Abstract: A gamma ray detector ring for a combined positron emission tomography (PET) and magnetic resonance imaging (MRI) system is integrated into a radio frequency (RF) coil assembly such that the detector ring is integrated with a RF shield. Each gamma ray detector in the detector ring includes a scintillator component that emits light when a gamma ray is detected and a photodetector component designed to be sensitive to the frequency of light produced by the scintillator. A RF shield may be integrated into a detector ring such that the RF shield is positioned between the scintillator and photodetector components of each detector, thereby saving valuable radial space within the imaging system. Multiple such detector rings may be located adjacent to one another to increase axial coverage and enable three-dimensional PET imaging techniques.

Abstract: In an arrangement with a basic field magnet and with a gradient coil of a magnetic resonance apparatus, the basic field magnet includes superconducting coils that are arranged in a reservoir with liquid helium for cooling. The helium reservoir is surrounded by a further reservoir, designated as an outer vacuum chamber. A vacuum exists between the outer vacuum chamber and the helium reservoir. A cryoshield is arranged between the outer vacuum chamber and the helium reservoir. The gradient coil is arranged in the inner chamber of the basic field magnet. The outer vacuum chamber has an additional coating with a high electrical conductivity.

Abstract: In a transmit apparatus, a multi-channel radio frequency transmitter (30, 46) includes a plurality of transmit elements (32) defining at least two independently operable transmit channels. A transmit configuration selector (54) determines a selected transmit configuration (60) specifying amplitude and phase applied to each transmit channel to generate a B1 field in a corresponding selected region (90) of a subject (38) coupled with the radio frequency transmitter. The transmit configuration selector determines the selected transmit configuration based on B1 mapping (58) of the subject and a B1 field quality assessment employing at least two different B1 field quality measures.

Abstract: A medical imaging system (2) excites multiple nuclei through a single RF amplifier (24). The medical imaging system (2) includes a magnet (10) that generates a main magnetic field (Bo) in an examination region. A gradient coil (14) superimposes magnetic field gradients (G) on the main magnetic field Bo. At least one transmitter (28) generates multi-nuclei excitation pulses associated with at least two different isotopes and two different frequency spectra. The single amplifier (24) sends the multi-nuclei excitation pulses to a RF coil (18, 20) for application to the examination region.

Abstract: To reduce high SAR values in the field of magnetic resonance imaging, and particularly with a body coil for an MRI apparatus, at least a bracket is added between the supporting tube of a body coil and the connecting copper sheet in order to raise the connecting copper sheet and the capacitors away from the human body. In addition to effectively solving the problem of a high SAR value, at the same time no significant loss of the imaging performance occurs. Moreover, the structure is simple, so the costs of modification or production are low.

Abstract: In one aspect an induction resistivity tool incorporated into a downhole tool string comprises an outer wall of a downhole component comprising an outer diameter and at least one induction transmitter assembly disposed along the outer diameter. The at least one transmitter assembly comprises at least one induction transmitter coil wound about at least one core. The at least one transmitter coil is adapted to project an induction signal outward from the outer wall when the at least one transmitter coil is carrying an electrical current. The transmitter assembly is adapted to create electromagnetic fields that originate the induction signal from outside the outer wall and substantially prevent the signal from entering the outer wall.

Abstract: In one aspect an induction resistivity tool incorporated into a downhole tool string comprises an outer wall of a downhole component comprising an outer diameter and at least one induction transmitter assembly disposed along the outer diameter. The at least one transmitter assembly comprises at least one induction transmitter coil wound about at least one core. The at least one transmitter coil is adapted to project an induction signal outward from the outer wall when the at least one transmitter coil is carrying an electrical current. The transmitter assembly is adapted to create electromagnetic fields that originate the induction signal from outside the outer wall and substantially prevent the signal from entering the outer wall.

Abstract: In one aspect of the invention an induction resistivity tool incorporated into a downhole tool string comprises an outer wall of a downhole component having an outer diameter. At least one induction transmitter assembly is disposed along the outer diameter. The transmitter assembly comprises at least one coil array and at least one induction transmitter coil wound about at least one core. The coil array comprises a plurality of magnetic units and each unit comprising a magnetic field orientation. The magnetic field orientations accumulatively form a Halbach array with an augmented field side and a canceled field side of the array. The transmitter assembly generates an induction signal from outside the outer wall and substantially prevents the signal from entering the outer wall when the transmitter assembly is carrying an electrical current.

