Abstract: A stacked layer type semiconductor device includes N memories each including at least one main via and (N?1) sub vias, the N memories being sequentially stacked on one-another so that central axes of the N memories face each other crosswise, and a plurality of connection units electrically connecting the N memories. Here, N is a natural number greater than 1.

Abstract: A semiconductor device has: a radiator plate that is maintained at a predetermined potential; an SOI (Silicon On Insulator) chip mounted on the radiator plate; and thermal grease applied to an interface between the radiator plate and the SOI chip. The SOI chip has: a first silicon substrate forming a circuit element part; a second silicon substrate facing the radiator plate; and an insulating film formed between the first silicon substrate and the second silicon substrate. The first silicon substrate and the second silicon substrate are electrically connected to each other. The thermal grease is conductive and electrically connects the second silicon substrate and the radiator plate.

Abstract: A method for forming a semiconductor device is presented. The method includes providing a substrate prepared with a dielectric layer formed thereon. The dielectric layer having a conductive line disposed in an upper portion of the dielectric layer. The substrate is processed to produce a top surface of the dielectric layer that is not coplanar with a top surface of the conductive line to form a stepped topography.

Abstract: A power module having at least one electric power component, such as a power electronic semiconductor component. An electrical contact for a load current is formed on a lower surface and also on an upper surface of the power semiconductor component. To reduce an explosion pressure and accept power when the power electronic semiconductor component is overloaded, a hollow space filled with at least one electrically conducting particle is formed on an electrical contact surface of the electrical contact. In case of a short circuit, an arc is initially generated above the semiconductor element thickness of the power semiconductor component, whereupon the filling in the hollow space takes over current conduction. Preferably, the filling in the hollow space is a plurality of spherical electrically conducting particles. The explosion pressure can escape into interstices in the filling if there is a short circuit. Furthermore, metal vapors are cooled and are condensed.

Abstract: The invention relates to the fabrication of electronic circuits on a thinned semiconductor substrate. To produce a connection pad on the back side of the thinned substrate, the procedure is as follows: an integrated circuit is produced on an unthinned substrate, in which a portion of a polycrystalline silicon layer (18) dedicated for the connection of the pad is provided. The circuit is transferred onto a transfer substrate (30) and then its back side is thinned. A via is opened in the thinned semiconductor layer (12) in order to gain access to the polycrystalline silicon; aluminum (80) is deposited and this layer is etched so as to define a pad which is in contact with the internal interconnects of the integrated circuit by way of the polycrystalline silicon.

Abstract: A semiconductor device includes: a semiconductor substrate; an interlayer insulating film provided on the semiconductor substrate; an interconnect (second interconnect trench) composed of a metallic film provided in an interconnect trench (second copper interconnect) and a plug composed of a metallic film provided in a connection hole (via hole) coupled to the second interconnect trench, both of which are provided in the interlayer insulating film; a first sidewall provided on a side surface of the via hole; and a second sidewall provided on a side surface of the second interconnect trench, and a thickness of the first sidewall in vicinity of a bottom of the side surface of the via hole is larger than a thickness of the second sidewall in vicinity of a bottom of the second interconnect trench.

Abstract: In forming a semiconductor device, an insulation layer is formed on top of a semiconductor chip having a plurality of external terminals. A plurality of interconnections is formed on the insulating layer. External terminals are electrically connected to coordinated interconnections through a plurality of vias formed in the insulation layer. The interconnections are each formed integral with a via conduction part which covers the entire surfaces of the bottom and the sidewall sections of the via. The interconnection is formed so as to be narrower in its region overlying the via than the upper via diameter.

Abstract: A semiconductor device includes a first pad row and a second pad row, a first ground potential supply electrode which is connected to a first interconnect provided near the first pad row, and a second ground potential supply electrode which is connected to a second interconnect provided near the second pad row. The first pad row includes a first pad connected to the first circuit within the chip and connected to the first interconnect via a first bonding wire, and includes a second pad connected to a second circuit within the chip and connected to the second interconnect via a second bonding wire crossing over the second pad row.

