Abstract: Disclosed is a method and device for controlling the startup of a synchronous reluctance motor.

Abstract: The present invention discloses an apparatus for controlling an operation of a reciprocating compressor and a method therefor which can reduce errors in an operation of a stroke estimated value of the reciprocating compressor, by previously preventing over-saturation of a magnetic flux density generated in a coil of a motor. The apparatus for controlling the operation of the reciprocating compressor includes a magnetic flux saturation constant operation unit for operating a magnetic flux saturation constant of a motor of the reciprocating compressor on the basis of a stroke estimated value of the reciprocating compressor, a stroke reference value generation unit for generating an increased or decreased stroke reference value by increasing or decreasing a predetermined stroke reference value on the basis of the magnetic flux saturation constant, and a control unit for controlling a voltage applied to the motor of the reciprocating compressor on the basis of the generated stroke reference value.

Abstract: A power converter for a switched reluctance motor or a permanent magnet brushless direct current (dc) motor may include first and second partial circuits for forming multiple conduction circuits in cooperation with first and second phase windings of the motor. The controller also includes a switch operable to open and close a first conduction circuit, which includes the first phase winding, and to regulate energization of the first and second phase windings of the motor through opening and closing the first conduction circuit. Control of the switch provides four-quadrant operation of the motor through regulated energization of the first and second phase windings.

Abstract: An apparatus for controlling a speed of a fan motor (HIM (Hybrid Induction Motor)) of an air-conditioner extends a speed control range of a fan motor of an air-conditioner by controlling revolutions per minute (RPM) of the fan motor. In order to extend the speed control range of the HIM, an RPM of the HIM is controlled based on a pre-set duty ratio of a switching device electrically connected with the HIM.

Abstract: A method and system for managing the voltage of a DC bus of a speed controller for an AC electric motor linked to a current distribution network. The method includes comparing a value of the voltage measured on the DC bus with a determined limit value, when the value of the voltage measured on the DC bus becomes greater than the limit value, forcing the slope of an internal ramp to a zero value so as to confer a constant frequency on the stator, and when the value of the voltage measured on the DC bus again becomes less than the limit value, progressively increasing the value of the slope of the internal ramp.

Abstract: There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a portable fuel cell power and management system (for example, hydrogen and/or methanol based systems), components and/or elements thereof, as well as techniques for controlling and/or operating such systems. The fuel cell power management system (and method of controlling and/or operating same) actively monitors, manages and/or controls one or more operating parameter(s) of the fuel cell system. For example, the system monitors, manages and/or controls the consumption and/or the rate of consumption of fuel by the system, and in response thereto, may provide and/or alert the user to amount of fuel remaining, consumed, the rate of consumption and/or the time (or estimation thereof) remaining until all of the fuel is spent. In this way, the user may schedule or plan accordingly.

Abstract: A battery charger may include a charger connector to be coupled to a corresponding device connector of a portable device including a rechargeable battery. The battery charger may also include a charging circuit connected to the charger connector, and a controller connected to the charger connector and the charging circuit. The controller may be for causing a portable device connected to the charger connector to identify its corresponding portable device type and its corresponding rechargeable battery type from among a plurality of different portable device types and different battery types, and for causing the charging circuit to charge the rechargeable battery based thereon.

Abstract: A contactless, inductive charger having a generally planar surface is provided. An image, text or other visual indicator is disposed upon the substantially planar surface such that the visual indicator represents a preferred placement orientation for an electronic device for optimal inductive charging. The charger includes a primary coil positioned within the boundaries of the image, such that a user has a visual guide for placing the device on the charging surface for maximum efficiency in charging. The visual indicator, which may be a picture, outline, text or other directional indicator, may be geometrically similar to a shape of the electronic device or may be in the shape of a generic device. It may be disposed upon the charger by a method selected from the group consisting of painting, molding, silk screening, plating, vapor deposition and adhesive retention.

