Patents Issued in November 20, 2008
  • Publication number: 20080284037
    Abstract: Apparatus and methods are provided for high density packaging of semiconductor chips using silicon space transformer chip level package structures, which allow high density chip interconnection and/or integration of multiple chips or chip stacks high I/O interconnection and heterogeneous chip or function integration.
    Type: Application
    Filed: May 15, 2007
    Publication date: November 20, 2008
    Inventors: Paul S. Andry, John M. Cotte, John U. Knickerbocker, Cornelia K. Tsang
  • Publication number: 20080284038
    Abstract: An integrated circuit package system is provided including forming a perimeter paddle having a first external interconnect extending therefrom, mounting an integrated circuit die over the perimeter paddle, connecting a second external interconnect and the integrated circuit die, and encapsulating the integrated circuit die and the perimeter paddle with the first external interconnect exposed.
    Type: Application
    Filed: May 16, 2007
    Publication date: November 20, 2008
    Inventors: Antonio B. Dimaano, JR., Sheila Marie L. Alvarez
  • Publication number: 20080284039
    Abstract: A method for fabricating an interconnect structure for interconnecting a semiconductor substrate to have three distinct patterned structures such that the interconnect structure provides both a low k and high structural integrity. The method includes depositing an interlayer dielectric onto the semiconductor substrate, forming a first pattern within the interlayer dielectric material by a first lithographic process that results in both via features and ternary features being formed in the interconnect structure. The method further includes forming a second pattern within the interlayer dielectric material by a second lithographic process to form line features within the interconnect structure. Hence the method forms the three separate distinct patterned structures using only two lithographic processes for each interconnect level.
    Type: Application
    Filed: May 18, 2007
    Publication date: November 20, 2008
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Matthew E. Colburn, Elbert Huang, Satyanarayana V. Nitta, Sampath Purushothaman
  • Publication number: 20080284040
    Abstract: A semiconductor device in a packaged form including a semiconductor includes a semiconductor substrate with an active component disposed thereon and pads disposed on a surface thereof and connected to the active component, a first interconnection disposed on the semiconductor substrate and connected to the pads, a first insulating layer disposed on the semiconductor substrate in covering relation to the first interconnection and having an opening reaching a portion of the first interconnection, and a second interconnection disposed in the opening and on the first insulating layer and connected to the first interconnection.
    Type: Application
    Filed: August 8, 2007
    Publication date: November 20, 2008
    Inventor: Osamu Yamagata
  • Publication number: 20080284041
    Abstract: In a semiconductor package, an electrode has a first part extending through a semiconductor substrate and a second part extending from the first part through a compositional layer to reach a conductive pad.
    Type: Application
    Filed: March 11, 2008
    Publication date: November 20, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyung-sun JANG, Un-byoung KANG, Woon-seong KWON, Young-chai KWON, Chung-sun LEE, Dong-ho LEE
  • Publication number: 20080284042
    Abstract: An anisotropically conductive member has an insulating base material, and conductive paths composed of a conductive material which pass in a mutually insulated state through the insulating base material in a thickness direction thereof and which are provided in such a way that a first end of each conductive path is exposed on a first side of the insulating base material and a second end of each conductive path is exposed on a second side of the insulating base material. The conductive paths have a density of at least 2 million paths/mm2 and the insulating base material is a structure composed of an anodized aluminum film having micropores therein.
    Type: Application
    Filed: March 27, 2008
    Publication date: November 20, 2008
    Applicant: FUJIFILM CORPORATION
    Inventors: Yoshinori Hotta, Takashi Touma, Yusuke Hatanaka
  • Publication number: 20080284043
    Abstract: A base semiconductor component for a semiconductor component stack is disclosed. In one embodiment, the base semiconductor component has a semiconductor chip arranged centrally on a stiff wiring substrate. The wiring substrate has, in its edge regions, contact pads which are electrically connected to external contacts and at the same time to contact areas of the semiconductor chip and also to stack contact areas. The stack contact areas simultaneously form the upper side of the base semiconductor component and have an arrangement pattern corresponding to an arrangement pattern of external contacts of a semiconductor component to be stacked.
    Type: Application
    Filed: February 23, 2005
    Publication date: November 20, 2008
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Robert-Christian Hagen, Jens Pohl
  • Publication number: 20080284044
    Abstract: A plurality of wafers are aligned and stacked on a thermally variable rotary table, the table and stack are rotated, and an underfill material is disposed and cured between wafers in the stack, bonding the wafers. Corresponding wafer portions of the plurality of wafers in the stack may be singulated from the stack, and may comprise semiconductor device packages either individually or when coupled with a substrate.