Abstract: A marine electromagnetic sensor cable includes a plurality of sensor modules disposed at spaced apart locations along a cable. Each module includes at least one pair of electrodes associated with the module. The electrodes are arranged to measure electric field in a direction along the direction of the cable. The cable is arranged to form a closed pattern. Another marine electromagnetic sensor cable includes a plurality of sensor modules disposed at spaced apart locations along a cable. Each module includes at least one pair of electrodes associated therewith. The electrodes are arranged to measure electric field in a direction along the direction of the cable. A plurality of spaced apart magnetic field sensors is associated with each module and arranged to enable determining an electric field amplitude in a direction transverse to the direction of the cable from magnetic field gradient.

Abstract: A method for measuring magnetotelluric response of the Earth includes measuring transient controlled source electromagnetic response of the subsurface below a body of water over a plurality of actuations of an electromagnetic transmitter. The transient response measurements are stacked. The stacked transient responses are subtracted from measurements of total electromagnetic Earth response over a time period including the plurality of transient response measurements to generate the magnetotelluric response. A method for determining a component of electric field response to a time varying electromagnetic field induced in the Earth's subsurface, includes measuring magnetic field gradient in at least two orthogonal directions in response to the induced electromagnetic field and determining an electric field response in a direction normal to the magnetic field gradient measurements.

Abstract: Provided is a method of accurately measuring earth resistance even when the composition state of soil that affects the installation of a metering device for measuring earth resistance is unknown. The method comprises measuring a potential at a first potential electrode point, measuring a potential at a second potential electrode point, calculating a voltage slope corresponding to a change rate of potential difference, using a potential difference between the first and second potential electrode points, and setting a potential point according to voltage slope characteristics and measuring earth resistance. A measurement approximating an accurate value of earth resistance can be performed even when soil composition characteristics are unknown at a site.

Abstract: To characterize an electrical cable that is deployed in a well, a voltage input is applied to the electrical cable at an earth surface location, where the well extends from the earth surface location. A current response resulting from the voltage input is measured at the earth surface location. At least one parameter of the electrical cable is computed according to the measured current response.

Abstract: A visual indicator system comprises a fuel injector pulse width signal generator in communication with an engine fuel injector by means of a circuit wire. A visual indicator is in circuit communication with the circuit wire and configured to light up in a first stage to indicate a good electrical connection of the fuel injector to the fuel injector pulse width signal generator to the engine fuel injector when the fuel injector signal generator, the engine fuel injector and the circuit wire are energized by a vehicle ignition system. The visual indicator is further configured to light up a second stage to indicate a good pulse width signal generator operation when an automobile engine is running through operation of the fuel injector signal generator, the engine fuel injector and the circuit wire.

Abstract: For monitoring the operation of a gas discharge lamp operated with an AC voltage, a lamp voltage signal is generated which is dependent on the voltage dropped across the gas discharge lamp during operation. Said lamp voltage signal is filtered with an attenuation that is different for a DC component and for a component having the frequency of the AC voltage, whereupon a positive and negative peak value of the filtered lamp voltage signal are determined. For monitoring the gas discharge lamp, an average value of the two peak values is determined and compared with a limit value, and a difference value between the two peak values is determined and compared with a limit value.

Abstract: A pair of measuring switches S21, S22 is interposed between both terminals of a capacitor C, and inputs T1, T2 of AID converters 11c, 11d via resistors R1, R2. A pair of measuring switches S23, S24 is interposed between both inputs T1, T2 and a ground. The CPU 12a controls the measuring switches S21 to S24 so that when a terminal “a” of the capacitor C is positive charged, while the other terminal “b” of the capacitor C is grounded, both terminals “a” and “b” are respectively connected to the inputs T1 and T2. The CPU 12a controls the measuring switches S21 to S24 so that when the terminal “b” of the capacitor C is positive charged, while the terminal “a” of the capacitor C is grounded, both terminals “a” and “b” are respectively connected to the inputs T1 and T2.

Abstract: A disclosed specific absorption rate measurement system according to an embodiment of the present invention measures a specific absorption rate of electromagnetic waves from a radiating source absorbed in a dielectric medium. The system includes a measurement portion that measures a first electric field vector on an observation surface which is a two-dimensional surface in the dielectric medium; an electric field calculation portion that calculates a second electric field vector in a point excluded from the observation surface in accordance with electric field components of the first electric field vector measured on the observation surface, the electric field components being parallel to the observation surface; and a calculation portion that calculates the specific absorption rate from the calculated second electric field vector.

