Abstract: Various techniques directed to the design and construction of transformers are disclosed. In one aspect, a computer system according to embodiments of the present invention includes instructions stored on a storage media which when executed by a processor performs the operations of loading parameters of a transformer included in a power supply design, calculating primary winding parameters of the transformer in response to the loaded parameters of the transformer, calculating secondary winding parameters of the transformer in response to the loaded parameters of the transformer, and generating a list of transformer construction materials. Shield winding parameters of the transformer may be calculated in response to the loaded parameters of the transformer. The calculation of secondary winding parameters may include allocating pins of a secondary winding of the transformer.

Abstract: A current probing system has a current probe and a detachable adapter. The current probe has a probe body with electrically conductive contacts that mate with electrically conductive contacts on the adapter. Leads extend from the adapter for coupling to a current carrying conductor. The leads can connect to a plug that is coupled to a current diverting device for coupling a current signal to the current probe. The adapter may also include a switch that selectively couples the current signal to the current probe when the adapter is mated with the current probe. The contacts of the current probe are coupled to a current sensing circuit which generates a voltage output representative of the current signal. The voltage output is coupled to an oscilloscope via an electrical cable.

Abstract: The present invention provides a terminator circuit including a potential variation detecting section that detects a variation in a potential at an end point to which an input signal is supplied, and a first current generating section that reduces an overshoot at the end point which is caused by the application of the input signal, by pulling a current from the end point, when the potential variation detecting section detects a rise in the potential at the end point. Here, the potential variation detecting section includes a comparison potential generating section that generates a comparison potential based on a reference potential, and a potential comparing section that compares the comparison potential which has risen in accordance with the rise in the potential at the end point, with the reference potential, and outputs a result of the comparison.

Abstract: A temperature detection function-incorporating current sensor includes a Hall IC, connector terminals for respectively outputting signals, detected by the Hall IC, to the exterior. The Hall IC includes a magnetism detection portion for detecting a magnitude of a magnetic field, a temperature detection portion for detecting an ambient temperature, and a temperature compensation portion for correcting an error of the magnetism detection portion due to temperature dependency based on the temperature detected by the temperature detection portion. The detection signal of the magnetism detection portion, corrected with respect to the error, and the temperature signal detected by the temperature detection portion are outputted via the connector terminals to the exterior. In this current sensor, it is not necessary to provide an additional temperature detection part, and also it is not necessary to effect an operation for connecting such a part to a board.

Abstract: A synthetic test system for swept-frequency measurements that has a clock synchronization device to enable test boxes and devices that form the synthetic test system to have a common sense of time when conducting swept-frequency tests.

Abstract: A current probing system for acquiring a current signal from a current carrying conductor has a current diverting element mounted on the conductor for serially coupling the current signal to a current probe. The current probe has a probe body and first and second electrically conductive contacts extending from one end of the probe body for connecting to the current diverting element. A current sensing circuit is coupled to the first and second electrically conductive contacts for generating an output signal representative of the current flowing in the current carrying conductor. An electrically conductive cable is coupled to receive the output signal from the current sensing device and extends from the other end of the probe body for coupling to an oscilloscope.

Abstract: A current probe for acquiring a current signal from a current carrying conductor via a current diverting element has a probe body and first and second electrically conductive contacts extending from one end of the probe body for connecting to current diverting element. A current sensing circuit is coupled to the first and second electrically conductive contacts for generating an output signal representative of the current flowing in the current carrying conductor. An electrically conductive cable is coupled to receive the output signal from the current sensing device and extends from the other end of the probe body for coupling to an oscilloscope.

Abstract: A current sensing circuit has a transformer where a current to be measured induces a magnetic flux into a magnetic core. The magnetic core has a magneto-electric converter for sensing DC to low frequency current signals and a secondary winding for sensing higher frequency current signals. The magneto-electric converter generates an output that is coupled via an amplifier to a non-inverting input of a transimpedance amplifier. The inverting input of the transimpedance amplifier is coupled to the secondary winding of the transformer. A current signal path having a transimpedance resistor couples the inverting input to the output of the transimpedance amplifier. The transimpedance amplifier functions as a power amplifier for coupling a nulling current to the transformer for DC to low frequency current signals and functions as a transimpedance gain amplifier for higher frequency signals.

