Abstract: The present disclosure provides for methods of using adhesive compositions having improved microwave absorbing properties to bond substrates to form laminated structures. Specifically, the adhesive compositions utilized in the methods of the present disclosure absorb the microwave energy, thereby heating and melting into the substrate materials and bonding the substrates together, providing for an improved laminated structure.

Abstract: The present disclosure provides for methods of using adhesive compositions having improved microwave absorbing properties to bond substrates to form laminated structures. Specifically, the adhesive compositions utilized in the methods of the present disclosure absorb the microwave energy, thereby heating and melting into the substrate materials and bonding the substrates together, providing for an improved laminated structure.

Abstract: A method for making a part, the method comprising: (a) providing an uncured upper layer on a part, a substrate, a workpiece, a support platform, or a base layer, wherein the uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (b) optionally providing a new uncured upper layer on the uncured upper layer provided in step (a), whereby the uncured upper layer provided in step (a) becomes an uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices, (c) curing the uncured upper layer and/or the uncured lower layer after step (b) using an electron beam; (d) after step (c), providing a new uncured upper layer on the cured or uncured upper layer, whereby the cured or uncured upper layer becomes a cured or uncured lower layer, and wherein the new uncured upper layer comprises resin and also comprises fibers, particles, powder, and/or electronic devices; (e) optionally curi

Abstract: The present invention relates to apparatus and method for a silicon ingot to a mounter, the apparatus including a frame; a mounter placed on the frame for mounting a silicon ingot; a press member installed movably to the frame for pressing the silicon ingot toward the mounter; and a heat or light emitting member arranged to emit heat or light to an adhesive member interposed between the silicon ingot and the mounter.

Abstract: A customizable notebook panel (CNP) manufactured with a photo image is to be attached to a surface of a computer system using a white color adhesive. To prevent streaks and bubbles from being visible on the CNP, a filler layer is used in between the CNP and the surface. Other techniques to reduce the visibility of the streaks and bubbles may include increasing the thickness of the adhesive layer and using inks that are opaque.

Abstract: A three-ply product includes a particle board core assembled with a patterned vulcanized fibre sheet or layer on each surface. One of the vulcanized fibre sheets may have a preprinted decorative pattern provided thereon. The other vulcanized fibre sheet may also be decorative, or merely a plain sheet of vulcanized fibre. The product is useful for woodworking applications, and may be processed (i.e., stained, sanded, lacquered, etc.) like a natural wood product. Unlike prior vulcanized fibre processes, the process of making the vulcanized fibre sheets preprints a pattern, in a preprinting process, on the top sheets of cellulose paper plies.

Abstract: A process for preparing an animal incontinence device comprises: providing a base layer of tissue; applying a uniform layer of superabsorbent polymer particles to a major surface of the base layer of tissue; applying water to the base layer of tissue having the uniform layer of superabsorbent polymer particles thereon; applying a cover layer of tissue over the base layer of tissue having the uniform layer of superabsorbent polymer particles thereon, to form an absorbent layer assembly; passing the absorbent layer assembly between a heated nip roll and a laminating roll, to at least partially adhere together the cover layer of tissue, uniform layer of superabsorbent polymer particles, and base layer of tissue, to form an absorbent layer; inserting the absorbent layer intermediate a base layer of liquid-impervious polymer film and a top layer of porous, hydrophilic, woven or non-woven polymer fibers, to form an animal incontinence device assembly; and laminating together at least a portion of the animal inconti

Abstract: A double-sided mounting apparatus includes a first pressure bonding tool and a second pressure bonding tool disposed opposite to each other, heating mechanism for heating the first pressure bonding tool and the second pressure bonding tool, pressing mechanism for applying pressure to an area between the first pressure bonding tool and the second pressure bonding tool, a work holding mechanism which holds a work item between the first and second pressure bonding tools, a first protective tape supply mechanism disposed between the first and second pressure bonding tools and used to supply a first protective tape to the first pressure bonding tool, and a second protective tape supply mechanism disposed between the first and second pressure bonding tools and used to supply a second protective tape to the second pressure bonding tool.

Abstract: The present invention relates to a process for the production of wood-base materials which have at least one thin veneer layer adhesively bonded over the surface to a substrate or to further veneer layers, which process comprises the following steps: i.

