Abstract: A method for forming a seed layer for damascene copper wiring is provided. The method comprises the step of forming a seed layer, during damascene copper wiring formation, using an electroless plating solution comprising a water-soluble nitrogen-containing polymer and glyoxylic acid as a reducing agent, wherein the weight-average molecular weight (Mw) of the water-soluble nitrogen-containing polymer is 1,000 to less than 100,000. Preferably, the electroless plating solution further comprises phosphinic acid.

Abstract: A cap layer for a metal feature such as a copper interconnect on a semiconductor wafer is formed by immersion plating a more noble metal (e.g. Pd) onto the copper interconnect and breaking up, preferably by mechanical abrasion, loose nodules of the noble metal that form on the copper interconnect surface. The mechanical abrasion removes plated noble metal which is only loosely attached to the copper surface, and then continued exposure of the copper surface to immersion plating chemicals leads to plating at new sites on the surface until a continuous, well-bonded noble metal layer has formed. The method can be implemented conveniently by supplying immersion plating chemicals to the surface of a wafer undergoing CMP or undergoing scrubbing in a wafer-scrubber apparatus.

Abstract: In a semiconductor device having a bonding wireless structure, a preform material is used for electrically connecting a metal plate serving as a connection with an electrode layer of a semiconductor chip. Thus, a multilayered metal layer needs to be provided in a junction part between the preform material and a first electrode layer, but has a problem of a variation in electrical characteristics and characteristic fluctuations in a temperature cycling test and the like. A metal layer mainly made of titanium is formed with a thickness of 1000 ?, as a bottom layer (a first metal layer in contact with an electrode layer of a semiconductor chip) in a multilayered metal layer with an electron impact heating deposition method. Thus, the film quality of the Ti layer is improved compared with the conventional structure, which minimizes variations in electrical characteristics and characteristic fluctuations in the multilayered metal layer.

Abstract: An explanation is given of, inter alia, an electronic device (10), comprising: an integrated component (12) with a substrate, an electrically conductive first layer region (14), arranged at the substrate, wherein the layer thickness of the first layer region is greater than 10 micrometres or greater than 50 micrometres.

Abstract: Highly thermally stable metal silicides and methods utilizing the metal silicides in semiconductor processing are provided. The metal silicides are preferably nickel silicides formed by the reaction of nickel with substitutionally carbon-doped single crystalline silicon which has about 2 atomic % or more substitutional carbon. Unexpectedly, the metal silicides are stable to temperatures of about 900° C. and higher and their sheet resistances are substantially unaffected by exposure to high temperatures. The metal silicides are compatible with subsequent high temperature processing steps, including reflow anneals of BPSG.

Abstract: An integrated circuit arrangement includes a substrate with a multiplicity of integrated semiconductor components arranged therein, the substrate having a wiring interconnect near to the substrate, a middle wiring interconnect and a wiring interconnect remote from the substrate, which are arranged in this order at increasing distance from the substrate.

Abstract: A micro electro-mechanical system, which can be stably formed so as to prevent sticking of a movable part and which has a narrow gap, and a method of manufacturing the same are provided. The micro electro-mechanical system includes at least one fixed electrode formed above a principal surface of a semiconductor substrate and at least one movable electrode formed on the principal surface. The at least one movable electrode includes the movable part separated from the principal surface and the at least one fixed electrode. The movable part is movable with respect to the principal surface and the at least one fixed electrode.

Abstract: A semiconductor chip has an active face in which an integrated circuit region is implanted. The chip includes an inclined lateral contact pad extending beneath the plane of the active face and electrically linked to the integrated circuit region. An electronic module includes a substrate having a cavity in which the chip is arranged. The module can be applied to the production of thin contactless micro-modules for smart cards and contactless electronic badges and tags.

Abstract: In a cell base design, when a circuit using a spare cell is corrected, a wiring length is shortened as much as possible, and the number of wiring layers which are affected by correction is reduced. Mask pattern data that expresses the configurations of a signal input terminal and a signal output terminal of a spare cell is set to mask pattern data of a wiring layer that is equal to or higher than a second wiring layer. As a result, the length of a wiring that is connected to the spare cell can be shortened as much as possible.