Abstract: A semiconductor device is made by forming a first conductive layer over a first temporary carrier having rounded indentations. The first conductive layer has a non-linear portion due to the rounded indentations. A bump is formed over the non-linear portion of the first conductive layer. A semiconductor die is mounted over the carrier. A second conductive layer is formed over a second temporary carrier having rounded indentations. The second conductive layer has a non-linear portion due to the rounded indentations. The second carrier is mounted over the bump. An encapsulant is deposited between the first and second temporary carriers around the first semiconductor die. The first and second carriers are removed to leave the first and second conductive layers. A conductive via is formed through the first conductive layer and encapsulant to electrically connect to a contact pad on the first semiconductor die.

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface has a storage elastic modulus (at 60° C.) of from 0.9 MPa to 15 MPa.

Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including: a dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material; and a film for flip chip type semiconductor back surface provided on the pressure-sensitive adhesive layer, in which the film for flip chip type semiconductor back surface is formed of a resin composition containing a thermosetting resin component and, as an optional component, a thermoplastic resin component in an amount of less than 50% by weight relative to the whole amount of resin components.

Abstract: A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.

Abstract: To obtain a water-resistant polarizing film free from deterioration in dichroic ratio caused by water-resistant treatment, it is critical that adjacent sulfonic acid groups or sulfonate groups in the organic dyes to be used for the polarizing film are spaced at moderate intervals.

Abstract: A processing method for a mold (1) to form a pattern of recessed portions (13) on a product forming surface (11) formed on the mold (1) includes a photoresist forming step in which a thermally deformable heat-mode photoresist layer (12) is formed on the product forming surface (11), a laser beam illumination step in which a laser beam is applied to the photoresist layer (12) by an exposure device incorporating a semiconductor laser to form a pattern of recessed portions (13), and an asperity forming step in which asperities are formed on the product forming surface (11) by making use of the pattern of recessed portions (13).

Abstract: Optical qualities of a production lot of base material used in the fabrication of semi-finished lenses may be accurately determined by employing chipper plate samples produced from the base material in accordance with aspects of the present invention. In various implementations of the present invention, the chipper plates samples may be fabricated by subjecting base material to an extended cycle time and temperature profile using a mold having cavities of different thicknesses. The resulting chipper plates provide an improved indication of the color of semi-finished lenses molded from the production lot as well as an improved indication of resin stabilizer defects that may be utilized during a pelletizing process to control and enhance the quality of a production lot. Furthermore, the chipper plates may be provided by suppliers as samples of a production lot to enable customers to base purchasing decisions on a reliable and accurate measure of optical properties.

Abstract: A method of producing a granular substance comprising (i) a step of melting a compound of the formula (1): (wherein, R1 and R2 represent each independently a hydrogen atom, alkyl group having 1 to 8 carbon atoms or cycloalkyl group having 5 to 8 carbon atoms, R3 represents a hydrogen atom or alkyl group having 1 to 8 carbon atoms. X represents a single bond, sulfur atom, oxygen atom, alkylidene group having 1 to 8 carbon atoms or cycloalkylidene group having 5 to 8 carbon atoms) to obtain the melted substance, and (ii) a step of dropping the melted substance obtained in the step (i) into water and recovering the granular substance.

Abstract: A system and method for making ultrafine particles are disclosed. A high temperature plasma is generated at an inlet end of a plasma chamber into which precursor materials are introduced. A converging member is located adjacent an outlet end of the plasma chamber. During operation, a substantially constant pressure and/or material flow pattern is maintained to reduce or eliminate fouling of the system.

Abstract: The present invention provides spherical rubber chemicals and the method for preparing the same. The spherical rubber chemicals of the present invention include spherical antioxidants, spherical vulcanization agents, spherical processing aids, spherical reinforcing agents, or spherical adhesive agents. With the spherical rubber chemicals of the present invention, the shortcomings of powdery or semi-spherical rubber chemicals are overcome, including eliminating the dust pollution during granulation procedure and avoiding the raw material loss and the environmental pollution, while solving the quality problem of lower melting point of product caused by the presence of fine powder crystal. Furthermore, the resultant rubber chemicals has an improved smoothness of surface, which is helpful to improve the flowing and mixing behaviors of the rubber chemicals in mixing or open milling process with rubbers.

Abstract: A graphite article having enhanced directional thermal conductivity is provided. The mesophase portions of a mesophase pitch are aligned with each other to create an oriented mesophase pitch which may be stabilized. The article may subject to further carbonization and graphitization as needed.

