Abstract: One embodiment of the present invention provides capacitive decoupling on the surface of a semiconductor die, instead of providing the decoupling on a package or printed circuit board to which the semiconductor die is attached. In this embodiment, a surface of a semiconductor die includes exposed power and ground conductors, which are electrically coupled to internal power and ground nodes within the semiconductor die. To provide the wafer-level decoupling, a plurality of bypass capacitors are electrically coupled between pairs of exposed power and ground conductors, so that the plurality of bypass capacitors reduce voltage noise between the power and ground conductors on the semiconductor die.

Abstract: Systems and methods are provided for maintaining performance of an integrated circuit at a reduced power. The systems and methods employ a performance monitor that generates a signal indicative of at least one performance characteristic of at least a portion of a critical path associated with the integrated circuit. The system further comprises a supply control that adjusts a supply voltage of the integrated circuit to maintain performance at a reduced power based on the signal. A temperature adjustment component can be provided to adjust the signal to compensate for temperature offsets associated with performance of the performance monitor relative to performance of the critical path over different operating temperatures. A performance measurement of the performance monitor can be determined based on the concurrent triggering of the performance monitor and the critical path.

Abstract: A structure including a substrate, a copper bump formed over the substrate, and a barrier layer comprising an alloy of at least one of iron and nickel, formed over the copper bump, and methods to make such a structure.

Abstract: A semiconductor device is disclosed including a data family pad layout wherein an effort is made to contrive layouts of a power lead wire and a ground lead wire to minimize effective inductance in priority to a length of a lead wire between a pad and a solder ball land of a semiconductor chip. Pad layouts are arrayed in two rows and one unit of the pad layout is configured such that a data power source and ground are adjacent to each other or one data is inserted between the data power source and the ground. Such configurations decrease mutual inductance between the data power sources and increase mutual inductance between the data power source and the ground causing reduction in effective inductance between the data power source and the ground with the resultant minimization of power and ground noises.

Abstract: A pad section serving as an electrode for external connection of a semiconductor device includes a first pad metal (61) formed in the top layer, a second pad metal (62) formed under the first pad metal (61) via an interlayer insulating film (71), and vias (63) which penetrate the interlayer insulating film (71) and electrically connect the first pad metal (61) and the second pad metal (62). The first pad metal (61) and the second pad metal (62) have edges displaced from each other so as not to be aligned with each other along the thickness direction of each layer. Thus, it is possible to reduce stress occurring on an edge of the second pad metal (62), thereby reducing damage on the interlayer insulating film (71) and so on.

Abstract: An object of the present invention is to provide a semiconductor device which comprises a barrier film having a high etching selection ratio of the interlayer insulating film thereto, a good preventive function against the Cu diffusion, a low dielectric constant and excellent adhesiveness to the Cu interconnection and a manufacturing method thereof.

Abstract: A coated electrically conductive substrate has particular utility where there are multiple closely spaced leads and tin whiskers constitute a potential short circuit. This electrically conductive substrate has a plurality of leads separated by a distance capable of bridging by a tin whisker, a silver or silver-base alloy layer coating at least one surface of at least one of the plurality of leads, and a fine grain tin or tin-base alloy layer directly coating said silver layer. An alternative coated electrically conductive substrate has utility where debris from fretting wear may increase electrical resistivity. This electrically conductive substrate has a barrier layer deposited on the substrate that is effective to inhibit diffusion of the substrate into a subsequently deposited layers, which include a sacrificial layer deposited on the barrier layer that is effective to form intermetallic compounds with tin, and a low resistivity oxide metal layer deposited on the sacrificial layer.

Abstract: An interconnect for testing a semiconductor component includes a substrate, and interconnect contacts on the substrate configured to electrically engage component contacts on a semiconductor component. Each interconnect contact includes a compliant conductive layer formed as a conductive spring element. In addition, the complaint conductive layer includes a tip for engaging the component contact and a spring segment portion for resiliently supporting the tip. A method for fabricating the interconnect includes the steps of shaping the substrate, forming a conductive layer on a shaped portion of the substrate and removing at least some of the shaped portion. The shaped portion can comprise a raised step or dome, or a shaped recess in the substrate. The conductive layer can comprise a metal, a conductive polymer or a polymer tape can include a penetrating structure or penetrating particles.