    Type: Application
    Filed: July 22, 2008
    Publication date: November 20, 2008
    Inventor: Preston T. Myers
  • Publication number: 20080284045
    Abstract: A method and apparatus for fabricating a semiconductor device are disclosed. The method attaches semiconductor chips (130) on a sheet-like insulating substrate (101) integral with two or more patterned layers of conductive lines and vias and with contact pads (103) in pad locations. A mold is provided, which has a top portion (210) with metal protrusions (202) at locations matching the pad locations. The protrusions are shaped as truncated cones of a height suitable to approach the pad metal surface in the closed mold cavity. The substrate and the chip are loaded onto the bottom mold portion (310); the mold is closed by clamping the top portion onto the bottom portion so that the protrusions are aligned with the contact pads, approaching the pad surface. After pressuring encapsulation compound into the cavity, the mold is opened; the encapsulated device has apertures to the pad locations. Any residual compound formed on the pads is removed by laser, plasma, or chemical to expose the metal surface.
    Type: Application
    Filed: May 18, 2007
    Publication date: November 20, 2008
    Applicant: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Mark A. Gerber, David N. Walter
  • Publication number: 20080284046
    Abstract: A flip chip mounting method which is applicable to the flip chip mounting of a next-generation LSI and high in productivity and reliability as well as a bump forming method are provided. After a resin 14 containing a solder powder 16 and a gas bubble generating agent is supplied to a space between a circuit board 21 having a plurality of connecting terminals 11 and a semiconductor chip 20 having a plurality of electrode terminals 12, the resin 14 is heated to generate gas bubbles 30 from the gas bubble generating agent contained in the resin 14. The resin 14 is pushed toward the outside of the generated gas bubbles 30 by the growth thereof and self-assembled between the connecting terminals 11 and the electrode terminals 12. By further heating the resin 14 and melting the solder powder 16 contained in the resin 14 self-assembled between the terminals, connectors 22 are formed between the terminals to complete a flip chip mounting body.
    Type: Application
    Filed: April 30, 2008
    Publication date: November 20, 2008
    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.
    Inventors: Seiji Karashima, Takashi Kitae, Seiichi Nakatani
  • Publication number: 20080284047
    Abstract: Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices in the first side. A polymeric stiffener ring is formed on the first side. The stiffener ring embeds the first plurality of passive devices without covering a central portion of the first surface of the substrate. A semiconductor chip is mounted on the central portion of the first surface of the substrate.
    Type: Application
    Filed: May 15, 2007
    Publication date: November 20, 2008
    Inventors: Eric Tosaya, Jun Zhai, Chia-Ken Leong, Tom Ley
  • Publication number: 20080284048
    Abstract: Provided are an alignment mark with a higher rate of recognition, a semiconductor chip including the alignment mark, a semiconductor package including the semiconductor chip, and methods of fabricating the alignment mark, the semiconductor chip, and the semiconductor package. The alignment mark may include an align metal pad on a substrate and may be electrically isolated. A protective film may be on the align metal pad and may include an aperture exposing a part of the align metal pad. A metal alignment bump may be on the align metal pad exposed in the aperture such that the metal alignment bump protrudes above the protective film.
    Type: Application
    Filed: May 14, 2008
    Publication date: November 20, 2008
    Inventors: Sung-jae Kim, Yong-bok Park, Jung-soo Nam, In-jung Lee, Sung-jun Kim
  • Publication number: 20080284049
    Abstract: Contact lens curing systems and methods are described. A contact lens curing system includes an oven that has a plurality of curing zones a mold advancement system for moving the contact lens mold assemblies between the plurality of zones and a controlled atmosphere within the curing zones that provides a substantially chemically inert environment in which contact lens precursor materials can be polymerized in contact lens mold assemblies located in the curing zones. Methods of producing contact lenses include curing contact lens precursor materials in contact lens mold assemblies in the lens curing system.
    Type: Application
    Filed: May 15, 2008
    Publication date: November 20, 2008
    Inventors: Hayden Atkinson, Paul Riggs, John Gibson, Tim Warren, Ronnie Dover, Arthur Williams, Jennifer Cowden, Michael Gunner
  • Publication number: 20080284050
    Abstract: The invention relates to the method of production of nanofibres through electrostatic spinning of solutions (14) or melts of polymers, at which the produced nanofibres are deposited on the moving base (2) in the spinning chamber (1), while before entering into the spinning chamber (1) the electrical conductivity of the base (2) is increased. The invention also relates to the device for production of nanofibres through electrostatic spinning of solutions (14) or melts of polymers containing the spinning chamber (1) in which the produced nanofibres are deposited on the base (2). In the direction of motion of the base (2) before the spinning chamber (1) there is arranged the device (3) for increasing the electrical conductivity of the base (2).
