Abstract: The present invention stacks chip scale-packaged integrated circuits (CSPs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion addressing system and method and preferably with the CSP stacked modules provided herein. In a preferred embodiment in accordance with the invention, a form standard is disposed between the flex circuitry and the IC package over which a portion of the flex circuitry is laid. The form standard provides a physical form that allows many of the varying package sizes found in the broad family of CSP packages to be used to advantage while employing a standard connective flex circuitry design. In a preferred embodiment, the form standard will be devised of heat transference material such as copper to improve thermal performance.

Abstract: To provide a semiconductor device that enables high integration degree, and a manufacturing method therefor. A multi-chip module according to an embodiment of the present invention includes: a first semiconductor chip having a first bonding pad; a second semiconductor chip having a second bonding pad thinner than the first bonding pad; and a bonding wire connected with each of the first bonding pad and the second bonding pad, the first bonding pad being connected with a first bond side end portion of the bonding wire and the second bonding pad being connected with a second bond side end portion of the bonding wire.

Abstract: The packaging device includes a substrate, a mounting pad, a connecting pad and an interconnecting element. The substrate is substantially planar and has opposed major surfaces. The mounting pad is conductive and is located on one of the major surfaces. The connecting pad is conductive and is located on the other of the major surfaces. The conductive interconnecting element extends through the substrate and electrically interconnects the mounting pad and the connecting pad. The packaging device has a volume that is only a few times that of the semiconductor die and can be fabricated from materials that can withstand high-temperature die attach processes. The packaging device can be configured as the only packaging device used in the semiconductor device or as a submount for a semiconductor die that requires a high-temperature die attach process.

Abstract: A semiconductor package uses various forms of conductive traces that connect to die bond pads via bond wires. In one form, adjacent bond wires are intentionally crossed around midpoints thereof to reduce self-inductance of the conductors and to minimize self-inductance. In another form, bond wires associated with bond pads having intervening, unrelated bond pads are crossed. Additionally, conductive traces are divided into separate sections and electrically connected by crossed jumper wires or bond wires. Any number of separate sections may be formed for each trace, but an even number is preferable. In another form, one trace is continuous and divides a second trace into two or more sections. The multiple sections are connected by an overlying bond wire. Either insulated or non-insulated bond wire may be used.

Abstract: In a semiconductor apparatus in which a main current of a semiconductor device flows through a wiring pattern formed on an insulation circuit board, the rise in temperature of the wiring pattern is suppressed and the increase in cost of parts can be minimized. On the insulation circuit board, a copper pattern is formed. A heat spreader is soldered to the copper pattern, and the heat spreader is loaded with a semiconductor chip. An external electrode and the heat spreader are arranged to shorten the distance between the side of the external electrode and the side of the heat spreader.

Abstract: A test carrier for a semiconductor component includes a base for retaining the component, and an interconnect on the base having contacts configured to electrically engage component contacts on the component. The base includes conductors in electrical communication with the contacts on the interconnect, which are defined by grooves in a conductive layer. In addition, the conductors include first portions of the conductive layer configured for electrical transmission, which are separated from one another by second portions of the conductive layer configured for no electrical transmission. The test carrier is configured for mounting to a burn in board in electrical communication with a test circuitry configured to apply test signals through the contacts on the interconnect to the component.

Abstract: A thermal transfer material is described herein that includes: a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material, and at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component. Methods of forming layered thermal interface materials and thermal transfer materials include: a) providing a heat spreader component, wherein the heat spreader component comprises a top surface, a bottom surface and at least one heat spreader material; b) providing at least one solder material, wherein the solder material is directly deposited onto the bottom surface of the heat spreader component; and c) depositing the at least one solder material onto the bottom surface of the heat spreader component.

Abstract: A heat sink that absorbs heat generated from at least one semiconductor device and dissipates the heat absorbed includes: a first surface adapted to match and contact at least one semiconductor device; a second surface having a fin structure adapted to dissipate heat from the heat sink into the air, the second surface arranged opposite to the first surface; combining portions having combining apertures each adapted to receive a predetermined combining element to affix the at least one semiconductor device to the heat sink, the combining apertures being arranged through the first surface and the second surface; and a protrusion arranged at a location of the first surface matching a point on an upper portion of the at least one semiconductor device; wherein the protrusion stops the at least one semiconductor device from rotating upon the at least one semiconductor device being affixed to the first surface of the heat sink by the combining element.