Abstract: An integrated circuit device with embedded passive component by flip-chip connection is provided which includes a flip chip and a dummy chip. The dummy chip includes at least an embedded passive component, a plurality of redistribution traces and a plurality of flip-chip pads. The flip chip is smaller than the dummy chip and is mounted on a surface of the dummy chip with the flip-chip pads. The embedded passive component is electrically connected to the flip chip via the redistribution traces and the flip-chip pads. A plurality of solder balls are placed at the peripheral region of the surface of the dummy chip.

Abstract: A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure operative stages introduces lower thermal-mechanical stress during flip chip packaging.

Abstract: A housing having a non-detachable bond to a micromechanical component using a flexible bonding material in particular. The combination including the housing and the micromechanical component as well as the manufacturing method of this combination. At least part of the component and/or of the housing has depressions for receiving the bonding material. These depressions may be designed as grooves, for example.

Abstract: A semiconductor device (7) has a number of bonding leads (1, 2, 3) with more than one individual bonding lead (1) being arranged on an individual contact area (4) of a semiconductor chip (5) or a wiring component (6) of the semiconductor device (7). The bonding leads (1, 2 and 3) of a stack (8) form ohmic transitions (12, 13) in their boundary layers. For this purpose, the stacked contact elements (9, 10) have different materials with a different material composition.

Abstract: Techniques for integrated circuit packaging in a flip chip configuration that ensures a migration path between related integrated circuits and utilizes core I/O (or area I/O) are provided. An integrated circuit, having a superset of functional circuit elements as compared to a reference integrated circuit, includes first and second sets of interconnection elements to connect to a package substrate. The first and second sets have matching arrangements, and corresponding interconnection elements of the first and second set have consistent functional assignments. The first and second sets include interconnection elements of mixed functional assignments. The first set is disposed within an area matching a size and shape of the reference integrated circuit, while the second set is disposed outside the area. In a specific embodiment, the first set includes an I/O signal and is located in the core area.

Abstract: A suspended-load backpack designed to permit the load to move relative to the backpack frame during walking and running so that the large movements between the load and the frame of the backpack reduce the fluctuations of absolute vertical motion of the load. Because the hip (and thus the pack frame) go up a down a good deal during walking, a large relative movement between the frame and the load reduces the absolute excursion of the load. This movement may be, in turn, transferred to a motor through, for example, a rack and pinion gear, to convert the mechanical movement to electrical energy. The movement may also be converted to electrical energy by using an electroactive polymer (EAP) to connect the suspended load to the frame. Such designs allow the load to move in a controlled fashion to prevent the patient from losing his or her balance as the load moves up and down along the backpack frame.

Abstract: A method and system for producing electricity, and more particularly to a method of producing electricity by producing steam by directing Gamma rays generated by directing X-rays at a mass of Hafnium 178 onto a mass of water. The steam thereafter is channeled to a steam turbine generator to produce electricity.

Abstract: A power generation system including a housing defining a cavity and having an inlet for receiving a fluid that is used to cool and pressurize the cavity and an outlet for removing the fluid from the cavity. The system also may include a rotor having a first end positioned within the cavity of the housing and a second end, a plurality of bearings, positioned to contact the rotor, for providing radial support to the rotor, and a turbine connected to the second end of the rotor. Further, the system may include a heat sink positioned within the cavity and between the housing and the rotor, and an electronic component attached to the heat sink.

Abstract: Various embodiments relate to systems and methods related to an integrated electrically-powered sub-system and wind power system including a wind power source, an electrically-powered sub-system coupled to and at least partially powered by the wind power source, the electrically-powered sub-system being coupled to the wind power source through power converters, and a supervisory controller coupled to the wind power source and the electrically-powered sub-system to monitor and manage the integrated electrically-powered sub-system and wind power system.