Abstract: Provided is a plasma diagnostic apparatus includes a probe unit, which is inserted into a plasma or disposed at boundary of a plasma, the apparatus includes: a signal supplying unit having a signal supplying source; a current detecting/voltage converting unit for applying a periodic voltage signal applied from the signal supplying unit to the probe unit, detecting the magnitude of the current flowing through the probe unit, and converting the detected current into a voltage; and a by-frequency measurement unit for computing the magnitude and phase of individual frequency components of the current flowing through the probe unit by receiving the voltage output from the current detecting/voltage converting unit as an input.

Abstract: An apparatus for checking lights on a tow trailer prior to connecting to a tow vehicle. The apparatus comprises a substantially hollow portable housing member. The portable member includes a turn signal switch for checking the status of such turn signals on such trailer, a brake light switch for checking the status of such brake lights, a tail light switch member for checking the status of tail lights on such trailer and a switch member for turning the portable housing member on and off. There is a power source for providing power to housing member disposed in the portable housing member. A communication means and is engageable with each of the power source, the turn signal switch, the brake light switch, the tail light switch and the switch means for providing electrical communication therein. A connection means is engageable with the communication means and is disposed on the housing member for connecting the housing member to a universal wiring harness of such trailer.

Abstract: A system and method for detection of environmentally-induced damage of conductive elements in a circuit board are disclosed. A system may include a test module and a detection module operably connected to the test module. The test module may comprise at least one conductive element. The detection module may be operable to detect a change in at least one electrical property associated with the at least one of conductive element, wherein the change occurs at least in part as a result of environmentally-induced damage to the at least one conductive element.

Abstract: A method and apparatus for testing an integrated circuit core or circuitry external to an integrated circuit core using a testing circuit passes a test vector from a parallel input of the testing circuit along a shift register circuit. The shift register circuit is configured to bypass one or more cores not being tested and to provide the test vector to a core scan chain of the core being tested. The bypassed cores are configured such that the associated shift register circuit portion is driven to a hold mode in which storage elements of the shift register circuit portion have their outputs coupled to their inputs. This method provides holding of the shift register stages when a core is bypassed and in a test mode, and this means the shift register stages are less prone to errors resulting from changes in clock signals applied to the shift register stages.

Abstract: Fuse sensing is performed in an integrated circuit by selecting a reference voltage based on a temperature measurement acquired by the integrated circuit. A state of one or more fuses included in the integrated circuit is sensed based on the reference voltage during normal operation of the integrated circuit. The state of the one or more fuses may be sensed during testing of the integrated circuit based on a different reference voltage.

Abstract: A shielding apparatus for electromagnetic testing includes a platform, a lid forming a cavity, a driving unit, and an elastic gasket attached to a bottom of the lid around a rim adjacent the cavity. The platform is for placing an electronic device to be tested. The lid is for covering the platform to define a closed space. The driving unit is for lifting and lowering the lid. The gasket is for being compressed and filling gaps between the lid and the platform when the platform covers the lid.

Abstract: This disclosure relates to an autosensitive detector and an autosensitive measurement system with a self-adjustable set-off value, and more specifically, to a probe for adaptation to an environmental parameter such as liquids adapted to reset its measured sensitivity each time the probe is enabled or turned on, which can be further desensitized by adjusting a sensitivity correction factor by a factor (F) within the range of 0.05<F<2.01 of the reset sensitivity or of up to ten times or ten percent of the reset sensitivity but most likely of 10 to 20% from the initial value using a remote control system such as a handheld programmer or programming function of the sensor board.

Abstract: A technique is disclosed for determining capacitive, inductive, and resistive components of power line impedance. A measurement circuit switches a burden resistor between power line conductors to cause a droop in a voltage waveform. The voltage waveform is sampled prior to inclusion of the resistor in the circuit, as well as after to identify the droop. The short circuit between the power lines is then removed by opening the circuit and a first effective capacitance in the test circuitry causes a resonant ring due to the inductive component of the power line impedance. The process is repeated a second time with a second effective load capacitance enabled in the test circuitry to cause a second resonant ring. Based upon the frequency of the rings and the voltage measurements, the capacitive, inductive, and resistive components of power line impedance can be computed.

