Abstract: The present disclosure relates to a power regulator including an inductor and a high-side switch comprising a first MOSFET and a second MOSFET in parallel. The regulator may also include an electrical pathway between the high-side switch and the inductor. A controller may also be communicatively coupled to the high-side switch. The controller may comprise logic to operate the high-side switch by simultaneously enabling the first MOSFET and disabling the second MOSFET.

Abstract: To provide a control circuit of a current mode DC-DC converter, a current mode DC-DC converter and a control method thereof having excellent high-speed responsiveness with respect to fluctuations in output voltage. The control circuit of the current mode DC-DC converter serves as a DC-DC converter 1 that controls a peak value of a coil current and comprises a window comparator that detects whether an output voltage VOUT is within a predetermined voltage range including a target voltage, and a peak current setting unit that sets a peak current setting value of a coil current to a lower limit value or an upper limit value in response to a high or low voltage level of the output voltage VOUT, in the case that the output voltage VOUT is not within the predetermined voltage range including the target voltage.

Abstract: To provide a control circuit for a synchronous rectifier-type DC-DC converter, a synchronous rectifier-type DC-DC converter and a control method thereof in which, in a light load state and a no-load state, an output voltage can be dropped to thus prevent an overshoot state from continuing.

Abstract: A digital multilevel memory system includes a charge pump and a voltage regulator for generating regulated high voltages for various memory operations. The charge pump may include a plurality of boost circuits to boost the output of the charge pump during a fast start up. Afterwards, the boost circuits are disabled to allow the charge pump to generate high voltages without boosting. The boost circuits may be successively enabled to boost the voltage. The boost circuits may be loadless. The voltage regulator may operate in an open loop and may include a resistive divider as a reference voltage for regulating the high voltage from the charge pump. The charge pump may include spread spectrum pump clocking to reduce electromagnetic inference for capacitor or inductor on-chip charge pumping.

Abstract: A voltage generating circuit of semiconductor integrated circuit includes: a voltage controller that detects the level of an external supply voltage and outputs a voltage control signal; a voltage supplier that outputs the external supply voltage or a first internal voltage in response to the voltage control signal; and a first reference voltage generator that is supplied with an output voltage of the voltage supplier and generates a first reference voltage.

Abstract: A voltage regulator architecture for an integrated circuit is described. An apparatus may comprise a power switch array having multiple pass transistors, a voltage regulator array having multiple voltage regulators each coupled to a subset of the pass transistors, a subsystem circuit array having multiple subsystem circuits each coupled to a subset of the pass transistors, and a power management control unit coupled to the pass transistors and the voltage regulators. The power management control unit may be arranged to control the pass transistors and voltage regulators to provide different amounts of power to the subsystem circuits. Other embodiments are described and claimed.

Abstract: The present invention provides a separate type converter. The separate type converter includes a power control module having a power control circuit generating a first control signal, and a power stage module having a power stage circuit coupled to the power control circuit for receiving the first control signal and an input voltage, and generating an output voltage, in which the power control module and the power stage module are separate from each other in an assembling structure.

Abstract: The object of the present invention is a device for the detection of concealed objects which exploits a transceiving system of the microwave type.

Abstract: The present invention relates to a quick reference electrical voltage testing tool utilizing a variable voltage range light bulb and digital read out voltage meter both incorporated in the testing tool's handle. The variable voltage range light bulb indicates to the user the knowledge of voltage present and the digital voltage read out indicates the measured amount of voltage available to the tested component. This allows for a faster diagnosis of an electrical problem particularly when voltage sensitive components are being tested. When testing electrical components for non-operation, this quick reference tool will allow a much quicker diagnoses of an electrical problem without the need of a voltage meter.

Abstract: A measurement apparatus that measures a current consumed by an electronic device is provided.

Abstract: A direct current measuring apparatus includes a voltage generating part generating a voltage to be applied to a load being a measuring object; a current limiting part limiting a current flowing in the load to a set value; and an output terminal connected to the load. The current limiting part includes a D/A converter, a positive side limiting circuit, a D/A converter and a negative side limiting circuit. The positive side limiting circuit includes a negative feedback loop. The negative feedback loop includes a capacitor and a buffer circuit besides the feedback resistance. An output of the positive side limiting circuit positive side limiting circuit is connected to a non-inverting input terminal of the main amplifier through a diode.

