Abstract: A heat dissipating semiconductor package is disclosed, including a chip carrier; at least a semiconductor chip mounted and electrically connected to the chip carrier; and a heat dissipating member mounted on the semiconductor chip with a thermal interface material (TIM) interposed therebetween, wherein the TIM is provided with a plurality of fillers for supporting the TIM at an appropriate height, thereby preventing the TIM from being wetted so as to avoid collapsing and overflow of the TIM as a result of wetting problem.

Abstract: A multi-chip package including a substrate, a first chip, a plurality of conductive bodies, a second chip, and a plurality of conductive studs is provided. The substrate has a first surface. The first chip disposed on the first surface has a first orthogonal projection on the first surface. The conductive bodies are disposed and electrically connected between the first chip and the first surface. The second chip disposed on the first surface has a second orthogonal projection on the first surface. At least part of the first chip is between the second chip and the substrate. The first orthogonal projection at least overlaps the second orthogonal projection. The conductive studs are disposed and electrically connected between the second chip and the first surface.

Abstract: A deformable spacer for wafer bonding applications is disclosed. The spacer may be used to keep wafers separated until desired conditions are achieved.

Abstract: An electric power converter has a main circuit section including a semiconductor module and a cooling device; a control circuit substrate section electrically connected to a signal terminal of the semiconductor module, and having a control circuit; and a power wiring section connected to a main electrode terminal of the semiconductor module. The main circuit section is interposed between the control circuit substrate section and the power wiring section.

Abstract: A semiconductor device includes a tape carrier substrate having a flexible insulating film base, a plurality of conductor wirings provided on the film base, and wiring bumps respectively formed so as to cover an upper surface and both side surfaces of the conductor wirings, and a semiconductor chip mounted on the tape carrier substrate, wherein electrodes of the semiconductor chip are connected to the conductor wirings via the wiring bumps. Electrode bumps are formed on the electrodes of the semiconductor chip, the electrodes of the semiconductor chip are connected to the conductor wirings via a bonding between the wiring bumps and the electrode bumps, and the electrode bumps are harder than the wiring bumps. This structure can reduce bonding damages to the electrodes of the semiconductor chip caused by a process of connecting the electrodes and the conductor wirings via the bumps.

Abstract: Methods for making solder balls, which can be used to bump semiconductor wafers are disclosed. Methods for bumping semiconductor wafers with the solder balls are also disclosed. The solder balls can be made using an injection molded soldering (IMS) process.

Abstract: A substrate improving immobilization of ball pads for BGA packages mainly comprises a substrate core, a plurality of ball pads and a solder resist layer. Each of the ball pads has a metal pad and at least a metal nail. The metal pads are adhered on a surface of the substrate core and the metal nails are embedded into but not penetrate the substrate core. The solder resist layer is formed over the substrate core and exposes the metal pads. By utilizing the shapes of the ball pads to increase bonding area between the ball pads and the substrate core, a separation or crack occurring at the interface between the metal pads and the substrate core can be substantially avoided.

Abstract: An integrated circuit and a method for making an integrated circuit is disclosed. In one embodiment, at least one contact of an electrically conductive material is formed on a substrate. A layer is disposed on the substrate to a predetermined height of the contact. An electrically conductive via hole is provided in the layer by the contact.

Abstract: A conductive composition for coating a semiconductor wafer comprises conductive filler that has an average particle size of less than 2 microns and a maximum particle size of less than 10 microns, a first resin that has a softening point between 80-260° C., solvent, curing agent, and a second resin, wherein at room temperature the first resin is substantially soluble in the solvent.

Abstract: A copper interconnection structure which is electroplated onto a silicon layer or semiconductor substrate. The structure includes an ultra-thin copper seed alloy incorporating selectively minor amounts of a dopant material to facilitate a continuous deposition thereof onto the silicon layer or semiconductor substrate. The copper seed alloy may contain dopant material selected from the group of materials consisting of Ru, Ir, Pt, Pd and alloys thereof. Furthermore, there is provided a method for producing the structure.

