Abstract: An apparatus which provides improved fluidic control includes a circumferentially extending windage plate adapted for placement adjacent a rotatable disc surface. The plate operates to direct fluidic currents established by rotation of the surface. One or more snubber members are supported by the plate to prevent localized contact between the plate and the surface as a result of deflection induced by application of a mechanical shock. Preferably, an access element is moveable along a movement path adjacent the rotatable surface. An air dam comprising a localized increased thickness portion of the plate at a leading or trailing edge of the plate preferably further directs the fluidic flow, and the snubber member-further prevents contact between the air dam and the rotatable surface. The rotatable surface preferably comprises a data recording surface and the access element preferably comprises a data transducing head.

Abstract: An apparatus separating a resonance excitation response of a first disc from a resonance excitation response of second disc, the apparatus includes spindle motor with a spindle motor hub supporting the first disc, a disc spacer communicating with the first disc supporting a second disc and a clamp ring attached to this on the motor hub imparting a clamping force on the second disc to form a disc pack. Separation of resonance response between the first disc and the second disc results from maintaining a distinction between an amount of extension of mass and stiffness of each disc available for resonance excitation beyond respective outboard clamping points of the disc spacer. Separation of resonance assures resonance of the first disc is dissipated by a damping of the spindle motor, as well as resonance of the second disc is dissipated by the damping of the spindle motor.

Abstract: A composite ring for coupling a disk to a spindle includes a upper layer constructed of a material having a hardness at least as hard as a primary material of the disk. A lower layer is fixedly coupled to the upper layer and constructed of a material having similar properties to that of the disk, the properties being selected from a group consisting of a coefficient of thermal expansion and Young's modulus.

Abstract: A magnetic write head for recording data having reduced erasure caused by a magnetic field is disclosed. The magnetic write head include a main pole and a conductive coil positioned adjacent the main pole. The conductive coil is insulated from the main pole. The magnetic write head includes means for directing a magnetic field produced by the conductive coil toward the main pole.

Abstract: There is provided a thin film magnetic head, with letting a distance of a portion, where a width of a track portion in an upper magnetic pole changes, from a flying plane from a medium be Ly, and letting a distance of a portion, where a distance between right and left of a surface portion in a lower magnetic pole in a track width direction is wider than the width of the upper magnetic pole in the track width direction, from the flying plane from a medium be Tp, by creating a thin film magnetic head that is equipped with a recording head that has a relation of Tp?Ly, it becomes possible to reduce a needless leakage magnetic field in the track width direction with securing magnetic field strength.

Abstract: A magnetic head for writing information on a relatively-moving medium has a pair of substantially flat soft magnetic pole layers separated by a pair of coil layers. A soft magnetic pedestal adjoins the leading pole layer adjacent to a medium-facing surface and is spaced from the second pole layer by a nanoscale nonferromagnetic gap, the pedestal having a layer of high magnetic saturation material that defines a throat height and extends beyond the throat height. A second high magnetic saturation material adjoins the trailing pole layer and either terminates at the throat height to form a second pedestal or extends to reach a magnetic backgap structure that magnetically couples the pole layers. The MR sensor can be located closer than the write transducer to the trailing end of the head to reduce separation between the read transducer and the write transducer.

Abstract: A magnetic head including a media heating device including an optical cavity resonator that produces a high intensity near-field optical beam adjacent to the write pole. Optical energy is coupled into the resonant cavity through a waveguide that is placed proximate the cavity, and optical energy is coupled out of the cavity through an aperture that is placed proximate an antinode or post within the cavity. The write pole tip may serve as the post in certain embodiments. The media heating device is preferably fabricated between the first and second magnetic pole layers of a perpendicular magnetic head and close to the ABS surface of the head. An alternative embodiment may include a near field aperture disposed between the resonant cavity and the ABS.

Abstract: A thin film magnetic read/write head for use in magnetic data storage systems to enable writing of data to a magnetic data storage medium with the assistance of laser heating. The read/write head allows magnetic reading of data from the storage medium, and thermally assisted magnetic writing of data on the storage medium. A waveguide is provided in a write gap in the form of an optical circuit having a plurality of inputs and a single output at the air bearing surface (ABS) for concentrating laser light used for heating the storage medium during the write operation. The thermally assisted magnetic writing improves the thermal stability of the recorded data and usefulness thereof throughout a wide temperature range.