Abstract: Disclosed herein is an automotive electrical system including a FET based rectifier and method of controlling the FET based rectifier without using either an alternator shaft position sensor or current sensors on each phase of the alternator output to control the switching of the FETs. In accordance with the teachings herein, the voltage and current on the DC bus of the automotive electrical system are sensed and switching of the FETs is controlled by a microcontroller that determines the appropriate switching times based on these sensed parameters.

Abstract: A system for providing anti-islanding protection of a synchronous machine based distributed generator includes a frequency sensor configured to generate a generator frequency signal, a bandpass filter configured for filtering the generator frequency signal, a governor controller configured for using the filtered frequency signal to generate a power feedback signal, and a governor summation element configured for summing the filtered frequency signal, the power feedback signal, and a reference power to provide an electrical torque signal. Another system includes a voltage sensor configured to generate a generator terminal voltage signal, a feedback power calculator configured for generating a reactive feedback power signal, a bandpass filter configured for filtering the terminal voltage signal, and a PI controller summation element configured for summing the filtered terminal voltage signal, the reactive power feedback signal, and a reference reactive power to provide an error signal.

Abstract: Provided is an apparatus and method for providing a voltage reduction for single-phase voltage regulator operation in a three-phase power system. The voltage regulator includes a plurality of tap positions selectable to adjust a voltage at a load to an in-band area. The method includes determining a measured voltage and current at the voltage regulator, determining a line voltage drop between the voltage regulator and the load if the measured voltage in the OOB area above the in-band area, and utilizing the measured voltage to lower the voltage at the load if there are no available taps. The method also includes utilizing the measured voltage less the line voltage drop to determine the tap change if there are available taps.

Abstract: A direct current to direct current converter includes first and second switches to output voltages on first and second output terminals in response to appropriate turn-on voltages at first and second control terminals. The first control terminal may selectively communicate with one of N>2 different voltages. The converter may include a first multi-level controller in communication with the first control terminal, the controller including N drivers to selectively apply the N>2 different voltages to the first control terminal.

Abstract: Novel systems of an evanescent microwave probe (EWP) are disclosed, which enable measurements of physical properties of a sample with enhanced sensitivity and resolution, simultaneously. In one embodiment, new shielding features are added to the probe (which may be of either a sharpened tip or loop configuration) to reduce the effects of residual far field radiation, while maintaining the probe section that extends beyond the shielding aperture of the resonator. To further increase the sensitivity of the instrument, an automatic gain-controlled active feedback loop system may be added to the probe resonator to form a self-oscillator. This new active circuit feature significantly increases the effective Q of the resonator probe, enhancing the sensitivity of both the frequency and Q measurement.

Abstract: A system, apparatus and method for performing differential return loss measurements and other measurements as a function of frequency uses a digital storage oscilloscope (DSO) having spectral analysis functions. A waveform generator generates a differential test signal in the form of a series of pulses where each pulse includes spectral components associated with each of a plurality of frequencies of interest. A test fixture presents the differential test waveform to a load including at least one of a device under test (DUT), a short circuit, an open circuit and a balanced load. A signal acquisition device differentially measures the test waveform during each of the load conditions. The signal acquisition device computes an error correction parameter using measurements made during the short circuit, open circuit and balanced load conditions. The correction parameter tends to offset signal acquisition errors within measurements made during the DUT load condition.

Abstract: A handheld portable battery powered digital antenna and/or network analyzer which derives complex impedance values at a given frequency includes an internal direct digital synthesis generator and provides software-defined multiple operating modes and real time graphic scalar and polar displays of results in a multiplicity of user-selectable visual formats.

Abstract: A method and apparatus for testing the loop impedance in residual current circuit breaker (RCCB) protected circuits is provided. An alternating test current is applied across the phase earth connections of a supply and a plurality of voltage samples are then taken across the connections. The voltage samples are subsequently transformed from time space to frequency space to allow the component due to the test current to be isolated. The loop impedance is then calculated.

Abstract: A voltage monitoring circuit is capable of being integrated into a chip and monitoring the voltage quality. It mainly uses a first waveshaper to receive a voltage signal of a voltage source to be measured, process it to a logic signal, and output to a first logic level transformer. A first digital signal is transformed by the processing and can be recorded by a register such that a managing system can read content of the register through a bus to further determine whether the voltage source has a situation of voltage surge. Similarly, an inverter can be concatenated between a second waveshaper and a second logic level transformer to monitor whether the voltage source has undercurrent pulse. This way, an object of monitoring voltage quality in the chip with a combination of simple analog circuit can be achieved.