Abstract: A semiconductor device including at least two layers of interlayer-insulator-films stacked above a substrate and at least partially formed by a low-relative-dielectric-constant-film having a relative-dielectric-constant of 3.

Abstract: A connection between a first circuit within an I/O region of an integrated circuit chip and a second circuit within a core region of the chip. The first circuit is connected to a bonding pad through a first conductor in a first layer of an I/O region. The second circuit is connected to the bonding pad through a second conductor in a second layer of an I/O region above the first layer.

Abstract: A semiconductor chip device including a surface on which at least one electrical contact surface is provided. A foil from an electrically insulating material is applied, especially by vacuum, to the surface and rests closely to the surface and adheres to the surface. The foil, in the area of the contact surface, is provided with a window in which the contact surface is devoid of the foil and is contacted across a large area to at least one layer from an electroconductive material. In at least one embodiment, the layer from the electroconductive material is part of a flexible contact for electrically connecting the contact surface to at least one external connecting conductor.

Abstract: A method of forming vertical contacts in an integrated circuit that couple one or more metal lines in a given metallization level to first and second features occupying different levels in the integrated circuit comprises various processing steps. A first etch stop layer is formed overlying at least of portion of the first feature while a second etch stop layer is formed overlying at least a portion of the second feature. An ILD layer is formed overlying the first and second etch stop layers. A photolithographic mask is formed overlying the ILD layer. The photolithographic mask defines a first opening over the first feature and a second opening over the second feature. A first etch process etches a first hole in the ILD layer through the first opening in the photolithographic mask that lands on the first etch stop layer and etches a second hole in the ILD layer through the second opening that lands on the second etch stop layer.

Abstract: A semiconductor package can comprise a die stack attached to a substrate, with bond wires electrically connecting the two. Often multiple die stacks are adhered to a single substrate so that several semiconductor packages can be manufactured at once. A molding compound flow controller is optimally associated with the substrate or semiconductor package at one or more various locations. Flow controllers can control or direct the flow of the molding compound during the encapsulation process. Flow controllers can be sized, shaped, and positioned in order to smooth out the flow of the molding compound, such that the speed of the flow is substantially equivalent over areas of the substrate containing dies and over areas of the substrate without dies. In this manner, defects such as voids in the encapsulation, wire sweeping, and wire shorts can be substantially avoided during encapsulation.

Abstract: Provided are a semiconductor chip package and a method of manufacturing the semiconductor package. The semiconductor chip package may include at least one semiconductor chip, whose upper surface includes a plurality of electrode pads on a substrate including a conductive pattern, and the conductive pattern and the electrode pads of the chip are connected electrically using a bonding wire. After a first insulation member is provided to an upper surface of the at least one semiconductor chip, the semiconductor chip package may be formed by providing a second insulation member in contact with the first insulation member, the bonding wires, and the at least one semiconductor chip.

Abstract: A multi-chip package including a carrier, at least one first chip, and a second chip is provided. The first chip is electrically connected to the carrier and disposed on the carrier. The second chip is electrically connected to the first chip and the carrier. A part of the second chip is disposed on the first chip and another part of the second chip is disposed on the carrier. A method of fabricating the multi-chip package is also provided.

Abstract: An electric power semiconductor device including first and second circuit patterns formed on main surfaces of first and second insulating substrates, respectively, first and second semiconductor chips mounted on the first and second circuit patterns, respectively, a multilayer electrode plate assembly disposed between the first and second insulating substrates, having first, second and third electrode terminals provided with a distance from each other, a first connecting conductor made by wire bonding for connecting the first and second semiconductor chips to the first and second electrode terminals, and a second connecting conductor having an extending portion extended from a part of the third electrode terminal to be connected to the second circuit pattern, and the connection between the extending portion of the third electrode terminal and the second circuit pattern is implemented by a solder.

Abstract: A difference in delay of signal transmission due to the wiring within a board is minimized. A wiring board includes wiring for connecting terminals included in one of a plurality of semiconductor chips to terminals included in another one of the plurality of semiconductor chips, through branch points. Each of the plurality of semiconductor chips includes first and second terminals. Moreover, a first wiring up to the first terminals and a second wiring up to the second terminals are in a positional relationship of being shifted parallel to each other in a planar direction of the wiring board so as not to come into electrical contact with each other.

