Abstract: In a semiconductor module including a wiring board having a top surface and a bottom surface, a passive element device Is soldered on the top surface of the wiring board by a first solder material, and an external solder electrode terminal is adhered on the bottom surface of the wiring board and made of a second solder material. The first solder material has a higher melting point than that of the second solder material.

Abstract: A semiconductor device according to the present invention includes a semiconductor substrate, which comprises a first surface on which an electrode pad is formed, and a second surface arranged at an opposite side of the first surface; an external terminal formed on the first surface of the semiconductor substrate and is electrically connected to the electrode pad; and a sealing resin which seals the first surface so that a surface of the external terminal is exposed. An outer edge of the second surface has a chamfered portion, a surface of which is inclined by substantially 45 degrees from the second surface.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A grating structure for channeling and concentrating incident radiation includes a regular pattern of elements each with a metallic shell partially surrounding at least one subcavity. The subcavity is filled with a dielectric or semiconductor. Light of one or more predetermined wavelength ranges can be concentrated in the subcavity(s) and then efficiently channeled through the grooves between adjacent elements. An optoelectronic device includes the structure superposed on a substrate, which can be semiconductive, and the elements of the grating used as electrodes and adapted to allow a potential difference between adjacent (electrode) elements. The optoelectronic devices include photodetectors, e.g., metal-semiconductor-metal, pn, pin, avalanche, LEDs, IR emitting devices, and biological or chemical sensors.

Abstract: An interconnection structure for integrated circuits having reduced RC delay and leakage is provided. The interconnection structure includes a first conductive line in a first dielectric layer, a second dielectric layer over the first dielectric layer and the first conductive line, and a dual damascene structure in the second dielectric layer. The dual damascene structure includes a second conductive line and a via between and adjoining the first and the second conductive lines, wherein the second conductive line comprises a first portion directly over and adjoining the via, and a second portion having no underlying and adjoining vias. The second portion has a second width less than a first width of the first portion.

Abstract: An interconnect structure of an integrated circuit includes a low-k dielectric layer over a semiconductor substrate, a conductor in the low-k dielectric layer, and a dielectric transition layer between the low-k dielectric layer and the conductor, wherein the dielectric transition layer has a thickness of less than about 50 ?.

Abstract: The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A method of closely interconnecting integrated circuits contained within a semiconductor wafer to electrical circuits surrounding the semiconductor wafer. Electrical interconnects are held to a minimum in length by making efficient use of polyimide or polymer as an inter-metal dielectric thus enabling the integration of very small integrated circuits within a larger circuit environment at a minimum cost in electrical circuit performance.

Abstract: A chip molded onto a substrate with a slot forms a molded semiconductor structure, wherein the chip covers one end of the slot and the other open. This special design leads the mold flow and enhances the semiconductor by a transverse pressure induced by the molding flow as the semiconductor is being molded. Moreover, to arrange the molded semiconductor structures especially in a cavity formed by the top portion die and bottom mold die avoids the flow spill. The special molded semiconductor structure and arrangement enhance the adhesion onto the bottom mold die to upgrade the molding quality.

Abstract: A semiconductor device comprises metal lines in a specific metallization layer which have a different thickness and thus a different resistivity in different device regions. In this way, in high density areas of the device, metal lines of reduced thickness may be provided in order to comply with process requirements for achieving a minimum pitch between neighboring metal lines, while in other areas having less critical constraints with respect to minimum pitch, a reduced resistivity may be obtained at reduced lateral dimensions compared to conventional strategies. For this purpose, the dielectric material of the metallization layer may be appropriately patterned prior to forming respective trenches or the etch behavior of the dielectric material may be selectively adjusted in order to obtain differently deep trenches.

Abstract: Two interconnect layers are electrically connected while reducing the number of manufacturing steps. A contact plug 9c which is formed into a beaded shape in a layer underlying two interconnects 11C and 11D and which also electrically connects the two interconnects 11C and 11D is included. The two interconnects 11C and 11D are separated to each other and are formed in a same layer. The contact plug 9c is simultaneously formed with a contact plug 9b to be connected to an interconnect 4b and a contact plug 9a to be connected to a source/drain region 6.