Abstract: A speed sensor for a wheel end that has an interior that is substantially isolated from an atmosphere around the wheel end. The speed sensor is carried by a housing of the wheel end for monitoring the rotation of the wheel end and indicating the angular velocity of the wheel end. The speed sensor includes a cable leading from the sensor to a location remote from the wheel end and further includes leads that transmit a signal and a sheath that encloses the leads. The sheath is open enough to allow a fluid to flow through its interior. A vent channel provides communication between the interior of the wheel end and the interior of the sheath on the cable.

Abstract: A rotor for a rotation sensor may be mounted on a bearing that supports a wheel on an automotive vehicle so that it can detect the number of revolutions for the wheel. The rotor for a rotation sensor 1 includes a reinforcing ring 2 formed like an L-shape in cross section, including a cylindrical part 3 adapted to be fitted on a peripheral surface of the rotating part of the bearing (inner race or outer race) and a flanged part 4 bent at an end edge of the cylindrical part 3, from which it extends in the radial direction. A multi-pole magnet 10 is attached to the axial outer lateral side of the flanged part 4, and a non-magnetic covering 6 encloses the axial outer lateral side of the multi-pole magnet 10 and has a peripheral edge on its one end secured to the reinforcing ring 2.

Abstract: A method of detecting the separation of an electronic module (1) from a vehicle on which the module is mounted. According to this method, the module (1) has associated with it an inductance (17) inseparable from the module, the inductance (17) and the associated module (1) are connected to an element of the vehicle, in the immediate vicinity of an element (18) made of ferromagnetic material, the current passing through the inductance (17) is measured (monitored), so as to detect any variation of current and, when a current variation greater than a predetermined variation threshold is detected, representative of a relative distance between the inductance (17) and the element made of ferromagnetic material (18), there is ordered the emission of a signal indicating the separation of the module (1) associated with the inductance from the vehicle.

Abstract: A non-contact position sensor comprises a first reactive element for accepting radio frequency (RF) energy from an oscillator and radiating said RF energy to generate an excitation flux. A second reactive element intercepts the excitation flux and an RF voltage is induced therein. An RF voltage detector, operatively coupled to the second reactive element, detects the RF voltage induced in the second reactive element to generate an output voltage. A third reactive element is capable of intercepting the excitation flux to generate a back electromagnetic force (EMF) in the second reactive element such that, upon the third reactive element being displaced relative to at least one of the first and second reactive elements, the RF voltage detector generates a position-dependent output signal indicative of the displacement of the third reactive element.

Abstract: A magnetized layer (12) is integrally bonded to an annular holder (11) installed to a rotating body, the magnetized layer is made of a material obtained by mixing a magnetic fine particle to a rubber elastic material or a synthetic resin material and magnetized in a multipolar manner at a predetermined pitch in a circumferential direction, and a portion having a different sectional shape from the other portions is formed in a part in a circumferential direction in a joining part of the holder (11) with the magnetized layer (12), by a raised part (11c) or the like, so that a significant point of a signal level is formed in this portion on the basis of a difference in a magnitude of a magnetic field, whereby the significant point is set to a rotation angle measurement starting point.

Abstract: The invention relates to a fluxgate micromagnetometer implemented in thin layers, fitted with at least one excitation coil with an arrangement and a structure that bring improvements particularly in terms of the magnetometer footprint, reduction in the “offsets” of measurements taken by the magnetometer, common mode rejection.