Abstract: An ethylene-vinyl alcohol copolymer (EVOH) composition preparation process is provided, which comprises the steps of: feeding an EVOH alcohol solution into a tower type apparatus, the EVOH alcohol solution comprising 100 parts by weight of an EVOH and not less than 300 parts by weight of an alcohol having a carbon number of not greater than 4; bringing the EVOH alcohol solution into contact with water, and feeding out a part of the alcohol together with water from the apparatus to provide an EVOH water/alcohol mixture solution comprising 100 parts by weight of the EVOH, 10 to 200 parts by weight of the alcohol and 50 to 200 parts by weight of water; bringing the EVOH water/alcohol mixture solution into contact with water in an agitator container with stirring, and feeding out a part or all of the alcohol together with water from the container to provide an EVOH composition comprising 100 parts by weight of the EVOH, less than 10 parts by weight of the alcohol and 20 to 100 parts by weight of water.

Abstract: A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.

Abstract: Method for making a hollow body comprising, as sole layer(s), at least one layer L1 consisting of a polyamide composition comprising an aromatic polyamide and an impact modifier, said method comprising extruding the polyamide composition through a die.

Abstract: A method and apparatus may be present for manufacturing. A shell may be formed having a support structure located in a cavity in which the shell and the support structure may be formed using an additive manufacturing system from a design of a tool. The cavity of the shell may be filled with a filler material through an opening in the shell. The shell may be cured with the filler material to form the tool.

Abstract: Disclosed is a method for continuously producing switch ties which differ from one another with respect to the length thereof and the mounting position of rail fastenings. Said method comprises the following steps: one or more supporting metal sheets and/or one or more internal molds are mounted in a tie mold according to the length and the shape of the switch tie to be produced, or at lease one tie mold is used which is adapted to the geometry of the switch tie to be produced; bracing bars are inserted as a reinforcement; the bracing bars are simultaneously tightened in an automatic manner by means of pairs of spindles, each bracing bar being individually tightened; concrete is filled into the tie mold; the switch tie is allowed to set; the switch tie is removed from the mold.

Abstract: A syringe and detachable needle assembly having binary attachment features include an elongate syringe barrel having a longitudinal axis, an open proximal end and an open distal end including a collar. The collar includes the cylindrically shaped sidewall having an inside surface and an outside surface. A needle assembly includes the hub having a body portion including a proximal end, a distal end and a conduit therethrough. A cannula having a distal end, a proximal end and a lumen therethrough is attached to the distal end of the hub so that the lumen is in fluid communication with the chamber. A lug is provided on one of the collar and the hub and a ramp and a rest surface is provided on the other of the collar and the hub. The ramp is oriented at an acute angle with respect to longitudinal axis for guiding the lug during needle assembly attachment, to the rest surface forcing the hub to contact the barrel to form a seal the hub and the barrel.

Abstract: A die is formed of a cavity mold having a hollow portion and a slidable core mold that allows a core to be inserted into hollow portion of cavity mold. An insert part that has been previously molded is fitted to and supported by the front end of core of core mold. Then, insert part is inserted into die and clamped therein, then a molten molding material is injected into die so as to perform injection molding of a container body of a substrate storage container with its rear part formed with insert part. Since insert part is put into contact with hollow portion of cavity core so as to restrain vibration of tapering flat core, core of core mold will not be flapped or flexed even if difference in injection pressure occurs in the molding material.

Abstract: An imprint apparatus, which performs an imprint process for forming a pattern of a mold on a resin coated on a substrate, includes an imaging unit configured to image the resin on which the pattern is formed, and a controller configured to control the imprint process. When the pattern is continuously formed on the substrate, the controller compares an image of at least a partial area imaged by the imaging unit and an image of a reference state, which is obtained in advance, and when patterns each having a difference, which falls outside an allowable range, between the images are continuously formed, it determines a transfer error.

Abstract: A pattern forming method for forming an imprinted pattern on a coating material disposed on a substrate with a pattern provided to a mold. The method includes preparing a mold provided with a first surface including a pattern area, a second surface located opposite from the first surface, and an alignment mark provided at a position at which the alignment mark is away from the first surface, contacting the pattern area of the mold with the coating material disposed on the substrate, obtaining information about positions of the mold and the substrate by using the alignment mark and a mark provided to the substrate in a state in which the coating material is disposed on the substrate at a portion where the alignment mark and the substrate are opposite to each other, and effecting alignment of the substrate with the mold in an in-plane direction of the pattern area, on the basis of the information in a state in which the pattern area and the coating material contact each other.