Abstract: This invention is directed to offer a semiconductor device having a stacked layer structure and its manufacturing method that bring high yield and reliability. Semiconductor dice judged as good dice are stacked on a base substrate in which through holes and through hole electrodes are formed. Next, a protection layer to cover the semiconductor dice is formed. It is preferable that the protection layer is composed of a plurality of resin layers (a first resin layer and a second resin layer) that are different in hardness from each other. Then, a conductive terminal that is connected with the through hole electrode is formed on a back surface of the base substrate. Next, the second resin layer and the base substrate are cut along predetermined dicing lines and separated into individual semiconductor devices in chip form. As described above, a process step of separation into the semiconductor devices is performed while each of the semiconductor dice is mounted on the base substrate in wafer form.

Abstract: A semiconductor module (1) which has semiconductor chips (2) each with one power supply electrode (6, 7) on its back, respectively for applying a supply potential (4, 5) and each with a power output electrode (8, 9) on its top side, respectively for transferring an output current to power outputs (10, 11, 12) of the semiconductor module (1). Furthermore, the semiconductor chips (2) have control electrodes (14, 15) for switching the semiconductor component. The semiconductor module has on its underside leads with supply leads on which the semiconductor chips (2, 3) are arranged with their power supply electrodes (6, 7). In addition, output leads (22, 23, 24) are effectively connected to the power output electrodes (8, 9). Finally, signal leads (25, 26, 27), which are effectively connected to the control electrodes (14, 15) or the power output electrodes (8, 9) are arranged on the underside of the semiconductor modules.

Abstract: A semiconductor device of one embodiment has a substrate, a semiconductor chip mounted over the substrate by flip-chip bonding, and a semiconductor chip provided over the semiconductor chip, wherein a space resides between the substrate and the semiconductor chip.

Abstract: A wiring board includes a main surface where an electronic component is mounted in a face-down manner so that a surface of the electronic component having plurality of external connecting terminals faces the main surface of the wiring board, the electronic component being fixed to the wiring board by an adhesive; an insulating layer formed on the main surface where the electronic component is mounted; an opening part formed in the insulating layer so that a plurality of adjacent wiring patterns are commonly and partially opened, the adjacent wiring patterns having electrodes where electrodes of the electronic component are connected; wherein an outer periphery of the opening part situated at a center side of the wiring board is formed in an oblique direction against extending directions of the wiring patters.

Abstract: A chip structure comprising a semiconductor substrate, a plurality of dielectric layers, a plurality of circuit layers, a passivation layer, a metal layer and at least a bump. The semiconductor substrate has a plurality of electronic devices positioned on a surface layer of the semiconductor substrate. The dielectric layers are sequentially stacked on the semiconductor substrate and have a plurality of via holes. The circuit layers are disposed on one of the dielectric layers, wherein the circuit layers are electrically connected with each other through the via holes and are electrically connected to the electronic devices. The passivation layer is disposed over the circuit layers and the dielectric layers, wherein the passivation layer comprises an opening that exposes one of the metal layers. The metal layer is disposed over the passivation layer, wherein the metal layer comprises at least a bump pad and at least a testing pad, the bump pad electrically connecting with the testing pad.

Abstract: A microelectronic substrate and a package including the substrate. The substrate comprises: a wafer; circuitry disposed within the wafer and including a plurality of bonding pads; and a plurality of bumping sites disposed on respective ones of the bonding pads, each of the bumping sites comprising a nanolayer including columnar nanostructures.

Abstract: An improved method for performing an improved Temporary Chip Attach utilizing an Injection Molded Solder (IMS) process to allow efficient testing of die for creating a Known Good Die Bank. The IMS is applied to the testing substrate to form a column on the substrate. The die to be tested can then be attached to the IMS column with C4 solder. A slight reflow is then applied to the die, allowing some of the C4 to melt, and form an electrical connection with the corresponding IMS column. After testing, the die can be removed along with the C4 from the IMS column or permanently attached the substrate by performing a full reflow of the C4.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.