Abstract: An AC voltage generated by an AC power source 1 is rectified by a full-wave rectifying circuit 2, which generates a rectified voltage. An internal regulator 33 performs waveform shaping of the rectified voltage. A comparator 42 compares the rectified voltage output from the internal regulator 33 with a reference voltage V1 and detects a period in which the rectified voltage exceeds the reference voltage V1. According to an output signal of the comparator 42, a determination signal generation circuit 50 determines the power source voltage supplied form the AC power source 1 and generates a determination signal. Accordingly, there is no need of a capacitor, etc. for detecting the peak value of the rectified voltage, and it is possible to reduce the size and cost of an AC voltage detection circuit.

Abstract: A fault indicator for indicating the occurrence of a fault in an electrical conductor is programmable, such as in the field, by placing a magnet in proximity to the housing of the fault indicator. A data processor senses the changed state of a magnetic switch and, after a predetermined delay, initiates a programming routine to enable selection of one of a plurality of trip settings for the fault indicator. During programming, display LEDs flash once for programming of the first trip setting, twice for setting of the second trip setting, and so forth. Removal of the magnet from proximity to the fault indicator while at the desired trip setting will result in programming of the fault indicator to that trip setting.

Abstract: An integrated circuit characterization printed circuit board and method is provided for improving the uniformity of impedance introduced by a test fixture across all of the pins of the integrated circuit device. The printed circuit board includes an array of substantially similar test contacts numbering greater than the pins of the integrated circuit device. The array of test contacts includes an active portion configured for electrically coupling with the corresponding pins on the integrated circuit device and an inactive portion adjacent to the active portion and electrically coupled to a reference signal on the printed circuit board.

Abstract: A linear variable transformer (LVDT) for use in a transducer. The LVDT has a non-ferromagnetic core which may eliminate Barkhausen noise and thereby improve the sensitivity of the resulting measurements. In one aspect, this system may be used in an atomic force microscope.

Abstract: A system for decoding a signal of a rotating portion of a machine. The system includes a sensor configured to output N signals based on signals received from the rotating portion, and a processor configured to derive a value from a plurality of differences between sampled data obtained from the N signals.

Abstract: A magnetic sensing apparatus includes a first magnetic transducer separated spatially from a second magnetic transducer and proximate to a target and a direction decoding circuit associated with the first and second magnetic transducers, wherein the direction decoding circuit produces output pulses that provide data indicative of a rotation of the target while rejecting rotational vibration signals associated with the target during a rotational detection of the target utilizing the first and second magnetic transducers without producing erroneous output pulses or missing an excessive number of the output pulses during speed and rotational detection operations thereof.

Abstract: A method of fabricating a multilayer wiring board proximity sensor includes forming a laminate, and fabricating a plurality of through-conductors through the layers of the laminate. The laminate has a plurality of layers including one or more core layers and a plurality of coil layers. Each core layer includes a core pattern formed of a permeable material, and each coil layer comprises at least one coil trace formed of a conducting material. Thus, the through-conductors may be fabricated through the layers of the laminate such that the coil traces are interconnected by the through-conductors to thereby form one or more coils disposed about at least a portion of the core patterns of the core layers.

Abstract: A sensor package comprising an X-axis sensor circuit component, a Y-axis sensor circuit component, and a Z-axis sensor circuit component, each mounted to a top surface of a rigid substrate. To minimize the height of the package, a channel is cut out of the top surface of the substrate in order to accommodate the Z-axis sensor component. On the Z-axis sensor component, input/output (I/O) pads are all arranged in an array along one edge of the sensor to conductively cooperate with I/O pads, or solder-filled vias, on the substrate located at a top edge of the channel. Once the sensors have all been mounted to the substrate, the package is encapsulated, and the overall height is less than 1.2 mm.