Abstract: The present invention relates to metallic interconnect having an interlayer dielectric thereover, the metallic interconnect having an upper surface substantially free from oxidation. The metallic interconnect may have an exposed upper surface thereon that is passivated by a nitrogen containing compound.

Abstract: The present invention relates to a stackable semiconductor package including a first substrate, a chip, a low modules film, a second substrate, a plurality of first wires, and a first molding compound. The chip is disposed on the first substrate. The low modules film is disposed on the chip. The second substrate is disposed on the low modules film. The area of the low modules film is adjusted according to the area of the second substrate, so as to support the second substrate. The first wires electrically connect the first substrate and the second substrate. Some pads of the second substrate are exposed outside the first molding compound. Therefore, the overhang portion of the second substrate will not shake or sway during a wire bonding process, and the area of the second substrate can be increased to receive more devices disposed thereon. In addition, the thickness of the second substrate can be reduced, so as to reduce the overall thickness of the stackable semiconductor package.

Abstract: A first semiconductor chip, a spacer of plane shape, and a second semiconductor chip are put on a module substrate, sequentially. These semiconductor chips have a relation that every side of the first semiconductor chip is shorter than the first side and the second side of the second semiconductor chip, and longer than the third side and the fourth side of the second semiconductor chip. The border of the spacer is parallel to the third side and the fourth side and is placed inside the border of the first semiconductor chip. Even if the second electrode pad of the second semiconductor chip approaches the border of the first semiconductor chip, since a spacer secures space between the border portion of the first semiconductor chip and the second semiconductor chip, the wire combined with the second electrode pad does not contact the first semiconductor chip.

Abstract: The semiconductor device 1 has a semiconductor chip 10 (first semiconductor chip) and a semiconductor chip 20 (second semiconductor chip). The semiconductor chip 20 is formed on the semiconductor chip 10. The semiconductor chip 20 is constituted by comprising a semiconductor substrate 22. The semiconductor substrate 22, which is an SOI substrate, is constituted by comprising an insulating layer 34, and a silicon layer 36, which is provided on the insulating layer 34, including a circuit forming region A1. The insulating layer 34 functions as a protective film (a first protective film) covering a lower face (a face opposite to the semiconductor chip 10) of the circuit forming region A1. A protective film 38 (a second protective film) is provided on the semiconductor substrate 22. The protective film 38 covers a side face of the circuit forming region A1.

Abstract: Apparatus including a chip substrate having a first chip surface facing away from a second chip surface; an array of microelectronic elements on the first chip surface; and an array of conductors each in communication with one of the microelectronic elements, the conductors passing through the chip substrate and fully spanning a distance between the first and second chip surfaces.

Abstract: In one embodiment, an electronic device package (1) includes a leadframe (2) with a flag (3). An electronic chip (8) is attached to the flag (3) with a die attach layer (9). A trench (16) having curved sidewalls is formed in the flag (3) in proximity to the electronic chip (8) and surrounds the periphery of the chip (8). An encapsulating layer (19) covers the chip (8), portions of the flag (3), and at least a portion of the curved trench (16). The curved trench (16) reduces the spread of die attach material across the flag (3) during chip attachment, which reduces chip and package cracking problems, and improves the adhesion of encapsulating layer (19). The shape of the curved trench (16) prevents flow of die attach material into the curved trench (16), which allows the encapsulating layer (19) to adhere to the surface of the curved trench (16).

Abstract: A semiconductor package and a method for fabricating the same are disclosed. The method includes installing a plurality of conductive components on a plurality of chip carriers of a chip carrier module, connecting electrically the conductive components to electrical connection points of the adjacent chip carriers, mounting and electrically connecting a semiconductor chip to each of the chip carries, forming an encapsulant for enveloping the semiconductor chip and the conductive components, cutting the chip carriers to separate the conductive components installed thereon, exposing a portion of the conductive components out of the encapsulant, forming on the exposed portion of the conductive components an electroplated layer of nickel/gold, and separating the chip carriers from each other. The conductive components exposed out of the encapsulant provide extra electrical connection points and thereby promote the functionalities of electronic products.