    Type: Application
    Filed: November 2, 2006
    Publication date: November 20, 2008
    Applicant: EL-MARCO, S.R.O.
    Inventors: Ladislav Mares, David Petras, Denisa Stranska, Miroslav Maly
  • Publication number: 20080284051
    Abstract: A foaming jig (35) with a refrigerator cabinet (13) is enclosed in a vacuum chamber (25); a metered quantity of a polyurethane mixture is then fed into the hollow walls of the refrigerator cabinet (13), making the foam to growth by generating a vacuum degree in the vacuum chamber (25) and into the foaming jig (35); the foaming of the cabinet walls (13) can be carried out in a comparatively short time, by using fast reactive polyurethane formulations.
    Type: Application
    Filed: July 20, 2005
    Publication date: November 20, 2008
    Inventor: Piero Corradi
  • Publication number: 20080284052
    Abstract: A method of manufacturing a thermal paste, in which the method includes feeding the thermal paste into a chamber of an extruder; mixing the thermal paste at elevated temperatures; de-airing the thermal paste; and extruding the thermal paste out of the chamber through a die as a pre-form or into a cartridge, such that air channels and pseudo-grain boundaries are prevented from forming in the thermal paste.
    Type: Application
    Filed: May 18, 2007
    Publication date: November 20, 2008
    Applicant: IBM CORPORATION (YORKTOWN)
    Inventors: Claudius Feger, Ijeoma M. Nnebe, Maurice McGlashan-Powell
  • Publication number: 20080284053
    Abstract: A method of forming a covering for a motor vehicle interior is disclosed, wherein a skin is disposed in a mold between a male part and a female part having an item disposed thereon and a vacuum is created in the mold to form the skin against the item.
    Type: Application
    Filed: April 24, 2008
    Publication date: November 20, 2008
    Inventor: Denis Dutouquet
  • Publication number: 20080284054
    Abstract: The present invention relates to the use of an aqueous sodium hydroxide/thiourea solution, specifically to the use of an aqueous sodium hydroxide/thiourea solution for pilot-scale production of cellulose products, wherein sodium hydroxide constitutes 8.1%-12.0% of the total weight of the aqueous solution, thiourea constitutes 3.0%-6.0% of the total weight of the aqueous solution, and said cellulose products include regenerated cellulose filaments, films, nonwovens, as well as composite fibers and/or functional materials of protein/cellulose, chitin/cellulose, Konjac Glucomannan/cellulose, nano-crystal particle/cellulose, etc.
    Type: Application
    Filed: April 21, 2006
    Publication date: November 20, 2008
    Applicants: JIANGSU LONG-MA GREEN FIBERS CO., LTD., WUHAN UNIVERSITY
    Inventors: Lina Zhang, Dong Ruan, Jinping Zhou, Ang Lv, Chuntao LI
  • Publication number: 20080284055
    Abstract: A fluidized mixture is issued from a nozzle comprising a fan jet at the outlet, causing the mixture to spread as it is issued. The issued material is collected on a moving collection surface located a distance of between 0.25 and 13 cm from the outlet of the nozzle, prior to the onset of large scale turbulence in the fluid jet. The resulting product has good basis weight uniformity.
    Type: Application
    Filed: July 25, 2008
    Publication date: November 20, 2008
    Inventors: Jack Eugene Armantrout, Robert Anthony Marin, Larry R. Marshall
  • Publication number: 20080284056
    Abstract: An extruded multilayer seal member having an expanded temperature range and an improved compression set resistance wherein the seal member comprises a first fluoroelastomer as the inner layer of the multilayer seal member and a second elastomer as the outer layer of the multilayer seal member; and a method for manufacturing the multilayer seal member which comprises extruding a multilayer tubular structure, crosslinking the extruded multilayer tubular structure on a mandrel, cutting the multilayer tubular structure to provide a plurality of uniform seal members and recovering the seal members, are described.
    Type: Application
    Filed: August 1, 2008
    Publication date: November 20, 2008
    Inventors: Jeremy Duke, Eric Frey, Kenneth Scott Jackson, John Mobley, Francis V. Rolland, Edi J. Wink
  • Publication number: 20080284057
    Abstract: A film roll of a heat-shrinkable polyester film meeting the following requirements: (1) when samples are cut off therefrom at an almost equal interval along the longitudinal direction, and immersed in hot water at 85° C. for 10 seconds, subsequently in water at 25° C. and withdrawn, heat-shrinkage percentages in the maximum shrinkage direction of all the samples are 20% or more; and (2) when raw polymers used for production of the film above comprises of a major constitutional unit and one or more sub constitutional units different therefrom, and the content of the primary sub constitutional unit in each sample is more than 7 mole % in 100% of all constitutional units, and the contents of the primary sub constitutional unit of all the samples fall within a range of ±2 mole % relative to the average.