Abstract: An apparatus and a method for monitoring a ratio of at least two components being mixed use sensors detecting ferrous taggant particles in the component(s) and the mixture. The sensors include an annular drive coil positioned between inner and outer annular sense coils all surrounding a passage for material being sensed. The ratio is determined by comparing a signal generated by one sensor through which a taggant particle containing component is flowing with a signal generated by another sensor through which the mixture is flowing delayed by the time required for the component to flow from the one sensor to the another sensor. The signals can also be used to control the flow of the components and to check the mixture after use.

Abstract: In one embodiment, a sensor assembly for measuring an angular position of a rotatable structure includes an annular ring that is eccentrically rotatable about an axis, a first and second sensors, and an sensor transducing circuit for combining the respective output levels from the two sensors. The first and second sensors are rotatable relative to the annular ring and disposed a predetermined distance from the axis such that the first and second sensors have a first and second output level respectively that is proportional to the angular position of the annular ring. The sensor transducing circuit is operable to proportionally combine the first and second output levels into an output signal based upon a weighting factor, the weighting factor being proportional to angular position of at least one of the first and second sensors.

Abstract: To provide a rotation detecting apparatus capable of increasing the angle detecting precision without being affected by an offset signal resulting from a stress in a silicon chip, the rotation detecting apparatus 3 includes a magnetic sensor array 5 and a magnet 4 rotatable in face-to-face relation with the magnetic sensor array 5. The magnetic sensor array includes a plurality of groups 16 of sensor elements each group 16 including four sensor elements. The four sensor elements 5a to 5d of each combined sensor element group 16 are so arranged as to be oriented vertically and horizontally in four directions and connected parallel to each other.

Abstract: The present invention relates to a method for evaluating the wall thickness of a hollow part, of the turbomachine blade type, at least at a point having a determined radius of curvature at this point, within determined ranges of radii of curvature and thicknesses, comprising the determination of impedance values of an electrical circuit formed by an eddy current detector (20) applied to the wall, and the insertion of these values into a digital processing unit with a neural network, wherein the network parameters have been defined in advance by learning on spacers having a determined radius of curvature and thickness in said ranges.

Abstract: A set of magnets, e.g., electromagnets, are used to produce an in-plane magnetic field with respect to an article under test or manufacture. The set of electromagnets includes electromagnets that are positioned above and below the plane of symmetry respectively. The bottom electromagnets may be positioned below the surface of the chuck for example. The plane of the article and/or set of electromagnets are positioned so that the plane of symmetry approximately coincides with the article. The set of electromagnets may include individual electromagnets or C-core electromagnets, which may produce magnetic fields with complementary polarities near the field of symmetry both above and below the field of symmetry. Magnetic fields with the same polarity are positioned near each other on opposite sides of the plane of symmetry to produce the in-plane magnetic field. A second set of electromagnets may be used to provide field rotation if desired.

Abstract: An inspection system positions a balancing shim to asymmetrically balance a magnetic field generated by an inductive sensor, which forms part of the inspection system. Additionally, relays and capacitors used to tune the inductive sensor to a desired resonance frequency are geometrically arranged to minimize electrical interference generated by operation of the relays and capacitors. A shielding device, which may be formed on a printed circuit board, protects a magnetic field generated by the inductive sensor from external electromagnetic interference. A slot positioned in the inductive sensor may be used to tune a resonant mode of the inductive sensor to accurately and particularly detect metallic shanks and/or other metallic objects in shoes, socks, and/or clothing.