Abstract: A humidifier which creates a visually entertaining helical flow of mist generally includes a base unit defining a reservoir for holding a quantity of water, a water tank supported on the base unit for supplying water to the reservoir, a humidification device, such as an ultrasonic transducer, in communication with the reservoir for vaporizing the water held in the reservoir to produce a mist, a vortex unit supported on the base unit and a nozzle and a vortex creator positioned in the vortex unit. The vortex unit has an opening disposed above the base unit reservoir to permit the mist produced by the humidification device to rise upwardly into the vortex unit.

Abstract: A method for thinning a substrate prior to drilling and/or for structurally reinforcing a thinned substrate having a via pattern after drilling and products resulting thereby. A substrate, or panel, has a first thickness. A pocket is formed in the substrate where the pocket has a second thickness less than the first thickness. At least one via is drilled in the pocket, and the via(s) are filled with an optically transmissive material.

Abstract: The invention relates to a method for manufacturing a reverse mold (2, 4) for replicating a high-density relief structure (1), to such a reverse mold (2, 4) and to a method for replicating of such a high-density relief structure (1). To provide an improved and reliable method for the best possible replication of a high-density relief structure (1) a method for manufacturing a reverse mold (2, 4) for replicating a high-density relief structure (1) is proposed comprising the steps of: applying a curable polymer to a surface of said high-density relief structure (1) having surface shape information to be replicated, thus forming a layer (2) of curable polymer on said surface of said high-density relief structure (1), curing of said polymer to form a reverse mold (2, 4), and separating said reverse mold (2, 4) from said high-density relief structure (1).

Abstract: Contact lens delensing methods are described, and the present delensing methods include using a gas to facilitate separation of a polymerized contact lens product from a contact lens mold member. The contact lens mold member is compressed to deform a portion of the mold member, and gas, such as air, is directed toward the polymerized contact lens product in contact with the portion. The contact lens mold member can be compressed as the mold member, and lens product, rotate. A vacuum device can be used to separate the polymerized contact lens product from the contact lens mold member after compressing the portion of the mold member and directing the gas towards the mold member. Delensing systems used to practice the present methods are also described.

Abstract: A device and method for continuous production of cotton candy and automated handling of the cotton candy in a way that collects and condenses the cotton candy into a continuous strand.

Abstract: A tire mold for molding a rubber or plastic article includes an aluminum tire mold having an internal mold cavity, at least one vent hole of a selected diameter extending from the mold cavity to the exterior of the mold. A metal vent plug is operatively disposed within the vent hole such that air may be released through the vent hole from the internal mold cavity to the exterior of the mold upon heating the entire mold during molding of the rubber or plastic article, but prevents any rubber or plastic from entering the vent hole during molding of the rubber article. This is done by heating the aluminum tire mold, then inserting a metal vent plug into each vent hole; then cooling the entire aluminum tire mold with the metal vent plug to room temperature; then freezing the aluminum tire mold to a temperature of at least about ?100° F. for at least one-half hour such that the aluminum tire mold deforms around each metal vent plug; and finally, removing the mold from the freezing conditions.

Abstract: Method and apparatus for controlling the delivery of polymer material in a sequential injection molding process. In one embodiment, the method provides: delivering a first shot of a first material simultaneously to a plurality of mold cavities; independently sensing for each cavity a property that is indicative of a volume or flow of material that is delivered to the corresponding cavity during the step of delivering the first shot; independently stopping the step of delivering the first shot to one or more cavities according to a program that uses as a variable a signal indicative of the property sensed for the corresponding cavity during delivery of the first shot; and delivering a second shot of a second material simultaneously to the cavities subsequent to the step of stopping the step of delivering the first shot.

Abstract: The invention relates to a method for the production of a patterned linoleum sheet, comprising the steps: a) application of a non-linoleum material to at least a part of the surface of a green linoleum and/or introduction of a non-linoleum material into given recesses in the green linoleum, or a?) application of a non-linoleum material in the form of a solution, a paste, a suspension or a dispersion onto the scraped linoleum mixture and calendering of the scraped linoleum mixture provided with the non-linoleum material to give a green linoleum, b) cutting the green linoleum thus obtained into pieces of given length, c) overlaying the cut green linoleum pieces to give a tiled stack of sheets and d) calendering the tiled stack of sheets to give a patterned linoleum sheet. The invention further relates to a patterned linoleum sheet obtained by said method and the use thereof.