Abstract: An aircraft part manufacturing device for automated composite lamination on a mandrel surface of a tool having a rotational axis includes a mechanical supporting structure that supports multiple material delivery heads. The tool is moveable and rotatable relative to the mechanical supporting structure. The mechanical supporting structure provides for axial translation of the material delivery heads relative to the mandrel surface while the mandrel surface is rotated for laying down courses of composite material over the entire mandrel surface of the tool. The position and movement of each of the plurality of material delivery heads is individually adjustable. Arm mechanisms provide motion of each material delivery head in a direction normal to the mandrel surface; rotation about an axis normal to the mandrel surface; circumferential position adjustment in a hoop direction relative to the mandrel surface; and axial position adjustment relative to the other material delivery heads.

Abstract: A method for connecting FPC to a second circuit board, comprising the steps of (i) preparing a flexible printed circuit board (FPC) and a second circuit board, (ii) disposing the connection parts of the FPC to face the connection parts of the second circuit board such that a thermosetting adhesive film is present between the connection parts of the FPC and the connection parts of the second circuit board, and (iii) applying heat and pressure sufficiently high to thoroughly push away the adhesive film for establishing electrical contact and allow for curing of the adhesive, wherein the ratio of conductor width (L)/conductor-to-conductor distance (S) in the conductor wiring end parts constituting the connection parts of FPC is 0.5 or less and the thermosetting adhesive film is adjusted to have a viscosity of 500 to 20,000 Pa·s at 200° C.

Abstract: A method of producing adhered substrates that includes: providing an adhesive composition that is a liquid dispersion when stored at temperatures from about room temperature up to about 140° F., becomes a molten solution when heated to a temperature above about 300° F. and mixed, and then becomes a non-exuding thermoplastic solid adhesive upon cooling below a temperature of about 140° F.; heating and mixing the liquid dispersion at a temperature above about 300° F. to form the molten blend; disposing the molten blend between the substrates to be adhered to each other; and retaining the molten blend between the substrates to be adhered to each other for a set time during which the molten blend cools to form the solid adhesive that adheres the substrates to each other.

Abstract: An apparatus and method for removing a temporary substrate from an optical disk is disclosed. A holding fixture (102) provides an optical disk supporting surface. A force imparting tool (118) imparts a force against an optical disk wherein a reaction force to the force imparting tool is provided by the supporting surface. The optical disk is flexed to break away and remove a temporary substrate of the optical disk.

Abstract: A surface processing apparatus includes a process chamber including a gas ejection mechanism; an exhaust for exhausting the inside of said process chamber; and a gas supply for supplying a gas to the gas ejection mechanism. The gas ejection mechanism includes a first gas distribution mechanism for distributing the gas into a cooling or heating mechanism, including a gas distribution plate placed in the frame member, the gas distribution plate having a plurality of holes that extend therethrough, the cooling or heating mechanism having multiple gas passages that extend therethrough, the plate having a number of outlets to eject the gas into the process chamber, wherein there are more outlets in the plate than there are gas passages, and the plate is fixed to a second gas distribution mechanism with a clamping member.

Abstract: In a plasma apparatus 1 for performing plasma processing on a substrate W to be processed, an upper electrode 21, which faces opposite a susceptor 5 which is a lower electrode, has an electrode supporting body 22 and an electrode plate 23. In the center on the side of the electrode supporting body at the boundary between the two, a hollow 62, the dimensions of which are determined such that a resonance is generated at a frequency of supplied high-frequency electric power and an electric field orthogonal to the electrode plate 23 is generated inside, is provided. Furthermore, a shield ring which surrounds the electrode plate 23 has a shape in which the lower surface is in the same level as the electrode plate 23, and it is made of a material that is not easily eroded by the plasma. By this, processing small features becomes possible with uniform distribution of plasma and in less degradation due to change over time.

Abstract: A machine for labeling containers, especially bottles or the like, with a stationary machine rack on which a rotary table for conveying containers is supported, and at least one labeling module, arranged to be interchangeable at or on a machine rack, for labeling the containers being guided past the labeling module by the rotary table wherein its own motor is assigned respectively to the rotary table and at least one labeling module. In order to simplify a change or replacement of a labeling module, the motor is located on the machine rack and remains there.