Abstract: A renewable energy electric power generating system consisting of Renewable Energy Wave Pumps, located under water, anchored to the sea bed, auto regulating to variable sea elevations and undulation heights, efficient, simple construction and resistant to storms, operate by using the law of conservation of energy to change, a large quantity of water at low head found in a surface undulation, into a lower water quantity at a much higher head, collecting this high head water into a piping network and a common header anchored to the sea bed, provided with a stand pipe and reservoir, and feeds directly into a hydro-turbo generator located on or off shore to produce renewable cheap electric power with zero emissions and independent of oil prices, optimizing land use for power plants, and providing a navigation-safe and a free Floating Break Water Structure for shore line protection

Abstract: A wind generator system includes a stationary frame, a shaft, mechanical bearings and a stator and a rotor, along with magnetic components configured to reduce or substantially eliminate various loads imposed on the mechanical bearings by the system and by wind. In particular, magnetic components at a bearing closest to the vanes of attached to the shaft act to impart a force on the shaft opposing gravity. Magnetic components at a bearing along the shaft distal from the vanes act to impart a force on the shaft opposing a bending force exerted by the shaft on the bearing at that point. Additional magnetic components act to oppose gravity adjacent the stator and rotor. Still further magnetic components act to impart a force on the shaft opposing the wind force.

Abstract: A heavy-duty hybrid vehicle power system includes a main power unit located in an engine compartment; an electric propulsion motor; a DC bus that receives DC power from the main power unit; a vehicle accessory traditionally powered directly from an internal combustion engine of a conventional heavy-duty vehicle and requiring more than 1 kilowatt of power; an electric accessory motor, which is electrically coupled with the DC bus and mechanically coupled with the vehicle accessory, configured to supply power to the vehicle accessory, and the electric accessory motor and vehicle accessory carried by the heavy-duty vehicle either inside or outside of the engine compartment; and at least one of an ultracapacitor pack and a fly wheel coupled with the DC bus and configured to store power when the main power unit is on and supply power in place of the main power unit when the main power unit is off.

Abstract: A device to vary a grounding configuration of a vehicle audio and video (A/V) system is provided to prevent various electrical system noise in the vehicle. The system includes a controller that outputs a control signal to connect an A/V system chassis ground to a vehicle body ground or to open the A/V system chassis ground and the vehicle body ground according to the usage mode of the vehicle A/V system. A relay connects the A/V system chassis ground to the vehicle body ground or opens the A/V system chassis ground and the vehicle body ground in response to the control signal output from the controller.

Abstract: A vehicle can have an electronic configuration or a mechanical configuration. In the electronic configuration, a button is operated to start the engine of the vehicle. In the mechanical configuration, a key is inserted in a key cylinder to start the engine of the vehicle. A button signal is output when the button is operated. A key signal is output when the key is inserted in the key cylinder. The configuration of vehicle can be automatically detected based on whether the button signal is output or the key signal is output. An appropriate starting control for the engine is selected based on the configuration of the vehicle.

Abstract: An uninterruptible power supply (UPS) includes an AC power source, a DC power source coupled to a DC bus, a load, a converter, an inverter and a controller. Responsive to the controller, the inverter receives power from the DC bus to supply the load a regulated voltage; the converter, operated in a hybrid mode, receiving power from the AC power source to supply the DC bus a regulated DC voltage in a double conversion mode or to supply the power to the load in a series-parallel mode, or a combination of the two modes. In the stored energy mode, with an additional bypass switch, both the converter and inverter receive power from the DC power source and jointly supply the load a high quality voltage. These configurations improve the efficiency and enable the UPS readily meet the VFI and the high quality output voltage requirements per IEC62040-3.

Abstract: An electrical switching topology for a hybrid switch provides extremely low losses in both cryogenic and non-cryogenic electronic systems. In this switch having switch modules connected in parallel, switching losses in a first module are separated from conduction losses in the parallel-connected second module. The conduction losses are then further reduced by cryogenically cooling the second module. Since the switching losses of the first module can be absorbed outside a cryogenic container, the switching losses do not add to the cryogenic heat load. In other applications, the switching module operates at lower temperatures to provide higher switching speeds and reduces switching heat generation.

Abstract: An improved electrical lockout mechanism includes a first connection means to a power source, and a second connection means to the power input terminal of the machine being protected. The machine being protected includes a manually-operated ON/OFF switch. A switching element is operably coupled between the first and second connection means. The switching element is adapted to selectively complete and break an electrical circuit between the first and second connection means in response to a control signal supplied thereto. A control circuit generates a control signal that is supplied to the switching element thereby causing the switching element to complete the electrical circuit between the first and second connection means under a first set of operating conditions and causing the switching element to break the electrical circuit between the first and second connection means under a second set of operating conditions in a manner that prevents unwanted machine restarts.