Abstract: A magnetic sensing element using a Heusler alloy is provided. In the magnetic sensing element, a free magnetic layer composed of a Heusler alloy layer is disposed on a nonmagnetic layer that corresponds to an fcc layer having the face-centered cubic (fcc) structure. Equivalent crystal planes represented as [111] planes in the fcc structure, which are the closest packed planes, are exposed on the surface of the nonmagnetic layer.

Abstract: A first magnetic sublayer constituting a pinned magnetic layer is provided in contact with a first magnetostriction-enhancing layer to increase the magnetostriction constant of the first magnetic sublayer. In addition, a nonmagnetic intermediate sublayer constituting the pinned magnetic layer is made of a material having a lattice constant larger than that of Ru, such as a Ru—X alloy, to distort the crystal structures of the first magnetic sublayer and a second magnetic sublayer each in contact with the nonmagnetic intermediate sublayer, increasing the magnetostriction constants of the first magnetic sublayer and the second magnetic sublayer.

Abstract: A magnetoresistive sensor having hard bias layers constructed of CoPtCrB, which high coercivity when deposited over crystalline materials such as an AFM layer or other sensor material. The bias layer material exhibits high coercivity and high moment even when deposited over a crystalline structure such as that of an underlying sensor material by not assuming the crystalline structure of the underlying crystalline layer. The bias layer material is especially beneficial for use in a partial mill sensor design wherein a portion of the sensor layers extends beyond the active area of the sensor and the bias layer must be deposited on the extended portion of sensor material.

Abstract: A magnetoresistive sensor comprises a pinned layer having a magnetization direction fixed with respect to an external magnetic field, a free layer, having a magnetization direction variable in accordance with the external magnetic field, and a spacer layer mainly containing copper, sandwiched between the pinned layer and the free layer. A sense current flows through the pinned layer, the spacer layer, and the free layer substantially in a direction in which the layers are stacked.

Abstract: According to the invention, in order to suppress a latch-up, the supply voltage is switched off following the detection of a latch-up, charge located in the circuit is reduced with the air of a short-circuiting switch, and the detection of a low voltage is temporarily canceled when the supply voltage is gradually increased again. A protective circuit is assigned to an electronic circuit in order to protect the radiation-sensitive components thereof, the electronic circuit being subdivided into groups of active circuit components accepting a similar amount of current in a predefined area and a protective circuit being assigned to at least one of the groups of active circuit components accepting approximately the same amount of current in a predefined area. In order to prevent the output current from influencing the output voltage, a current-detecting unit is mounted upstream of a voltage-regulating unit.

Abstract: A connector includes a base board having at least four contacts provided on each of two opposite sides thereof. The contacts on the second side of the base board are arranged in the reverse order relative to the contacts on the first side of the base board, and some of the contacts on the first and the second side of the base board are electrically connected to one another to enable the connector to plug in and electrically connect to a corresponding female connector.

Abstract: A overheat protection circuit is formed on the same semiconductor substrate as a power MOS FET is formed on.

Abstract: A power supply for an RF transmitting tube while protecting the tube from a high voltage arc event. The supply includes a rectifier circuit configured to be connected to an AC voltage supply and having an output circuit that supplies a DC voltage to a load including the tube and wherein the DC voltage may have a ripple voltage thereon. A control circuit is located intermediate the output circuit and the load for reducing any ripple voltage. The control circuit includes a series solid state switch that is connected in series between the rectifier circuit and the load. The control circuit also includes a reference capacitor coupled to the output circuit and to the load for supplying a reference voltage to the switch so that a voltage at the output circuit that exceeds the reference voltage will be clipped to reduce the voltage that is applied to the load.

Abstract: A tunable element in the microwave frequency range is described that may include one or more tunable elements that are directly digitally controlled by a digital bus connecting a digital control circuit to each controlled element. In particular, each digital signal is filtered by a digital isolation technique so that the signal reaches the tunable elements with very low noise. The low noise digital signals are then converted to analog control voltages. The direct D/A conversion is accomplished by a special D/A converter which is manufactured as an integral part of a substrate. This D/A converter in accordance with the invention may consist of a resistor ladder or a directly digitally controlled capacitor. The direct digitally controlled capacitor may be a cantilevered type capacitor having multiple separate electrodes or sub-plates representing binary bits that may be used to control the capacitor.