Abstract: Disclosed herein is a high release nip roll assembly comprising a nip roll with a covering comprising a high release material. The release properties of the nip roll material can permit intermittent contact without the coating adhering to the surface of the roller and wrapping the nip. Also disclosed is a high release nip roll belt is made of a high release material on the top and bottom surfaces of the belt. The belt can be positioned at each end of a nip roll so that areas of the nip roll typically vulnerable to molten thermoplastic material contact are protected by a belt. Also disclosed is a belt making apparatus. Also disclosed is a frame assembly for moving a belt longitudinally along a nip roll. Also disclosed is a rope guide assembly for threading a belt in relation to a nip roll and at least at least one belt roller.

Abstract: A tape and masking material composite including a sheet of masking material, and a length of pressure sensitive adhesive coated tape adhered to a first surface along a first edge of the sheet of masking material with the tape having a longitudinal pressure sensitive adhesive covered portion extending past the first edge of the sheet of masking material. The masking material has removable pressure sensitive adhesive on a second major surface opposite its first major surface at least including on and along a portion of that second surface along a second edge opposite its first edge.

Abstract: A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.

Abstract: A conveyance system includes a conveying unit, an alignment unit, and an attaching unit. The conveying unit conveys objects, packaged by one or more package members, in a given direction. The alignment unit, disposed at a given position along a conveyance route of the conveying unit, aligns a positional orientation of the packaged objects to a reference position when the packaged objects are conveyed by the conveying unit. The attaching unit attaches at least one electronic functional device to each of the packaged objects.

Abstract: A system for providing at least a partially mounted tire and wheel assembly is disclosed. The system includes the steps of using a prime mover to bring a tire and wheel together and using the primer mover to work on at least one of the tire or the wheel to mount the tire and the wheel together, wherein the work performed by the prime mover is the only positive work introduced into the tire/wheel system.

Abstract: A method for making a sheet of paper and/or cardboard and the like, comprises, prior to forming said sheet, adding to the fibrous suspension, separately or mixed, in any sequence of introduction, into one or more injection points, at least three dry strength agents respectively: first agent corresponding to a (co)polymer having a cationic filler density higher than 1 meq/g and exhibiting primary amine functions; a second agent corresponding to a synthetic organic (co)polymer having cationic filler density higher than 0.1 meq/g; and a third agent corresponding to a (co)polymer having an anionic filler density higher than 0.1 meq/g.

Abstract: This invention relates to a process for preparing sized paper and paperboard which incorporates in the paper and paperboard at the size press size a composition comprising one or more “hydrophobic polymers” wherein hydrophobic polymers, the amount of such polymers and the weight ratio of starch to such polymer in the composition are selected such that the paper and paper board exhibits a Cobb Value equal to or less than about 25 and to a sized paper or paperboard web formed by the process.

Abstract: A papermaking machine for making paper includes a forming section, a press section, and a drying section. The paper web is pressed between two press members while enclosed between a press felt and a transfer belt having non-uniformly distributed microscopic depressions in its surface, the web following the transfer belt from the press to a transfer point at which the web is transferred via a suction transfer device onto a structuring fabric, the web then being dried on a drying cylinder. The transfer point is spaced a distance D from the press nip selected based on machine speed, a basis weight of the web, and the surface characteristics of the transfer belt, such that within the distance D a thin water film between the web and the transfer belt at least partially dissipates to allow the web to be separated from the transfer belt.

Abstract: A die casting process using pattern recognition techniques to identify those die castings manufactured under conditions likely to produce a die casting which would subsequently prove unacceptable for use. By promptly identifying such die castings, they may be discarded before being shipped to a remote facility for further processing. As a result, the rejection rate of die castings at the remote facility may be reduced and the raw materials used to form the discarded die castings may be more readily recycled.

Abstract: A mold (200) for manufacturing a heat dissipation apparatus (10) includes a movable mold (20) and a fixed mold (30) covering the movable mold. The heat dissipation apparatus includes a plurality of fins (12). One of the movable mold and the fixed mold includes an insert group (50). The insert group includes a plurality of separated inserts (51) stacked together. A plurality of compartments (513) are formed between adjacent inserts of the insert group for forming the fins of the heat dissipation apparatus when molten metal is injected into the mold.

