Abstract: A motor driving circuit includes an inverter circuit including switching devices connected in a bridge manner, electric-current detection resistances connected between the lower switching devices in the inverter circuit and the ground, so as to enable detection of the phase currents with the electric-current detection resistances, a PWM circuit which controls ON/OFF of the switching devices and repeatedly causes powering and regenerative time intervals, by alternately turning on and off the upper switching devices and the lower switching devices. During a time interval during which the lower switching devices, the electric-current detection resistances and the motor constitute a closed circuit and a regenerated electric current flows through the circuit, when the electric current values detected are equal to or greater than a predetermined electric current value, it is determined that a ground fault has occurred in the connection lines between the inverter circuit and the motor.

Abstract: An electrical receptacle having a tamper resistant mechanism is disclosed. In addition, a GFCI can optionally be configured to include the tamper resistant mechanism. Furthermore, the GFCI can be configured so that the GFCI engages the tamper resistant mechanism when the GFCI is tripped or reset. When the GFCI is tripped, the tamper resistant mechanism is engaged such that it prevents user access to the face terminals of the electrical receptacle. When the GFCI is reset the tamper resistant mechanism does not restrict access to the face terminals of the electrical receptacle. The tamper resistant mechanism has one or more shutter positioned with respect to one or more entry ports to the face terminals. The shutter positioning restricts the insertion of prongs of an electrical plug when the GFCI device of the electrical receptacle is tripped. The GFCI device is tripped when it detects a fault.

Abstract: An electrostatic discharge control system and circuit uses a voltage variable material to protect an electrical circuit, such as radio frequency identification (RFID) tag, from electrostatic damage, The circuit includes two separate electrical circuit traces with a gap between the traces. The circuit includes and protects an electrical device, such as an integrated circuit, connected between the traces. The circuit includes a voltage variable material disposed adjacent to the gap and configured to directly electrically couple the first circuit trace to the second circuit trace upon occurrence of an electrostatic discharge event. The voltage variable material may be anisotropic.

Abstract: A semiconductor apparatus is equipped with an internal circuit (201) including a semiconductor element (202)(203) and a protection circuit (101) including a semiconductor (102)(103) for protecting the internal circuit (201) against damage from electrostatic discharge (ESD). The semiconductor elements (102)(103) (202)(203) constituting the internal circuit (201) and the protection circuit (101) include an impurity diffusion region (7)(8) connected by an eternal terminal and a guard band region (6)(5) formed near the impurity diffusion region (7)(8), respectively. A shortest distance (102L)(103L) between the impurity diffusion region (7)(8) and the guard band region (6)(5) in the semiconductor element (102)(103) of the protection circuit (101) is set to be shorter than a shortest distance (202L)(203L) between the impurity diffusion region (7)(8) and the guard band region (6)(5) in the semiconductor element (202)(203) of the internal circuit (201).

Abstract: A circuit protection system includes a normal mode and a maintenance mode. A current sensor senses current in the circuit. An enclosure includes an access panel that is movable between a closed position and open position. A circuit breaker is mounted within the enclosure. An electronic trip unit is in communication with the current sensor and controls interruptions of the current by the circuit breaker based on a trip setting. An interface device is accessible when said access panel is closed and allows selections of the normal and maintenance modes. A display, which is in communication with both of the user interface device and the electronic trip unit, monitors the interface device and transmits data to the trip unit that is based on the selected mode. The display receives data from the trip unit and displays information based on the received data. The display is viewable when the access panel is closed.

Abstract: A quick response system incorporated in a TWACS for mapping an outage in an electrical distribution system without having to continuously poll the electrical meters connected to the system. In a primary embodiment of the invention when a fault is sensed to have occurred, the amplitude of the fault is measured to determine if the fault is a medium voltage fault, or a low voltage fault. The pattern of the fault signature and change in load, both before and after the fault, are examined to determine what protective device was triggered by the fault. Using this information, and knowledge of the number and location of electrical meters connected in the distribution system, a population of meters to be polled is determined. By polling the identified population, a map of the extent of the outage is readily determined, and the time to respond to the fault and restore service is reduced.