    Type: Application
    Filed: November 1, 2007
    Publication date: November 20, 2008
    Inventors: Satoshi Hayakawa, Norimi Tabota, Yoshinori Takegawa, Katsuya Ito, Shigeru Komeda, Katsuhiko Nose
  • Publication number: 20080284058
    Abstract: Method of producing a multilayer article forming an axisymmetric body, said article comprising at least a base of diameter D joined to a side wall of average thickness T and of height H said method consisting in feeding a coextruded multilayer charge into the cavity of a mould then in compressing said charge in order to form the article, the charge forming a body axisymmetric about an axis of symmetry, the charge consisting of a radial stack of several layers of which at least one is a thin functional layer, the outer diameter of said charge being approximately equal to D, the direction of compression being parallel to the axis of symmetry of said charge, and the compression being carried out on one face of the charge, which method is characterized by the fact that the charge is compressed only on one portion of said face.
    Type: Application
    Filed: August 17, 2006
    Publication date: November 20, 2008
    Inventor: Jacques Thomasset
  • Publication number: 20080284059
    Abstract: A method of bonding an insulation layer (26) to a CMC layer (22) by applying a compliant joining layer (24) between them in a series of steps (52-70) effective to bond the layers (22, 24, 26) with reduced differential shrinkage stresses during firing and reduced residual stresses. The CMC layer (22) and the compliant layer (24) may each be fired to an intermediate stage prior to applying the next layer (24 and 26 respectively), such that the compliant layer (24) has a remaining amount of curing shrinkage between that of the CMC layer (22) and the insulating layer (26) during a final firing stage. The insulation layer (26) may be a friable graded insulation (26F) cast as a composite of hollow ceramic spheres (26S) in a ceramic matrix (26M). The compliant layer (24) may form a checkerboard of cracks (72) oriented generally perpendicular to the layer surface that function to relax stress.
    Type: Application
    Filed: May 17, 2007
    Publication date: November 20, 2008
    Inventors: Gary B. Merrill, Thomas B. Jackson
  • Publication number: 20080284060
    Abstract: Touch fasteners for use as mold inserts in molding seat foam buns include selvedges that deflect under pressure to engage a mold surface in face-to-face contact. Another touch fastener includes a base with an exposed thermally activatable resin surface that has a softening point low enough to be activated by the exothermic foaming reaction to adhere the fastener in the foam bun.
    Type: Application
    Filed: May 21, 2008
    Publication date: November 20, 2008
    Applicant: VELCRO INDUSTRIES B.V.
    Inventors: Kevin Keith Line, Daniel Lee Janzen, Paul Joseph Voigt
  • Publication number: 20080284061
    Abstract: An apparatus and process for fusing labels onto plastic parts having multiple contoirs and/or holes during the molding process is presented. According to the invention, a label having art work or wording on its interior surface and made of the same material as the plastic piece to which it is to be applied, is positioned onto a mold. Placement is accomplished through the use of a robotic arm having an insulated plate at its operational end to eliminate electrical charge transfer to the tool. The interior side of the label is insulated. An electrical charge is then applied to the front surface of the label enabling it to be positioned and held in place on an irregularly shaped mold. In the preferred embodiment, polypropylene is used for the label and the plastic layer.
    Type: Application
    Filed: May 17, 2007
    Publication date: November 20, 2008
    Inventors: Pedro Jorge Pinto Oliveira Araujo, Pedro Miguel Gomes de Sa
  • Publication number: 20080284062
    Abstract: In one embodiment, an injection molded doll head having at least two portions is provided. A first portion may have a first mating surface, an alignment indicator and include at least the skullcap portion of a doll head. A second portion may have a second mating surface welded to the first mating surface and may include at least a lower portion of the doll head and a concave inner cavity. The first portion and the second portion may be configured to receive rooted doll hair. Some embodiments may include doll hair rooted above and below a seam defined by the welded mating surfaces.
    Type: Application
    Filed: May 2, 2008
    Publication date: November 20, 2008
    Inventor: Peter J. Simpson
  • Publication number: 20080284063
    Abstract: A multilayer plastic container comprises a layer of a polypropylene and an intermediate layer directly adjacent the layer of polypropylene wherein at least one of the polypropylene and intermediate layers comprises an adhesive such as maleic anhydride incorporated therein to adhere the layer of polypropylene to the layer of EVOH.
