Abstract: A novel design and method of fabricating a semiconductor device. In a preferred embodiment, the present invention is a flip chip package including a BT substrate. On the side of the substrate facing the die, thin traces are formed of an enhanced conductive material. Conductive bumps such as eutectic solder balls are then mounted on the traces, and the die mounted to the bumps. The die then packaged and mounted to a printed circuit board using, for example, a ball grid array.

Abstract: Integrated circuit devices include electrically conductive interconnects containing carbon nanotubes. An electrical interconnect includes a first metal region. A first electrically conductive barrier layer is provided on an upper surface of the first metal region and a second metal region is provided on the first electrically conductive barrier layer. The first electrically conductive barrier layer includes a material that inhibits out-diffusion of the first metal from the first metal region and the second metal region includes a catalytic metal therein. An electrically insulating layer having an opening therein is provided on the second metal region. A plurality of carbon nanotubes are provided as a vertical electrical interconnect in the opening.

Abstract: A method for manufacturing a semiconductor device comprises growing a carbon nano tube (CNT) in a contact hole to form a contact plug, thereby preventing diffusion of a tungsten layer. The method does not require forming a titanium nitride (TiN) film deposited to improve an adhesive strength. The CNT has an excellent electric conductivity and a high mechanical strength to improve characteristics of the device.

Abstract: Devices are presented including: a substrate including a dielectric region and a conductive region; a molecular self-assembled layer selectively formed on the dielectric region; and a capping layer formed on the conductive region, where the capping layer is an electrically conductive material such as: an alloy of cobalt and boron material, an alloy of cobalt, tungsten, and phosphorous material, an alloy of nickel, molybdenum, and phosphorous. In some embodiments, devices are presented where the molecular self-assembled layer includes one or more of a polyelectrolyte, a dendrimer, a hyper-branched polymer, a polymer brush, a block co-polymer, and a silane-based material where the silane-based material includes one or more hydrolysable substituents of a general formula RnSiX4-n, where R is: an alkyl, a substituted alkyl, a fluoroalkyl, an aryl, a substituted aryl, and a fluoroaryl, and where X is: a halo, an alkoxy, an aryloxy, an amino, an octadecyltrichlorosilane, and an aminopropyltrimethoxysilane.

Abstract: A damascene wire and method of forming the wire. The method including: forming a mask layer on a top surface of a dielectric layer; forming an opening in the mask layer; forming a trench in the dielectric layer where the dielectric layer is not protected by the mask layer; recessing the sidewalls of the trench under the mask layer; forming a conformal conductive liner on all exposed surface of the trench and the mask layer; filling the trench with a core electrical conductor; removing portions of the conductive liner extending above the top surface of the dielectric layer and removing the mask layer; and forming a conductive cap on a top surface of the core conductor. The structure includes a core conductor clad in a conductive liner and a conductive capping layer in contact with the top surface of the core conductor that is not covered by the conductive liner.

Abstract: A semiconductor device with a bonding pad is provided. The semiconductor device includes a first substrate having a device area and a bonding area, wherein the first substrate has an upper surface and a bottom surface. Semiconductor elements are disposed on the upper surface of the first substrate in the device area. A first inter-metal dielectric layer is disposed on the upper surface of the substrate in the bonding area. A lowermost metal pattern is disposed in the first inter-metal dielectric layer, wherein the lowermost metal pattern serves as the bonding pad, and the first substrate is exposed through an opening in the lowermost metal pattern.

Abstract: A method of forming an organic silica-based film, including: applying a composition for forming an insulating film for a semiconductor device, which is cured by using heat and ultraviolet radiation, to a substrate to form a coating; heating the coating; and applying heat and ultraviolet radiation to the coating to effect a curing treatment, wherein the composition includes organic silica sol having a carbon content of 11.8 to 16.7 mol %, and an organic solvent, the organic silica sol being a hydrolysis-condensation product produced by hydrolysis and condensation of a silane compound selected from compounds shown by the general formulae (1): R1Si(OR2)3, (2): Si(OR3)4, (3): (R4)2Si(OR5)2, and (4): R6b(R7O)3-bSi—(R10)d—Si(OR8)3-cR9c.

Abstract: The present invention adds one or more thick layers of polymer dielectric and one or more layers of thick, wide metal lines on top of a finished semiconductor wafer, post-passivation. The thick, wide metal lines may be used for long signal paths and can also be used for power buses or power planes, clock distribution networks, critical signal, and re-distribution of I/O pads for flip chip applications. Photoresist defined electroplating, sputter/etch, or dual and triple damascene techniques are used for forming the metal lines and via fill.