Abstract: An apparatus and method for degating is provided for separating excess molding material from encapsulated electronic packages while the electronic packages are located in a molding system. At least one holding device is coupled to a mold of the molding system, which is located such that excess molding material is molded onto at least a portion of the holding device during molding. A locking feature on the portion of the holding device locks the excess molding material such that the holding device may hold the excess molding material molded onto it to forcibly separate the excess molding material from the encapsulated electronic packages after molding.

Abstract: A method and apparatus that permits the shrinking of recycled multilayered plastic film by means of two molds which have been treated with a release agent and one of the molds being transparent or translucent that are flat or nearly flat that permits viewing of the sandwiched recycled shrinking plastic film. Also the remolding of a shrunken recycled multilayered plastic film by means of a mold. The recycled shrunk or remolded shrunk plastic film can be used as, but not limited to, ornamental or decorative or fastening. This invention can be fastened to different surfaces or materials.

Abstract: A pattern forming method for forming a pattern on a pattern forming material on a substrate by using an imprint pattern provided to a mold is constituted by preparing a substrate having thereon a pattern forming area, disposing the pattern forming material placed in an uncured state in the pattern forming area in a dispersion state at a plurality of positions at different intervals, and curing the pattern forming material in a state in which the pattern forming material is deformed in a shape corresponding to a shape of the imprint pattern provided to the mold.

Abstract: A method for producing a composite part from a first molded part and a second molded part via injection molding, injection compression molding or back compression molding of a plastic material, includes the following steps: producing the first molded part from a first plastic via such molding of the first plastic such that the first molded part features at least one elevation on one side, removing a segment of the first molded part and arranging the second molded part on the first molded part instead of the removed segment so that the respective elevation is situated on an edge of the second molded part, and applying a layer of a second plastic on the second molded part on the side facing away from the first molded part via injection molding, injection compression molding or back compression molding of the second plastic.

Abstract: A method for making an article of footwear is disclosed. The method can include a number of steps where various molds are used to attach or mold a tread element onto a substrate or matrix lining. The tread element can be formed by compressing a rubber block between various molding members to liquefy and cause the resulting rubber material to flow into at least one lug cavity disposed near the matrix lining. The rubber material eventually enters the lug cavity and becomes attached to the matrix lining.

Abstract: A film coated with a metal foil is embossed beforehand with a shape conformed to a formed article. Injection molding is performed, with the embossed film coated with the metal foil being sandwiched between an injection molding male mold and an injection molding female mold. As a result, the metal foil of the film coated with the metal foil is transferred to a product having a deeply concavo-convex surface, without damage to the metal foil, with the quality of the product being ensured.

Abstract: A method for making an article of footwear is disclosed. The method can include a number of steps where various molds are used to attach or mold a tread element onto a substrate or matrix lining. The tread element can be formed by compressing a rubber block between various molding members to cause the resulting rubber material to flow through at least one injection cavity, which penetrates through holes in the matrix lining, into at least one lug cavity disposed on the side of the matrix lining opposite to the injection cavity. The rubber material eventually enters the lug cavity and becomes attached to the matrix lining.

Abstract: Disclosed is a process to produce thermoformed articles comprising a coupled propylene polymer composition.

Abstract: A resin infusion system uses a housing that has an upper flexible diaphragm and a lower flexible diaphragm such that the two diaphragms form a cavity. A fiber reinforcement mat is positioned within the cavity. A mold is positioned below the lower diaphragm. A flow plate has a series of V-shaped grooves and is positioned either underneath the lower diaphragm or overtop the upper diaphragm so that the grooves press into the respective diaphragm. A vacuum is created within the housing causing resin to be drawn into the cavity with the resin interacting with the grooves increasing the turbulence of the resin flow. Once the reinforcement mat is properly wetted, the mold is pressed into the lower diaphragm.