Abstract: An integrated circuit chip package and a method of manufacture thereof are provided. In one embodiment, the integrated circuit chip package comprises a semiconductor die having power and ground routings, a plurality of through wafer vias disposed within the semiconductor die, the through wafer vias connected to the power and ground routings, and a substrate attached to the semiconductor die, the substrate having power and ground leads connected to the through wafer vias for transferring power from the substrate to the semiconductor die.

Abstract: An electronic device includes: a semiconductor chip that includes an integrated circuit, a plurality of electrodes electrically connected to the integrated circuit, and a passivation film formed in a manner that at least a portion of each of the plurality of electrodes is exposed; a resin layer that is formed on the passivation film; a plurality of wirings, each of the plurality of wirings extending from a top surface of each of the plurality of electrodes to a top surface of the resin layer and electrically connected to each of the plurality of electrodes, respectively; a wiring substrate that has a wiring pattern opposing to and electrically connected to portions of the plurality of wirings above the resin layer; and a hardened adhesive resin that is placed between the semiconductor chip and the wiring substrate, wherein the adhesive resin internally has a residual stress that is generated by contraction at the time of hardening the adhesive resin, and a portion of the adhesive resin is disposed between a p

Abstract: A specially designed mask controls the arrangement of conductive materials that form a source and drain of a transistor. Designing the mask can be costly and time-consuming, which means that the testing of a circuit involving a transistor can also be costly, time consuming and a barrier towards efficient circuit development and testing. Accordingly, the present invention provides a pre-fabricated, general-purpose pattern comprising an array of conductive islands. The pattern is used as a source and a drain terminal for the formation of a thin-film transistor and as a conductive source for the formation of other electrical components upon the array.

Abstract: A semiconductor device is disclosed that includes a wiring board having a via formed therein; a semiconductor element provided on the wiring board; a resist layer covering a surface of the wiring board, the resist layer having an opening in a part thereof positioned on the via; and a sealing resin covering the surface of the via in the opening and the resist layer, and sealing the semiconductor device.

Abstract: A substrate on which a plurality of epoxy over molded integrated circuit dies are formed includes a beam formed on the substrate for providing stiffness to the substrate. The beam includes structure having a cross-sectional shape, for example, substantially in the shape of a trapezoid, “T” or “L”, and may be formed on the top or bottom surface of the substrate.

Abstract: A carburetor for a stratified charge two cycle engine with a choke bore, venturi, and throttle bore configuration matching an irregularly shaped choke valve. The trailing and leading edges of the choke and throttle valves, respectively, preferably overlap during wide open throttle operation to separate a single intake passage bore into an air intake passage above the choke and throttle valves and an air/fuel intake passage below the choke and throttle valves. The choke valve is preferably bent to minimize operational rotation and limit fuel spit back.

Abstract: A kit for coupling a container holding a liquid to a fluid path of a humidifier is disclosed. The kit includes a spike configured to pierce the container and to pass the liquid from the container to a vent through a tube. The vent is configured to vent gas from the liquid while retaining the liquid. The vent has a vent body including an inlet configured for coupling to the tube to receive the liquid from the tube and an outlet configured to pass the liquid to the humidifier. A cap opening is positioned to vent the gas. A filter is positioned over the cap opening to prevent the escape of the liquid therethrough. A cap is coupled to the vent body over the cap opening and has at least one opening therein to allow passage of gas from the opening to atmosphere.

Abstract: A diffuser assembly with a buoyancy vessel and a chamber for buoyantly raising the diffuser assembly for maintenance work. The diffuser assembly has a support structure, diffusers connected to the frame, and a buoyancy vessel positioned on the frame, capable of alternating between a state of buoyancy or ballast.