Abstract: A semiconductor device according to an embodiment includes: a semiconductor substrate having a semiconductor element formed on a surface thereof; an interwiring insulating film formed above the semiconductor substrate; a wiring formed in the interwiring insulating film; a first intervia insulating film formed under the interwiring insulating film; a first via formed in the first intervia insulating film and connected to a lower surface of the wiring; a second intervia insulating film formed on the interwiring insulating film; a second via formed in the second intervia insulating film and connected to an upper surface of the wiring; and a CuSiN film formed in at least one of a position between the interwiring insulating film and the first intervia insulating film, and a position between the interwiring insulating film and the second intervia insulating film.

Abstract: A method of manufacturing a semiconductor device includes: forming a first pad including a first metal and an inter-connection line including the first metal in a scribe lane region; forming a second pad including the first metal in a chip region; sequentially forming an etch-stop layer and a first insulation layer on the first pad, the inter-connection line, and the second pad; exposing the first and second pads by patterning the etch-stop layer and the first insulation layer; forming third and fourth pads including a second metal on the first and second pads; sequentially forming second and third insulation layers on the third pad, the fourth pad, and the patterned first insulation layer; and etching the first, second, and third insulation layers using the patterned photosensitive layer on the third insulation layer to expose the third and fourth pads.

Abstract: A device according to various aspects of the present invention generally includes a surface mount device having a top side, a bottom side, a plurality of sidewalls, and a circuit comprising one or more layers. The device includes a first conductive surface covering a portion of one of the sidewalls for providing an input to the circuit, a second conductive surface covering a portion of one of the sidewalls for providing an output from the circuit, and a third conductive surface covering a portion of one of the sidewalls for providing an electrical ground to the circuit. When the surface mount device is mounted to a provided mounting surface, at least one layer of the circuit is orthogonal to the provided mounting surface.

Abstract: A method for realizing a nanometric circuit architecture includes: realizing plural active areas on a semiconductor substrate; realizing on the substrate a seed layer of a first material; realizing a mask-spacer of a second material on the seed layer in a region comprised between the active areas; realizing a mask overlapping the mask-spacer and extending in a substantially perpendicular direction thereto; selectively removing the seed layer exposed on the substrate; selectively removing the mask and the mask-spacer obtaining a seed-spacer comprising a linear portion extending in that region and a portion substantially orthogonal thereto; realizing by MSPT from the seed-spacer an insulating spacer reproducing at least part of the profile of the seed-spacer realizing by MSPT a nano-wire of conductive material from the seed-spacer or insulating spacer, the nano-wire comprising a first portion at least partially extending in the region and a second portion contacting a respective active area.

Abstract: A semiconductor device includes a substrate having a dielectric layer and a device layer on the substrate. The device layer has an opening. First and second sublayers are disposed on the device layer and line the opening. The second sublayer serves as a stop layer for planarization to provide a substantially planarized top surface for the semiconductor device.

Abstract: This invention prevents a break in a signal wire disposed between wire ends due to attenuation and improves production yields of devices. In a standard cell, a first signal wire extends in a first direction. Second and third signal wires extend in a second direction substantially perpendicular to the first direction and are facing each other across the first signal wire. The second and third signal wires have the widths larger than the width of the first signal wire.

Abstract: A damascene approach may be utilized to form an electrode to a lower conductive line in a phase change memory. The phase change memory may be formed of a plurality of isolated memory cells, each including a phase change memory threshold switch and a phase change memory storage element.

Abstract: A chip stack package may include a substrate, semiconductor chips, a molding member and a controller. The substrate may have a wiring pattern. The semiconductor chips may be stacked on a first surface of the substrate. Further, the semiconductor chips may be electrically connected to the wiring pattern. The molding member may be formed on the first substrate covering the semiconductor chips. The controller may be arranged on a second surface of the substrate. The controller may be electrically connected to the wiring pattern. The controller may have a selection function for selecting operable semiconductor chip(s) among the semiconductor chips.

Abstract: A semiconductor device (1,21) includes a solid state device (2,22), a semiconductor chip (3) that has a functional surface (3a) on which a functional element (4) is formed and that is bonded on a surface of the solid state device with the functional surface thereof facing the surface of the solid state device and while maintaining a predetermined distance between the functional surface thereof and the surface of the solid state device, an insulating film (6) that is provided on the surface (2a, 22a) of the solid state device facing the semiconductor chip and that has an opening (6a) greater in size than the semiconductor chip when the surface of the solid state device facing the semiconductor chip is vertically viewed down in plane, and a sealing layer (7) that seals a space between the solid state device and the semiconductor chip.