Abstract: A module determines the mismatch corrected power output of a generator. Loads within the module provide at least three different load values. At least one power sensor detects at least a portion of the power output by the generator for each of the load values. Input electrical paths transmit power from the generator to the loads. At least one output electrical path transmits signals from the at least one power sensor indicative of power received when the generator is electrically connected to the different load values.

Abstract: A technique is disclosed for determining capacitive, inductive, and resistive components of power line impedance via a portable line impedance measurement system. The measurement system includes a circuit that switches a burden resistor between power line conductors to cause a droop in a voltage waveform. The voltage waveform is sampled prior to inclusion of the resistor in the circuit, as well as after to identify the droop. The short circuit between the power lines is then removed by opening the circuit and a first effective capacitance in the test circuitry causes a resonant ring due to the inductive component of the power line impedance. The process is repeated a second time with a second effective load capacitance enabled in the test circuitry to cause a second resonant ring. Based upon the frequency of the rings and the voltage measurements, the individual impedance components of power line impedance can be computed.

Abstract: A capacitive rain sensor for activating automotive window wipers includes: capacitive plates, electronic circuitry for sensing the capacitance between said plates, processing the sensed capacitance signal, and generating wipe commands. The capacitive plates are protected from water adsorption and condensation by means of a hermetic enclosure. The interconnection between the inside and outside of the enclosure is optionally implemented by means of conductors printed on the window. Wiper-induced and other parasitic signals are rejected by means of an adaptive filter Optional radiation sensor is utilized to suppress solar induced fast temperature variations. An optional far-field cancellation plate is utilized to minimize false wipes due to nearby objects.

Abstract: A differential electrode is charged and discharged in the opposite phases. By obtaining the sum of stray capacitances of the differential electrode from charge/discharge characteristics, the approach or the position of an object is detected based on the stray capacitances from which noise is cancelled.

Abstract: A system and method of detecting a network cabling change comprises measuring cable parameters of a cable to create a baseline signature of the cable and storing the baseline signature in a memory. The system and method is operable to detect a cable change based upon a comparison of the stored baseline signature and a subsequent cable measurement. A network device operable to perform the above method comprises a physical layer device that transmits signals into a coupled cable and receives return signals from the cable, a cable diagnostic module that measures cable parameters, a memory operable to store a baseline cable signature, and a controlling system that compares subsequently measured cable parameters to the baseline cable signatures to detect a cable change.

Abstract: This present invention discloses a method for performing an accurate calibration of signal measurement by a light-driving system including an automatic power control (APC) circuit which is pre-calibrated for a signal measurement process. By enlarging at least one measured pad of the APC circuit, multiple grounding paths are established via a plurality of probes of a test instrument. An impedance effect predicted on the contact between the probes and the pad is diminished greatly. A voltage value on the pad can be accurately measured. Thus, a reference voltage value input to a first input of a comparator of the APC circuit can be determined on a basis of a specific condition when a ramping voltage value input to a second input of the comparator is substantially equal to a sum of a predetermined reference voltage value and the voltage value of the pad.

Abstract: A return loss bridge circuit for testing a balanced test impedance includes an input connector and a reflection connector. The input connector and the reflection connector are electrically connected to an output of a network analyzer and an input of the network analyzer, respectively. The return loss bridge circuit further includes a reference impedance connected between the input and reflection connectors, first and second transformers and a common mode choke. The common mode choke is electrically connectable to the balanced test impedance.

Abstract: The test-socket lid subassembly of the invention consists of a lid for locking the object in the socket unit and a pusher with a handle for clamping the object in the locked position. The pusher is separated from the lid and is inserted into the lid for pressing on the object to fix the latter in the socket only after the lid is locked in place. The pusher is made in the form of a threaded ring, which has an outer thread for engagement with the inner thread in the central opening of the lid member for movement in the direction perpendicular to the contact surface of the object. This provides uniform distribution of pressure on the test object that is locked in the socket subassembly.

Abstract: We introduce a new Periodic micro coaxial transmission line (PMTL) that is capable of sustaining a TEM propagation mode up to THz band. The PMTL can be manufactured using the current photolithographic processes. This transmission line can be embedded in microscopic layers that allow many new applications. We use the PMTL to develop a wideband highly scalable connector that is then used in a Probe that can be used for connecting to microscopic scale Integrated Circuits with picoseconds High Speed Digital and near THz Analogue performance in various stages of development from R&D to production testing. These probes, in one embodiment, provide a thin pen-like vertical probe tip that matches the die pad pattern precisely that can be as agile as a high speed plotter pen, connecting on the fly to any die pattern on a wafer.