Abstract: A coil array for use in magnetic resonance imaging (MRI) is provided and comprises a plurality of low loss coil elements and at least one non-conducting substrate containing adapted to position the plurality of low loss coil elements in a fixed position thereon. Further, a coil array assembly for use in a magnetic resonance imaging (MRI) scanner is provided. The coil array assembly comprises a pair of coil arrays, wherein each coil array comprises: a plurality of low loss coil elements and at least one non-conducting substrate containing adapted to position the plurality of low loss coil elements in a fixed position thereon. Further, the pair of coil arrays are coupled to the MRI scanner for receiving imaging signals in a region of interest excited within the pair of coil arrays. Further, the coil array is adapted for use in breast imaging.

Abstract: Disclosed is a wideband SSFP, wherein a standard balanced SSFP MRI sequence is played with repetition times of alternating lengths, TR and TRS, where TRS<TR. The result is significantly improved tradeoff between signal bandwidth and available acquisition interval lengths. This is particularly important as it enables the combination of balanced SSFP with high field imaging for many applications such as cardiac, musculoskeletal and abdominal imaging.

Abstract: Apparatus and methods of generating magnetization transfer contrast images in which signal to noise ratios are improved and/or in which image acquisition times are reduced. In certain embodiments, apparatus and methods which utilize sensitivity and/or non-sensitivity to magnetization transfer effects to improve the contrast of images which are generated. In certain additional embodiments, apparatus and methods for generating magnetization transfer contrast images which exhibit sensitivity to longitudinal and transverse relaxation times of bound and free proton pools, respectively.

Abstract: An NMR probe for high-temperature NMR measurements includes tubular heating means mounted respectively immediately below and immediately above an area to be measured. A sample tube is inserted inside the tube formed by the two heating means. A sample placed in the sample tube is heated. Heat from the two heating means is transmitted to the sample via at least one heat transfer pipe of a good thermal conductivity. The heat transfer pipe is disposed inside the tube of the heating means.

Abstract: A magnetic resonance coil system 18 allows for the use of modular components and which in one embodiment is particularly well-suited for use with small animals and includes an animal receiving apparatus 202, a transmit coil module 204, and a receive coil module 206. The receive coil module 206 includes a cryogenic receive coil. The coil system 18 is selectively insertable in the bore of the gradient coil of a magnetic resonance examination system.

Abstract: A magnetic resonance (MR) probe head comprises a detecting device (3) with at least one antenna system which is cryogenically cooled by a cooling device, a cooled preamplifier (16) in a preamplifier housing (15a, 15b) which is spatially separated from the detecting device (3), and a thermally insulating connecting means via which the detecting device (3) and the preamplifier housing (15a, 15b) are connected, wherein the connecting means (15c) comprises at least one cooling line (9a, 9b, 53a, 53b) for supplying and/or returning a cooling fluid, and at least one RF line (10, 52) for transmitting electric signals. The connecting means (15c), including its RF and cooling lines (10, 52, 9a, 9b, 53a, 53b), can be separated from the preamplifier housing (15a, 15b) by a coupling. The MR probe head is an open system which can be used in a universal fashion through use of different measuring inserts.

Abstract: A magnetic resonance (MR) probe head comprises a detecting device (3) with at least one antenna system which is cryogenically cooled by a cooling device, and a cooled preamplifier (16) in a preamplifier housing (15a) which is spatially separated from the detecting device (3), and a thermally insulating connecting means via which the detecting device (3) and the preamplifier housing are connected, wherein the connecting means (15c) comprises at least one cooling line (9, 9a, 9b) for supplying and/or returning a cooling fluid, and with at least one RF line (10) for transmitting the electric signals. The connecting means is implemented as a mechanically flexible connecting line (8) with mechanically flexible RF lines (10) and cooling lines (9, 9a, 9b) disposed therein. The MR probe head is easy to handle and can be highly sensitive, wherein the detecting device can be quickly installed, removed and put into operation.

Abstract: A method for measuring anisotropy in thin-bed formations calls for placing a logging tool into a borehole in the formation and applying current to at least one set of injection electrodes and at least one set of return electrodes to measure resistivity in the formation. Resistivity measurements are used to determine aspects of thin-bed formations exposed in the borehole to the tool. The aspects include the formation azimuth angle (?) and the formation dip angle (?). Typically, the measurements and determinations are completed using apparatus including a computer program product.