Abstract: A substrate processing apparatus carrying out processing on a substrate, which enables attachment of particles to a surface of a substrate to be prevented. A substrate processing apparatus comprises a housing chamber in which the substrate is housed, and a stage that is disposed in the housing chamber and on which the substrate is mounted. The stage having in an upper portion thereof an electrostatic chuck comprising an insulating member having an electrode plate therein, and the electrode plate having a DC power source connected thereto. The DC power source applies a negative voltage to the electrode plate when the substrate is to be attracted by the electrostatic chuck.

Abstract: A high impedance surface and a method of making same. The surface includes a molded structure having a repeating pattern of holes therein and a repeating pattern of sidewall surfaces, the holes penetrating the structure between first and second major surfaces thereof and the sidewall surfaces joining the first major surface. A metal layer is put on said molded structure, the metal layer being in the holes, covering at least a portion of the second major surface, covering the sidewalls and portions of the first major surface to interconnect the sidewalls with other sidewalls via the metal layer on the second major surface and in the holes.

Abstract: A laminated ceramic electronic component has a plurality of conductive layers embedded in a ceramic substrate. The laminated ceramic electronic component includes: a functional area composed of the plurality of conductive layers and ceramic layers interposed therebetween; and a protective area formed around the functional area to have a ring-like cross section. The laminated ceramic electronic component satisfies the following condition: 0<t/Wg?0.80, where t represents a wall thickness of the protective area in a vertical direction, and Wg represents a wall thickness of the protective area in a transverse direction.

Abstract: A multilayer capacitor has a multilayer body in which dielectric layers and internal electrode layers are alternately laminated, and terminal electrodes formed on each of two mutually opposed side faces of the multilayer body. Each internal electrode layer includes a plurality of internal electrodes arranged in an array direction along a direction perpendicular to a laminating direction of the multilayer body and parallel to the side faces. A plurality of internal electrodes included in one internal electrode layer are electrically connected to the terminal electrodes respectively. A distance between a plurality of internal electrodes included in one internal electrode layer is not less than 20 ?m nor more than 200 ?m.

Abstract: As the ceramic powder for addition to the electroconductive paste fated to form internal electrode layers in a multilayer ceramic electronic component resulting from alternately stacking the dielectric ceramic layers and internal electrode layers, a ceramic powder that possesses a perovskite-type crystal structure and satisfying the condition that the weight ratio Wt/Wc of the tetragonal phase content Wt and the cubic phase content Wc be not less than 2 is used. The weight ratio Wt/Wc of the tetragonal phase and the cubic phase is determined by the polyphasic analysis in accordance with the Rietveld method. The ceramic powder is a barium titanate powder, for example.

Abstract: As the ceramic powder for addition to the electroconductive paste fated to form internal electrode layers in a multilayer ceramic electronic component resulting from alternately stacking the dielectric ceramic layers and internal electrode layers, a ceramic powder that possesses a perovskite-type crystal structure and satisfying the condition that the weight ratio Wt/Wc of the tetragonal phase content Wt and the cubic phase content Wc be less than 2 is used. The weight ratio Wt/Wc of the tetragonal phase and the cubic phase is determined by the polyphasic analysis in accordance with the Rietveld method. The ceramic powder is a barium titanate powder, for example.

Abstract: The present invention is directed to a dielectric thin film composition comprising: (1) one or more barium/titanium-containing additives selected from (a) barium titanate, (b) any composition that can form barium titanate during firing, and (c) mixtures thereof; dissolved in (2) organic medium; wherein the barium/titanium-containing additives are not intentionally modified or doped; wherein the composition has been annealed in an environment having an oxygen partial pressure of less than about 10?7 atmospheres and/or at a temperature in the range of 700° C. and 1050° C.; wherein a capacitor comprising the composition would have a loss tangent of greater than about 0.07; and wherein the composition is not reoxygenated.

Abstract: As the ceramic powder fated to form dielectric ceramic layers in a multilayer ceramic electronic component resulting from alternately stacking the dielectric ceramic layers and internal electrode layers, a ceramic powder that possesses a perovskite-type crystal structure and satisfies an expression X<3, wherein X denotes the weight ratio Wt/Wc of the tetragonal phase content Wt and the cubic phase content Wc, is used. The weight ratio Wt/Wc of the tetragonal phase and the cubic phase is determined by the polyphasic analysis in accordance with the Rietveld method. The ceramic powder is a barium titanate powder, for example. The specific surface area of the ceramic powder is in the range of 4 to 10 m2/g.