Abstract: An electro-magnetic interference filter terminal assembly for active implantable medical devices includes a structural pad in the form of a substrate or attached wire bond pad, for convenient attachment of wires from the circuitry inside the implantable medical device to the capacitor structure via thermal or ultrasonic bonding, soldering or the like while shielding the capacitor from forces applied to the assembly during attachment of the wires.

Abstract: A monolithic capacitor includes a main capacitor unit having first capacitor portions and a second capacitor portion arranged in a direction of lamination, with the first capacitor portion located towards at least one end in the direction of lamination, so that the first capacitor portion is located closer to a mounting surface than the second capacitor portion. The number of pairs of third and fourth lead-out portions for third and fourth internal electrodes in the second capacitor portion is less than the number of pairs of first and second lead-out portions for first and second internal electrodes in the first capacitor portion, so that the first capacitor portion contributes to decreasing ESL while the second capacitor portion contributes to increasing ESR.

Abstract: A laminated ceramic capacitor includes a body having an inner layer portion and an outer layer portion and a plurality of terminal electrodes spaced apart from each other in a length direction of the body. The inner layer portion has a plurality of internal electrodes stacked in a height direction of the body. The internal electrodes have led-out portions led out to a side face of the body. The outer layer portion is disposed on one of opposite faces of the inner layer portion in the height direction. Each terminal electrode extends along the height direction to cover corresponding one of the led-out portions and is provided with an intermediate portion and an end portion. The intermediate portion has a larger electrode width than the led-out portion. The end portion has a smaller electrode width at an edge of the side face than the intermediate portion.

Abstract: The present invention relates to an electrochemical capacitor, and provides an electrochemical capacitor which has a fully lowered internal resistance and can yield excellent charging/discharging characteristics. The electrochemical capacitor of the present invention is mainly constituted by an anode and a cathode which oppose each other, an insulating separator disposed between the anode and cathode adjacent thereto, an electrolytic solution, and a casing accommodating them in a closed state. The anode contains a substantially spherical carbon material having an electronic conductivity as a constituent material, whereas the cathode contains a fibrous carbon material having an electronic conductivity as a constituent material.

Abstract: The substation has at least one outdoor busbar (11, 12) as well as at least two switch bays which can be connected to the busbar and at least one encapsulated, gas-insulated, arrangement of switchgear modules (30) which is arranged in one of the switch bays. This switchgear arrangement contains at least one disconnector module (DS) and at least one circuit breaker module (CB). An installation module (MM) is arranged between the disconnector module and the circuit breaker module and allows lateral removal of at least one of the two switchgear modules (DS, CB). This substation is distinguished by high availability, since each of the most severely loaded components of the encapsulated switchgear arrangement, that is to say the disconnector module and the circuit breaker module, can be removed from the substation by lateral removal without having to change the position of the other components.

Abstract: A switching installation (5) having a circuit breaker (12), which is connected to a cable connection (33), and optionally a disconnector (14) for making or breaking a conductive connection between the cable connection (33) and a rail system (15), and an electrically insulating barrier (10). The electrically insulating barrier (10) surrounds at least the parts which are under electric voltage in operation from the circuit breaker (12) to the rail system (15), including a branch (18) leading to a rail (15) of the rail system, separately for each phase of the switching installation (5). Furthermore, inside the electrically insulating barrier (10) the switching installation may be provided with field-control means and/or voltage-sealing means (22, 25, 37).

Abstract: A flat-panel display with fixtures in its sidewalls to enable support by lateral mounting members is disclosed. The advantage of this approach, in which the fixtures are essentially rotated around to the sides of the flat-panel display, is the reduction in the portion of the portable computer's top cover that is not the active display. In practice, this results in an increase in the size of the display that may be housed in the same-sized top cover. In order to accommodate the lateral mounting of the flat-panel display, metal brackets are used. These brackets extend from the base unit hinges and cradle the display. This adds torsional rigidity, but also removes the requirement that the back must be structural. Further reductions in the inactive portions of the top cover may be achieved by extending the ends of the display's fluorescent back-light beyond or through the metal rim that surrounds the display.