Abstract: A pellet for use in die bonding of an electronic chip and a substrate in an electronic component generates minimized voids in spite of the pellet being made of a lead-free solder. The pellet forms a colorless transparent protective film comprising Sn-(30-50 at % 0)-(5-15 at % P) or Sn-(10-30 at % In)-(40-60 at % O)-(5-15 at % P) when heated for soldering, has a thickness of 0.05-1 mm, and has generally the same shape as the semiconductor chip to be bonded to the substrate.

Abstract: A semiconductor device (601) is provided which comprises a substrate (603); a semiconductor device (605) disposed on said substrate and having a first major surface; a first metal strap (615) which is in electrical contact with said substrate and which is adapted to provide power to a first region (608) of said semiconductor device; and a second metal strap (616) which is in electrical contact with said substrate and which is adapted to provide ground to a second region (609) of said semiconductor device.

Abstract: A semiconductor device that improves adhesion between a resin and a die pad and prevents cracking of the resin includes: a semiconductor chip; a die pad on which the semiconductor chip is mounted; a bonding agent for bonding the semiconductor chip to the die pad; a plurality of inner leads provided at the outer periphery of the die pad; outer leads extending from the inner leads; bonding wires connecting the inner leads to the semiconductor chip mounted on the die pad; and a resin for sealing the inner leads, the die pad, the semiconductor chip, the bonding agent and the bonding wires. The bonding agent is further disposed in all or part of a margin of the die pad at a peripheral portion where the semiconductor chip is mounted, and a plurality of dimples are formed in the surface of the bonding agent in the die pad margin.

Abstract: A layout structure disposed on the substrate of the liquid crystal display (LCD) for chip coupling is provided. The first and second orientations that are substantially perpendicular to the first orientation can be defined on the substrate. The layout structure includes a plurality of lines, which extend along the second orientation, and a plurality of conductive pads that are respectively disposed on the lines. The conductive pads are distributed along the first orientation and staggered along the second orientation. Each line can shift away from the adjacent conductive pad on the first orientation. Thus, the LCD chip has a better conductivity and a thinner dimension under the precision of the conventional machines.

Abstract: A semiconductor device comprises a semiconductor layer including a plurality of paralleled linear straight sections extending in a first direction. The layer also includes a plurality of connecting sections each having a width in the first direction sufficient to form a wire-connectable contact therein and arranged to connect between adjacent ones of the straight sections in a second direction. The connecting sections have respective ends formed aligned with a first straight line parallel to the second direction.

Abstract: A humidifier includes a water storage tank, and an air passage and a filtering device in the water storage tank; the filtering device has a hollow holding portion therein, and magnetic members held in the hollow holding portion, which will make metallic substances adhere to the hollow holding portion when water is flowing through the filtering device; the filtering device has an annular wall between the hollow holding portion and an outer wall thereof; the filtering device has a flow passage, which exists next to inner and outer sides of the annular wall, and which is stuffed with ion exchange resin for filtering out minerals; the filtering device having a water inlet on an outward edge of a lower end thereof, and a water outlet on an inward edge of the lower end; therefore, unfiltered water is prevented from flowing to the heater through the air passage.

Abstract: The present invention relates to a carburetor of an internal combustion engine having a manually activated start position. The carburetor comprises at least a choke valve and a throttle valve both located in the carburetor's main air passage which are able to move between an open and a closed position, each valve having at least one respective lever that cooperates during the manual activation to give at least one start position of the choke and throttle valves. The carburetor further usually comprises at least one thermally responsive member arranged to affect the start position. Further a handle is arranged to provide a two stage draw—lift motion to attain the start position.

Abstract: The present invention includes molds for forming ophthalmic lenses, such as contact lens. In particular, the present invention relates to apparatus, molds and methods for fashioning mold parts used to fashion an ophthalmic lens which includes cooling a mold structure used to fashion a mold part prior to depositing a molten material into the mold structure.