Abstract: A method for producing a photochromic synthetic resin object, comprising: (a) applying a layer, comprising at least one liquid monomer suitable for forming a polymer and at least one photochromic dyestuff, to at least one internal surface area of a first casting mold situated in a casting assembly, and partially or completely curing the layer to form a photochromic polymer layer; (b) optionally applying a protective layer to the completely or partially cured photochromic polymer layer, and curing the protective layer; (c) introducing a casting resin into the casting assembly which comprises a predetermined mold cavity formed by the first casting mold together with a second casting mold in the casting assembly, and (d) curing the casting resin to form a photochromic synthetic resin object; and a photochromic synthetic resin object produced by this method.

Abstract: The invention relates to coextruded foils with prism structure, to a process for production of coextruded foils with prism structure and to uses.

Abstract: A method of making a polarizing sheet and a related method of lamination are disclosed. The method of making a polarizing sheet includes steps of forming a surface-modified polarizer having carboxylic groups from a polyvinyl alcohol (PVA) film, and then performing a thermocompression lamination to laminate the polarizer with at least one protective film having hydroxyl groups on a surface thereof to form a polarizing sheet.

Abstract: Disclosed is an injection moulding machine, comprising an extruder for continuously producing a melt of a desiccant-filled polymer; at least one injection device fluidly connected with the extruder by a first conduit to receive melt and including an injection ram movable to a forward position for injection of melt into an injection mould and a rear position for introduction of melt into the injection device; characterized in that the injection moulding machine further comprises a sensor which allows determination of the viscosity or melt flow index of the desiccant-filled polymer. Further disclosed is a method of operating such a compounder-type injection moulding machine.

Abstract: The present invention is directed at an improved method for forming two-tone trim panels for automobiles and the like, wherein the color demarcation line between color regions of the panel skin may be hidden in a narrow groove or joint. The groove in the formed skin may be formed by the expansion pressure of foam conforming the skin to a narrow projection in a foam mold. Alternatively, a narrow groove may be formed by skiving or embossing along the color demarcation line.

Abstract: A method of producing a porous ceramic media structure is provided. The method comprises preparing an aqueous solution that comprises ceramic fibers in a liquid carrier, adding a pore-forming, fibrous material to the aqueous solution, drying the aqueous solution to form a ceramic web, and removing the fibrous material from the ceramic web to thereby increase the porosity of the ceramic web.

Abstract: The present invention relates to a method of making a cemented carbide body. The body is made using conventional powder metallurgical methods such as milling, pressing and sintering. According to the invention, a combined sintering process is used comprising at least a sequence where the batch of bodies in the sintering furnace is heated to a sintering temperature at least above the melting point of the binder phase. The batch of bodies in the sintering furnace is then allowed to cool down to a temperature at least below the melting point of the binder phase and kept there for at least from about 1 but preferably less than about 30 minutes and then heated up again to a sintering temperature at least above the binder phase melting point. The present invention also relates to a cemented carbide body made according to the method.

Abstract: Methods of manufacturing hot mix on site utilizing a composition of discrete substances that are capable of being mixed together to form a composite material are disclosed. The composition includes a plurality of pellets of a tacky, deformable material at an ambient temperature dispersed within a flowable fine material. Stone aggregate is placed in a mixing chamber that has been moved within proximity of the location where the hot mix is to be used. At least a portion of the stone aggregate is heated in the mixing chamber to a temperature sufficient to soften the pellets of the tacky, deformable material. The composition of discrete substances is added into the mixing chamber. The mixture of the composition of discrete substances and the stone aggregate is agitated until the pellets of a tacky, deformable material soften and uniformly coat the stone aggregate.

Abstract: A film (5) is extruded from plastic material by means of an extruder. Material is mixed into the plastic (5a) of the plastic film (5) before the extrusion so that cavitation bubbles are formed in the material particles mixed into the plastic (5a) when the plastic film is stretched. The film (5) is orientated by stretching. After the extrusion the plastic film (5) is cooled slowly below the crystallization point of the plastic material before the orientation.