Abstract: There is provided an MRI apparatus that is capable of imaging ON/OFF in response to a biological gating signal and changing conditions for imaging, even while the moving bed imaging is performed, and further reducing a load on a subject to be examined, which is caused by fluctuations in the bed moving velocity. A controller that controls a bed to transport the examined subject in a static magnetic field and a unit to apply an RF magnetic field and a gradient magnetic field for imaging configures settings so that the bed moving velocity is kept constant considering an entire imaging time, and further controls the magnetic applying unit for applying the RF magnetic field and the gradient magnetic field so that a moving velocity of the FOV (imaging area) in the subject coordinate system is made different from the bed moving velocity.

Abstract: In one aspect, a method of inducing nuclear magnetic resonance (NMR) signals from a region of an object to be imaged is provided. The method comprises applying to the region a preparation sequence configured to substantially establish a zero flip-angle pseudo steady state (PSS) for the region, applying to the region a transitioning sequence configured to transition the zero flip-angle PSS to a higher target flip-angle PSS, and applying a radio frequency (RF) pulse sequence configured to cause the region to emit detectable NMR signals.

Abstract: A signal line is drawn from a generally middle point of the antenna coil, and a capacitance-variable capacitors are connected at both sides of the antenna coil. This structure realizes a circuit in which a series resonance circuit composed of an antenna coil and a capacitor and an another series resonance circuit composed of an another antenna coil and an another capacitor are connected in parallel to each other across the generally middle point of the antenna coil to which the signal line is connected. Through the control of the resonance frequencies of the series resonance circuits, the parallel resonance frequency of the whole antenna is tuned to a desired frequency, and the resonance characteristic in which the impedance is matched to a specific value, e.g., 50 ?, can be achieved.

Abstract: A RF coil according to the invention is made up of an 8-shaped coil having a crossed conductive path, and an impedance adjustment coil that performs connection between crossing points of the conductive path. The crossing points of the conductive path are connected in parallel by the impedance adjustment coil and a floating capacitance between the crossing points of the conductive path. An impedance between the crossing points of the conductive path is increased, and a current that flows between the crossing points of the conductive path reduces in a Larmor frequency that is in proportion to the intensity of the magnetostatic field of an MRI apparatus. The RF coil according to the invention is made up of an 8-shaped coil having a crossed conductive path, an impedance adjustment coil that performs connection between the crossing points of the conductive path in parallel, and an impedance adjustment coil.

Abstract: A radio-frequency (RF) resonator system, in particular, for a magnetic resonance (MR) probe, comprising at least one RF resonator with a substrate, on which a conductive structure is applied, wherein the conductive structure comprises regions of capacitive and inductive elements, is characterized in that the conductive structure is coated at least in the regions of the capacitive elements with at least one dielectric layer that covers the regions of the capacitive elements at least partially, wherein the local thickness of at least one of the dielectric layers is set in dependence on the resonance frequency of the uncoated RF resonator, on a defined resonance frequency of the resonator once it is coated, on the dielectric constant of the substrate and on the dielectric constant of the materials of the dielectric layers.

Abstract: A method for determining a property of earth formations surrounding a borehole includes the following steps: deriving a fluid sample downhole in the borehole, subjecting the sample while downhole to a magnetic field; measuring a magneto-optical shift of a beam of electromagnetic radiation passed through the sample, and determining the property from the measured magneto-optical shift.

Abstract: Arrangements, apparatus and associated methods are described for use in a multi-frequency boring tool locating system. The boring tool includes a transmitter for transmitting a locating signal at two or more selectable frequencies. One set of above ground procedures may be applied to the transmitter in order to change the frequency of the boring tool transmitter. Another set of procedures is applicable for changing the frequency during below ground drilling operations, for example, by subjecting the boring tool to a predetermined roll orientation sequence. An enhanced portable locator operates in a manual or automatic mode to receive locating frequency information transmitted from the boring tool transmitter including frequency updates. Boring tool transmitter, as well as above ground locator shutdown/restart procedures are described relating to multi-frequency operation. A tone detector is described which implements one or more digital match filters.

Abstract: An underground digital locating system includes a receiver capable of acquiring a signal produced by an underground object and displaying a digital representation of the orientation of underground object and of its depth. The system includes a carrying case for the digital locating receiver, the carrying case further including a transmitter for energizing underground objects to emit a magnetic field. A method of locating an underground object using the described system is also disclosed, as well as methods of measuring a flux field and translating a flux field signal of an underground object into a visual representation of the underground object on the display screen of the locating receiver.