Abstract: In order to fabricate a semiconductor device that can perform at its full capacity, in which (i) a single-crystal silicon integrated circuit is formed on an insulating substrate without an adhesive agent, and (ii) an active region of the single-crystal integrated circuit is not damaged by implantation of hydrogen ions, (a) the single-crystal silicon integrated circuit is formed on the insulating substrate, and (b) the single-crystal silicon integrated circuit is surrounded by an oxide (buried oxide layer made of silicon dioxide).

Abstract: The combined waterwheel oxygen-increasing machine pertains to the area of life-saving and facilitation equipment in aquaculture development. The existing waterwheel oxygen-increasing machine is a floating body with brackets integrally connected, inconvenient for assembly and disassembly and for general use. The present invention comprises of floating bodies, a power device, a reduction gearbox and impellers, wherein the power device is connected to a reduction gearbox, which then drives said impellers via an output shaft. The floating bodies are hollow, closed, bodies including longitudinal floating bodies and transversal floating body connected vertically with each other, wherein one end of the longitudinal floating bodies are connected to transversal floating body. The floating bodies bear an output shaft. The impellers are located in the midst of the area surrounded by the longitudinal floating bodies and the transversal floating body.

Abstract: This invention provides a packing element for use in a chemical processing apparatus housing a mass transfer reaction. The packing element has lobes and channels radially disposed around a common axis and alternately spaced from one another. The lobes abut at least 60% of the circumference of the smallest circle that circumscribes the element and the channels form openings that abut no more than 40% of the circumference.

Abstract: The present invention relates to a process for producing optical elements, in particular lenses made from an optoceramic, comprising a forming step, which step comprises the formation of a green body. The invention further relates to optical elements produced according to the before mentioned process. The process according to the present invention comprises a forming step including the application of a mould being close to the final geometry of the body to be formed (near net shape principle) including the application of moderate pressure between 0.1 MPa and 50 MPa, preferably between about 0.5 MPa and 25 MPa, in particular preferred between about 1 MPa und 12 MPa. The pressure is applied either on the ceramic powder mass during positioning of the ceramic powder mass into the form or is applied onto the ceramic powder mass within the form.

Abstract: A method of fabricating a polarizing plate includes: providing a polarizing roll film having transmission axes; and cutting the polarizing roll film with a knife having a plurality of openings each having a rectangular shape to form a plurality of polarizing plates, the plurality of openings parallel to the transmission axes.

Abstract: A method of manufacturing anti-bacteria polyamide fiber via high speed spinning disclosed a kind of method, which can make manufacturing anti-bacteria polyamide fiber via high-speed spinning realized, including the preparation of anti-bacteria particles and process of high-speed spinning. The preparation of anti-bacteria particles includes surface treatment of anti-bacteria agent and its process of preparation. Choose nano zeolite carrying silver ion as anti-bacteria agent, mix the anti-bacteria particles and polymer chips, after melting, produce anti-bacteria yarns via high speed spinning. The surface treatment to the anti-bacteria agent the invention can improve the spinnability of raw material and place foundation for realizing high speed spinning.

Abstract: The identification and location of possible faults of operation and/or installation of a hot runner are obtained through the measurement of the absorption of power by the heating resistors applied to the arms and to the injectors of the hot runner. The qualitative and quantitative analysis of the power absorbed by the resistors also enables identification of the type of possible faults and the corresponding seriousness.

Abstract: The disclosed invention provides a combined laminating, cutting and applying apparatus and method to manufacture time temperature indicator (TTI) labels for sensitive commodity items, wherein a chemical reaction occurs within the labels. The combined apparatus comprises a plurality of rollers withdrawing layers with chemicals that are being brought in contact by a presser. When the reactants are being pressed together, a temperature or time or both sensitive reaction starts between the layers. The label is being cut and immediately adhered on a commodity item that is also sensitive to time/temperature parameters so as to visually indicate the conditions to which the label had been exposed.