Abstract: In a method for manufacturing compact keypad, a first molding die with bottom surface of smooth face, matted face or patterned layer is prepared. Colloid is injected into the first molding die and a first carrier covers the surface of the colloid. A rolling wheel presses the first carrier and the colloid evenly into the first molding die. The colloid is cured by UV light to form a keypad layer attached on the first carrier. A background color layer, a functional color layer and a textual color layer are formed on the first carrier. A second carrier is prepared and a reflection layer is printed on the surface of the second carrier. The second carrier and silicon rubber are placed into a second molding die and thermally pressed therein to form a resilient layer. The resilient layer is adhered with the keypad layer to form the keypad panel.

Abstract: There are provided a press-molding apparatus and a work-conveying method, which are capable of restraining oxygen from entering the molding apparatus when a work, such as a mold or a material, is carried into the molding apparatus. In a press-molding apparatus comprising a heating section, a molding section and a cooling section, each of the sections including an inlet and an outlet for a work, each of the inlet and the outlet is provided with a door, which has a restoring force and is capable of being push-opened, whereby a work is conveyed, push-opening the door.

Abstract: This invention relates generally to methods of rotationally molding multi-layer parts. More particularly, in certain embodiments, the invention relates to methods of manufacturing a part having an interior layer of polymerized macrocyclic polyester oligomer and an exterior layer of a substantially non-oligomeric polymer. The invention also relates to methods of manufacturing a part with a scratch resistant surface.

Abstract: A method for creating spout assembly for use with a container having an internal chamber in communication with a predefined opening includes molding steps. A hollow body is molded of a first material and includes a passage therethrough. A base member of a second material is molded over the hollow body in a mold using at least a part of the hollow body as at least a part of the mold, The base member is configured to be secured to the container and is configured to cover the predefined opening. The step of molding the base member over the hollow body is carried out such that the hollow body is rotatably mounted to the base member to be movable between an open position and a closed position upon completion of the molding step.

Abstract: A method and apparatus is provided which uses activation members for incrementally stretching a web at a low strain rate. The activation members include an activation belt and a single activation member wherein the activation belt and single activation member comprise a plurality of teeth and grooves that complement and engage one another at a depth of engagement in a deformation zone. The depth of engagement can be controlled to increase linearly over at least a portion of the deformation zone such that a web interposed between the activation belt and the single activation member in the deformation zone is incrementally stretched at a low rate of strain.

Abstract: In a solution casting system, a casting die causes dope containing polymer and solvent to flow. A casting support belt is disposed movably under the casting die, for forming cast film from the dope being cast. A stripping roller strips the cast film having a self-supporting property to form self-supporting cast film. A first dryer stretches the self-supporting cast film, and while the self-supporting cast film is stretched, applies first gas with temperature T2 to the self-supporting cast film containing the solvent, to evaporate the solvent therefrom. A second dryer, after the self-supporting cast film is stretched, applies second gas with temperature T3 to the self-supporting cast film containing the solvent, to evaporate the solvent therefrom for obtaining polymer film. The first and second dryers satisfy a condition of: 0<T2?T3<50. Also, a tentering machine contains the first and second dryers to stretch the self-supporting cast film.

Abstract: Disclosed is: (i) a molding system having a hydraulic valve, (ii) a molding system having: (a) an extruder, (b) a hydraulic circuit, and (c) a hydraulic valve, (iii) a hydraulic valve of a molding system, (iv) a method of a molding system having a hydraulic valve, and (v) a valve controller performing a method of a molding system having a hydraulic valve. The hydraulic valve includes: (i) a valve sleeve that is configured to convey a pressurized hydraulic fluid, and (ii) a valve spool that is movable relative to the valve sleeve, once the valve spool is made to move from a valve-closed position to a valve-opened position, the valve spool is imparted with a running start before the pressurized hydraulic fluid is permitted to flow out of the valve sleeve.