Abstract: A multicomponent induction logging tool uses a nonconducting mandrel with a windowed conducting sleeve. This arrangement reduces effects due to tool eccentering and coil misalignment.

Abstract: A controller is provided for use with a vehicle security system, particularly a remote start system. The controller includes a housing, means for detecting voltage of a vehicle wire, and means for displaying detected voltage. The means for detecting voltage can be an external probe. The means for displaying detected voltage can be a light indicator, a sound indicator, or a display screen. If a light indicator is used, such as an LED, the light indicator can emit different colors of light responsive to different voltages detected. If a sound indicator is used, the sound indicator emits different pitched sound tones or a different number of sound tones based on different voltages detected. The controller can include a means for detecting resistance of a wire and a switch for changing between detecting voltage and resistance. The controller can include a switch for changing between different detection states.

Abstract: The car power source apparatus is provided with a battery array that has a plurality of battery units connected in series, a battery over-charge and over-discharge detection circuit, selection switches that sequentially input battery unit voltages to the over-charge and over-discharge detection circuit, a reference voltage circuit that inputs reference voltages to the over-charge and over-discharge detection circuit, and a control circuit that controls selection switches and the reference voltage circuit. The control circuit controls the selection switches to input battery unit voltages to the over-charge and over-discharge detection circuit to determine over-charge and over-discharge.

Abstract: A method for detecting a discharge condition fault in an electrical system of a vehicle or a piece of machinery includes supplying electrical energy to the electrical system from an auxiliary battery or batteries of a multiple battery system when a main battery of the multiple battery system does not have sufficient power to start the vehicle or piece of machinery. The supply of electrical energy from the auxiliary battery or batteries is sufficient to at least enable the vehicle or piece of machinery to start. After the vehicle or piece of machinery has been started using the auxiliary battery or batteries, electrical energy is supplied to the electrical system from the main battery. A general operating fault is determined to exist in the electrical system in the event that the vehicle or piece of machinery stops running after being supplied electrical energy from the main battery.

Abstract: Among the various embodiments described is a method of detecting defects in a cell of an integrated circuit that analyzes exercising conditions applied to an input of the cell during a capture phase of testing with failed test patterns that produce an indication of a fault and that analyzes the exercising conditions that are applied during a capture phase of testing with observable passing patterns that do not provide an indication of a fault. From the analysis, true failing excitation conditions and passing excitation conditions can be determined and used to identify whether a defect is in the cell or on an interconnect wire of the integrated circuit.

Abstract: A capacitive plate dielectrometer method and system is provided that is used to measure dielectric properties, such as permittivity, of a small sample test material at a low frequency. The capacitive plate dielectrometer method and system calibrates the capacitive plate dielectrometer with a plurality of standard dielectric materials and the sample test material is rotated in the capacitive plate dielectrometer to allow measurement of several electric field directions.

Abstract: A front-end circuit suitable for digital multimeters and measurement devices may be configured with strictly capacitive attenuators replacing the resistive attenuators in the AC signal path. An inverting programmable-gain amplifier (PGA) may be built around an operational amplifier (op-amp), with a single resistor for DC feedback providing a 1st-order response for AC coupling. The single resistor may be replaced by a more complex RC network to provide a 2nd-order response. The feedback circuit may also include active components such as additional op-amps, which may assist in shaping the overall response and/or reducing the DC offset at the output of the circuit. The capacitive load presented to the input by the front-end circuit may be minimized to compare to capacitances present in resistive implementations. The circuit would not present a DC load to the input since DC loads are typically the result of a resistive attenuator in the DC signal path.

Abstract: A method of detecting small changes to a complex integrated circuit measuring RF/microwave scattering parameters between every pin over a wide frequency range. The data from a characterization of a known good integrated circuit is stored and compared to each subsequent integrated circuit of unknown background.