Abstract: A ball grid array housing, a semiconductor device having a ball grid array housing and an electronic circuit are disclosed. In one embodiment, a ball grid array housing includes a substrate with solder ball connections pointing out from a housing and at least one semiconductor chip. For better heat dissipation from the housing, the ball grid includes a metallic cooling foil, or a metallic cooling plate. A method of making a ball grid array is also disclosed.

Abstract: A chip package including a heat spreader, a circuit substrate, locating structures, a chip, wires, and an encapsulating compound is provided. The heat spreader has a bonding surface, and the circuit substrate is disposed on the bonding surface of the heat spreader. The circuit substrate has an opening, which exposes a portion of the bonding surface. The locating structures are disposed on the heat spreader for fixing the circuit substrate and attaching the circuit substrate to the bonding surface closely. The chip is disposed on the bonding surface exposed by the opening, and the wires are coupled between the chip and the circuit substrate. The encapsulating compound is disposed on the bonding surface exposed by the opening for covering the chip, the wires, and a portion of the circuit substrate. The chip package has high reliability and high yield of processing.

Abstract: A package substrate is manufactured by electrolytically plating Au in a semi-additive manner without using any plating lead line. Such a package substrate includes a base substrate with a plurality of through holes, a first copper plated layer on portions of the base substrate and inner surfaces of the through holes, a plated pattern layer on the first copper plated layer, wire bonding pads on the plated pattern layer at an upper surface of the base substrate, the wire bonding pads including Au and not connected to a remnant of a plating lead line, solder ball pads on the plated pattern layer at a lower surface of the base substrate, the solder ball pads including Au and not connected to a remnant of a plating lead line, and a solder resist covering the base substrate and the plated pattern layer.

Abstract: A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.

Abstract: This invention provides a semiconductor device that can minimize deterioration of electric characteristics of the semiconductor device while minimizing the amount of etching required. In the semiconductor device of the invention, a pad electrode layer formed of a first barrier layer and an aluminum layer laminated thereon is formed on a top surface of a semiconductor substrate. A supporting substrate is further attached on the top surface of the semiconductor substrate. A second barrier layer is formed on a back surface of the semiconductor substrate and in a via hole formed from the back surface of the semiconductor substrate to the first barrier layer. Furthermore, a wiring layer is formed in the via hole so as to completely fill the via hole or so as not to completely fill the via hole. A ball-shaped terminal is formed on the wiring layer.

Abstract: Semiconductor devices and methods for fabricating the same. The semiconductor device includes a resistance-reduced transistor with metallized bilayer overlying source/drain regions and gate electrode thereof. A first dielectric layer with a conductive contact overlies the resistance-reduced transistor. A second dielectric layer having a first conductive feature overlies the first dielectric layer. A third dielectric layer with a second conductive feature overlies the second dielectric layer, forming a conductive pathway down to the top surface of the metallized bilayer over one of the source/drain regions or the gate electrode layer.

Abstract: An integrated circuit is provided including forming a porous ultra-low dielectric constant dielectric layer over a semiconductor substrate and forming an opening in the ultra-low dielectric constant dielectric layer. A dielectric liner is formed to line the opening to cover the pores in the ultra-low dielectric constant dielectric layer and a barrier layer is deposited to line the dielectric liner and conductor core is deposited to fill the opening over the barrier layer.

Abstract: A first insulating film is formed on a semiconductor substrate. A second insulating film made of insulating metal nitride is formed on the first insulating film. A recess is formed through the second insulating film and reaches a position deeper than an upper surface of the first insulating film. A conductive member is buried in the recess. A semiconductor device is provided whose interlayer insulating film can be worked easily even if it is made to have a low dielectric constant.

Abstract: In a semiconductor device having a package structure in which lead terminals connected to electrodes on both of the upper and lower surfaces of a semiconductor chip are exposed from both of the upper and lower surfaces and side surfaces of a sealing body formed of resin, electrodes of the semiconductor chip and the lead terminals are connected by Pb-free connection parts each having a configuration of connection layer/stress buffer layer/connection layer. In each connection part, the connection layer is formed of an inter-metallic compound layer having a melting point of 260° C. or higher or Pb-free solder having a melting point of 260° C. or higher, and the stress buffer layer is formed of a metal layer having a melting point of 260° C. or higher and having a function to buffer the thermal stress.

