independent formed by the flexible resin is extruded from the other end of the resin flow path, wherein the aperture of the die has a shape in which each part of a plurality of circles each having the same axis as a corresponding one of the distal portions and mutually having the same inner diameter are overlapped and mutually connected, and each of a diameter of a distal portion of the core is lager than or equal to a diameter of a distal portion adjacent to the outer side in the arrangement.

Abstract: Carbon nanotubes can be uniformly dispersed in a polymer and subsequently fabricated in macroscopic nanotube/polymer ribbons having nanotubes aligned in a primary direction. The technique is readily scalable and could be applied to the fabrication of larger-scale structural/functional materials and devices.

Abstract: A mold for imprint capable of forming a reduced seam or seamless pattern, on a surface of a substrate, having larger area than that of the mold includes a first pattern area comprising a plurality of first recesses; and a second pattern area, comprising a plurality of second recesses, for being used as an alignment mark. The first pattern area and the second pattern area have an equal height at their outermost surfaces. The first recesses and the second recesses have different depths. The first pattern area and the second pattern area have an equal cyclic interval.

Abstract: A method of fabricating a flexible mold for forming a flat display panel, comprising: forming a plurality of protrusions on a flexible film, forming plated patterns between the protrusions on the flexible film, the plated patterns having an inverted shape corresponding to partitions that define one or more sub-pixel regions in the panel, and removing the protrusions to form a flexible material.

Abstract: Method of producing an administering device for infusing or injecting a product, whereby in order to mould a housing shell (1) serving as a case for components of the administering device in a multi-component injection moulding process at least one pre-moulded, transparent insert part (22, 23) made from a first plastic material is inserted in an injection mould moulded to a shape matching the shape of the housing shell (1), a dimensionally stable, curable second plastic material is injected into the injection mould around the insert part (22, 23) to render it watertight and an opening left free in the second plastic material is closed to render it watertight by injecting on an elastomeric third plastic material.

Abstract: Tools for manufacturing composite parts and methods for using such tools are disclosed herein. A method in accordance with one aspect of the invention includes manufacturing a fiber-reinforced resin part from a plurality of fibers positioned on a tool having a female mold surface. The mold surface can include a first side region, a second side region, an interior region between the first and second side regions, and transition regions between the first and second side regions and the interior region. The method includes positioning a compaction tool over the mold surface. The compaction tool includes a first pressing device and a second pressing device carrying the first pressing device. The method further includes pressing a first portion of the fibers against the transition regions with the first pressing device without generally compacting the portions of the fibers outboard of the transition regions.

Abstract: A method of injection molding an orthopedic device comprising: injection molding a polymeric orthopedic device having a length along a longitudinal axis; and deliberately inducing, in the device, a material property change along the longitudinal axis by varying a molding parameter during the injection molding. The material property may be, for example, elastic modulus and/or density. The molding parameter varied during the injection molding may be a supply material pressure. The orthopedic device may be an elongated rod-shaped element, such as a spinal fixation rod, which may or may not have a substantially uniform cross-section, and may or may not have a metallic core. A corresponding apparatus is also described.

Abstract: Composite webs having one or more polymeric structures located on a substrate, methods of manufacturing the composite webs, and systems for manufacturing the composite webs are disclosed. The polymeric structures are formed using thermoplastic compositions deposited into one or more depressions on a forming tool. The forming tool is maintained at a temperature that is below the melt processing temperature of the thermoplastic composition.

Abstract: A method for filling polymer blanks into molds and an apparatus thereof. The method includes steps of picking a predetermined amount of blanks formed with predetermined shapes; locating the blanks to fixedly space the blanks from each other by predetermined distances corresponding to the distances between the mold cavities of the molds, in which the blanks are to be filled; and respectively filling the blanks into the mold cavities of the molds. The apparatus includes at least one mold unit having at least one closable mold cavity for receiving a predetermined amount of blanks; and a picking/feeding unit disposed on one side of the mold unit. The picking/feeding unit includes a blank-picking section for picking a predetermined amount of blanks and locating the blanks in predetermined positions. The picking/feeding unit further includes a blank-feeding section for driving the blank-picking section to move and feed the blanks picked by the blank-picking section into the mold cavity.

Abstract: Method for manufacturing an elongate stiffening element (12) and a rigid shell structure (10) integrated with at least one elongate stiffening element (12). The method includes the steps of providing a preformed, form-stable reinforcement member (16), which has a hat profile with two inwardly directed, opposing flange portions (20), covering the reinforcement member with a curable composite material to form an external hat profile having outwardly directed flanges (26), and integrating this assembly with either a curable or preformed shell structure (10) of composite material.