Abstract: Articles for use with highly reactive alloys that include a graphite crucible having an interior, and at least a first protective layer applied to the interior of the graphite crucible in which the graphite crucible having the first protective layer is used for melting highly reactive alloys.

Abstract: In an air conditioner, air-supply passages cross air-discharge passages, and heat exchangers are disposed at intersections between the air-supply passages and the air-discharge passages. This increases the effective heat-exchanging areas of the heat exchangers. In addition, the air conditioner is configured such that the air conditioner can be easily installed and repaired even when the air conditioner is rotated to be properly connected with air-supply ducts and air-discharge ducts.

Abstract: Heat exchanger assemblies, and in particular, heat exchanger assemblies for automotive vehicle applications are disclosed. The heat exchangers have manifolds with retention tabs for brackets, caps and other components, such as attachment elements.

Abstract: A mounting bracket for mounting a first component onto a second component, includes a body member having a formation which is engageable with a corresponding formation on the second component to which the first component is to be attached to and an attachment member protruding from the body member. The attachment member is provided with resilient means co-operable with a corresponding formation on the first component.

Abstract: The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.

Abstract: A heat dissipation device includes a heat sink (10) and a fan (30) mounted on the heat sink via a pair of fan holders (20) and clips (40). The fan holders each have a supporting plate (24) attached on the heat sink and a sleeve (26) connected to the supporting plate and spaced from the supporting plate. The fan has upper and lower flanges (32, 34). The lower flange is sandwiched between the sleeve and the supporting plate. The clips each include a shaft (42) extending through the sleeve, a spring (44) mounted around and received in sleeve, and a handle (46) pivotably mounted on the shaft and movable between unlocked and locked positions. When the handle is positioned at the locked position, the shaft is inserted in the lower flange of the fan to thereby secure the fan on the heat sink.

Abstract: A heat dissipation device includes a base (10), a heat radiator (40) mounted on the base (10), and two heat pipes (20) connecting the base (10) and the heat radiator (40). The base (10) has a bottom face adapted for contacting with a heat-generating electronic component. The heat pipes (20) each comprise an evaporating portion (22) embedded in the base (10) and a condensing portion (24) extending from an end of the evaporating portion (22). The heat radiator (40) comprises first and second fin assemblies (42, 44) each having two contacting faces (43, 45), the condensing portions (24) of the heat pipes (20) are sandwiched between the contacting faces (43, 45) by the first and second fin assemblies (42, 44), and an opening is enclosed by the first and second fin assemblies (42, 44) and receives an electric fan (50) therein.

Abstract: A thermal module (200) includes a centrifugal blower (20) including a housing (21) and a rotor (22) rotatably deposed in the housing, a fin assembly (30) including a plurality of fins (31) disposed at an air outlet (24) of the centrifugal blower and a heat pipe (40) including a condenser section (42) thermally connecting with the fin assembly. The fins of the fin assembly are stacked along a direction parallel to a rotation axis (A) of the rotor; the heat pipe is flattened and forms a bend portion (43) at a free end of the condenser section thereof; the fins of the fin assembly define substantially rectangular-shaped receiving holes (314) therein; the condenser section of the heat pipe is thermally and physically attached to an outmost fin of the fin assembly and the bend portion is received in the receiving holes of the fins of the fin assembly.

Abstract: An axial fan having a rotatable impeller is arranged above a heat sink with a rotation axis of the impeller substantially coincident with a center axis of a base portion of the heat sink. Radially outer ends of fins arranged on the outer peripheral surface of the base station define an envelope which is provided with a recess therein. The axial fan has a hosing including a surrounding portion surrounding the impeller and arms extending from the surrounding portion. Each arm is provided with an engagement portion engaging with the recess of the heat sink, so that the axial fan is secured to the heat sink. Each arm also has an attachment portion at its lower end. At the attachment portion, an assembly of the axial fan and the heat sink is attached to a motherboard with an object to be cooled mounted thereon.

Abstract: Disclosed is a system for cooling an electronics package. The system includes a fluid pump and a microcooler assembly. The system utilizes one or more cooling layers interspersed with layers of electronics in the electronics package. Each cooling layer has an array of cooling channels formed in a substrate, an input manifold through which cooling fluid is provided for distribution through the array of cooling channels, and an output manifold which collects fluid from the array of cooling channels. The elements of the cooling system are integrated by conduits including a package conduit for passage of fluid from the fluid pump to the electronics package, a cooler conduit for passage of fluid from the electronics package to the microcooler assembly, and a pump conduit for passage of fluid from the microcooler assembly to the fluid pump. Also disclosed is a method for cooling the electronics package.