    Type: Application
    Filed: January 11, 2008
    Publication date: November 20, 2008
    Inventors: Guy Richards, A.B.M. Bazlur Rashid, Robert W. Knoll, Sahin Emre, Kevin James Curie, Randolph Lee Davidson
  • Publication number: 20080284064
    Abstract: A process is disclosed for making a closure having (i) a top portion, and (ii) a latch member that includes an actuator portion and a follower portion, the follower portion including a blocking structure. The process includes providing a mold assembly that defines a space therein which corresponds to the closure, the mold assembly including (i) a first mold portion that defines a first subspace which corresponds to the actuator portion, and (ii) a second mold portion that defines a second subspace which corresponds to the blocking structure. The process further includes advancing a material into the space so as to form the closure. The process also includes moving the second mold portion in relation to the first mold portion after the advancing step so as to remove the actuator portion from the first subspace.
    Type: Application
    Filed: May 16, 2007
    Publication date: November 20, 2008
    Applicant: Allen Tool Company, Inc.
    Inventor: David O. Allen
  • Publication number: 20080284065
    Abstract: A method for forming a covering for a motor vehicle interior is disposed wherein a kin is formed on a mold and non-visible surfaces of an item irremovably attached to the mold so that the skin is in the substantially same plane as a visible surface of the item.
    Type: Application
    Filed: April 28, 2008
    Publication date: November 20, 2008
    Inventor: Denis Dutouquet
  • Publication number: 20080284066
    Abstract: An integrated circuit package system that includes: providing a support structure including a device and an electrical contact adjacent thereto; providing a mold system having a cavity, a recess channel, a recess integrally connected to the recess channel, and a resilient member that cooperatively engages the recess channel and the recess; engaging the mold system and the support structure with the cavity over the device and the resilient member between the device and the electrical contact; and injecting encapsulation material into the cavity.
    Type: Application
    Filed: May 16, 2007
    Publication date: November 20, 2008
    Inventors: Heap Hoe Kuan, Pei Ee Chua, Seng Guan Chow
  • Publication number: 20080284067
    Abstract: A material for a silicon carbide fired body is manufactured by wet mixing at least a silicon carbide powder and an iron compound powder. A honeycomb structure is manufactured by molding a raw material composition containing the material for a silicon carbide fired body and an additive to manufacture a honeycomb molded body which has cell walls extending along a longitudinal direction of the honeycomb molded body to define a plurality of cells extending along the longitudinal direction. The honeycomb molded body is degreased to manufacture a honeycomb degreased body. The honeycomb degreased body is fired to manufacture a honeycomb structure including a honeycomb fired body.
    Type: Application
    Filed: May 8, 2008
    Publication date: November 20, 2008
    Applicant: IBIDEN CO., LTD.
    Inventors: Kazuya NARUSE, Kosei Tajima
  • Publication number: 20080284068
    Abstract: An air distributor for use in heap or dump leaching systems is disclosed. The air distributor includes an air pipe having a series of holes for releasing air from the pipe and one or more protective members spaced outwardly of the air holes to shield the air holes.
    Type: Application
    Filed: November 14, 2007
    Publication date: November 20, 2008
    Inventors: Danny Ignacio Castillo, Elliott Paul Smithson
  • Publication number: 20080284069
    Abstract: The invention relates to a leaf spring (1) consisting of a fibre-composite material and having a central longitudinal section (2) and two adjoining axial end sections for a wheel suspension in a vehicle, the end sections of said leaf spring tapering with respect to the leaf spring width. The leaf spring (1) is composed of resin-impregnated fibre layers and axially orientated uncut first fibres (6) of the fibre-composite material extend the full length of the leaf spring (1) to the two axial ends (5) of said spring. The axial ends (5) of the unfinished untreated leaf spring (1?), when viewed from above, have an essentially V-shaped geometry or an essentially V-shaped notch and thus form two respective limbs (8, 9) lying transversally to the longitudinal extension of the axis of the untreated leaf spring (11), said limbs (8, 9) abutting one another in the finished leaf spring (1).
    Type: Application
    Filed: November 4, 2006
    Publication date: November 20, 2008
    Applicant: IFC COMPOSITE GMBH
    Inventors: Clemens Aulich, Rainer Forster, Heiko Kempe
  • Publication number: 20080284070
    Abstract: The invention relates to a leaf spring (1) consisting of a fibre-composite material for use in a vehicle. To prevent cracking or the escape of leaf spring material on the longitudinal edges (10) of said leaf spring (1) when the latter is fixed to a vehicle, according to the invention at least the upper face (13) and/or the lower face (14) of the leaf spring (1) are convex transversally to the longitudinal extension of said spring.