Abstract: An organic material decomposition and treatment method using a magnetic wave is disclosed, in which organic materials can be well decomposed without creating or producing harmful materials. The organic material decomposition and treatment method using a magnetic wave comprises a first step in which an organic material is inputted into the interior of a container body, and the container body is sealed; a second step in which the interior of the container body is dried; and a third step in which a magnetic wave is induced in the interior of the container body, whereby a thermal energy is generated while the organic material is decomposed by the magnetic waves, and the organic material is carbonized by the thermal energy.

Abstract: The objects of the present invention are to provide a durable magnetic field molding device for producing molded bodies for ferrite magnets, which needs a controlled amount of releasing agent, reduces production cost and improves productivity, and die and magnetic field molding method. The lower die 12B of the die 12 is coated, on the surface which defines the cavity 11, with the coating film 30 with a high hardness and a low friction coefficient, which improves resistance of the lower die 12B surface to wear by the solid component (fine powder) in the slurry, thereby greatly improving durability of the coating film 30 itself and reducing lubricant usage.

Abstract: A single-sided shuttle-type blow molding apparatus having an extruder for substantially continuously extruding a thermoplastic material in tubular form at a moldable temperature downwardly along a vertical axis. The apparatus includes a mold having a set of mold parts adapted to open and close relative to each other to define, when closed, a mold cavity. A shuttle having the mold mounted thereon is arranged to move along a closed path from a first position wherein the mold engages, when open, a finite length of the thermoplastic tube, to a second position away from the first position. The apparatus further includes a blow head adapted to blow the finite length of the thermoplastic tube to form the container as the mold moves from the first position to the second position of the closed path. The apparatus includes no more than one mold. A method is also described.

Abstract: A cooling tube assembly for operating on a malleable molded plastic part. The cooling tube assembly comprising a porous tube/insert having a profiled inner conditioning surface, and a vacuum structure configured to cooperate with the porous tube. In use, the vacuum develops a reduced pressure adjacent the inner conditioning surface to cause an outer surface of the malleable molded plastic part, locatable within the cooling tube assembly, to contact the inner conditioning surface of the porous insert so as to allow a substantial portion of the outer surface of the malleable part, upon cooling, to attain a profile substantially corresponding to the profile of the inner conditioning surface. The cooling tube assembly further including a suction channel therein that is configured to cooperate with a valve member for the control of a suction flow therethrough that assists in a transferring of the molded article into the cooling tube assembly.

Abstract: A method of making a solid electrolyte-YSZ product, where the method includes the step of providing a powdered mixture of zirconia, yttria and about 2%, by wt., or less of a metal oxide, where yttria-stabilized zirconia is not added to the mixture. The method also includes sintering the powdered mixture at about 1500° C. or less, for about 5 hours or less, to form a reaction sintered YSZ. Also, a method of making a fuel cell electrolyte that includes the step of forming a green body that includes zirconia, yttria and about 2%, by wt., or less of a metal oxide, where yttria-stabilized zirconia is not added to the green body. The method also includes shaping the green body into a form of the electrolyte, and sintering the green body at about 1500° C. or less to form a reaction sintered yttria-stabilized zirconia and metal oxide electrolyte.

Abstract: A vascular implant formed of a compressible foam material has a compressed configuration from which it is expansible into a configuration substantially conforming to the shape and size of a vascular site to be embolized. Preferably, the implant is formed of a hydrophilic, macroporous foam material, having an initial configuration of a scaled-down model of the vascular site, from which it is compressible into the compressed configuration. The implant is made by scanning the vascular site to create a digitized scan data set; using the scan data set to create a three-dimensional digitized virtual model of the vascular site; using the virtual model to create a scaled-down physical mold of the vascular site; and using the mold to create a vascular implant in the form of a scaled-down model of the vascular site. To embolize a vascular site, the implant is compressed and passed through a microcatheter, the distal end of which has been passed into a vascular site.

Abstract: An apparatus is provided for determination of at least one interface of a slag layer on top of a molten metal. The apparatus has a carrier tube and a measuring head arranged on one end of the carrier tube with a body fixed within the carrier tube and an end face facing away from the carrier tube. The apparatus further includes an oscillator arranged within the measuring head and an induction coil connected with the oscillator and arranged outside of the body and in front of its end face.