Abstract: A metal interconnection for an integrated circuit device is fabricated by forming a trench in an integrated circuit substrate and a via hole beneath a portion of the trench. The trench includes a trench sidewall and the via hole includes a sacrificial film therein. A buffer layer is formed on the trench sidewall. At least some of the sacrificial film is removed from the via hole by etching the sacrificial film through the trench that includes the buffer layer on the trench sidewall. The metal interconnection is formed in the via hole from which at least some of the sacrificial film has been removed, and in the trench. The buffer layer may use material having etch selectivity to an etchant which is used when removing the sacrificial film, to thereby protect the trench sidewall when removing the sacrificial film.

Abstract: A semiconductor structure and method for forming the same. The semiconductor structure includes (a) a substrate and (b) a chip which includes N chip solder balls, N is a positive integer, and the N chip solder balls are in electrical contact with the substrate. The semiconductor structure further includes (c) first, second, third, and fourth corner underfill regions which are respectively at first, second, third, and fourth corners of the chip, and sandwiched between the chip and the substrate. The semiconductor structure further includes (d) a main underfill region sandwiched between the chip and the substrate. The first, second, third, and fourth corner underfill regions, and the main underfill region occupy essentially an entire space between the chip and the substrate. A corner underfill material of the first, second, third, and fourth corner underfill regions is different from a main underfill material of the main underfill region.

Abstract: A circuit support for a semiconductor chip with a substrate made of an insulating material has a chip mounting area and a plurality of bonding pads surrounding the chip mounting area. The chip can be applied in a central area of the chip mounting area. A peripheral area surrounding the central area defines the border of the chip mounting area and it is of a far greater length than a length of the lateral edges of the chip to be mounted.

Abstract: A device for monitoring a rotating shaft is provided. The device measures strain in the shaft and provides angular velocity and torque in the shaft. The device includes a sensor, sensor conditioning circuitry, a microprocessor, and a transmitter, all located on a rotating shaft. The device obtains power by harvesting mechanical energy of the rotating shaft itself. Coils are provided rotating with the shaft and permanent magnets are mounted adjacent the rotating shaft so electrical energy is induced in the coils as they rotate through the magnetic field of the permanent magnets. A battery or capacitor is connected to the coils for storing energy. A microprocessor is connected to the sensors, the storage device, and the transmitter for managing power consumption and for monitoring the amount of electrical energy stored in the storage device and for switchably connecting the storage device to the transmitter when the stored energy exceeds a threshold.

Abstract: A system is disclosed which accomplishes a method of providing backup power to a device in a facility. The method includes using turbines to combusting a fuel to generate a primary power source. If this source fails, a secondary source of power is obtained from a commercial utility. If the commercial utility is not available, power is generated by a proton exchange membrane. Proton exchange membranes generate power by noncombustibly consuming hydrogen. Capacitors are used to maintain power when the system switches between energy sources.

Abstract: An inverter controlled generator set including: a power supply unit that uses a generator driven by an engine as a power supply to output a DC voltage; an inverter device that converts the output voltage of the power supply unit into an AC voltage; and a rotational speed control unit that controls a rotational speed of the engine so as to be kept at a target rotational speed suitable for a load applied to the inverter device, wherein the rotational speed control unit is comprised so that a settling time when the rotational speed of the engine is caused to converge to the target rotational speed in a state where the load is above a set value is longer than a settling time when the rotational speed is caused to converge to the target rotational speed in a state where the load is below the set value, in order to minimize an operation sound of the engine when the load is intermittently driven.

Abstract: The invention relates to a wind-driven power-plant comprising a rotor (100) which is fitted with at least one rotor blade and which is connected directly or indirectly to a generator for power generation, further including an electrical assembly made up of different electrical sub-assemblies including electronic, electrical and/or electromechanical and/or sensor elements and/or electrotechnical safety elements, where, depending on their purposes, all elements/components of one or more electrical sub-assemblies or specific elements of the electrical sub-assembly are combined into one or more function modules that implement at least one function in relation to the generation of electric power, where a parallel module is associated with at least one function module, and the parallel module is able to implement the same or nearly the same function as the function module in normal operation.