Abstract: An electromagnetic energy transducer comprising a permanent magnet (1), a soft-magnetic element (9), an electrical coil (6), and stop points (8a-8d). The electrical coil surrounds a part of the magnetic circuit, wherein the permanent magnet (1) and said soft-magnetic element (9) are arranged to form a magnetic circuit with a first flux direction. At least one of the soft-magnetic element (9) and the permanent magnet (1) is mounted for rotary movement about an axis (4) with respect to the other. End points of the rotary movement are formed by the stop points (8a-8d).

Abstract: An in-slot conductor part of a stator winding of a rotary electric machine has multiple in-slot conductors disposed in multiple slots. In each of the multiple slots a plurality of the in-slot conductors are disposed in a line in the depth direction of the slot, in the coil end parts each of the multiple coil end conductors has a root part led out through a slot opening at one of the end faces of a stator core in substantially the same direction as the extension direction of the in-slot conductors and a connecting part disposed farther from the end face of the stator core than this root part and bent so as to form a bridge between two root parts.

Abstract: The invention relates to a circuit arrangement and a switching module, in which an attenuator is, for EMV suppression of a DC motor, connected to the lines of the DC motor. The attenuator comprises a ferrite, particularly a common mode ferrite.

Abstract: The present invention relates an electric rotating machine comprising a plurality of phase coils each composed of a plurality of partial coils each made by connecting segments each composed of an inside-slot conductor portion to be accommodated in each of slots of each of phase slot groups made in a stator core and an outside-slot conductor portion protruding from the slot. Of the plurality of partial coils constituting each of the phase coils, in each of the partial coils to be connected to an input/output terminal, its inside-slot conductor portion is accommodated in the slot other than end portions of the phase slot group in a circumferential direction of the stator core. This reduces the electric potential difference between the outside-slot conductor portion continuing thereinto and the outside-slot conductor portion of an adjacent phase coil, thereby improving the insulating performance.

Abstract: A spindle motor which allows appropriate formation of communicating hole for compensating a pressure difference due to an error in working of dynamic pressure generating grooves and other components, easy formation of dynamic pressure generating grooves and readily prevention of leakage of a lubrication fluid is provided. An outer cylindrical member is attached to a shaft, a radial hydrodynamic bearing and a thrust hydrodynamic bearing are provided between the outer cylindrical member and the sleeve, and communicating holes are formed between the shaft and the outer cylindrical member, and between the hub and the outer cylindrical member. Since the collared outer cylindrical member is attached to the shaft, the communicating holes can be readily formed. Also, since a thrust hydrodynamic bearing is formed between an opening of a communicating hole and a seal, a lubrication fluid is unlikely to leak from the seal portion.

Abstract: A heat-dissipating fan includes a casing, a stator, and an impeller. The casing includes a base supported by a plurality of ribs. The base includes an axial tube for receiving a bearing through which a shaft extends. Vanes are provided on an outer circumferential wall of the impeller. An end of the shaft is fixed to an axial seat at a center of the impeller. A magnetic member is mounted to the other end of the shaft. The magnetic member and the impeller rotate synchronously under magnetic induction. When the heat-dissipating fan is mounted on top of a heat-dissipating device, a propeller of the heat-dissipating device is driven to turn synchronously under magnetic attraction. When air currents are driven by the vanes to flow downward, great noise resulting from tangential wind effect is avoided, as the ribs are not in the air inlet area.

Abstract: A conformable layer (14) for inhibiting electrical discharge between vent tubes (16) and strands (12) in an inner-cooled coil (5). The conformable layer comprises a resistive inner core (24) and a conductive strip (20) wrapped in a conductive outer wrap (26). The conductive strip (20) is electrically connected to the strands (12) at one end of the coil (5) and left to electrically float at the other end. In this configuration, the conformable layer (14) reduces voltage buildup between the vent tubes (16) and the strands (12) to help prevent electrical damage to the coil (5).