Abstract: An apparatus for determining capacitance variation in an integrated circuit, includes at least two capacitances, a stimulus provided to the at least two capacitances, and a first logic element coupled to the stimulus and the at least two capacitances, the first logic element configured to switch state upon a state transition of the stimulus when the at least two capacitances differ in value by a predetermined amount.

Abstract: The device for examining a solid, elongate product to be tested contains a measurement capacitor with a measurement part-electrode and guard electrodes electrically insulated therefrom. The device further comprises means for applying an alternating voltage to the measurement capacitor for the purpose of generating an alternating electrical field in the measurement capacitor. The guard electrodes are set up for active guarding, in that, with regard to the alternating voltage, they are kept at the same potential as the measurement part-electrode. Differently thick products to be tested may be tested with one and the same measurement head thanks to the active guarding. The signal noise is reduced, the output signal is largely independent of the position of the product to be tested in the transverse direction, and the measurement head has small geometric dimensions.

Abstract: An exemplary method for examining bonding resistance includes providing a first electronic component having a first and second reference pins. A second electronic component having a third and fourth reference pins is also provided. A first input voltage is applied to the first reference pin. A bias resistor connected between the third reference pin and ground is provided, with the third reference pin serving as an output for providing a first reference voltage. The first reference voltage is measured. Bonding resistance between the first reference pin and the third reference pin is evaluated according to the measured first reference voltage.

Abstract: The inventive circuitry on a semiconductor chip includes a first functional element having a first electronic functional-element parameter that exhibits a dependence relating to the mechanical stress present in the semiconductor circuit chip in accordance with a first functional-element stress influence function. The first functional element provides a first output signal based on the first electronic functional-element parameter and mechanical stress. A second functional element has a second electronic functional-element parameter that exhibits a dependence in relation to the mechanical stress present in the semiconductor circuit chip in accordance with a second functional-element stress influence function. The second functional element is configured to provide a second output signal based on the second electronic functional-element parameter and the mechanical stress.

Abstract: A scanning/imaging system wherein an external stimulus is used for exciting a device under test (DUT). A stimulus source is included for providing a stationary stimulus with a controllable spot size to a device under test (DUT), the controllable spot size covering a portion of the DUT for excitation by the stationary stimulus. A sensor is operable for capturing at least one of a functional response signal and an optical image signal emanating from the DUT portion. A linear positioning device is operable to facilitate scanning of remaining portions of the DUT until a predetermined area thereof has been traversed. A controller is operably coupled to the linear positioning device, stimulus source and the sensor for providing the overall control thereof.

Abstract: There provides a method of producing a probe card where a manufacturing process is simplified so that energy can be saved and resources can be saved. In addition, there provides a probe card which can flexibly deal with reduction in the pitch of terminals, variation in the arrangement of terminals, frequent change in these, and the like, and a producing method of the same. Further, there provides a method of producing a probe card where a sintering process is not required for each ejection of a droplet and fine bumps that become probes can be formed in a short time. Furthermore, there provides a probe card which has cushioning effects against pressure when the probe card makes contact with a semiconductor chip, so that uniform contact is made possible, and a producing method of the same. A liquid material containing metal ultra-fine particles is ejected onto a substrate in accordance with a fine inkjet process, and fine bumps are formed on the substrate.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: The present invention is directed to a high density test probe which provides a means for testing a high density and high performance integrated circuits in wafer form or as discrete chips. The test probe is formed from a dense array of elongated electrical conductors which are embedded in an compliant or high modulus elastomeric material. A standard packaging substrate, such as a ceramic integrated circuit chip packaging substrate is used to provide a space transformer. Wires are bonded to an array of contact pads on the surface of the space transformer. The space transformer formed from a multilayer integrated circuit chip packaging substrate. The wires are as dense as the contact location array. A mold is disposed surrounding the array of outwardly projecting wires. A liquid elastomer is disposed in the mold to fill the spaces between the wires.

Abstract: A membrane probing assembly includes a probe card with conductors supported thereon, wherein the conductors include at least a signal conductor located between a pair of spaced apart guard conductors. A membrane assembly includes a membrane with contacts thereon, and supporting at least a signal conductor located between a pair of spaced apart guard conductors. The guard conductors of the probe card are electrically interconnected proximate the interconnection between the probe card and the membrane assembly. The guard conductors of the membrane assembly are electrically interconnected proximate the interconnection between the probe card and the membrane assembly.