Abstract: A fine channel device capable of producing fine particles in an industrial scale, hardening the fine particles immediately after the production and recovering the fine particles from a medium without collapsing the shape of the produced fine particles, a fine particle producing method using the fine channel device and a solvent extraction method using the fine channel, are presented. The fine channel device comprises a fine channel provided with an inlet port and an inlet channel which feed a dispersion phase, an inlet port and an inlet channel which feed a continuous phase, and an outlet channel and an outlet port which discharge fine particles produced by the dispersion phase and the continuous phase, wherein the inlet channel for feeding the dispersion phase and the inlet channel for feeding the continuous phase are joined at an arbitrary angle, and the two inlet channels are connected to the outlet channel at the arbitrary angle.

Abstract: A method of separating a poly(arylene ether) from a solvent includes treating a poly(arylene ether)-containing solution with a devolatilizing extruder to form an extruded composition, and cooling the extruded composition with a cooling device that does not immerse the extruded composition in water. The composition may be used to isolate a poly(arylene ether) from the solvent-containing reaction mixture in which it is prepared, or to remove solvent from a multi-component poly(arylene ether)-containing thermoplastic composition.

Abstract: A permeable cement composition including an aqueous slurry of a hydraulic cement which is based upon a water-immiscible dispersed fluid phase and a hollow particulate material. The hollow particulate material breaks down in the presence of the cement so as to leave voids which together with the dispersed phase create a permeable structure in the cement.

Abstract: Composite sections for aircraft fuselages and methods and systems for manufacturing such sections are disclosed herein. A composite section configured in accordance with one embodiment of the invention includes a skin and at least first and second stiffeners. The skin can include a plurality of unidirectional fibers forming a continuous surface extending 360 degrees about an axis. The first stiffener can include a first flange portion bonded to an interior surface of the skin and a first raised portion projecting inwardly and away from the interior surface of the skin. The second stiffener can include a second flange portion bonded to the interior surface of the skin and a second raised portion projecting inwardly and away from the interior surface of the skin. A method for manufacturing a section of a fuselage in accordance with one embodiment of the invention includes positioning a plurality of uncured stiffeners on a mandrel assembly.

Abstract: The invention is a method of manufacturing construction precast elements made of porous construction materials, especially composite materials with open structure of pores, cured under normal temperatures, such as concretes, where these construction materials are formed of a mixture of aggregate and bond. Unsorted plastic waste is added into the mixture of aggregate and bond. Such unsorted plastic waste is freed from dirt, crushed and shaped into granules. These granules of plastic waste are mixed into the mixture of construction material before curing. When cured, the resulting precast element is heated to a temperature causing at least part of the granules to melt into a fully liquid state. The resulting composite element is allowed to cool. The plastic waste becomes an additional bond in the precast elements.

Abstract: The present invention relates to a process for the production of moldings from finely divided materials based on lignocellulose, and the moldings obtainable thereby. The invention also relates to the use of aqueous compositions which comprise at least one crosslinkable urea compound for the preparation of finely divided materials based on lignocellulose and treated with this composition for the production of moldings.

Abstract: There are provided a method for dividing a ceramic cylindrical body, involving forming first and second notched portions in an inner periphery surface of the ceramic cylindrical body at positions confronting each other in the diametrical direction and subsequently applying a compressive load in the diametrical direction to divide the cylindrical body along the first and second notches, thereby making it possible to afford divided surfaces having such a concave and a convex as prevent axial displacement when re-joining divided sections, as well as a shape of the notched portions. Bisected cylindrical body portions can be joined together closely without axial displacement of the joined cylindrical body.

Abstract: A composition and method for making a simulated rock climbing, including the steps of making a mold for a basic shape for a rock climbing wall casting, filling the mold with cellular concrete; allowing the concrete to cure partially and inverting it in a bed of sand, removing the mold to expose the simulated rock climbing wall casting; sandblasting the simulated rock climbing wall casting into its general finished shape; and using concentrated sandblasting to form integral recesses and protrusions comprising various hand holds.

Abstract: In certain exemplary embodiments of the present invention, three-dimensional micro-mechanical devices and/or micro-structures can be made using a production casting process. As part of this process, an intermediate mold can be made from or derived from a precision stack lamination and used to fabricate the devices and/or structures. Further, the micro-devices and/or micro-structures can be fabricated on planar or nonplanar surfaces through use of a series of production casting processes and intermediate molds. The use of precision stack lamination can allow the fabrication of high aspect ratio structures. Moreover, via certain molding and/or casting materials, molds having cavities with protruding undercuts also can be fabricated. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure.