Abstract: An unfocused resistivity imaging device horizontal and vertical currents conveyed into the borehole. Pad mounted electrodes are used to make voltage measurements in orthogonal directions. The voltage measurements are then rotated to give principal resistivity measurements in an anisotropic formation with dipping beds.

Abstract: An improved induction tool for formation resistivity evaluations. The tool provides electromagnetic transmitters and sensors suitable for transmitting and receiving magnetic fields in radial directions that are orthogonal to the tool's longitudinal axis with minimal susceptibility to errors associated with parasitic eddy currents induced in the metal components surrounding the transmitter and receiver coils. Various transmitter receiver combinations are provided to select sensitivity to a desired reservoir formation properties, for example, different orientations xy, xz, yz, 20-40, 20-90, and combinations, such as, Symmetric-symmetric; Asymmetric-symmetric; and Asymmetric-asymmetric. Measurements made with a multi-component logging instrument when used in a substantially horizontal, vertical or deviated borehole in earth formations are diagnostic of the direction of resistive beds relative to the position of the borehole.

Abstract: A programmable system for testing relays and controlling systems is provided. In one embodiment the present disclosure provides a programmable device capable of, for example, testing relays. The device includes a signal generator for generating signals to test relays. The device includes a memory location, and a first program stored in the memory location. The first program supports relay testing. The device includes a versioned program to support relay testing, and a processor in communication with the signal generator and the memory location. The device also includes a routine that is operable by the processor to install a versioned program in the memory location replacing the first program.

Abstract: Disclosed are methods and apparatuses for determining an impedance of an energy-output device using a random noise stimulus applied to the energy-output device. A random noise signal is generated and converted to a random noise stimulus as a current source correlated to the random noise signal. A bias-reduced response of the energy-output device to the random noise stimulus is generated by comparing a voltage at the energy-output device terminal to an average voltage signal. The random noise stimulus and bias-reduced response may be periodically sampled to generate a time-varying current stimulus and a time-varying voltage response, which may be correlated to generate an autocorrelated stimulus, an autocorrelated response, and a cross correlated response. Finally, the autocorrelated stimulus, the autocorrelated response, and the cross correlated response may be combined to determine at least one of impedance amplitude, impedance phase, and complex impedance.

Abstract: A potential sensor including first and second detection electrodes opposed to an object of which a potential is to be measured, and a movable shutter so positioned between the detection electrodes and the potential-measured object with gaps thereto; wherein the movable shutter can assume a first state and a second state, the first detection electrode is exposed to the potential-measured object wider when the movable shutter assumes the first state than when the movable shutter assumes the second state, and the second detection electrode is exposed to the potential-measured object narrower when the movable shutter assumes the first state than when the movable shutter assumes the second state.

Abstract: A protection circuit comprises: at least one shielded line arranged to cover an area to be protected over a semiconductor device, the at least one shielded line having only one route from a start point to an end point; a signal generator for applying a signal to the start point of the shielded line; a counter which starts measurement of time in response to application of the signal to the start point of the shielded line by the signal generator and which ends measurement of the time in response to arrival of the signal at the end point of the shielded line; and a comparator for comparing the time measured by the counter with a reference value to output a fraud detection signal according to a result of the comparison.

Abstract: Included is a device for monitoring a test material. The device can include a probe configured for introduction to the test material. The probe can include a first electrode and a second electrode, where the first electrode can be positioned a predetermined distance from the second electrode. The device can also include a power source configured to provide a current to the probe. Additionally, the device can include a first data indicator and a potentiometer.