Abstract: A process for producing a transparent or opaque silica glass product including mixing a silica fine powder and a cellulose derivative and injection molding the mixture, followed by degreasing treatment and baking treatment, which is characterized in that the cellulose derivative is a cellulose derivative which causes reversible thermal gelation in an aqueous solution of at least one member selected from methyl cellulose, hydroxypropylmethyl cellulose and hydroxyethylmethyl cellulose; in producing a transparent silica glass product, the cellulose derivative is added in water heated at a gelation temperature thereof or higher, and after cooling, the formed aqueous solution is kneaded with the silica fine powder; and in producing an opaque silica glass product, the cellulose derivative is added in a silica slurry containing a silica powder and heated at a gelation temperature of the cellulose derivative or higher.

Abstract: A spinning nozzle for producing the synthetic fibers and a method for producing a DNA counterfeit-proof fiber by the spinning nozzle are provided. The spinning nozzle includes a polymer solution inflow passage and a pair of water inflow passages located at the both sides of the polymer solution inflow passage, wherein the polymer solution inflow passage and the water inflow passages are converged into a mixing outflow passage and a synthetic fibers are produced at the outlet of the mixing outflow passage. A method for producing a DNA counterfeit-proof fiber by the spinning nozzle includes the steps as follows. First, mixing a plurality of the DNA microcapsules with a material solution to produce a polymer solution. Then, to form a converging interface between the polymer solution and the two streams of acid-hydrolysis waters. Afterwards, causing the flowing polymer solution to converge with the two streams of acid-hydrolysis waters for producing the DNA counterfeit-proof fiber.

Abstract: This invention relates to a process for making toothbrushes, in particular an injection moulding process.

Abstract: According to the invention there is provided a method of forming a door skin including the steps of: introducing a sheet moulding compound (SMC) into a mould; moulding and at least partially curing the SMC to produce a skin having substantially the dimensions and external appearance of a door, and thereafter introducing an in-mould coating (IMC) composition to the mould; causing, at least partially through applied pressure, the IMC composition to spread across a surface of the skin; and curing the SMC composition to produce a cured door skin having a cured coating thereon.

Abstract: The invention provides a method for producing thermoplastic articles of two or more components with different surface finishes on different surface zones, using overmolding. In particular, a method is provided for producing thermoplastic articles of two or more components with a different surface finish on different surface zones, wherein one component has a paint finish.

Abstract: The present invention provides a vertical molding machine whose mechanisms can be simplified and whose cost can be lowered. The vertical molding machine includes a frame; an upper platen (31) fixed to the frame and having an upper mold (41) mounted thereon; a connection member disposed in such a manner as to extend downward from the upper platen (31); a lower base member held by the connection member under the upper platen (31); a lower platen (35) disposed in a manner capable of advancing and retreating along the connection member and having a lower mold mounted thereon; and a mold-clamping drive section which advances and retreats the lower platen (35) so as to bring the lower mold in contact with the upper mold (41) or move the lower mold away from the upper mold (41) for effecting mold closing, mold clamping, and mold opening. The lower base member is moved downward by a mold-clamping force generated by the drive section at the time of mold clamping.

Abstract: The present invention relates to release surfaces, particularly release surfaces with fine features to be replicated, and to lithography which may be used to produce integrated circuits and microdevices. More specifically, the present invention relates to a process of using an improved mold or microreplication surface that creates patterns with ultra fine features in a thin film carried on a surface of a substrate.

Abstract: In accordance with the invention, a mold for imprinting a patterned region by imprint lithography is provided with a peripheral groove around the patterned region. The groove is connected, as by channels through the mold, to a switchable source for gas removal to prevent bubbles and for the application of pressurized gas to separate the mold and substrate. In use, the mold is disposed adjacent the moldable surface and gas is withdrawn from the patterned region through the groove as the mold is pressed toward and into the moldable surface. At or near the end of the imprinting, the process is switched from removal of gas to the application of pressurized gas. The pressurized gas passes through the groove and separates or facilitates separation of the mold and the moldable surface.