Abstract: A laminated ceramic capacitor includes a body having an inner layer portion and an outer layer portion and a plurality of terminal electrodes spaced apart from each other in a length direction of the body. The inner layer portion has a plurality of internal electrodes stacked in a height direction of the body. The internal electrodes have led-out portions led out to a side face of the body. The outer layer portion is disposed on one of opposite faces of the inner layer portion in the height direction. The terminal electrodes are each provided with a connecting portion and a spreading portion. The connecting portion extends along the height direction to cover corresponding one of the led-out portions. The spreading portion has a width gradually increasing from one of opposite ends of the connecting portion in the height direction toward an edge of the side face.

Abstract: An activated carbon material having a BET specific surface area of 10 to 1,000 m2/g as measured by means of a nitrogen adsorption method, and the ratio of the height of the D peak (1,360 cm?1) of a Raman spectrum of the activated carbon material to that of the G peak (1,580 cm?1) of the Raman spectrum is 0.8 to 1.2. When the activated carbon material of the present invention is used as a polarizable electrode material of an electric double layer capacitor, high capacitance per electrode is attained without application of excessive voltage.

Abstract: A wet electrolytic capacitor that includes an anode, cathode, and an electrolyte is provided. The cathode contains a plurality of metal particles disposed on a surface of a substrate and sinter bonded thereto. The metal particles have a median size of from about 20 to about 500 micrometers.

Abstract: A wet electrolytic capacitor that includes an anode, cathode, and an electrolyte is provided. The cathode contains a substrate and a coating overlying the substrate. The coating comprises a sintered body containing carbonaceous particles (e.g., activated carbon) and inorganic particles (e.g., NbO2).

Abstract: An integrated capacitor assembly that offers improved performance characteristics in a convenient and space-saving package is provided. More specifically, the capacitor assembly contains a multi-anode stack of at least two electrolytic capacitors and at least one ceramic component, which are connected in parallel to common terminals within an encapsulating case. The resultant capacitor assembly is characterized by such performance characteristics as relatively high capacitance, low ESR, low piezoelectric noise, and space reduction. Reduced piezoelectric noise may be particularly advantageous for providing clear filtering in audio/video data processing and communication.

Abstract: A holding case to support an information processing apparatus that includes a first cover having a holding part that protrudes from a surface of the first cover to detachably support the information processing apparatus, a second cover that can be foldably coupled with the first cover, and a third cover that can be foldably coupled with one of the first cover and the second cover.

Abstract: A liquid crystal display (LCD) device includes a cover, an LCD panel, and a bezel together with the cover for sandwiching the LCD panel. The cover includes a board, a side flange extending from a side of the board, and two end flanges extending from opposite ends of the board. An orientation portion extends from a distal end of the side flange toward an opposite side of the board. A first locating portion extends from an inner surface of one end flange of the end flanges. A first hook extending from a corresponding side of the bezel has a restriction part extending up therefrom, for being located under the orientation portion of the cover. A second locating portion extending from a corresponding end of the bezel has a locating part at a distal end thereof, for being located under the first locating portion of the cover.

Abstract: A video display has a cabinet. The cabinet has a first through hole penetrating in a direction orthogonal to a screen of a monitor body. The back of the monitor body is covered with the cabinet. An insert nut has a second through hole with an inside diameter smaller than an inside diameter of the first through hole, and inserted into the first through hole such that a through hole direction of the second through hole is along the direction orthogonal to the screen. A wall-mounting fitting has a third through hole to be communicated with the second through hole. On the front surface of the cabinet, the wall-mounting fitting is provided. A bolt is engaged with the second through hole through the third through hole.

Abstract: The case disclosed has a raised portion stepped upward convexly and a rib molded inside of the raised portions integrally. The case is disposed at a rear surface of a display unit of a portable information equipment.

Abstract: A portable notebook computer includes a base, and a display pivotably connected to the base. An I/O port is provided on a bottom surface of the base configured to connect the portable notebook computer to external electronic devices.

Abstract: A portable electronic device includes a main body, a display part provided in the main body and displaying an image thereon, a main stand which is coupled with a rear part of the main body to adjust a supporting angle of the main body, and an auxiliary stand which is coupled with either the main body or the main stand, to adjust the supporting angle of the main body.