Abstract: A support 7 for an acoustic resonator 4 includes at least one bilayer assembly having a layer of high acoustic impedance material 11 and a layer of low acoustic impedance material 12 made of material having a low electrical permittivity.

Abstract: An acoustic resonator assembly includes a layer of high-acoustic-impedance material and a layer of low-acoustic-impedance material made of a low-electrical-permittivity material. This assembly may support the resonator over an interconnect layer or act as a decoupling assembly between two active elements of the resonator. The assembly may alternatively include three low-acoustic impedance layers. Alternatively, the assembly may include three acoustic impedance layers wherein two of the layers are low acoustic impedance layers and the third layer has a higher acoustic impedance than the first two or alternatively is a high-acoustic impedance layer.

Abstract: A carbon-based composite particle for an electron emission source comprises a particle of a material selected from the group consisting of metals, oxides, and ceramic materials; and a carbon-based material such as a carbon nanotube which is partially embedded inside the particle and which partially protrudes from the surface of the particle.

Abstract: A cold-cathode electron source is formed that successfully achieves a high frequency and a high output. Embodiments include a cold-cathode electron source comprising emitters having a tip portion tapered at an aspect ratio R of not less than 4, thereby decreasing capacitance between the emitters and a gate electrode by a degree of declination from the gate electrode, such that the cold-cathode electron source is able to operate at a high frequency. Embodiments also include a cold-cathode electron source formed of a diamond with a high melting point and a high thermal conductivity, such that the emitters operate at a high current density and at a high output.

Abstract: A halogen incandescent lamp has a transparent sealed bulb, a gas filling comprising an inert gas and a halogen additive, a luminous element which is attached to a current supply system extending in a pinched portion of the bulb, and a mount extending from at least adjacent the outside of the pinched portion into the bulb and comprising at least one metal support wire which retains the luminous element in the vicinity of the end of the bulb remote from the pinched portion. The mount has a non-conducting part such that the outer end of the part of the mount at or near the outside of the pinched portion and the support wire are electrically insulated from each other.

Abstract: A light detector having a cathode wafer, a cavity wafer and an anode wafer. The cathode wafer may be bonded to one side of the cavity wafer and the anode wafer may be bonded to another side of the cavity wafer. The cathode wafer may have numerous cathodes, the anode wafer numerous anodes and the cavity wafer numerous cavities which may be aligned on a one-to-one basis to form a wafer structure of a plurality of detectors which may be diced into separable detector chips. When there is a voltage potential across a cathode and an anode, and a gas such as Ne or the like in the cavity, a reception of light such as ultra violet may result in an electronic discharge between the cathode and anode of the light detector.

Abstract: A phosphor blend comprises at least two phosphors each selected from one of the groups of phosphors that absorb UV electromagnetic radiation and emit in a region of visible light. The phosphor blend can be applied to a discharge gas radiation source to produce light sources having high color rendering index. A phosphor blend is advantageously includes the phosphor (Tb,Y,LuLa,Gd)x(Al,Ga)yO12:Ce3+, wherein x is in the range from about 2.8 to and including 3 and y is in the range from about 4 to and including 5.

Abstract: An image forming apparatus includes a first substrate, a potential-regulated conductive element, a second substrate having an electrode and an anode electrode connected to the electrode via a resistor, and a spacer which abuts on the conductive element, electrode and anode electrode to regulate a distance between the first and second substrates. The spacer includes a base material. A first resistor film covers a side face of the base material and is electrically connected to the conductive element, electrode and anode electrode. A second resistor film covers a portion of the spacer facing the resistor, and is electrically connected to the electrode and anode electrode. A sheet resistance value of the second resistor film is less than a sheet resistance value of the first resistor film. A resistance value of the second resistor film between the electrode and anode electrode is greater than a resistance value of the resistor.

Abstract: The present invention provide a lateral type electron-emitting device in which abnormal discharge near an electron-emitting region is suppressed, electron emission characteristics are stable, and electron emission efficiency is high. A method of manufacturing an electron-emitting device of the invention includes: a first step of preparing an electron-emitting electrode and a control electrode that are arranged on a surface of an insulating substrate; and a second step of covering the surface of the insulating substrate, which is located between the electron-emitting electrode and the control electrode, with a resistive film to connect the electron-emitting electrode and the control electrode. In the method of manufacturing an electron-emitting device, the resistive film is arranged to cover an end of a surface of the electron-emitting electrode opposed to the control electrode.