Abstract: An electrical connector device for an enclosure is provided. The electrical connector device includes an outer frame that is configured to at least partially surround an enclosure. The outer frame includes a plurality of mutually coupled sidewalls. The outer frame also includes an inner surface for coupling adjacent to the enclosure. An electrical connector body is included with one of the plurality of sidewalls of the outer frame.

Abstract: An electronic apparatus includes a package, a circuit board, a thermal dissipating module and a thermal transmitting module. The package includes a substrate, a heat source and a plurality of electric terminals electrically connected to the circuit board. The heat source and the electric terminals are disposed on a surface of the substrate facing to the circuit board. The heat source is located between the substrate and the circuit board. The thermal transmitting module passes through the electric connection structures between the package and the circuit board and connects the heat source of the package with the thermal dissipating module. Thus, the thermal transmitting module enhances the thermal dissipating efficiency for the heat source of the package and improves the reliability of the electronic apparatus.

Abstract: A heat dissipation structure connected to switching elements that control charge and discharge of a secondary battery module, the heat dissipation structure includes a pair of side frames to which charge-purpose switching elements and discharge-purpose switching elements are coupled, respectively, a main frame for interconnecting the side frames and a plurality of heat dissipation ribs protruding upward from the main frame while the heat dissipation ribs are arranged in parallel with each other, whereby the heat dissipation structure is constructed in a rectangular compact shape.

Abstract: A modularized redundant heat sink for dissipating heat generated from chips includes an independent rectangular fin whose sides are provided with at least more than two elastic pins, and which is provided with a bottom surface for conducting temperature; a circuit board on which are welded with at least more than two chips having upper surfaces. A bottom surface of the fin is attached to the upper surfaces of at least more than two chips through a heat conducting glue, so as to provide a temperature conducting and heat dissipating to at least more than two chips by one fin.

Abstract: According to one embodiment, an electronic apparatus includes: a casing having a bottom portion; a circuit board housed in the casing, the circuit board having first and second areas; a heating element mounted on the first area of the circuit board; an elastically-deformable partition member interposed between the circuit board and the bottom portion and surrounding the first area; and a fan having an air take-in port through which air in the first area is taken in.

Abstract: A air shroud for dissipating heat from an electronic component is composed of a air shroud of a roughly U-shaped cross section, whose left and right sides are formed into a first and a second opening, respectively. A passage is formed between the first and second openings, enabling air to flow along a specific direction. A flexible thin piece is fixed inside the air shroud which covers a specific electronic component on a circuit board, and the flexible thin piece is touched with a surface of the electronic component. The fast-flowing air flows quickly along the passage, so as to effectively cool down a working temperature of the specific electronic component, thereby increasing a lifetime of usage of the specific electronic component.

Abstract: A heat dissipating device of the present invention includes a heat sink (20) and two locking devices (10) for securing the heat sink. The heat sink includes a base (22) for contacting an electronic component. Each locking device includes a spring member, a post (12) and a sleeve (18). The spring member elastically rests on the base. The post extends through the sleeve. The post has one end engaging with the spring member, and an opposite end thereof extending beyond the sleeve for locking the combination. The sleeve has one end tightly grasping the post, and an opposite end thereof preventing the locking device from departing from the heat sink.

Abstract: A system for maintaining an IC-chip near a set-point temperature while electrical power dissipation in the IC-chip is varied includes a container having an open end with a seal ring. Located in the container is at least one nozzle for spraying liquid coolant droplets on a portion of an IC-module which holds the IC-chip. This spraying of the liquid coolant occurs while the seal ring is pressed against the IC-module. Also, a pressure reducing means is coupled to the container for producing a sub-atmospheric pressure in the space between the container and the IC-module while the seal ring is pressed against the IC-module.

Abstract: A heat sink has a plurality of pipes that are connected to an array of magnets. The plurality of pipes are connected to a lid that is operatively connected to an integrated circuit. Temperature sensors are disposed on the lid to measure temperatures of hot spots of the integrated circuit. Dependent on a temperature of one of the hot spots, the array of magnets may be used to propagate thermally conductive fluid toward the hot spot through the lid using the plurality of pipes.

Abstract: An electrical assembly comprising plurality of heat producing devices in direct thermal contact with perforated heat pipe film. Direct benefits of this invention for circuit board packages are weight reduction, volume reduction, increase of allowable heat dissipation.