Abstract: The short-pulse laser light 9 emitted from the short-pulse laser light source 1 is focused on and caused to irradiate an organic crystal 8 contained in a sample container 6 via a shutter 2, intensity adjusting element 3, irradiation position control mechanism 4, and focusing optical system 5. The sample container 6 is carried on a stage 7, and can be moved in three dimensions along the x axis, y axis and z axis in an x-y-z orthogonal coordinate system with the direction of the optical axis being taken as the z axis; furthermore, the sample container 6 can be rotated about the z axis. Working of the organic crystal 8 is performed by means of short-pulse laser light that is focused on and caused to irradiate the surface of the organic crystal 8. Prior to working, nitrogen is caused to jet onto the sample container 6 by a low-temperature gas jet device C that is a cooling device; consequently, the organic crystal 8 is cooled to ?150° C. or below.

Abstract: Methods and devices relating to polymer-bioceramic composite implantable medical devices are disclosed.

Abstract: A method for the extrusion of preforms (1), which exit from a die gap of an extrusion head (4) delimited by a mandrel (2) and a die ring (3), and are widened in a blow mold (5). The width of the die gap is changed during the extrusion of the preforms, by means of a setting movement of the mandrel and/or of the die ring. The cross-sectional geometry of an elastically deformable sleeve (9) disposed on the extrusion head (4) and delimiting the die gap on the circumference side is also changed during the extrusion of the preforms. By means of setting movements of an additional element (10) that is controlled or regulated separately, the melt distribution on the circumference side is changed at least in that section of the preforms (1) that is widened to form an upper barrel end in the blow mold (5).

Abstract: A hoisting mechanism for raising a ladle filled with liquid steel from a transfer vehicle to immersion pipes of a vacuum treatment tank of an RH degasser. Two lifting arms are provided, one end of which can be brought into engagement with a support device formed on the ladle, and a bearing end of the arms is supported in a stationary saddle support comprised in such a way of a runway, disposed on the bearing ends of the lifting arms and having the shape of a circular arc, and of a path of rolling contact, adapted to axially fixedly guide the runway during pivoting of the lifting arms, that due to shifting of the point of load introduction in the saddle support occurring during a raising movement, reduction of a horizontal movement of the ladle occurs.

Abstract: A suspension system for a seat of a vehicle comprises a base, a linkage, and a seat attached to the base via the linkage. A pneumatic shock absorber provides a respective resistance level against movement of the seat with respect to the base based on a corresponding pressure level of air or gas within the pneumatic shock absorber. An output member of a linear motor is connected to the seat via a bracket. A first sensor is arranged to detect first sensor data associated with an instantaneous position of the seat versus time. A controller generates at least one of a first control signal for the linear motor to change a height of the seat in opposition to a change in the instantaneous position of the seat and a second control signal to change the pressure level.

Abstract: A vibration-sensitive module having a mounting flange is mounted to a vibrational base with a bushing assembly secured to the base, where the mounting flange has cammed surfaces radially adjacent to the bushing assembly that variably engage the radial peripheries of the bushings in response to vibrational movement of the base. The cammed surfaces produce a desired force vs. deflection characteristic of the mounting apparatus, and the bushing material retains its compressibility under load to minimize cross-coupling of vibrational force impulses.

Abstract: A damper device used in a range of electronic apparatuses. The damper device allows a diverse opening and closing operations by means of a simple structure. A stationary plate and a movable plate resiliently contact, due to the action of a spring, over different contact areas as a movable shaft rotates. This enables a change in a damping force in accordance with opening and closing angles. Accordingly the damper device which allows diverse opening and closing operations, such as to open at a constant speed from immediately after starting to open, is achievable by means of a simple structure.

Abstract: A strut type shock absorber (1) comprises an outer shell (2) and a knuckle bracket (3). A curved portion (4) of the knuckle bracket (3) positioned in close contact with the outer shell (2) comprises a reinforcing flange (7) formed by bending a part of an axial end of the curved portion (4) outward and a no-flange portion (6), both of which are welded onto the outer shell (2). By setting an axial distance (H) from an inflection start point to an inflection end point of the outer circumferential surface of the reinforcing flange (7) to be equal to an axial distance from the inflection start point to the no-flange portion (6), and by forming an insulation portion (9) between the reinforcing flange (7) and the no-flange portion (6), an effectual welding operation and the prevention of molten metal from flowing over the reinforcing flange (7) during welding are realized.