Abstract: The objective of present invention is to obtain high positioning accuracy while securing moving space for a probe positioned by insertion into a through-hole. For this reason, a probe having a perpendicular portion where a lower face contacts an electrode, and a beam formed in a horizontal direction from a top edge of the perpendicular portion. A locking portion protrudes outward and is formed on the perpendicular portion. A taper portion, having a diameter gradually increasing from a lower side of the locking portion is formed on the perpendicular portion. This taper portion is formed on the face on the opposite of the direction in which the beam portion is formed on the perpendicular portion. When the perpendicular portion of the probe is inserted into a through-hole, the perpendicular portion is guided by the taper portion, and locked to the upper end of the through-hole by the locking portion.

Abstract: Methods and apparatus for use in analyzing probe cards are provided. For some embodiments, chucks with particular materials selected to achieve desired properties, such as improved conductivity, robust viewing windows, and the like, are provided. For other embodiments, useful features, such as force measurements for probe pins may be provided. For still other embodiments, improved flipping tables or features thereof may be provided.

Abstract: A method of using a blade probe for probing a node of a circuit where the node includes a pad surface surrounding a node hole is disclosed. A probe having a longitudinal probe axis, a shaft, and a probe blade is provided. The shaft is generally concentric to the longitudinal probe axis and is made from an electrically conductive material. A probe blade is disposed at a first end of the shaft. The probe blade includes first and second faces positioned about the longitudinal probe axis in facing opposition to each other. The first and second faces converge towards each other and terminate at an edge. The probe is urged in a direction generally parallel to the longitudinal probe axis to create at least one electrical contact point between the edge of the probe blade and one of the solder disposed a pad surface of a node or the solder disposed on a rim of a hole of the node.

Abstract: The invention includes methods of utilizing removable mechanical precising mechanisms and/or optical-based precising mechanisms to align chips within sockets. The sockets can be configured so that compression of the sockets opens a clamping mechanism. A chip can be placed within a socket with a manipulator and aligned during compression of the socket. Subsequently, the compression of the socket can be released while the manipulator remains in contact with the chip to hold the chip in place until the clamping mechanism is retaining the chip in the socket. The chip can then be released from the manipulator. The invention also includes systems for utilizing removable nests to align various chip geometries within generic socket designs.

Abstract: A method to fabricate a high density, minimal pitch, thermally matched contactor assembly to maintain electrical contact with contact regions on fully processed semiconductors, preferably while still in wafer form, and throughout a range of temperatures. A guide plate and a contactor assembly for such use, comprising a substrate formed of a material having a coefficient of thermal expansion approximately equal to that of the device; and at least one hole in the guide plate for receiving an electrical contact (probe element) for contacting at least one respective region on said surface, said at least one hole being sized and shaped so as to accept said electrical contact, while allowing said electrical contact (probe element) to move with respect to said hole in said guide plate. The material can be one of silicon, borosilicate glass and cordierite.

Abstract: Low profile printed circuit board assembly test fixtures and methods are disclosed, the fixtures mountable at a tester having a plurality of conductive interface contacts. The fixture includes a low profile mount defined by a frame having an interface bed at one end and a dynamic plate movably positioned at an opposite end thereof, a chamber being thereby defined and having an opening for evacuating air therefrom to effect movement of the plate. A plurality of conductive terminals extend through the interface bed, each of the terminals having a node at one end positioned at the bottom surface of the bed and corresponding to the position of one of the conductive interface contacts of the tester. A plurality of conductive probes in the chamber are secured at the top surface of the bed, are coupled to the terminals, and extend through the plate. The electronic assembly is selectively positioned atop the plate for probe access.

Abstract: An electrical connector assembly includes a socket (10), spring contacts on the socket, a supporting circuit plate (12), a plurality of capacitor components (13) on the supporting circuit plate, and an integrated circuit package (2) having power delivery lands. The spring contacts includes certain power delivery spring contacts (11) for engagement with corresponding power delivery lands on the package. The socket defines a region for the supporting circuit plate to be retained thereon. The plurality of capacitor components is arranged adjacent the respective power delivery spring contacts, and electrically connected with the capacitor components by the use of the supporting circuit plate. Since the capacitor components are directly incorporated into the socket, the conductive path between a voltage regulation module and the microprocessor package is minimized, thereby minimizing the inductance associated therewith.