Abstract: A poured molten metal quantity control device includes a fixed plate brick having at least one pouring port, a collector nozzle brick, a slide plate brick sandwiched therebetween, an outer race mounted so as to be turned on the outer peripheral side of the fixed plate brick by an extendable unit, and a frame having the slide plate brick mounted thereon that is mounted on the outer race through a pivotal hinge so as to be capable or open and close operation, wherein the frame can be opened and closed by the pivotal hinge irrespectively of a turning means composed of the extendable unit as well as the outer race is turned by a crank mechanism using triangle points consisting of a support pivot P1, a center of turn P3, and a pivot P2, and the positions of the triangle points are defined such that the completely open/close positions of the pouring port are matched to the end point and the start point of the stroke of the extendable unit.

Abstract: An air spring assembly for a vehicle includes a spring seat adapted to be secured to vehicle structure of the vehicle. The spring seat has a post extending therefrom. The air spring assembly includes an inflatable air spring having a mounting cap for attachment to the spring seat. The mounting cap has a cavity extending therein to receive the post. The air spring assembly further includes a retaining member extending through the mounting cap and over the post to prevent the post from exiting the cavity to attach the mounting cap to the spring seat.

Abstract: The invention disclosed is a low-profile, multi-axis, highly passively damped, vibration isolation mount which when used in multiplicity provides a complete vibration load isolation mounting system. The device provides in unique fashion a very low profile interface in combination with independently determinable compliance in all directions of vibration loading. Substantial passive damping is afforded without sacrifice to strength and linearity of behavior through adaptation of a shear wall type constrained layer damping. The result is a highly passively damped vibration isolation device that provides a very low profile interface, wide ranging longitudinal and lateral compliance management, in a durable, reliable, lightweight, and compact form.

Abstract: A vibration-proofing apparatus is provided which is capable of reliably preventing the occurrence of looseness, abnormal noises and the like even if the outer casing member is unadhered. The vibration-proofing apparatus is composed of a mounting fixture 1, which is joined to either one of a vibration-generating portion and a vibration-receiving portion, an outer casing member 2 made of resin, which is joined to the other of the vibration-receiving portion and the vibration-generating portion, and a rubber resilient body 4, which is fixed between the mounting fixture 1 and an insert fixture 3. The insert fixture 3 is arranged along an inner peripheral face of the outer casing member 2, and the rubber resilient body 4 is attached to the outer casing member 2 via the insert fixture 3. This vibration-proofing apparatus is an apparatus in which a buffer material 5 is interposed between the outer casing member 2 and the insert fixture 3.

Abstract: A fluid filled vibration damping device including an elastic body connecting a first and second mounting member, a pressure-receiving chamber defined by the elastic body and an equilibrium chamber defined by a flexible rubber film. The second mounting member is press fitted into a tubular holder member having an annular holding portion integrally formed at its lower end projecting radially inwardly. A cover plate member having an outside diameter smaller than an inside diameter of the holder member is disposed within the holder member with an outer peripheral portion is fixedly clamped by the second mounting member and the annular holding portion. A sealing rubber is disposed for fluid-tightly closing a gap formed between the clamped portion so that an tightly closed air chamber defined by the cover plate member is formed on a back side of the flexible rubber film.

Abstract: In a compression coil spring device, suitable for use in a strut wheel suspension system, including a coil wire wound into a coil having an end turn, the end turn is adapted to be supported by a spring seat at one or a plurality of discrete points. This can be accomplished either by providing a plurality of projections on the coil wire along the length of the coil wire of the end turn, with the remainder of the coil wire being substantially free of projections, or by providing a plurality of projections for supporting the end turn at one or a plurality of discrete points of the spring seat. Thus, the spring demonstrates the same property with regard to the centroid of contact pressure or line of action of the spring force, and the spring constant, without regard to the spring load as long as the spring end is supported by the same discrete contact point or points.

Abstract: A one-piece elastomeric spring having four spaced end portions all joined to and extending from a common body portion. Two end portions are commonly disposed to each side of an axis of the spring such that each end portion can independently deflect when a force is applied thereto. The one-piece spring is formed from a preform formed from an elastomer which is normally free of spring-like characteristics. The elastomer from which the preform is created has a molecular structure along with a ratio of plastic strain to elastic strain greater than 1.5 to 1. The molecular structure of the preform is oriented in at least one direction so as to allow a predetermined spring rate to be imparted to the preform whereby transmuting the preform into an elastomeric spring.

Abstract: A clamping tool, particularly a clamping clip, is provided with first and second clamping jaw carriers which are associated with a track and which respectively bear a clamping jaw. At least the first clamping jaw carrier can be displaced along the track in one direction by a stepped shifting gear mechanism and is prevented from being displaced in the opposite direction by a detachable return locking element and can be displaced along the track.