Abstract: Method for stake-fastening an accessory (4) into a plastic fuel tank, whereby:—the accessory (4) is equipped with at least one orifice (5) which passes right through the accessory (4); —at least some of the plastic of which the wall of the tank (1) is made is melted; and—some of the molten plastic is forced through the orifice (5) of the accessory without becoming detached from the remainder of the molten plastic; —the protruding molten plastic is given an appropriate shape (8) to obtain a self-formed plastic rivet, and is left to solidify; the size and shape of the orifice (5) and/or of the solidified plastic (8) being such that the accessory (4) is mechanically fastened to the tank by at least some of the solidified plastic (8), the stake-fastening of the accessory (4) occurring at the time of manufacture of the tank (1) through the moulding of a split or at least two-part parison.

Abstract: A method of molding a shopping cart component includes providing a first subcomponent and then overmolding the shopping cart component as a second subcomponent about the first subcomponent. The first subcomponent acts as an obstacle to a plastic injection stream and to a gas injection stream during the overmolding of the second component to assist in defining a first hollow section of the shopping cart component adjacent the first subcomponent.

Abstract: An extrusion mold for molding a ceramic membrane having an one-end closed tube structure which is easily integrated and has a high gas separation efficiency, and a fabrication method of a ceramic membrane tube using the same, the extrusion mold comprised of an outer mold, an inner mold and an extrusion hole end cap, wherein the cap has a through hole at its center for controlling an extrusion molding density, and a passage is formed in each of the inner and outer molds for maintaining an inner pressure of an extruded tube to be the same as an outer pressure. The one-end closed ceramic membrane tube is fabricated by supplying a ceramic mixture into the extrusion mold in a state that the end of the extrusion hole of the extrusion mold is closed by the cap, removing the cap after filling the mixture in the end of the extrusion hole, and further supplying the mixture into the extrusion mold to obtain a tubular ceramic extrusion body with a particular length.

Abstract: A process and a device for the manufacture of a hollow body, particularly of a heat-resistant hollow body, which is molded out of a heated preform of thermoplastic plastic in a contoured blow mold through the introduction of a first medium into the preform, which medium is stored in a first medium storage unit and is under a pressure (p1) (preblowing phase), and the more or less simultaneous stretching of the hollow body through a stretching rod and the introduction of a second medium in the hollow body, which medium is stored in a second medium storage unit and the pressure of which (p2) is higher than the pressure of the first medium (p1) (final blowing phase), and which is cooled by a third medium, which is medium stored in a third medium storage unit (rinsing phase), whereby the preblowing medium is under a pressure of approximately 2-20 bar, the final blowing medium is under a pressure of approximately 15-45 bar, and the cooling medium is under a pressure of approximately 30-45 bar.

Abstract: A manufacturing method of a plugged honeycomb structure 30 which comprises a honeycomb substrate 1 and plugging portions 15 arranged so as to form complementary checkered patterns alternately at both end surfaces 11 and 21 of the honeycomb substrate 1. The method comprises attaching mask films 4a and 4b to both end surfaces 11 and 21 of the honeycomb substrate 1, respectively; forming slurry permeation holes 3a at portions of the mask films 4a and 4b corresponding to cell opening end portions 7, respectively; forming deaeration holes 3b at portions of the mask films 4a and 4b facing the portions provided with the slurry permeation holes 3a via cells 2; submerging both end surfaces 11 and 21 of the honeycomb substrate 1 to which the mask films 4a and 4b have been attached into a plugging slurry 6, respectively; and firing the resultant slurry filled substrate 20.

Abstract: A vibration isolation apparatus is provided that includes a main spring and a tuned mass damper. The main spring has a first end and a second end, and is configured to resonate when vibrated within a predetermined frequency range with a first axial surge mode having a magnitude. The tuned mass damper is coupled to the main spring at a first axial position located substantially equidistantly between the main spring first end and the main spring second end and is configured to reduce the first axial surge mode magnitude at least 50% when the main spring is vibrated within the predetermined frequency range. Methods of manufacturing the vibration isolation apparatus are also provided.