Abstract: A wind power plant including a rotor having at least one angle-adjustable rotor blade, a generator that, for generating electrical power, can be directly or indirectly coupled to the rotor and, for supplying the electrical power, can be directly or indirectly coupled to an electrical grid, at least one rotor blade adjusting device for setting an angle of the rotor blade including at least one blade adjusting drive having at least one direct-current motor that can be coupled to the electrical grid via a converter, a control device, coupled to the converter and via which the control and/or regulation of the blade adjusting drive ensues, and a direct current voltage source that ensures a power supply to the blade adjusting drive in the event of grid power failure, whereby the direct current voltage source can be directly coupled to the blade adjusting drive or indirectly to the blade adjusting drive.

Abstract: An electro-mechanical transmission is provided having only a single motor/generator, at least one differential gear set and two torque-transmitting mechanisms. A first of the torque-transmitting mechanisms is selectively engageable to establish a first continuously variable operating mode and a second of the torque-transmitting mechanisms selectively engageable to establish a second continuously variable operating mode and a synchronous shift between the two operating modes is achievable. A method of control is provided in which vehicle operating characteristics are analyzed to identify a target operating state in terms of operating mode and ratio based on the available motor torque and motor power and on maximizing energy efficiency. The transmission is controlled to approach this operating mode as closely as possible and the diverge away from the optimum torque operating with zero net battery use as the battery charge of the battery connected with the motor/generator accumulates or depletes.

Abstract: Installation method of turbine-generator equipment controlling a turbine-generator is described. The method includes manufacturing a thyristor excitation equipment as a package including a circuit breaker, an excitation transformer, a power rectifier coupled with the excitation transformer, and an excitation control panel controlling a thyristor ignition angle of the power rectifier. After the manufacturing, positioning the thyristor excitation equipment where the power rectifier is connectable to the turbine-generator, and after the positioning, wiring between the turbine-generator and the thyristor excitation equipment.

Abstract: A wind powered variable area exit aperture electric generating system having configurable, adjustable duct side walls by which means the ratio between the intake cross-sectional aperture area and the exhaust cross-sectional aperture area may be varied for maximum air molecule flow through the duct, leading to ideal maximum electrical output for any given air mass input. The planar characteristic and angular dispersion of the mutually leading edge coupled extended flaps, and the regular square interior housing result in complementary internal vortices developed at the trailing edge of the planar architectural surfaces.

Abstract: A locomotive auxiliary power system and control techniques for such a system are provided. In one exemplary embodiment the auxiliary power system includes an auxiliary alternator coupled to the internal combustion engine of the locomotive. The system further includes an auxiliary power bus powered by the auxiliary alternator. A rectifier may be connected between the auxiliary alternator and the auxiliary power bus. A plurality of devices may be electrically powered by the auxiliary power bus. A respective inverter is connected between the auxiliary power bus and each device, wherein the inverter provides a path for diverting electrical power generated during a transient mode by at least one the plurality of devices. In one exemplary embodiment, the auxiliary alternator is made up of a single alternator connected through a single shaft to the internal combustion engine.

Abstract: Device and method for operation of at least one electrical machine for a motor vehicle. In order to coordinate torque requirements for the propulsion system and voltage requirements for the vehicle power supply system and at least one battery for the vehicle power supply system, a voltage reference variable is formed for the voltage requirements for the vehicle power supply system, and a torque reference variable is formed for the torque requirements of the propulsion system. The voltage reference variable is limited by upper and lower torque limit values which must not be overshot or undershot in the event of changes to the voltage reference variable. The torque reference variable is limited by voltage limit values which must not be overshot or undershot in the event of torque changes.

Abstract: A power supply system for supplying power to a system load is described. The power supply system includes a plurality of power supply modules. Each power supply module includes a power-generating module, a unidirectional device, and a fan. When the power-generating module is in normal operation, the power generated by the power-generating module is sent in one direction to the system load through the unidirectional device. When the power-generating module fails, the fan is powered from a terminal connected to the system load.