Abstract: A cart including (a) a base (110) configured to hold a central processing unit; (b) an uninterruptible power supply (160) configured to provide power to the central processing unit; (c) a compartment (190) adjacent the base and configured to enclose at least a portion of the uninterruptible power supply; and (d) at least one wheel (180) coupled to the base.

Abstract: The removable hard disk housing assembly includes a housing base, a hard disk bracket connected to a rear side of the housing base for carrying a hard disk, a securing handle pivotably mounted to a front side of the housing base, a locking hook pivotably mounted to the securing handle and a restoring spring. The locking hook has a hooking portion and is rotatable along a longitudinal direction relative to the securing handle. The hooking portion is selectively engaged in or departed from the engaging opening of the housing base. The restoring spring is disposed between the securing handle and the locking hook to provide a restoring force to the locking hook. Therefore, the hard disk housing assembly is prevented from falling off when it is subjected to an external force, and the locking hook is located along a longitudinal direction to increase a heat-dissipating space.

Abstract: The present invention relates to a data storage device and a support therein. The support is provided with a hollow portion. The hollow portion is provided with a damping spacer therein for attenuating vibration, thereby to reduce the lateral space occupied by the lateral sides of the support, and to increase the usable lateral space for accommodating electronic device and thus to increase the number of the accommodated electronic devices.

Abstract: An apparatus includes a casing and a latch unit. The latch unit includes first and second latch members, first and second interlocking members, a driving member, and an operating member. The first latch member is provided on a disk drive. The first interlocking member is formed on the first latch member. The second latch member is pivoted to the casing, and is rotatable relative to the casing between latched and unlatched positions. The second interlocking member is formed on the second latch member, and engages releasably the first interlocking member when the disk drive is received in the casing and when the second latch member is disposed at the latched position. The driving member is pivoted to the casing. The operating member is pivoted to the casing, and is operable so as to drive rotation of the second latch member to the unlatched position through the driving member.

Abstract: A mounting apparatus for mounting a data storage device that has a protrusion protruding from a sidewall thereof includes a mounting board, and a bracket. The mounting board includes a depressed portion for holding the data storage device. The depressed portion includes a first side wall. The bracket includes a leg member with an end pivotably mounted to the first side wall of the depressed portion of the mounting board. A first receiving slot for receiving the protrusion of the data storage device is defined in a bottom of the leg member. A drive portion is formed at a side of the receiving slot away from the end of the leg member, for cooperating with a corresponding protrusion of the data storage device when installing the data storage device.

Abstract: A multichip module comprises: a first rigid member defining one outer wall of a chamber; a second rigid member defining the opposite wall of the chamber; a sealable interface joining the first and second rigid members at their peripheries, whereby a hollow chamber is formed; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit affixed to at least one of the first and second rigid members; electrical contacts at least partially extending outward through the sealable interface; and, a fluid inlet and a fluid outlet configured to permit fluid to flow through the chamber whereby heat generated by the integrated circuit chips may be removed from the module.

Abstract: A shielding box includes a first wiring board and a second wiring board maintaining a distance relative to the first wiring board and facing thereto. A ventilating hole is formed in the second wiring board and having side surfaces facing each other. A pair of flat cables are extending through the insides of the side surfaces of the ventilating hole and are facing each other, the ends on one side thereof being connected to the first wiring board and the ends on the other side thereof being connected to the second wiring board. A cooling fan is disposed so as to blow the external air toward the first wiring board passing through the pair of flat cables.

Abstract: Multi-stage air movers for cooling computers and other systems are described herein. In one embodiment, a computer system includes a computer cabinet holding a plurality of computer modules. The computer cabinet includes an air inlet and an air outlet. The computer system further includes a multi-stage air mover configured to move a flow of cooling air from the air inlet, past the plurality of computer modules, and out the computer cabinet via the air outlet.

Abstract: According to one embodiment, a housing apparatus for a heat generating device includes a housing being provided with sidewalls arranged sideward to separate from each other, and shelf members placed at a plurality of positions along the sidewalls between the sidewalls. The shelf members support a plurality of devices including a heat generating device, and each sidewall has a plurality of ventilation openings corresponding to the devices held by the shelf members. A duct member is provided on at least outermost sidewall to correspond to at least two adjacent ventilation openings in the outermost sidewall. An airflow producing unit is provided in the duct member and includes at least two airflow producing devices performing one of supplying outside air into the inside of the housing and evacuating the inside air from the housing through the at least two adjacent ventilation openings.