Abstract: The invention relates to a liquid cooling device for a computer, provided for a housing (1), enclosing a computer processor. In order to dissipate the heat by a radiant effect, the device advantageously comprises heat-removal means (20, 22, 23, 25) within the housing, attached to a lower wall (100), an upperwall (105) and at least one lateral wall (102, 103) of the housing (1). Each of the heat-removal means has two walls (P1, P2) at a separation from each other, made from a thermally-conducting material between which at least one circulation channel for a fluid is formed which is connected by a closed circuit (3) to at least one cooling element (61, 62, 63, 64, 65), attached to a power component in the computer. A pump (30), integrated in the circuit (3), circulates the fluid which permits a dissipation of the heat across the walls.

Abstract: A heat pipe structure with sectional heat conducting capability includes a hollow metal pipe and a working liquid, in the hollow metal pipe, having a heat absorption/exothermic cycle for achieving a heat dispersing effect. In the present invention, at least one pressed section is located between the ends of the metal pipe, and the pressed section further has, relative to the pipe, an indentation portion to contact with the sidewall of the metal pipe so as to form a sealing surface on the metal pipe such the metal pipe is divided into at least two sections which respectively have a heat absorption/exothermic cycle. Therefore, except improving the arrangement flexibility and heat dispersing effect, the processing procedure can be simplified and the cost also can be reduced.

Abstract: A method of cooling a first airstream employs the steps of dehumidifying a second airstream, injecting water into the dehumidified airstream so as to cool the second airstream, and passing the first and the cooled second airstream through a heat exchanger so as to cool the first airstream. In so doing, the condensate recovered during the dehumidification of the second and/or first airstream is used in the injection step.

Abstract: A plate heat exchanger comprising a first fluid (cooling media) supply channel and a first fluid discharge channel arranged though a heat plate package; with at least one second fluid (hot media) supply channel and at least one second fluid discharge channel also arranged through the heat plate package. The plate heat exchanger further comprises the addition of one or more auxiliary fluid heat exchange circuits including a conduit heat exchanger adapted to fit inside either the first fluid supply or discharge channels when acting as an after cooler, or the second fluid supply or discharge channel when acting as a pre-heater.

Abstract: The invention relates to a jet-weaving machine, particularly an air jet-weaving machine, which comprises a main discharge nozzle (1) with a mixing tube (2) for introducing a weft thread (3) into a shed by means of a conveying fluid discharged from the main discharge nozzle (1), and comprises a clamping device. This clamping device is placed inside the mixing tube (2) in the area from which the weft thread exits, and is provided with an actuator, which is situated outside of the mixing tube (2) and with a lever that is connected thereto in such a manner that this lever, when actuating the actuator (6) via an actuating means or when the actuation is stopped, executes a tilting motion whereby clamping the weft thread in an opening of the mixing tube between itself and an abutment (9).

Abstract: The present invention is a water source heat pump using various modular components to determine and locate the air flow pattern through and around in multiple patterns as assembled post production in the heat pump system. The current invention uses conventional water source heat pump components, assembled in modules including a refrigerant system using a heat exchange medium existing in both the gaseous and liquid form during operation and includes all other necessary components for control, air movement, and commonly occurring processes as in conventional water source heat pumps. The current invention will use an industry standard geothermal or geoexchange source as with the earth as a heat source for heating and a heat sink for cooling in a commonly referred to as an “open loop” or “closed loop” fashion, or as a water source heat pump utilizing a mechanical means for heating or cooling a source liquid.

Abstract: A ventilating apparatus, a heat exchange apparatus, a heat exchange element, and a rib therefor are provided. The heat exchange element includes a plurality of heat exchange sheets which are multi-stacked, and a plurality of ribs arranged between the heat exchange sheets to form ducts with the heat exchange sheets. Each of the plurality of ribs includes an irregular structural surface including an uneven portion. The uneven portion may include a recess portion, a protrusion portion, or a combination of a recess portion and a protrusion portion, which generates a turbulent flow in a heat exchange gas flowing through the duct. Such heat exchange element having such a rib may minimize duct resistance by suppressing a laminar flow and growth of a boundary layer in airflow of outdoor and indoor air passing through a heat exchanger, and may further increase heat exchange efficiency because the heat exchange gas may be introduced/exhausted smoothly at a low flow velocity.