Abstract: A magnetometer is disclosed that enables high resolution magnetometry using magnetoresistive sensors that consume less power. The magnetometer exploits the ability of the sensor to alter or modulate sensitivity via external means. This modulation effectively transfers the signal of interest from the noisy DC domain to the AC domain by applying an AC signal to a current strap in a magnetic field sensor. The AC signal causes a first magnetic field to be formed in a direction perpendicular to the current strap. A magnetic field sensing structure in the magnetic field sensor senses the first magnetic field. The magnetic field sensing structure uses the first magnetic field to sense a second magnetic field. The second magnetic field is an external magnetic field that is of interest. An output of the magnetic field sensing structure is an AC signal that is proportional to the second magnetic field. The AC signal may be further amplified and refined employing signal conditioning techniques.

Abstract: Method and apparatus for treating a sample to acquire multidimensional spectra within a single scan that partitions a sample into a set of independent subensembles endowed with different resonance frequencies. A polychromatic irradiation of the sample is implemented whereby the various subensembles are selectively manipulated by a time-incremented series of excitation or refocusing sequences. Thereafter, a homogeneous sequence capable of generating an observable spectral signal from each of the subensembles is applied with simultaneous monitoring of the observable signals arising from the various subensembles in a resolved fashion. The observable signals acquired in this manner are processed into a complete multidimensional spectral data set.

Abstract: A probe head for nuclear magnetic resonance measurements in an area of a surface of a measuring object is disclosed. The probe head comprises first means for generating a static magnetic field extending at least partially parallel to the surface, second means for generating a radio frequency magnetic field having components extending perpendicular to the surface, and third means for amplifying a radio frequency magnetic field effective within the measuring object. The third means are configured as an aperture and are located between the second means and the surface.

Abstract: In order to suppress fringe field due to the magnetic field generated from shield coils along the center axis of main coils and the shield coils that are disposed with their center axes being identical, when reducing fringe field to the outside of a magnet apparatus using the shield coils, the magnet apparatus is configured so that the radii of the main coils are approximately equal to or smaller than the radii of the shield coils, the radii of auxiliary coils are smaller than the radii of the shield coils, the distance between the two main coils is smaller than the distance between the two shield coils, and the distance between the two shield coils is smaller than the distance between the two auxiliary coils.

Abstract: A method includes heating a MRI shim with a heater to reduce a temperature rise per unit of time during a gradient operation of a MRI system.

Abstract: An analytical device for rapid, non-invasive nuclear magnetic resonance (NMR) spectroscopy of multiple samples using a single spectrometer is provided. A modified toroid cavity/coil detector (TCD), and methods for conducting the simultaneous acquisition of NMR data for multiple samples including a protocol for testing NMR multi-detectors are provided. One embodiment includes a plurality of LC resonant circuits including spatially separated toroid coil inductors, each toroid coil inductor enveloping its corresponding sample volume, and tuned to resonate at a predefined frequency using a variable capacitor. The toroid coil is formed into a loop, where both ends of the toroid coil are brought into coincidence. Another embodiment includes multiple micro Helmholtz coils arranged on a circular perimeter concentric with a central conductor of the toroid cavity.

Abstract: A method for detecting charge defect spots (CDSs) on a chargeable surface is provided, including charging the chargeable surface to receive and hold a first voltage charge, spacing a surface of a scanner probe a distance from the chargeable surface, the scanner probe having a diameter, and biasing the scanner probe to a second voltage charge within a predetermined voltage threshold of the first voltage charge, wherein a parallel plate capacitor is established with the chargeable surface and a dielectric substance between the scanner probe and the chargeable surface.

Abstract: A system for processing signals includes a receiver assembly for receiving a signal. The signal has a sample component with a sample electric field and a sample polarization, and has a reference component with a reference electric field and a reference polarization. The receiver assembly includes an analyzer for polarimetrically processing the signal, including differencing the signal to generate a difference electric field proportional to the difference of the sample and reference electric fields. By polarimetrically differencing the signal, the analyzer reduces the magnitude of the common-mode signal at the difference signal receiver. The receiver assembly includes an electric-field detector for measuring the difference electric field such that the reduction in common-mode amplitude decreases the noise equivalent power of the electric-field detector.