Abstract: Disclosed is a probe card providing an upper structure formed to be separatable from a lower structure and a lower structure including a lower substrate electrically connected with a plurality of the needles and a plurality of the lower terminals independently connected with the needles formed above the lower substrate. In particular, the lower structure of the probe card includes a needle fixing structure, a plurality of the needles fixed on the needle fixing structure, a lower substrate provided on the needle fixing structure while electrically connecting with the needles, and a plurality of the lower terminals formed on the upper surface of the lower substrate in order to be independently connected with the each needle. Meanwhile, the upper structure separatable from the lower structure includes a main substrate and a plurality of the upper terminals formed on the lower surface corresponding to the lower terminals.

Abstract: A probe card includes a base wiring layer, a rewiring layer, and a contactor. The base wiring layer has a non-contactor area and a contactor area that projects to a higher level than the non-contactor area. The rewiring layer is formed on a surface of the base wiring layer so that the contactor area is higher than the non-contactor area. The contactor is provided on a surface of the rewiring layer in a contactor area thereof.

Abstract: Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer comprises a substrate having a first surface and a second surface opposite of said first surface, a first plurality of contact elements disposed on said first side of said substrate, and a second plurality of contact elements disposed on said second surface of said substrate, wherein said interposer connects electronic devices via said first and said second plurality of contact elements.

Abstract: A reduced width tie bar and a common lead hold a die paddle of each integrated circuit SOT-23 package to a leadframe within a strip of leadframes after isolating signal leads from the leadframe. Strip testing of most devices in the SOT-23 lead packages may then be performed. The common lead may be at the center of an edge of the SOT-23 package. Also the common lead may be any one of the leads of the SOT-23 package. The reduced width tie bar may be downstream of the epoxy encapsulation flow for better package integrity.

Abstract: An improved contactor nest for receiving and holding IC devices against a pin board interposer during the test or burn-in of the devices includes a frame having an IC pocket with a top opening, which is oversized in relation to the footprint of the IC device for which the contactor is designed, and centering guide walls for guiding an IC device to be tested into the pocket from the oversized top opening to the IC device seating plane. The centering guide walls have a gradual angle relative to the insertion axis of the IC pocket, and extend down to a bottom perimeter portion of the IC pocket immediately adjacent the IC seating plane for gradually centering the IC device in the pocket as the IC device approaches the seating plane. Preferably, the angled guide walls extend far enough into the IC pocket to allow the spring pins of the pin board interposer to scrub the contact pads of the IC devices as the IC device is being centered.

Abstract: A test configuration for double sided probing of a device under test includes a holder to secure the device under test in a first orientation, a calibration substrate secured in a second orientation and a probe capable of calibration using the calibration substrate and probing the device under test.

Abstract: Disclosed is a test head comprising: a supporting member configured on an end face of a test head housing on a side of connection with a device under test; a pin electronics circuit disposed in the test head housing, the pin electronics circuit outputting a test signal; flexible wiring including one end connected to the pin electronics circuit and another end provided to elongate onto the supporting member on an outside of the test head housing; and a connection section with a side of the device under test, the connection section annexed on the other end of the flexible wiring, wherein a load loaded at a time of connection of the device under test to the connection section is supported by the supporting member.

Abstract: A probe card assembly used to test electronic devices in an automated test equipment system. The probe card assembly includes a substrate having a plurality of through-holes contained therein and a plurality of electrical contact elements. Each of the plurality of electrical contact elements has characteristics of both a torsional beam and a cantilever beam design and is configured to scrub a test pad associated with the electronic device in two directions concurrently. The plurality of electrical contacts is configured to be magnetically aligned to the substrate. Each of the plurality of electrical contact elements is further configured to be removably adhered to the substrate thus allowing easy field replacement of individual electrical contact elements.

Abstract: A semiconductor device, in which a test element group (TEG) including check patterns is formed together with a chip on a wafer so as to measure electric characteristics thereof, includes an interface circuit for selecting the check pattern from the test element group, a protection resistor connected in series with the test element group so as to protect the test element group, and a dummy element connected in series with the test element group. It allows the TEG test, which can be performed after packaging, to be easily performed at a high precision irrespective of dispersions of parasitic resistances and protection resistors. The test result is corrected based on the calculated values of the parasitic resistance and protection resistor and is then stored in a specific table form, wherein a pass/fail decision is made as to whether or not the test result falls within the prescribed range.