Abstract: A rackmount server has dual-redundant hot-swappable fans for uniformly providing air flow to a plurality of CPU modules housed in the rackmount server. Air flow generated by the fans may also be provided to I/O circuitry disposed in the rackmount server. An airflow zone in which air flow is provided by the fans is separate, however, from an airflow zone in which air flow is provided to at least one power supply and/or disk drive housed in the rackmount server.

Abstract: One or more heat exchangers are coupled to one or more heat sources using a single gimballed joining mechanism. The joining mechanism includes a gimbal plate and a gimbal joint. The gimbal joint enables independent application of a retention force to the heat exchanger as a single-point load. This results in a balanced and centered application of the retaining force over the thermal interface area. The gimbal plate is mounted directly to a circuit board using spring means. The spring means regulate the amount of retention force directed through the gimbal joint to each heat exchanger. Because the gimbal joint is rotation-compliant, the two mating faces making up the thermal interface are forced into a parallel mate. In this manner, a high performance TIM interface is generated.

Abstract: A heat dissipating device mounted onto a VGA card (10) includes a base (22) contacting with a GPU (12) attached on the VGA card, a cover (21) mounted on the base, and a plurality of fins (24) received between and thermally connecting the cover and the base. The base defines a slot (222) above the GPU. A fan (28) is positioned on the base for driving an airflow, wherein one portion of the airflow flows through the fins and another portion of the airflow flows through the slot and blows over other electronic components near to the GPU. Thus, rebounding of the airflow is reduced, and the heat dissipating device has better heat dissipating efficiency.

Abstract: An electronic device having a heat radiating body, a metal substrate, a heat generating component, and a non-heat-generating component is disclosed. The metal substrate is fixed to the heat radiating body with heat conductive oil arranged between the metal substrate and the heat radiating body. The heat generating component and the non-heat-generating component are mounted on the metal substrate. A gap that permits the heat conductive oil to enter the gap is defined between the metal substrate and the heat radiating body. The gap is arranged at a position corresponding to the non-heat-generating component or a position corresponding to a portion between the heat generating component and the non-heat-generating component.

Abstract: A low-cost heat sink easy to assemble which is designed to be mounted on a power semiconductor module (5) through the medium of cooling water includes a base member (1), a heat sink body (2) superposed on the base member (1) to form in cooperation with the base member (1) a passage through which the coolant flows, and a bellows-like flow straightening plate (6) disposed between the power semiconductor module (5) and the base member (1) in physical contact with the power semiconductor module (5) on one hand and with the base member (1) on the other hand. The flow straightening plate (6) partitions the passage into a plurality of flow straightening channels (14A, 14B).

Abstract: An integral cold plate/chassis (ICPC) housing may be formed from two blocks of material, having a cold plate sandwiched therebetween, brazed together. The blocks may then be machined to fit power electronics therein, thereby providing a cold plate as an integral part of the power electronic's housing. Unlike conventional heat exchangers that may be used to dissipate heat from power-dissipating components that are housed typically in sheet metal housings, the ICPC described herein provides a cold plate integral to the housing of power electronics, thereby allowing the rapid and efficient removal of heat from the components into the cold plate carrier fluid and out of the system.

Abstract: An exemplary apparatus generally includes a fence, a heat sink, and a thermal interface. The fence includes walls defining at least one opening along an upper portion of the fence. The walls are configured to be disposed generally about one or more electrical components of a board. The heat sink includes resilient fingers connected to a lid portion, and configured to engage openings of the fence and/or the board. The lid portion is configured to substantially entirely cover the at least one opening of the fence for cooperatively shielding the one or more electrical components within the interior defined by the lid portion and the fence's walls. The thermal interface is configured such that engagement of the resilient fingers with the openings compresses the thermal interface between the lid portion and the one or more electrical components, thereby forming a thermally-conducting heat path from the one or more electrical components to the heat sink.

Abstract: A fixing means for a heat dissipater is provided to position the heat dissipater and a heat-generating element, which includes a heat-dissipating base and a positioning frame. The surface of the heat-dissipating base is provided with a plurality of heat-dissipating pieces. The center of the plurality of heat-dissipating pieces is provided with a sliding groove. Further, the positioning frame is formed into a T-lettered shape and constituted of a transverse rod and a pressing end. The pressing end is accommodated in the sliding groove of the base to abut against the surface of the base. Both side faces of the transverse rod are provided with a screw hole, respectively, for receiving a locking element.