Abstract: An apparatus for transferring heat from an electrical module includes: (a) a thermally conductive base member having a plurality of edges establishing a polygonal perimeter and having a first side for presentation toward the electrical module; and (b) a heat transferring structure integrally formed with the base member and extending from a second side of the base member opposite from the first side. The heat transferring structure occupies less than all of the second side and establishes a margin substantially about the perimeter.

Abstract: Remote enclosure systems have now been designed that meet the following goals: a) consolidate electrical terminations in one system; b) pre-terminate AC and DC equipment loads before site installation; c) provide multiple access points for facilitating equipment repair and installation; d) are easily configurable and expanded through the use of a modular frame design that accommodates a variety of customized side panels or the attachment of a variety of expansion cabinets; e) are aesthetically functional given the cable entry and routing structure; f) provide exceptional thermal management and g) reduce problems inherent in conventional electronic setups. Remote enclosure systems contemplated generally include: a) a frame system further comprising at least two side panels; b) at least one door coupled to the frame system; c) a cable management top assembly coupled to the frame system; d) at least one removable radiofrequency (RF) management system and e) a bottom panel coupled to the frame system.

Abstract: A computer enclosure includes a base (10), a first retaining member (20) and a bracket (40). The base has a side panel (12) and a top panel (11) extending from one edge of the side panel. The first retaining member and a second retaining member are separately fixed on the side panel for securing a circuit board. The bracket is attached to the first retaining member. The top panel of the base and the first retaining member are shared with the bracket to form a cage for receiving a storage device.

Abstract: A casing that has an electronic component housed therein has a conductive layer made of a mixture of carbon fibers and a thermoplastic resin and an insulating layer where only the thermoplastic resin is exposed on a surface of the conductive layer. The casing prevents leakage of unwanted electromagnetic waves from inside, is not affected by external electromagnetic waves, has small thickness, light weight, high strength and high rigidity, and has excellent contactability with a coating.

Abstract: The present invention provides a securing device for securing a card to a socket within a computer is provided where the card and the socket are coupled. The device includes a unitary base member comprising a foundation portion dimensioned to receive a stationary socket and an arm portion orthogonally positioned relative to the foundation. A first engaging means is formed on at least one side of the arm member. The device also includes a clasp assembly that includes an opening for slideably receiving the arm portion of the unitary base member, a recess for receiving a non-connecting end of a card, and a second engaging means for securely engaging the first engaging means. The clasp assembly secures the card to the socket with the socket received in the foundation portion and edge of the card is received in the recess.

Abstract: The present invention provides a thin-film embedded capacitance having a substantial electrostatic capacity per unit area, and a method for manufacturing thereof. A thin film embedded capacitance comprising: a metallic thin-film for wiring made of a metallic material in a non-yield state; the first electrode formed on the film for wiring; a dielectric material layer formed on the first electrode and the film for wiring, at a temperature not lower than ordinary room temperature to lower than a yield temperature of the film for wiring, having a coefficient of thermal expansion lower than that the film for wiring; and the second electrode formed on the dielectric material layer, and a method for manufacturing thereof.

Abstract: Disclosed are embodiments of an integrated circuit die interconnection interposer suited to controlled high performance transmission of electronic or optical signals or combinations thereof. The various embodiments are designed to provide direct path interconnections away from the surface of one or more integrated circuit die. The structures are amenable to improved thermal management and can be fabricated on at semiconductor wafer.

Abstract: An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a connector on the printed circuit board, and at least one capacitor on the printed circuit board. The connector is configured to fit into one of the expansion slots on the motherboard, and comprises at least one power pin and at least one ground pin. The at least one capacitor is connected to the power and ground pins of the connector and has sufficient capacitance to buffer power transients within the supply power to the expansion slots.

Abstract: An exemplary mounting apparatus for aiding in mounting a plurality of long expansion cards in electrical devices includes a locating member, and a retention member rotatably attached to the locating member. The locating member includes a base wall, a pair of sidewalls, and a top wall. Pairs of guiding rails extend from the base wall for slidably receiving ends of the expansion cards opposite to ends with cover plates. Two pairs of first positioning blocks extend from the top wall. The retention member includes a base plate, a pair of flanges, and a pair of resilient arms. A plurality of retaining tabs extends from the base plate to abut against top edges of the expansion cards. The flanges are rotatably attached to the sidewalls of the locating member. The resilient arms each include a pair of second positioning blocks for engaging with the first positioning blocks of the locating member.