Abstract: A probe, wherein a beam 3 is cantilevered by a supporter 2 with a predetermined space from a probe substrate 1, and a contact 4 extending in a direction away from the probe substrate 1 is attached to the beam 3. A projection 5 extending toward the probe substrate 1 is formed on the beam 3. Since the projection 5 is brought into contact with the probe substrate 1 when a load is applied to the probe substrate 1, stress imposed on the beam 3 can be dispersed.

Abstract: An integrated circuit is described. The integrated circuit includes an interface circuit that includes a transmitter and a receiver. A generator in the integrated circuit is selectively coupled to the transmitter. The generator is to provide a test sequence that is output by the transmitter during a test mode of operation. A memory in the integrated circuit is selectively coupled to the generator and the receiver. The memory is to receive and synchronize the test sequence and a signal corresponding to the test sequence that is received by the receiver. A logic circuit in the integrated circuit is to compare the test sequence and the signal.

Abstract: An integrated circuit (70) having parallel scan paths (824-842, 924-942) includes a pair or pairs of scan distributor (800,900) and scan collector (844,944) circuits. The scan paths apply stimulus test data to functional circuits (702) on the integrated circuit and receive response test data from the functional circuits. A scan distributor circuit (800) receives serial test data from a peripheral bond pad (802) and distributes it to each parallel scan path. A scan collector circuit (844) collects test data from the parallel scan paths and applies it to a peripheral bond pad (866). This enables more parallel scan paths of shorter length to connect to the functional circuits. The scan distributor and collector circuits can be respectively connected in series to provide parallel connections to more parallel scan paths. Additionally multiplexer circuits (886,890) can selectively connect pairs of scan distributor and collector circuits together.

Abstract: An inspecting method comprises the following steps. A plurality of defect inspection devices is formed on a wafer. Each defect inspection device comprises an insulating layer and a conductive layer stacked over the insulating layer. A defect inspection parameter is set and the wafer is scanned with an electron beam to obtain a plurality of defect signals. The number of defect signals is checked to determine if it is equal to the number of defect inspection devices. If the number of defect signals is smaller than the number of defect inspection devices, the defect inspection parameter is readjusted and the aforementioned step of performing an electron beam scanning and checking for equality between the number of defect signals and the number of defect inspection devices are repeated. The process is complete when the number of defect signals is at least equal to the number of defect inspection devices.

Abstract: A main power source supplies current through path impedance to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal temporarily increases following edges of a clock signal applied to the DUT during a test as transistors within the IC switch in response to the clock signal edges. To limit variation (noise) in voltage at the power input terminal, an auxiliary power supply supplies an additional current pulse to the power input terminal to meet the increased demand during each cycle of the clock signal. The magnitude of the current pulse is a function of a predicted increase in current demand during that clock cycle, and of the magnitude of an adaption signal controlled by a feedback circuit provided to limit variation in voltage developed at the DUT's power input terminal.

Abstract: Embodiments of the invention include a trio of reliability oscillators. In one embodiment, an on-chip frequency compensation circuit includes a selectively enabled reliability oscillator to generate a reference oscillating signal, a clocked reliability oscillator to generate an AC degraded oscillating signal, and a static reliability oscillator to generate a DC bias degraded oscillating signal. A compare circuit coupled to the reliability oscillators compares the oscillating signals and generates a frequency compensation signal if the comparison determines that there is frequency degradation greater than a predetermined threshold.

Abstract: An exemplary device (27) for adjusting angle of a base plate (2710) includes: two side walls (21) being parallel to and spaced apart from each other, each of the side walls including a pivot hole (217); a base plate disposed between the two side walls and pivotally attached to the side walls via the pivot axles; and a plurality of magnetism members (211, 212 and 2715) disposed on the base plate (2710) and the side wall. The magnetism members configures for holding the base plate stably in a starting position and further configures to allow the base plate to be displaced from the starting position by manual pressure applied to the base plate, such that a tilt angle of the base plate relative to the two side walls is adjustable up or down as desired. An exemplary apparatus (2) for testing display modules using the angle adjusting device is also provided.