Abstract: A heat sink device for conventional memory modules, such as DIMMs, that is configured to be positioned between adjacent memory modules mounted in substantially parallel connectors on a printed circuit board. Each heat sink device includes thermally conductive first and second members configured to thermally couple with electronic components of a conventional memory module. The first and second members may be resiliently biased away from one another so that the resilient bias causes the members to abut respective electronic components when placed between adjacent memory modules. A separate wedge, or a lever-mounted wedge, may be provided for insertion between the members to urge them away from one another and into abutting relationship with electronic components on facing surfaces of the adjacent memory modules. When abutting opposing electronic components, a single heat sink device facilitates heat dissipation from both of the adjacent memory modules.

Abstract: An electronic apparatus has plural circuit units, such as server components of a computer. A cabinet type apparatus case has plural outer cover panels. A front portion included in the outer cover panels is openable. Plural sliding drawer trays are arranged in a multi tier form, for containing respectively the server components, and are contained in the cabinet type case movably in a forward direction. Numerous inlets are formed in side cover panels among the outer cover panels, for air intake. Numerous vents are formed in front and rear cover panels among the outer cover panels, for air discharge. There are six fans for flowing in of air through the inlets, for blowing the air to the server components, and for venting the air through the vents, to cool the server components. A recess is formed in the drawer trays, opposed to the six fans, for passing the air.

Abstract: An MP3 player seat unit includes a player seat having a receiving slot provided at a front center for receiving an MP3 player therein, a sound source terminal in the receiving slot for plugging into a sound source jack on the MP3 player to output music signals, an amplifier and a loudspeaker built in two sides of the receiving slot, a receiving space formed at a rear lower central area of the player seat, and two battery compartments formed at two sides of the receiving space for supplying power to internal circuits of the player seat; a signal cable having a first terminal connector located in the receiving space for connecting to a female connector on the MP3 player, and a second terminal connector for connecting to an external computer or other music signal source apparatus; and a back cover for covering the receiving space and the two battery compartments.

Abstract: An enclosure for securely place electronics therein uses fewer parts and with the parts being simple in structure. The part of enclosure can be easily and securely assembled. Further the enclosure can be easily disassembled.

Abstract: A two-part, high-density card retention system includes a tapered channel in a chassis or housing and a mating wedge that runs the length of the housing, with the lead wedge being cammed towards a flat channel surface by drawing the wedge inwardly and locating the edge of the board to be mounted between the wedge and the opposing straight channel wall. The mounting provides continuous high-pressure contact between the board and the straight channel wall for maximal thermal transfer and robust anti-vibration and anti-shock mounting of the board to the chassis. Because no additional assemblies are mounted to the edge of the board, the boards may be spaced apart by a fine pitch, thus to minimize the size of the module into which the boards are mounted.

Abstract: A method and product produced includes a power layer board that is manufactured by providing a printed circuit board having an input configured to receive an input power and an output configured to deliver an output power conditioned to power a motor. The method also includes soldering a first component to the printed circuit board. Thereafter, a request to manufacture the power layer board is received that includes parameters of the input power and/or the output power. Therefrom, characteristics of a second component including a resistor, a capacitor, and/or an inductor is identified based on the parameters of the input power and/or the output power. Accordingly, the identified second component is mounted to the printed circuit board through a solder-less cold-weld connector to complete the power layer board.

Abstract: The invention provides a system of components in an electronic device is provided. The system comprises: a PCB; a first component mounted to the PCB; a cap located about the first component; a second component; and a platform for the second component. In the system, the platform and the cap cooperate with alignment features such that the platform may be placed on top of the cap at a predetermined location utilizing the alignment features. The invention also provides a method for assembling the device.

Abstract: According to various aspects of the present disclosure, exemplary embodiments are provided of low-profile apparatus capable of providing board level shielding for one or more electrical components while also providing dissipation of heat generated by the one or more electrical components. In one particular embodiment, an apparatus generally includes a resiliently compressible EMI gasket, a heat sink, and a spring clip. The spring clip has resilient legs with feet. The feet are configured to engage the board. When the feet are engaged with the board, a clamping force is generated that compressively biases the heat sink and the resiliently compressive EMI gasket generally towards the board.