    Type: Application
    Filed: November 4, 2006
    Publication date: November 20, 2008
    Applicant: IFC COMPOSITE GMBH
    Inventors: Clemens Aulich, Rainer Forster, Heiko Kempe
  • Publication number: 20080284071
    Abstract: Package (10) of flat-packing multiple pocketed spring core assemblies (12) wherein a stack of multiple pocketed spring assemblies (12) are trapped between a pair of wooden frames (16). After compression of the stack including the wooden frames (16), bands (28) are tightly wrapped around the compressed stack. Loops of wire (32) are then inserted through the stack and wrapped about at least one cross element (34) of the frame (16) on each side of the stack. Each loop of wire (32) is pulled taut and its opposite ends connected together so as to prevent the center portion of the stack from ballooning outwardly after removal of compression forces on the rigid frames.
    Type: Application
    Filed: August 1, 2008
    Publication date: November 20, 2008
    Applicant: L&P PROPERTY MANAGEMENT COMPANY
    Inventors: Kelly M. Knewtson, William B. York, III
  • Publication number: 20080284072
    Abstract: A gas spring assembly that is suitable for use on a vehicle suspension system includes a first end member and a second end member that is spaced from the first end member. A flexible wall is secured between the first and second end members and at least partially defines a first gas chamber therebetween. A confinement at least partially forms a second gas chamber that is in communication with the first gas chamber. A porous flow restrictor is operatively disposed between the gas chambers. A suspension system including such a gas spring assembly as well as a method is also included.
    Type: Application
    Filed: May 16, 2008
    Publication date: November 20, 2008
    Applicant: BFS DIVERSIFIED PRODUCTS, LLC
    Inventors: Bradley W. Hayes, Pradipta N. Moulik, Sydney Kelsey
  • Publication number: 20080284073
    Abstract: A gas spring having a cylindrical housing has multiple regions through which a piston moves. A piston rod extends through one end of the cylindrical housing. One region is pressurized with an inert gas and at least a second region includes a multiple viscosity fluid, such that, as the piston moves under the influence of the pressurized gas, the piston rod moves at a variable speed. In one embodiment, the second region includes two layers of different viscosity oils with the oil adjacent the piston, having a lower viscosity and density than the second layer of oil. In other embodiments, the second region has a substantially continuously varying viscosity fluid.
    Type: Application
    Filed: May 16, 2007
    Publication date: November 20, 2008
    Inventor: Clare P. Heleski
  • Publication number: 20080284074
    Abstract: A shock absorber is provided that also includes vibration damping. The shock absorber includes at least one shock absorbing frame member that partially surrounds an electronic device enclosure. The shock absorber also includes at least two protrusions that protrude from the at least one shock absorbing frame member. Each protrusion extends beyond the at least one shock absorbing frame member from a recessed surface recessed into the at least one shock absorbing frame member.
    Type: Application
    Filed: May 17, 2007
    Publication date: November 20, 2008
    Applicant: SEAGATE TECHNOLOGY LLC
    Inventors: JuiJing Lim, Chenyang Ding, Xiong Liu, MingZhong Ding, KianKeong Ooi, ChoonKiat Lim
  • Publication number: 20080284075
    Abstract: To block the transmission to a vehicle body side of the vibration due to the cavitation phenomenon occurred in a primary liquid chamber so as to prevent the generation of noises, at the same time, to make the device compact, and to improve the fitting accuracy to obtain the reliable positioning, a first metallic fitting and a second metallic fitting are connected by an insulator. A primary liquid chamber and a secondary liquid chamber formed inwardly are partitioned by a partition member and communicated therebetween by an orifice passage. The partition member is floatingly supported between an extended portion of the insulator and an outer peripheral thick wall portion of a diaphragm, and the tuning is performed to generate the rigid resonance at the predetermined frequency. An outer ring is provided in the outer peripheral thick wall portion so as to be securely fixed by a fixing portion formed by bending an end of an outer cylindrical fitting.
    Type: Application
    Filed: December 5, 2007
    Publication date: November 20, 2008
    Applicants: YAMASHITA RUBBER KABUSHIKI KAISHA, HONDA MOTOR CO., LTD.