Abstract: Method and apparatus using a retention arrangement with a potting enclosure for holding a plurality of probes by their retention portions, the probes being of the type having contacting tips for establishing electrical contact with pads or bumps of a device under test (DUT) to perform an electrical test. The retention arrangement has a top plate with top openings for the probes, a bottom plate with bottom openings for the probes, the plates being preferably made of ceramic with laser-machined openings, and a potting enclosure between the plates for admitting a potting agent that upon curing pots the retaining portions of the probes. In some embodiments a spacer is positioned between the top and bottom plates for defining the potting enclosure. Alternatively, the retention arrangement has intermediate plates located in the potting enclosure and having probe guiding openings to guide the probes.

Abstract: Pin probes and pin probe arrays are provided that allow electric contact to be made with selected electronic circuit components. Some embodiments include one or more compliant pin elements located within a sheath. Some embodiments include pin probes that include locking or latching elements that may be used to fix pin portions of probes into sheaths. Some embodiments provide for fabrication of probes using multi-layer electrochemical fabrication methods.

Abstract: A circuit for isolating a short-circuited integrated circuit (IC) formed on the surface of a semiconductor wafer from other ICs formed on the wafer that are interconnected with the short-circuited IC includes control circuitry within the short-circuited IC for sensing the short circuit. The control circuitry may sense the short circuit in a variety of ways, including sensing excessive current drawn by the short-circuited IC, and sensing an abnormally low or high voltage within the short-circuited IC. Switching circuitry also within the short-circuited IC selectively isolates the short-circuited IC from the other ICs on the wafer in response to the control circuitry sensing the short circuit. As a result, if the wafer is under probe test, for example, testing can continue uninterrupted on the other ICs while the short-circuited IC is isolated.

Abstract: According to an aspect of the invention, there is provided, a semiconductor device, including an internal voltage generation circuit generating a prescribed voltage, a first test circuit connecting to a voltage-supplying wiring, one end of the voltage-supplying wiring being connected to a source wiring and the other end of the voltage-supplying wiring being connected to the internal voltage generation circuit, the first test circuit being supplied an outer voltage from the source wiring and a voltage of the internal voltage generation circuit through the voltage-supplying wiring, the first test circuit generating a prescribed resistance value on a basis of a control input from an outer portion in a test mode.

Abstract: A programmable after-package, on-chip reference voltage trim circuit for an integrated circuit having a plurality of programmable trim cells generating a programmed sequence. A converter is provided to convert the bit sequence into a trim current. The trim current is added to an initial value of a reference voltage to be trimmed, as generated by the integrated circuit. Once the correct value of the trim current is determined, isolation circuitry is programmed to isolate the trim circuitry from the remainder of the IC, thereby freeing the logic and package pins associated with the IC for use by users of the IC. The preferred trim circuitry includes fuses which are blown in accordance with a bit value supplied to the trim cell to permanently fix a trim current value, once a best fit value is determined.

Abstract: A system and method for supporting and transferring a substrate relative to a plurality of testing columns are provided. The system includes a testing table adapted to support and move the substrate relative to the plurality of testing columns. The testing table may include an end effector disposed therein to transfer the substrate relative to an upper surface of the testing table. The method includes transferring the substrate to the testing table and moving the substrate relative to the plurality of testing columns. Signals indicative of electronic device performance are sensed to determine operability of the devices on the substrate.

Abstract: According to the invention, one or more external test connection contact points (pads; pins; balls), are provided in an integrated circuit component (chip) (1), through which signals (4, 5, 6) that are to be measured or analyzed are selectively fed, e.g. by means of a multiplex circuit (7,8), and wherein the signals may be connected by means of routes located internally in the component from switch points that are not directly accessible, e.g. points inside the chip (15 to 20) or covered contact points. The device according to the invention is particularly useful for highly integrated semiconductor chips.