Abstract: An organic light emitting diode (OLED) is capable of improving light efficiency per pixel unit by forming a cathode electrode to cover an anode electrode, thereby focusing light emitted from a luminescent layer per pixel unit. The OLED comprises: a second insulating film formed on a substrate including a TFT with source/drain electrodes formed on a first insulating film; a lower electrode formed on the second insulating film and connected to one of the source/drain electrodes; a third insulating film having an opening for exposing a portion of the lower electrode; a luminescent layer formed on the lower electrode inside the opening; a groove formed to surround the luminescent layer; and an upper electrode formed on the substrate including the groove so that the upper electrode surrounds the luminescent layer. The upper electrode functions as a reflection layer for reflecting total light while light emitted from the luminescent layer is being pulled out through the substrate.

Abstract: The present invention discloses an inorganic thin layer which is composed of an inorganic composite containing at least two kinds of inorganic materials and shows excellent moisture and oxygen proof, an organic electroluminescence device including the inorganic thin layer as a passivation layer, and a fabrication method thereof.

Abstract: A light emitting device has: a light emitting element; a lead that is electrically connected to the light emitting element at its one end and serves as a terminal to supply a power source to the light emitting element; a metal base that the light emitting element is mounted thereon and radiates heat of the light emitting element; and a sealing member that is of transparent resin or glass and covers the light emitting element. The lead is secured to the metal base by a heat-resisting insulating member with a thermal expansion coefficient nearly equal to that of the metal base.

Abstract: A low-pressure gas discharge lamp includes a gas discharge vessel containing an inert gas filling as a buffer gas, and electrodes for generating and maintaining a low-pressure gas discharge. The lamp contains at least one tin halide.

Abstract: A plasma display panel having barrier ribs designed to prevent phosphor material from forming on a top surface thereof. The barrier ribs include a plurality of parallel first barrier rib members and a plurality of parallel second barrier rib members formed substantially perpendicularly intersecting the first barrier rib members. The first barrier rib members have a cross-sectional apex width and the second barrier rib members have a cross-sectional apex. The apex width of the first barrier rib members is less than the apex width of the second barrier rib members, so that when the phosphor material is deposited thereon, the phosphor accumulates on the sidewalls of the barrier ribs and between the barrier ribs, and not on top of the barrier ribs, thus improving image quality.

Abstract: A plasma display panel includes a first substrate and a second substrate facing each other to provide a discharge space between the first substrate and the second substrate, a scan electrode and a sustain electrode both provided on the first substrate, a dielectric layer for covering the scan electrode and the sustain electrode, and a protective layer provided on the dielectric layer. The protective layer includes MgO, at least one element of Si, Ge, C and Sn, and at least one element of fourth, fifth, sixth and seventh group elements of a periodic table. This plasma display panel performs stable discharge characteristics, such as a driving voltage, thereby displaying an image stably.

Abstract: A plasma display device includes: a plasma display panel; a chassis base supporting the plasma display panel, the chassis base being parallel to the plasma display panel; a thermally conductive layer arranged between the plasma display panel and the chassis base, the thermally conductive layer being adjacent to the plasma display panel; and a thermally non-conductive layer arranged between the thermally conductive layer and the chassis base.

Abstract: A dielectric waveguide integrated plasma lamp (DWIPL) with a body consisting essentially of at least one dielectric material having a dielectric constant greater than approximately 2, and having a shape and dimensions such that the body resonates in at least one resonant mode when microwave energy of an appropriate frequency is coupled into the body. A bulb positioned in at least one lamp chamber in the body contains a gas-fill which when receiving energy from the resonating body forms a light-emitting plasma.

Abstract: Lighting device having a number of light sources for illumination an area around the lighting device. The lighting device including capabilities for generating illumination when a primary power source is unavailable. The light device may include a secondary power source for use in powering the lighting device when the primary power source is unavailable. The lighting device may include multiple operating modes, optionally depending on the active power source.