Abstract: A composition comprises, based on the total weight of the composition: from 10 to 80 wt. % of a modified polybutylene terephthalate copolymer that (1) is derived from polyethylene terephthalate component selected from the group consisting of polyethylene terephthalate and polyethylene terephthalate copolymers and (2) has at least one residue derived from the polyethylene terephthalate component; from 10 to 80 wt. % of a polycarbonate; from 0 to 20 wt. % of an impact modifier; from 1 to less than 25 wt. % of a reinforcing filler; from 0.1 to less than 2.5 wt. % of a fibrillated fluoropolymer; from 0 to 5 wt. % of an additive selected from the group consisting of antioxidants, mold release agents, colorants, quenchers, stabilizers, and combinations thereof. The composition has a heat deflection temperature of at least 110° C., measured in accordance with to ASTM D648 on 3.2 mm thick molded bars at 0.455 MPa.

Abstract: The present disclosure is directed to systems and methods of manufacturing filter cartridges are disclosed, the system including a tube of laminated and seamed filter media, a media unwind mechanism, a mandrel having a starting point operatively positioned proximate the media unwind mechanism, structure, operatively positioned proximate the mandrel, for feeding the tube of laminated and seamed filter media into the starting point of the mandrel, structure, operatively positioned in the mandrel, for pressurizing the tube of laminated and seamed filter media with a gas, structure, operatively positioned in the mandrel, for expanding the tube of laminated and seamed filter media into a substantially cylindrical shape as the tube of laminated and seamed filter media passes over the mandrel, a pleater mechanism, operatively positioned proximate the mandrel, a blade mechanism, operatively associated with the pleater mechanism, for alternately engaging the tube of laminated and seamed filter media with the blade mec

Abstract: The invention provides a method of manufacturing a golf ball composed at least in part of a spherical elastomeric body. The method includes the steps of extruding a bar of an unvulcanized rubber compound for obtaining the elastomeric body, cutting the extruded bar into slugs of a given length, and coating the slug with a saturated or unsaturated carboxylic acid metal salt in powder form having a melting point at or below a vulcanizing temperature. This method prevents the slugs from clumping together and improves mold releasability.

Abstract: Process for moulding sheets possessing, locally, a three-dimensional projecting or recessed structure (6), in which a blank sheet (7) is placed between the two parts of a mould, the surface of which corresponds to the negative (2) of said three-dimensional structure. At least one portion of the surface of the mould surrounding said negative possesses a feature intended to form a local reservoir able to supply or receive material of the three-dimensional structure depending on whether it is projecting or recessed, respectively.

Abstract: A lamp body is an enclosing structure that encloses a blue light-emitting crystal to form a LED structure. In a method of manufacturing frame body of the LED, resin, titanium, and fluorescent powder are mixed uniformly to constitute a composition of frame body, then the composing materials being placed into a mould for processing a thermally pressing procedure to thus form a frame body. By the blue light emitted from the blue light-emitting crystal, the fluorescent powder of the frame body may be excited to emit uniform yellow light, which may be further mixed with the blue light to become white light.

Abstract: A method for making a polyarylene ether copolymer including mixing a polyarylene ether, a hydroxyaromatic terminated siloxane reagent and an oxidant, and melt compounding the mixture. A polyarylene ether copolymer including a polyarylene ether, a hydroxyaromatic terminated siloxane reagent, an oxidant and a filler is also presented.

Abstract: A method of forming thermoplastic polyurethane (TPU) into an optical lens. Suitable TPUs contain urethane (—NHCOO—) repeating units that are present in at least 23% by weight. This range of urethane weights is an indicator of a flexural modulus above 1,400 MPa. The TPUs have refractive indices above 1.54 and Abbe numbers above 27. They have glass transition temperatures above about 100 degrees C. The selected TPU can be injection molded to form ophthalmic lenses, that are well suited for use in rimless spectacles. The lenses are highly solvent resistant, while at the same time being readily tintable. The lenses made according the invention meet FDA 21 CFR 801.41 Impact Requirement, and ANSI Z87.1 high velocity impact (HVI) standard.

Abstract: The method of predicting the amount of deformation due to shrinkage of a molded article of the present invention finds a support point P of the bending moment M from a distribution of shrinkage rates of a molding material forming a molded article 10 and uses the support point P to predict the amount of deformation. At that time, it is preferable to use the support point P to find the bending moment M and to use the bending moment M to predict the amount of deformation.