Abstract: A method and system for monitoring and compensating the performance of an operational circuit is provided. The system includes one or more integrated circuit chips and a controller. Each integrated circuit chip includes one or more operational circuits, each operational circuit having at least one controllable circuit parameter. Each integrated circuit chip also includes a process monitor module at least partially constructed thereon. The controller is coupled to each process monitor module and to each operational circuit. The controller includes logic for evaluating the performance of an operational circuit based on data obtained from process monitor module and operational circuit related data stored in a memory. Based on the evaluation, the controller determines whether any deviations from desired or optimal performance of the circuit exist. If deviations exist, the controller generates a control signal to initiate adjustments to the operational circuit to compensate for the deviations.

Abstract: An LSI chip includes a plurality of output terminals and a test circuit. The test circuit includes a single test signal input terminal, a single test signal output terminal, a shift register, and a plurality of switches. The shift register includes an input terminal, which is connected to the test signal input terminal, output bits of the shift register being equal to a number of the output terminals of the LSI chip, and a voltage level of one of the output bits of the shift register being different from these of other output bits of the shift register in response to a clock pulse. Each switch includes an input terminal, an output terminal and a control terminal.

Abstract: A method is provided for monitoring interconnect resistance within a semiconductor chip assembly. A semiconductor chip assembly can include a semiconductor chip having contacts exposed at a surface of the semiconductor chip and a substrate having exposed terminals in conductive communication with the contacts. A plurality of monitored elements of the semiconductor chip can include conductive interconnects, each interconnecting a respective pair of nodes of the semiconductor chip through wiring within the semiconductor chip. In an example of such method, a voltage drop across each monitored element is compared with a reference voltage drop across a respective reference element on the semiconductor chip at a plurality of different times during a lifetime of the semiconductor chip assembly. In that way, it can be detected when a resistance of such monitored element is over threshold. Based on a result of such comparison, a decision can be made whether to indicate an action condition.

Abstract: A semiconductor test apparatus including a test apparatus body generating a test pattern supplied to a semiconductor device; a test head directly contacting the semiconductor device and supplying to the semiconductor device the generated test pattern; a cable passing the test pattern from the test apparatus body to the test head; a holding platform holding the test head in a movable manner; and a movable support section holding the cable, moving in a direction to release tension on a side closer to the test head than the test apparatus body in a case where tension arises in the cable because the test head moves on the holding platform, and moving in a direction to pull the cable on a side closer to the test head than the test apparatus body in a case where slack arises in the cable because the test head moves on the holding platform is provided.

Abstract: The semiconductor device testing apparatus according to the present invention has a testing LSI; a power supply unit; and an intermediate substrate provided so that there is a connection between the testing LSI, and the power supply unit and tester. The testing LSI has a testing circuit and a waveform shaping circuit; a dielectric material layer disposed so as to face a tested semiconductor device; an electrode disposed in a position that corresponds to a position of an external terminal electrode of the tested semiconductor device on a surface of the dielectric material layer facing the tested semiconductor device; and a first penetrating electrode that passes completely through the dielectric material layer, is connected to the electrode, and is used for exchanging signals with the exterior.

Abstract: A semiconductor integrated circuit includes S PLLs (S is an integer satisfying S?2), and the (k?1)th PLL 12(k-1) (k is an integer satisfying 2?k?S) is connected to the kth PLL 12k in the test mode. In this manner, the examination of S PLLs can be performed in a single test, and thereby it can reduce the time needed to examine PLLs for the in semiconductor integrated circuit having a plurality of PLLs.

Abstract: An integrated multi-function analog circuit includes at least one MOSFET gate-drive circuit coupled to a first I/O pad. At least one voltage-sensing circuit is coupled to a second I/O pad. At least one current-sensing circuit is coupled to the second I/O pad and a third I/O pad. At least one temperature-sensing circuit is coupled to a fourth I/O pad.

Abstract: An integrated circuit device can include a plurality of field effect transistors (FETs) having channel depths no greater than a first depth, and at least a first switch junction FET (JFET) having a source coupled to a signal transmission input node, a drain coupled to a signal transmission output node, and a gate. The first switch JFET has a channel depth greater than the first depth. Switch JFETs can enable low resistance configurable switch paths to be created for interconnecting different portions of a same integrated circuit device.