Abstract: A multi-memory module circuit topology is disclosed that includes a memory controller, a plurality of memory modules connected to the memory controller through a memory bus, and a resonator connected to the plurality of memory modules in a starburst topology. A method for reducing impedance discontinuities in a multi-memory module circuit is disclosed that includes providing a plurality of memory modules connected to a memory controller through a memory bus, selecting a starburst topology, and connecting a resonator to the plurality of memory module in dependence upon the selected starburst topology. An additional method for reducing impedance discontinuities in a multi-memory module circuit is disclosed that includes providing by a resonator a predetermined discontinuity reducing impedance at a predetermined location in the multi-memory module circuit between at least two memory modules, the multi-memory module circuit having a plurality of components of logically arranged around the predetermined location.

Abstract: Some embodiments of the invention provide a configurable integrated circuit (“IC”). The configurable IC includes a set of multiplexers that each has a set of input terminals, a set of output terminals, and a set of select terminals. The set of multiplexers includes a group of multiplexers, where at least one input terminal of each multiplexer in the group is a permanently inverting input terminal. During at least a set of cycles during the operation of the configurable IC, several multiplexers in the group of multiplexers are used to implement a particular function.

Abstract: An electronic circuit includes configurable cells capable of being functionally linked to logic cells with which they cooperate to form at least one logic circuit if a chaining command signal is in a first (inactive) state. The electronic circuit also includes a logic interconnection circuit for performing the following functions if the chaining command signal is in a second (active) state. Functionally connecting the configurable cells in a linear feedback shift register if an authentication signal is in a first state, or functionally connecting the configurable cells in a chain in a predefined order to form a shift register if the authentication signal is in a second state.

Abstract: Some embodiments of the invention provide a configurable integrated circuit (“IC”). This IC includes several configurable logic circuits for receiving configuration data and configurably performing a set of operations based on the configuration data. It also includes several hybrid circuits. Each particular hybrid circuit has: (1) a set of inputs, (2) a set of outputs for selectively connecting to the set of inputs, and (3) a set of select lines for receiving select signals that direct the hybrid circuit to connect the input set to the output set in a particular manner. At least one select signal is for controllably receiving configuration data and at least one select line is for controllably receiving signals generated by the configurable logic circuits.

Abstract: A logic circuit system with power consumption that is reduced by automatically varying the clock frequency and operating voltage according to processing capability imposed on programmable logic circuits. The programmable logic circuits are capable of achieving plural circuit functions dynamically and can change realized circuit functions during operation. In addition, the system has a voltage supply portion for supplying a voltage to the programmable logic circuits, a clock signal supply portion for supplying a clock signal to the programmable logic circuits, a change control portion for changing the circuit functions realized by the programmable logic circuits to any one of the circuit functions, an operation time measuring portion for measuring the operation times of the programmable logic circuits to perform processing to achieve the circuit functions, respectively, and a clock-and-voltage determination portion for determining the frequency of the clock signal and the voltage, using the operation times.

Abstract: A method includes providing a crossbar array including a programmable material layer, wherein the crossbar array is configured to function as part of a signal processing system and reprogramming at least one impedance value of the programmable material layer formed at crosspoints of the crossbar array to change the signal processing system.

Abstract: A device is provided for managing the current consumption peak on each powering-up of a domain in an electronic circuit. A plurality of domains are present and a global power supply grid provides power. Each domain is selectively supplied by a local supply grid connected to the global supply grid via a plurality of commanded switch transistors. A pre-charge transistor is used to pre-charge a domain at powering-up. A command circuit controls operation of the switch transistors through an analog command signal whose slew rate is controlled to ensure that switch transistor conduction is delayed to enable the pre-charge circuit to charge the domain to a sufficient degree that activation of the switch transistor will not draw excessive current.