    Inventors: Jun Saito, Masatomo Nishizaka, Nobuo Kubo, Hiroshi Yanagase
  • Publication number: 20080284076
    Abstract: The object of the present invention is to prevent damages of a vibration isolating rubber and cracks in a welded portion of a sub-frame when press-fitting a sub-frame mount. The sub-frame mount 1 comprises an outer cylinder 2, an inner cylinder 2 and the vibration isolating rubber 4 connecting these outer and inner cylinders. A small diameter portion 10 and a large diameter portion 11 are provided on a lateral wall of a barrel portion of the outer cylinder 2. Between the small diameter portion 10 and the large diameter portion 11 is formed a step-like boundary portion 12. The height in the axial direction of the boundary portion 12 changes in the circumferential direction and has a substantially mountain-like shape with a top 12a projecting in the press fitting direction. A contact area of the large diameter portion 11 contacting a mounting hole 21 of the sub-frame 20 is increased in accordance with an amount of the press fitting.
    Type: Application
    Filed: May 16, 2008
    Publication date: November 20, 2008
    Applicants: HONDA MOTOR CO., LTD., YAMASHITA RUBBER KABUSHIKI KAISHA
    Inventors: Tetsuya Miyahara, Tsutomu Ogawa, Yuichi Nakamaru, Yuji Muto
  • Publication number: 20080284077
    Abstract: A compressible spring for at least absorbing and dissipating energy includes a plurality of elastomeric pads disposed coaxially and in series with each other and a plurality of separator plates, with each plate being disposed between a pair of the adjacent pads. A plurality of first prongs are formed integrally with or secured to a first surface of each separator plate for attaching the plate to one pad and a plurality of second prongs are formed integrally with or secured to a second surface for attaching the plate to an opposed pad. An axial aperture is also formed through each plate with prongs positioned in an alternating manner on a peripheral edge of the axial aperture. Projections may be also provided on each surface of the plate and adapted with an axial aperture that continues through the plate for additional attachment of the plate to the pair of pads.
    Type: Application
    Filed: May 1, 2008
    Publication date: November 20, 2008
    Inventors: Ronald J. Sprainis, Michael E. Ring, Bradley Anderson, Jonathon Marlow
  • Publication number: 20080284078
    Abstract: The invention relates to deflectable micromechanical elements which can preferably be deflected in translation and optionally also in an oscillatory manner. With respect to known solutions, it is the object of the invention to enable larger deflections with a simultaneously improved resistance toward lateral forces and torques. In this connection, a suspension having at least one spring system is present at elements in accordance with the invention. Levers pivotally connected to torsion spring elements are present at spring systems. Torsion spring elements of a spring system are aligned in a common axis and/or a plurality of axes arranged parallel to one another and at least one torsion spring element is fixedly clamped.
    Type: Application
    Filed: November 25, 2005
    Publication date: November 20, 2008
    Applicant: Fraunhofer-Gesellschaft Zur Forderung Der Angewandten Forschung E.V.
    Inventors: Alexander Wolter, Thomas Klose
  • Publication number: 20080284079
    Abstract: A device for supporting a functional element in applications requiring a high-precision gimbal-mount includes a first holder member for the functional element, a second holder member for the first holder member, a supporting member for the second holder member, and first and second joints. The first holder element is pivotable about a first pivot axis disposed in a plane of the functional element. The second holder member is pivotable about a second pivot axis disposed in the plane of the functional element. The first joint is disposed between the first holder member and the second holder member, and the second joint is disposed between the second holder member and the supporting member. Pivoting at least one of the first and the second holder member is achieved by an elastic deflection of the first and the second joint, respectively.
    Type: Application
    Filed: September 21, 2005
    Publication date: November 20, 2008
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventors: Martin Rohrer, Daniel Rossetti, Sasa Zelenika
  • Publication number: 20080284080
    Abstract: A workpiece attitude change apparatus includes a first suction nozzle which includes a suction port, the suction port being able to suction a first surface of a workpiece, a second suction nozzle which has a predetermined inclination relative to the first suction nozzle, the second suction nozzle including a suction port, the suction port of the second suction nozzle being able to suction a second surface of the workpiece, and a vacuum pressure switch device for imparting a vacuum pressure to the first suction nozzle to cause the suction port of the first suction nozzle to suction the first surface of the workpiece, the vacuum pressure switch device stopping supply of the vacuum pressure to the first suction nozzle and imparting a vacuum pressure to the second suction nozzle to cause the suction port of the second suction nozzle to suction the second surface of the workpiece.