Abstract: Provided are two monitor circuits for monitoring two input signals of an input stage differential amplifier, respectively, and two monitor circuit for monitoring two output signals of the input stage differential amplifier, respectively. When failure occurs at the bridge circuit of a sensor element or at the input stage differential amplifier, the monitoring units or the monitoring units detect abnormality, which makes it possible to detect the failure of the sensor element or the input stage differential amplifier. Therefore it is possible to detect failure such as a disconnection or a short circuit of the bridge circuit of the sensor element and failure which has occurred at the amplifier for amplifying outputs of the sensor element.

Abstract: A technique for testing a signal path while an operational signal is present is disclosed. The technique may be performed without injecting a test signal into the signal path by using an operational signal already present in the signal path. A method of testing a signal path includes receiving an operational signal from the signal path and estimating a correlation of the operational signal. A system for testing a signal path includes an extractor configured to extract a sample of the operational signal when coupled to a signal path and a correlator configured to estimate a correlation of the operational signal. Various properties of the signal path may be determined using the technique.

Abstract: An electronic device has a first signal path, a first power supply path, and a connector that transmits to an external device the input signal on which the voltage has been superposed. The device also has a first power supply switch inserted into the first power supply path and an amplitude detector that detects at the connector an amplitude of the input signal, a control section that determines, based on a detection output from the amplitude detector, which a connection condition of the external device to the connector is a first condition in which the external device is not connected to the connector or a second condition in which the external device is connected to the connector. Based on the connection condition, the control section turns on or off the first power supply switch.

Abstract: A system and method for detecting a defect in an actuator arm conductor coil is disclosed. An actuator arm including a conductor coil is received. The conductor coil is coupled with a voltage as an anode. The conductor coil is submerged into a first solution, the first solution having no organic matter therein. The first solution is then coupled with a second solution including an organic indicator. The second solution also includes a cathode coupled to the voltage such that a defect in an insulation layer of the conductor coil is indicated by the organic indicator.

Abstract: An infrared radiation image pickup apparatus, the image pickup elements of which are each formed by a bolometer, is disclosed. The resistance value of the bolometer outside a preset range in a given readout circuit associated with a given image pickup element does not affect other readout circuits performing parallel operations with the readout circuit. The readout circuit includes an OP amplifier 5, a non-inverting input terminal of which is connected to an output of a D/A converter 7, a MOS transistor 4, and a switch 6. The MOS transistor 4 has a gate connected to an output terminal of the OP amplifier 5 and has a source connected to an inverting input terminal of the OP amplifier 5 and connected via a horizontal switch 3 to a bolometer 1. The switch 6 is connected between the gate and the source of the MOS transistor 4. The D/A converter 7 receives data for applying a bias voltage to the bolometer 1, and outputs the bias voltage.

Abstract: First, second, and third semiconductor switches are connected in series between input and output terminals and first and second voltage application circuits are connected in parallel to first and third semiconductor switches, whereby providing a semiconductor switch circuit. Each voltage application circuit comprises a first or second voltage application semiconductor switch connected at the output side thereof with a first or second direct current amplifier having a gain state of approximately +1 and whose input side is connected to the input or output terminal. One end of the first or second voltage application semiconductor switch is connected to a first junction of the first and second semiconductor switches, or to a junction of the second and third semiconductor switches, respectively.

Abstract: A device includes a light emitter, a current sensing resistance, a current generator, and detection circuitry. The current generator is connected to the light emitter and to the current sensing resistance. During a normal operating mode of the device, the current generator regulates current flow through the light emitter. In a test mode, the current generator regulates current flow through the current sensing resistance. The detection circuitry, during the test mode, detects when current flow through the current sensing resistance is outside an expected range.

Abstract: A probe card assembly is provided. The probe card assembly includes a substrate layer defining a plurality of apertures and a plurality of probes. Each of the probes has a base and a tip. The base of each probe is configured to be at least partially inserted within one of the plurality of apertures.