Abstract: A charging system for simultaneously charging the batteries of a plurality of battery powered vehicles. The charging includes one or more DC-DC power converters having one or more charging ports configured to plug into the batteries. The DC-DC power converters are each configured to selectively connect to more than one charging port to selectively provide for higher port power levels. The DC-DC power converters connect to an AC rectifier through a DC bus. The AC rectifier connects to an AC power source having a limited power rating. The AC charging system also has a controller that controls the operation of the DC-DC power converters such that the total power draw on the AC rectifier does not exceed the power rating. The system is further configured such that the DC-DC power converters can drain selected batteries to obtain power for charging other batteries, thus allowing for batteries to be cycled.

Abstract: A universal interface circuit and an associated method are provided that can supply a computer logic circuit, such as the components mounted upon an adapter card, with first and second inputs having first and second predetermined voltage levels, respectively, based upon power drawn from both first and second supply voltages. The interface circuit typically includes a first power supply circuit for providing the first input having the first predetermined voltage level in response to the first supply voltage. Additionally, the interface surface includes a regulator for generating an output having the second predetermined voltage level in response to the first supply voltage. The interface circuit further includes a second power supply circuit for providing an output that also has the second predetermined voltage level, albeit in response to the second supply voltage.

Abstract: Linear actuators comprised of a plurality of geometric links connected together in displacement multiplied fashion by a plurality of SMA wires. The links may have a trigon or chevron configuration. The trigon links may be combined with a hexagonal or rhomboidal shaft to create a defined stacking pattern of links about the shaft. The shaft extends from the medial portion of the stack. Ohmic heating circuits connect to non-moving ends of SMA wires. Various groupings of links in parallel displacement are described.

Abstract: A linear actuator includes a driving part having an inner yoke, an outer yoke and a coil for generating an alternating magnetic field and includes a movable body provided with a magnet disposed between the inner yoke and the outer yoke. The movable body is formed in a tubular shape having an aperture edge part at least one end is opened, and the aperture edge part or a portion near the aperture edge part disposed between the inner yoke and the outer yoke is positioned closer to the inner yoke side than to the outer yoke side. Alternatively, the linear actuator may includes an expansion preventing member which is disposed at the aperture edge part or the portion near the aperture edge part for preventing the aperture edge part from expanding.

Abstract: A power tool comprising an electric motor for driving a tool is disclosed. The electric motor comprises a shaft, an armature, and a brush collector. The stator is configured as a self-supporting unit comprising first and second supporting parts. One of the supporting parts may be configured as an air guide ring allowing air to be routed between a fan and the opposite end of the electric motor along the armature and the brushes.

Abstract: A plurality of slots is provided at a stator core. A cable component is formed by bundling a plurality of conducting wires and connectors are mounted on both ends. The cable component is inserted into corresponding slot so as to cross over the corresponding plurality of slots and then a coil is formed by connecting both ends of the cable component.

Abstract: A motor is described that includes a motor enclosure, a mid shield, and a motor control unit having a chassis and a plurality of components mounted on the chassis. The motor enclosure includes a plurality of protrusions extending into the motor enclosure. The mid shield is configured for placement within the motor enclosure and configured to engage the protrusions. The mid shield is configured with a plurality of open spaces. The chassis of the motor control unit is configured to engage an end of the motor enclosure and the motor control unit is configured such that at least a portion of the components extend into the motor enclosure and the spaces in the mid shield.

Abstract: A first bearing part is arranged fixedly in terms of rotation on a rotor shaft with permanent magnetic elements arranged next to one another and flux guide elements arranged between them. A second bearing part, separated from the first bearing part by a bearing gap, is provided on the stator and has a structure formed of superconductive high-Tc material. The bearing gap is sealed against penetration of ambient air, but allows movement of the first bearing part with respect to the second bearing part while maintaining the seal.

Abstract: First and second stators are arranged on mutually spaced positions of an imaginary common axis, and first and second rotors are coaxially and rotatably arranged on mutually spaced positions of the imaginary common axis between the first and second stators.

Abstract: A slot insulator is provided and includes: an annular part; and a plurality of insulated winding parts disposed a circumference of the annular part. Each of the insulated winding parts has an insulated winding holding part and an insertion groove for housing a winding part of a tooth in a stator yoke. The insertion groove opens in one direction along a center axis of the annular plate and opens at both ends of the insertion groove in a radial direction of the annular plate.