Abstract: A ventilation apparatus, a heat exchange apparatus, and a heat exchange element therefor are provided. The heat exchange element includes a heat exchange sheet, a plurality of first ribs arranged on one surface of the heat exchange sheet that guides a first gas flowing along the one surface of the heat exchange sheet, and a plurality of second ribs arranged on the other surface of the heat exchange sheet and parallel to an arrangement angle of the first rib that guides a second gas flowing along the the other surface of the heat exchange sheet. The first and second ribs alternately support the heat exchange sheet. The heat exchange element may prevent the sag phenomenon of the heat exchange sheet without increasing duct resistance.

Abstract: A heat exchange element of a heat exchanger prevents losses due to internal pressure non-uniformity. The heat exchanger includes a plurality of heat exchange sheets which are stacked together. A plurality of airflow guide ribs located between the sheets have connection passages that allow gases to flow between adjacent ducts. The flow of gasses through the connection passages offsets pressure non-uniformity between adjacent ducts. Also, the ribs can be continuously arranged over the length of the heat exchange ducts to increase an area supporting the heat exchange sheets, and thus the sag phenomenon of the heat exchange sheet can be prevented.

Abstract: Specified is a heat exchanger, in particular an exhaust-gas heat exchanger or charge-air heat exchanger, for exchanging heat between a first fluid, in particular an exhaust gas or charge air, and a second fluid, in particular a coolant, which heat exchanger has: a block for separate and heat-exchanging guidance of the first and second fluids; a block closure element for connecting the block to a fluid connection. In order to eliminate the problems which occur in particular during a soldering process and to reduce thermal stresses in operation, the block closure element has a contact face arranged at the block side, with a surface normal of the contact face being aligned substantially in a radial direction in order to form a radial stop for a block edge, and a cohesive connection, in particular as a soldered connection, is formed in a joining region between the contact face and the block edge. The invention specifies an arrangement and a method for producing the heat exchanger.

Abstract: A heat exchanger system includes a duct having a duct wall with a duct wall outer surface and a duct wall inner surface; and a heat exchanger partial shell hermetically joined to the duct wall inner surface. The heat exchanger partial shell and a shell portion of the duct wall inner surface constitute a heat exchanger. A heat exchanger inlet manifold is defined by a nonplanar inlet sheet of material hermetically joined to the duct wall outer surface. A heat exchanger outlet manifold is defined by a nonplanar outlet sheet of material hermetically joined to the duct wall outer surface. A heat exchanger inlet opening extends through the duct wall between the inlet manifold and the heat exchanger, and a heat exchanger outlet opening extends through the duct wall between the outlet manifold and the heat exchanger.

Abstract: The formation of electronic assemblies including a heat spreader coupled to a die through a thermal interface material formed from an indium preform, is described. One embodiment relates to a method including providing a preform comprising indium, the preform including an indium oxide layer thereon. The method also includes exposing the preform to fluorine so that part of the indium oxide layer is transformed into an indium oxy-fluoride. The method may also include, after the exposing the preform to fluorine so that part of the indium oxide layer is transformed into an indium oxy-fluoride, positioning the preform between a die and a heat sink, and applying pressure to and heating the preform positioned between the die and the heat sink so that reflow occurs and a bond is formed between the die and the heat sink.

Abstract: In one embodiment, an apparatus comprises a semiconductor device, a heat dissipation assembly, and a thermal interface material disposed between the semiconductor device and the heat dissipation assembly, wherein the thermal interface layer comprises an indium alloy.

Abstract: A heat exchange system selectably controls the temperature of a fluid being delivered to a patient's body by a pump device. The heat exchange system includes a thermal element and a heat exchanger that is removably coupled under pressure to the thermal element. The heat exchanger includes a first half made from thermally conductive material that correspondingly mates with the thermal element, a second half made from thermally conductive material opposite the first half, and an internal heat exchange zone existing between the first half and the second half, wherein fluid flows therethrough. The thermal element of the heat exchange system may controllably and safely warm and/or cool the fluid prior to delivery.