Abstract: A cellulosic resin film which is wide and, despite this, is extremely reduced in breakage during a stretching step; a process for producing the film; and an antireflection film, a polarizer, and a liquid-crystal display each comprising or employing the film. The process for cellulosic resin film production comprises casting a liquid cellulosic resin on a support to form a web, peeling the web from the support, subsequently drying the web in a first edge gripping step (105) while gripping both edges, temporarily eliminating the edge gripping, and then stretching both edges in the width direction in a second edge gripping step (109). The process is characterized in that the first edge gripping step is followed by a heat treatment step in which both edge parts of the web relieved from the edge gripping are heated with heating rolls (107 and 108).

Abstract: To provide a flexible mold useful for manufacturing a PDP rib having a lattice pattern and other microstructures, and capable of highly precisely manufacturing the microstructures without involving defects such as occurrence of bubbles and pattern deformation. A flexible mold comprises a base layer made of a first curable material having a viscosity of 3,000 to 100,000 cps at 10 to 80° C. and a coating layer coating a surface of the base layer and made of a second curable material having a viscosity of 200 cps or below at 10 to 80° C.

Abstract: A polyester composition comprising a reaction product of 50 to 95 wt. % of a polyester having a number average molecular weight of greater than or equal to 42,450 g/mol, wherein the polyester is of the formula wherein T is a divalent C6-10 aromatic group derived from a dicarboxylic acid, and D is a divalent C2-4 aliphatic group derived from a dihydroxy compound; 16 to 25 wt. % of a carboxy reactive impact modifier; and more than 0 to 5 wt. % of a fluoropolymer; wherein the composition has less than 70 wt. % of a polyester derived from a dicarboxylic acid and an aliphatic diol component selected from 1,3-propylene glycol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, decamethylene glycol, cyclohexanediol, and 1,4-cyclohexanedimethanol.

Abstract: A polyester composition comprising a reaction product of: 65-94.5 weight percent of a polyester having a weight average molecular weight of greater than or equal to 70,000 g/mol, of the formula wherein each T is a C6-10 aromatic group derived from a dicarboxylic acid and D is a C2-4 aliphatic group derived from a dihydroxy compound; 5-30 weight percent of an impact modifier copolymer comprising units derived from a C2-20 olefin and units derived from a glycidyl(meth)acrylate; and 0.5-5 weight percent of a particulate fluoropolymer encapsulated by a copolymer having a Tg of greater 10° C. and comprising units derived from a monovinyl aromatic monomer and units derived from a C3-6 monovinylic monomer; and wherein the composition has less than 70 weight percent of a polyester derived from a dicarboxylic acid and an aliphatic diol selected from the group consisting of 1,3-propylene glycol, neopentyl glycol, 1,5-pentanediol, 1,6-hexanediol, decamethylene glycol, cyclohexanediol, and 1,4-cyclohexanedimethanol.

Abstract: This invention discloses bottles and pre-forms prepared by injection-stretch-blow-moulding (ISBM) from a composition comprising polypropylene and an inorganic non-sorbitol nucleating agent.

Abstract: A method of producing a laminated body having a ceramic porous body having a thickness of 300 ?m or larger and a ceramic dense body having a thickness of 25 ?m or smaller. A green body for the porous body and a green body for the dense body are laminated to obtain a laminate, which is then subjected to pressure molding by cold isostatic pressing to obtain a pressure molded body. The pressure molded body is sintered to obtain a laminated sintered body. By reducing the leakage rate of helium gas of the laminated sintered body to 10?6 Pa˜m3/s or lower, the operational efficiency of the cell can be improved, and the deterioration of the cell can be prevented to improve an output after the cell is subjected to initiation and termination cycle tests of operation.

Abstract: Molten steel is conducted by a tubular shroud interconnecting a slide gate at a bottom tap hole of a ladle with the molten steel in an underlying tundish of a continuous caster. The flow path is confirmed to be isolated from contaminants in atmospheric air by applying a source of partial vacuum to the internal cavity of tubular shroud to allow prevailing atmospheric pressure acting on molten steel in a tundish to push molten steel upwardly in the internal cavity of the tubular shroud. A measure of the partial vacuum in the cavity of the shroud is used to assess the integrity of the gas tight seal. Before and after the integrity of the gas tight seal is determined, a three way valve is used to apply an inert gas to the volume in the cavity of the shroud.

Abstract: [SUMMARY] [Object] To provide a container that, even when an openable lid is made larger, can be easily opened and closed in high safety level. [Means for Solving] A container includes a container main body that has a first opening in an upper portion and can store a molten metal, a first lid that can cover the first opening and is rotatably disposed in a horizontal direction against the first opening, a pressurized gas introducing port for introducing a pressurized gas into the container main body and a flow path that supplies the molten metal stored inside of the container main body outside thereof.