Abstract: One or more wheels of an electrically powered vehicle contains a motor rotor and a motor stator that is mounted on an integrated structure having a motor stator mounting element portion and wheel axle portion on each side thereof. The structure is fabricated from a unitary non-ferromagnetic substance. A rotor housing is journalled to the axle portion on both sides of the motor stator mounting element via bearings. A wheel assembly is mounted on the rotor housing thereby to be driven by the rotor. Forced-air cooling is provided through a hollow central passage. A plug separates the passage into two distinct sections, the inlet and the outlet. A plurality of cavities, provided with heat exchanger surfaces, are contained within the stator mounting element portion. Channels at each end of each cavity extend in the radial direction into the central passage.

Abstract: The brush holding device includes a brush holder having a brush-housing chamber, and a holder plate to which the brush holder is attached. The holder plate is formed with a center hole at a center portion thereof, the center hole having a size allowing a commutator to path therethrough, and a pair of elongated holes opposing to each other with respect to the opening portion, the elongated holes defining bridge portions with the opening hole. The brush holder has a thick-wall portion integral with a bottom wall of the brush-housing chamber, the thick-wall portion being formed with fitting grooves at lateral sides thereof. The bridge portions are inserted into the fitting grooves so that the brush holder is fitted to the holding plate in such a state that the thick-wall portion is caught between the bridge portions.

Abstract: A tie ring is provided wherein the tie ring includes a tie ring structure defining at least one strap cavity. The tie ring structure includes a tie ring top surface and a tie ring bottom surface, wherein the tie ring top surface defines at least one top surface opening and wherein the tie ring bottom surface defines at least one bottom surface opening, wherein the at least one top surface opening and the at least one bottom surface opening are communicated with the at least one strap cavity.

Abstract: A method for driving an actuator. The method includes applying an electrical potential across an electrostrictive material relative to a counterelectrode disposed within an electrolyte, thereby creating a double layer potential across a region of enhanced ionic concentration. A current flowing between the electorostrictive material and the counterelectrode is measured. A portion of the applied potential appearing across the electrolyte and counterelectrode is calculated and subtracted from the applied potential to obtain an estimated double layer potential. The applied electrical potential is adjusted to obtain a specified double layer potential.

Abstract: A piezoelectric transformer drive circuit of a full-bridge type having high efficiency minimizes the effect of voltage fluctuation of an input voltage VCC.

Abstract: A driving apparatus of the invention comprises a fixed member, a piezoelectric element fixed at one end to the fixed member, and a driving friction member fixed to the other end of the piezoelectric element. The driving apparatus of the invention is arranged to move a movable unit which is slidably mounted on the driving friction member by expansion and contraction of the piezoelectric element. Herein, a bonded surface of the piezoelectric element to the driving friction member is included in a bonded surface of the driving friction member to the piezoelectric element.

Abstract: A method and apparatus attains high voltage gain by using a composite structure of an elastic section of piezoelectric layers bonded between magnetic and electric sections of magnetostrictive layers, with a harmonic magnetic field being applied along the layers at a mechanical resonance frequency of the composite structure, through coils around the laminate carrying current, such as to produce a continuity of both magnetic and electric flux lines, and achieving a high voltage output.

Abstract: A spark plug includes a sparking electrode with a firing tip, and a ground electrode having an elongated member extending outwardly from the sleeve. The elongated member has an inner surface defining a generally circular hole. The inner surface forms a circle disposed generally in a plane transverse to and having a radial center coinciding with the central axis of the insulator body, whereby each differential segment of the inner surface radially thereabout is generally equidistant to the firing tip. The inner surface is a closest portion of the ground electrode relative to the firing tip. At least a portion of the inner surface of the elongated member opposing the firing tip has a radius of curvature of about that of the firing tip for providing a spark along a path of least resistance from the firing tip to a point on the opposing inner surface of the elongated member.

Abstract: A flat panel display has an insulating substrate at the upper part of which a pixel electrode is equipped; an opaque conductive film formed on the front surface of the insulating substrate except at the pixel electrode; an insulating film equipped with a contact hole exposing a portion of the opaque conductive film; and a thin film transistor equipped with a gate electrode, and conductive patterns for source/drain electrodes connected to the opaque conductive film through the contact hole.