Abstract: The present invention relates to a polyethylene composition wherein (i) the composition has an MFR2 of 0.05 to 100 g/10 min, (ii) the environmental stress crack resistance ESCR measured in hours according to ASTM 1693, condition B and E-modulus EM measured according to ISO 527-2: 1993 in MPa satisfy the following relation: ESCR>?EM h/MPa+1150 h.

Abstract: A method for bow reduction of a composite sheet includes providing a bow composite sheet including a top sheet and a bottom sheet, the top sheet including a non-metal and the bottom sheet including a metal, and either placing the bow composite sheet on a continuous transportation unit including a cooling unit to substantially eliminate the bow through the cooling unit, or placing the bow composite sheet on a fixed cooling unit spraying a cooling fluid to substantially eliminate the bow.

Abstract: The invention relates to a process for the production of a die for the production of a surface-structured coating which can be bonded to a sheet-like substrate, in particular a leather or a textile material, and which is formed by application of a liquid plastic material to the surface of the die and subsequent solidification of the plastic material, the die having a surface structure corresponding to the surface structure of the coating, wherein the surface structure of the die is produced by laser engraving.

Abstract: A process for producing foam moldings from prefoamed foam particles which have a polymer coating under pressure in a mold in the absence of steam, and also foam moldings produced therefrom and their use.

Abstract: A nano-molding process including an imprint process that replicates features sizes less than 7 nanometers. The nano-molding process produces a line edge roughness of the replicated features that is less than 2 nanometers. The nano-molding process including the steps of: a) forming a first substrate having nano-scale features formed thereon, b) casting at least one polymer against the substrate, c) curing the at least one polymer forming a mold, d) removing the mold from the first substrate, e) providing a second substrate having a molding material applied thereon, f) pressing the mold against the second substrate allowing the molding material to conform to a shape of the mold, g) curing the molding material, and h) removing the mold from the second substrate having the cured molding material revealing a replica of the first substrate.

Abstract: In a method of manufacturing a thin keypad of a keypad panel having a smooth surface, a mist surface or a lines layer, the method includes the steps of: preparing a mold with an internal bottom surface of a coarse surface, a smooth surface or a lines surface; applying an adhesive into the mold and coating a carrier onto the surface of the adhesive; rolling the surface of the carrier by a roller to level the adhesive in the mold; performing a ultraviolet projection to cure the adhesive to form a keypad layer on the carrier; filming a ground color layer, a function color layer and a font color layer sequentially on the carrier as the background of the keypad panel; and hot pressing and combining the keypad layer and silicon to produce the keypad panel.

Abstract: A method and device are provided for manufacturing a unitary caul sheet to be used in creating a composite material fuselage for an airplane. Specifically, a generally tubular shaped tool having a hollow interior cavity defining a fuselage IML surface is provided. In the method, a caul sheet material such as polyurea is applied to the IML surface before an armature is inserted into the interior cavity of the tool. Then, a filler material is introduced between the armature and the caul sheet material. Further, steam is injected to form the filler material into an infrastructure. Then, the caul sheet material is cured before the tool is removed from the caul sheet material to expose the caul sheet to receive composite material.

Abstract: This invention relates to an object having a display panel embedded in its top surface and processes for its manufacture. The process comprises the steps of: forming an in-mold display transfer film or foil which comprises a temporary carrier layer, a release layer, a display panel, an adhesive layer and optionally a durable layer; feeding said in-mold display transfer film or foil into a mold with the temporary carrier film in contact with the inner surface of the mold; forming an object in the mold and transferring the in-mold display transfer film or foil onto the object; removing the object formed from the mold; and simultaneously removing both temporary carrier layer and release layer.

Abstract: A device (1) for treating containers (10) with a nozzle device (4) which fills the container (10) with a gaseous medium, wherein the nozzle device (4) can be introduced at least partly in a mouth (12) of the container (10). Furthermore a wall body (6) is provided which surrounds completely at least one area of the nozzle device in the peripheral direction, and a sealing device (8) to seal a space (R) between the container (10) and the wall body (6). According to the invention the sealing device (8) can be pressed in a substantially radial direction against the outer periphery of the mouth (12) of the container (10).