Abstract: An elastomer bushing having an increased axial rate, improved durability, and high fatigue life due to the compression and confinement of the rubber element is provided. The manufacture of the elastomer journal is conventional for commercial vehicle applications. In a primary embodiment, the rubber is bonded to a bar pin by an adhesive, wherein the rubber journal is then subsequently assembled into an outer tube. After assembly, the outer tube is curled to retain the rubber journal, and the center of the outer tube diameter is swaged or compressed so as to deform the outer tube into the rubber. The compressed groove in the outer tube comprises the unique feature of this bushing design. This groove provides a mechanical “footing” that resists movement when an axial load is applied.

Abstract: A workholder, in particular a saw jig, is provided for mounting a substrate containing a plurality of electronic devices. The saw jig has a base platform having a plurality of pockets laid out in the same arrangement as the electronic devices are arranged on the substrate and a plurality of resilient collets are detachably inserted into the pockets, each collet being sized and configured to hold one electronic device by vacuum suction.

Abstract: The invention provides for a binding assembly for a printer. The binding assembly includes a chassis defining an inlet for receiving a sheet of paper from the printer, and an exit hatch from which bound sheets can be removed. The assembly also includes a glue wheel assembly arranged on the chassis and configured to apply glue to an edge of the sheet when the sheet is fed through the inlet, and a document support platen for supporting bound sheets of paper. Also included is a binding platen configured to press the sheet onto the document support platen to bind the sheet to other sheets supported on said support platen.

Abstract: A machine that is operable to create a series of holes in at least one sheet of paper includes a base, a punch mechanism positioned on the base, and a tray coupled to the base. The tray includes a first guide and a second guide. The tray is configured to move between a first position and a second position. Movement of the tray between the first position and the second position adjusts a position of the first guide and a position of the second guide relative to the punch mechanism.

Abstract: An apparatus for feeding sheets to a sheet processing machine smoothes out and fixes a sheet through the use of a suction groove disposed transversely relative to a sheet transport direction, before the sheet is gripped by an onward transport device. A sheet-fed rotary printing press having the apparatus is also provided.

Abstract: An imaging apparatus including a media source having a plurality of sheets of photothermographic imaging media contained therein, an exposure unit including an input engagement point, an output engagement point, and a laser module positioned therebetween, and a driven roller pair forming a nip. A driven roller pair is configured to receive a leading edge of a sheet from a media source and is configured to begin extracting the sheet from the media source and driving the sheet along a transport path extending from the media source to at least the output engagement point of the exposure unit. Upon the leading edge being engaged by the input engagement point, the nip is configured to open while the trailing edge of sheet is still within the media source such that a remaining portion of the sheet is extracted from he media source by the exposure unit while the laser module exposes a desired image on the sheet.

Abstract: A separation roller includes a body, a shaft assembly and two friction roller assemblies. The shaft assembly is connected to the body. The friction roller assembly is mounted on two ends of the shaft assembly and located on two sides of the body. The friction roller assembly contacts a sheet, and the body is separated from the sheet. The body provides a limiting torque to the friction roller assemblies through the shaft assembly to limit movement of the sheet. A sheet separating mechanism using the separation roller is also disclosed.

Abstract: There is provided a feed roller that includes a feed drive roller and a teeth roller drivenly rotated by making contact with the feed drive roller, wherein the circumferential surface of the feed drive roller is equipped with a groove with which a part of the teeth roller makes contact.

Abstract: A foosball table accessory comprises at least one themed foosball man outfit which is attachable to and removable from a foosball man without removing the foosball man from an associated rod, wherein the foosball man outfit comprises one of headgear selectively attachable to and removable from a head portion of the foosball man, torso gear selectively attachable to and removable from a torso portion of the foosball man, and combinations thereof. A visually striking presentation may be provided when the foosball man outfits are provided for one whole team of foosball men and wherein the opposing team has suitably selected opposing outfits. A thin mat adding visual elements to the playing surface may be provided to further accentuate the desired theme.