Abstract: A distribution box for enclosing an electrical connection in an electrical wiring system includes a housing that is resistive to penetration by electromagnetic fields and a plurality of electrical conductors that form the electrical connection. A mirror plate is disposed within the housing and generates mirror currents to suppress electromagnetic fields generated by current flowing through the plurality of electrical conductors.

Abstract: A method and components are provided for implementing EMC shielded resonance damping of a printed circuit board. The EMC shielded resonance damping component includes a capacitor and resistor formed in series combination and contained within a shielded enclosure. A pair of coaxial pads is provided for connection to the printed circuit board. The series combination of the capacitor and resistor is connected between a first pad of a pair of coaxial pads and an interior wall of the shielded enclosure. The shielded enclosure provides a return current path to a second pad of the pair of coaxial pads through the series components.

Abstract: A switching regulator includes a transformer having a primary winding and an auxiliary winding connected to the supply rail of the switching regulator. The primary winding is coupled to the positive supply rail. The auxiliary winding is coupled to the negative supply rail. A switch is connected in series with the primary winding and the auxiliary winding for switching the transformer. A control circuit is coupled to the switch and the auxiliary winding to generate a switching signal for switching the switch and regulating the output of the switching regulator. A supplied capacitor is connected to the control circuit to supply the power to the control circuit. The auxiliary winding having a leakage inductor stores a stored energy when the switch is on. A diode is coupled from the negative supply rail to the supplied capacitor. The stored energy of the leakage inductor is discharged to the supplied capacitor through the diode once the switch is off.

Abstract: In an electric power transmission device in which a primary side power transmission coil (L1) and a secondary side power receiving coil (L2) are magnetically coupled, and electric power is transmitted from the primary side power transmission coil (L1) to the secondary side power receiving coil (L2) via a non-contact and out of touch, a capacitor (C1) is connected to the primary side power transmission coil (L1) in series, a voltage to be supplied to the primary side power transmission coil (L1) is converted into AC voltage and stepped up, and a series resonance circuit (7) including a mutual inductance (M) by the secondary side power receiving coil (L2) is formed; wherein a resonance point of the series resonance circuit (7) including the mutual inductance (M) by the secondary side power receiving coil (L2) is set to a frequency higher than a resonance point of a primary side series resonance circuit (6) which is composed of the primary side power transmission coil (L1) and the capacitor (C1), whereby a high

Abstract: A capacitor charging circuit does not include a Zener diode and makes it possible to integrate a large number of circuits and elements within a semiconductor integrated circuit. The capacitor charging circuit includes a flyback transformer having a primary coil, a secondary coil, and a tertiary coil, a switching element that turns the current that flows through the primary coil on and off, a capacitor that is charged by a current produced in the secondary coil through the on-off action of the switching element, and a charge control circuit that controls the on-off action of the switching element. When the switching element is off and a voltage produced at a first end of the tertiary coil is larger than a reference voltage corresponding to the predetermined voltage of the charge voltage of the capacitor, the on-off action of the switching element is stopped.

Abstract: The present invention discloses a method for controlling transformer excitation cycles and a circuit for controlling the same, wherein the excitation cycle and the demagnetization cycle, which determine the rise and fall of the excitation current, are modified to prevent the coil from being saturated. In the present invention, a sense current is acquired from the excitation current of the transformer coil, and a demagnetization reference value is set. The sense current is used to determine whether the excitation current is lowered to the demagnetization reference value in the demagnetization cycle. A cycle modifying circuit is used to modify the duty cycle signal output by a pulse control unit until the excitation current is lowered to a preset level.

Abstract: A switching power supply for achieving a constant current drooping characteristic of sufficient accuracy with low cost and the minimum number of components. In the switching power supply, a secondary duty limiter circuit outputs a clock signal from the time a switching element is turned off until the time the on duty of secondary current, which starts flowing to a secondary winding of a transformer, is fixed at a predetermined value. A clock signal selector circuit selects and outputs the clock signal when a load increases and the on duty of the secondary current reaches the predetermined value. Consequently, when the load increases, a direct current output voltage decreases and an output characteristic becomes a constant current drooping characteristic.