    Type: Application
    Filed: May 14, 2008
    Publication date: November 20, 2008
    Inventors: Emiko Nakagawa, Masaaki Furuya, Masahiko Takahashi
  • Publication number: 20080284081
    Abstract: A panel is slidable on a table saw by means of a roller assembly which is mounted in a groove in the working surface of the table saw. The panel has two parallel tracks for a pair of fence retainers. The retainers are pivotally connected to a fence and at least one is slidable relative to the fence. The retainers may be immobilized in the tracks and also immobilized relative to the fence. A fence stop supports a work piece on the fence. The fence stop has a head to which an arm is connected. The arm pivots toward and away from a work-piece contacting position. The head may be turned upside down and whether it is upright or upside down determines the distance between the work-piece contacting position and the fence.
    Type: Application
    Filed: May 15, 2008
    Publication date: November 20, 2008
    Inventor: Darrin Eugene Smith
  • Publication number: 20080284082
    Abstract: A wafer clamp according to the present invention always firmly clamps a wafer. A supporting arm of the wafer clamp will be replaced with a different one according to the wafer size. Moreover, with a larger area of the supporting arm, a wear resistance and a smoothness of the wafer is improved. Besides, the wafer clamp stops the wafer from slipping.
    Type: Application
    Filed: May 14, 2007
    Publication date: November 20, 2008
    Applicant: ATOMIC ENERGY COUNCIL - INSTITUTE OF NUCLEAR ENERGY RESEARCH
    Inventors: Chih-Hung Wu, Hung-Sheng Chiu, Kai-Sheng Chang, Kuan-Yu Chu
  • Publication number: 20080284083
    Abstract: The present invention provides an image forming apparatus that can perform stable sheet conveyance, regardless of whether a sheet processing apparatus is connected thereto. The image forming apparatus can be connected to a sheet processing apparatus that performs post processing on each conveyed sheet. The image forming apparatus includes: a pair of discharge rollers that are located at the discharge outlet of the image forming main body for sheet conveyance, and have rotational members arranged so as to alternately face both sides of each sheet in the direction perpendicular to the sheet conveying direction; and an upper discharge roller holding member that changes the center distance between the discharge rollers from a first center distance observed when the sheet processing apparatus is not connected to the image forming main body to a second center distance observed when the sheet processing apparatus is connected to the image forming main body to convey a sheet to the sheet processing apparatus.
    Type: Application
    Filed: October 25, 2007
    Publication date: November 20, 2008
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: NAONORI KAYAMA, Takashi Kuwata, Junichi Sekiyama
  • Publication number: 20080284084
    Abstract: A device for opening folded or bound printed products, comprises a feeder device (2, 13) for feeding-in individual folded or bound sub-products (4) and an opening device (6) for opening the sub-products (4), as well as furthermore an opening verifying installation (11, 14, 15, 16), in order to with optical means (14) identify deficiently opened sub-products (4) before the sub-products (4) are further processed. In case of sub-products (4) identified as being deficiently opened, the further processing is not carried out, but rather a deficiently opened sub-product (4) is conducted back to the opening device once more.
    Type: Application
    Filed: May 16, 2008
    Publication date: November 20, 2008
    Applicant: FERAG AG
    Inventor: Marcel Ramseier
  • Publication number: 20080284085
    Abstract: Equipment for processing banknotes in stack, as an example for a banking deposit, including a transport mechanism for banknotes or similar sheets, and a receiving section the banknotes or sheets are transported at a given transport velocity (Vt) and the receiving section is arranged downstream of a section of the transport mechanism for receiving, in superimposition, the banknotes or sheets. The equipment comprises an interface mechanism with nipping members interposed between the transport mechanism and the receiving section and electronic control circuits which cause the nipping members to slow down the banknotes or sheets of the receiving section at a reduced velocity (Vb), in response to information of transit of the banknotes or sheets, making easy a regular stacking of the banknotes or sheets.
    Type: Application
    Filed: November 21, 2005
    Publication date: November 20, 2008
    Applicant: CTS CASHPRO S.P.A.
    Inventors: Maurizio Curina, Felice Giacone
  • Publication number: 20080284086
    Abstract: A sheet-feeding device is used in an apparatus main body having a box-shaped apparatus external surface and includes a sheet feeding cassette having an outer side surface and detachably mounted to the apparatus main body; and an elastic member provided on the outer side surface of the sheet feeding cassette. The outer side surface of the sheet feeding cassette constitutes a part of the apparatus external surface in a state where the sheet feeding cassette is mounted to the apparatus main body. At least a part of the elastic member projects outward from the apparatus external surface farther than the outer side surface.
    Type: Application
    Filed: May 5, 2008
    Publication date: November 20, 2008
    Applicant: KYOCERA MITA CORPORATION
    Inventors: Kotaro Kawasaki, Masuo Kawamoto