Abstract: A probe measurement system for measuring the electrical characteristics of integrated circuits or other microelectronic devices at high frequencies. The probe measurement system preferably includes a probe having a conductive path extending between the first and second surfaces of a membrane and a probe contact electrically connected to the conductive path.

Abstract: The present invention provides a method for testing semiconductor wafers by means of a temperature-regulated chuck device, comprising the following steps: controlling the temperature of the chuck device to a predetermined measurement temperature by means of a heating device having a predefined heating power and a cooling device having a predefined cooling capacity, the heating power being substantially greater than a predefined testing power; laying the rear side of a semiconductor wafer on a supporting side of the temperature-regulated chuck device; placing a probe card on the front side of the semiconductor wafer; testing the semiconductor wafer by impressing the testing power from a testing apparatus into a chip region of the front side of the semiconductor wafer by means of probes of the probe card placed on; reducing the heating power by the amount of the testing power during the testing with a substantially constant cooling capacity. The invention also provides a corresponding apparatus.

Abstract: A burn-in apparatus for conducting a burn-in test by housing a burn-in board mounted with a large number of DUT in a burn-in chamber, moving a temperature adjustment board downward and bringing temperature adjustment arrays attached to the temperature adjustment board contact with corresponding DUT; comprising a push-pull device having a movable body moving back and forth in the horizontal direction of a board surface of the burn-in board and a cam mechanism composed of a tilted cam and cam follower for elevating/lowering an elevator board by converting a back-and-forth movement of the movable body to a vertical movement is provided; wherein the push-pull device for elevating/lowering the temperature adjustment board can be downsized, so that a more compact burn-in apparatus can be provided.

Abstract: The voltage at a node of an integrated circuit can be measured or controlled using a two-wire kelvin contact with spring-based probe pins by offsetting and tapering the lower end section of the spring-based probe pin. As a result, multiple spring-based probe pins can be connected to a single contact bump, such as a solder bump.

Abstract: A probe needle apparatus and method provides a drive guard having the same potential as a probe needle for reducing signal noise in low current measurements. The probe needle apparatus includes a conductive central core covered with alternating layers of dielectric and conductive materials, a first layer of dielectric material applied to maintain electrical access to the conductive central core while providing continuous isolation of the conductive central core elsewhere, and a conductive driven guard layer applied around the first layer of dielectric material in electrical isolation from the conductive central core.

Abstract: A prognostic cell is used to predict impending failure of a useful circuit or circuits in a host IC. Increasing the stress on the prognostic cell relative to the useful circuit shifts the failure distribution of the cell along the time axis. The relative amount of time between the useful circuit failure and prognostic cell trigger point is the “prognostic distance”. The prognostic distance is controlled by designing in the excess stress applied in test device(s), by setting the threshold for triggering in the comparison circuit or by both. Prediction accuracy is enhanced by using multiple test devices to oversample the underlying failure distribution and triggering the failure indicator when a certain fraction fail.

Abstract: Described is a method for automatically generating a wafer prober file whereby testing parameters and die identities can be established for testing a complete semiconductor wafer and whereby acceptable or rejected dies can be identified and correlated later with where the good or bad dies are physically located on a wafer-under-test.

Abstract: Circuitry for use in testing a device includes a first measurement unit to apply a forced voltage to the device, and a second measurement unit having functionality that is disabled. The second measurement unit includes a sense path to receive a sensed voltage from the device, where the sense path connects to the first measurement unit through the second measurement unit. The first measurement unit adjusts the forced voltage based on the sensed voltage.

Abstract: A method for testing a semiconductor component includes the steps of bonding an interconnect to the component to form bonded electrical connections, applying test signals through the bonded electrical connections, and then separating the interconnect from the component. The bonding step can be performed using metallurgical bonding, and the separating step can be performed using solder-wettable and solder non-wettable metal layers on the interconnect or the component. During the separating step the solder-wettable layers are dissolved, reducing adhesion of the bonded electrical connections, and permitting separation of the component and interconnect. The interconnect includes interconnect contacts configured for bonding to, and then separation from component contacts on the components.