Abstract: Solid-state deformation processing of crosslinked high molecular weight polymers such as UHMWPE, for example by extrusion below the melt transition, produces materials with a combination of high tensile strength and high oxidative stability. The materials are especially suitable for use as bearing components in artificial hip and other implants. Treated bulk materials are anisotropic, with enhanced strength oriented along the axial direction. The material is oxidatively stable even after four weeks of accelerated aging in a pressure vessel containing five atmospheres of oxygen (ASTM F2003). Because of its oxidative stability, the deformation processed material is a suitable candidate for air-permeable packaging and gas sterilization, which has thus far been reserved for remelted crosslinked UHMWPE.

Abstract: A forming tool for forming a container from a blank is disclosed. The forming tool has a cavity and a core. The cavity has an articulating portion moveably connected to a cavity base. The core has a nose moveably connected to a nose base. When the container is formed from the blank, the nose is moved relative to the nose base prior to moving the articulating portion relative to the cavity base.

Abstract: A laboratory test tube is formed between male and female mold elements by injection of molten plastic material. The female element has a bottom element formed by first and second alternating complementarily shaped wedges. At least the second wedges are able to move under the pressure of the molten plastic from a rest position to an operative position in order to form slits which allow air, but not molten plastic, to exit from the mold.

Abstract: A chucking system may include a plurality of discrete vacuum sections. The size of at least one vacuum section may be configured to be substantially similar to size of a strained region of the substrate. The strained region of the substrate is a localized deformation in the substrate due to separation force applied during a nano-imprint lithography process.

Abstract: The present invention provides a method for the production of semiconductor ribbons using exclusively a gaseous feedstock. A fine powder of semiconductor material is produced by decomposition, within the gas phase, of a gaseous feedstock. A layer of this semiconductor powder is uniformly distributed, compressed and flattened over a planar substrate, which is continuously moving in one direction. This said layer of semiconductor powder is, in the following stage, heated to a temperature sufficient to decompose the said gaseous feedstock on its surface. A continuous flow of the said gaseous feedstock over said powder layer is ensured so that a solid plate of semiconductor material grows over the said layer of semiconductor powder. After the growth stage, during which the solid plate has grown to a convenient thickness, the said solid plate of semiconductor material is separated from the said layer of semiconductor powder and substrate.

Abstract: An apparatus and method for forming cavities in pouches. The packages are used for packaging sterile medical products. The apparatus has a frame and a tongue plate member. A pouch is placed onto the tongue plate member to form a cavity into at least one side of the pouch.

Abstract: The method and the device serve for the blow moulding of containers. A preform of a thermoplastic material is first subjected to thermal conditioning in the region of a heating section along a transporting path. Subsequently, the preform is transformed into the container inside a blow mould by the effect of blowing pressure. The thermal conditioning of the preforms is carried out by a number of radiant heaters positioned one above the other. The radiant heaters are activated during production in accordance with a first heating profile and activated during standby mode in accordance with a second heating profile (50), which is different from the first heating profile.

Abstract: The present invention provides a method for producing a profile from composite fiber material, in particular in the aviation and aerospace field, having the following steps: A preliminary fabric, particularly made of pre-impregnated fiber material, is first packed in a vacuum bag. Then support elements are laid on the packed preliminary fabric to support the latter. The vacuum bag is then supplied with a vacuum. Next, the preliminary fabric is hardened to the profile under the action of heat, in particularly in an autoclave. With the claimed method the support elements can be formed advantageously from favorable material, in particular aluminum, instead of highly expensive nickel-36 steel, since the support elements are uncoupled mechanically from the preliminary fabric in a longitudinal direction by means of the vacuum bag, enabling movement of the support elements in the longitudinal direction relative to the preliminary fabric.

Abstract: A method for manufacturing lamp shell to improve structural strength and light penetration includes steps of: providing a plastic material, injecting the plastic material into a injection molding equipment to form a preform containing a first space with an opening and a connecting section at one end and a closed another end to form a light penetrating section, and placing the preform in a blow molding equipment and blowing the plastic material by injecting gas to inflate the preform through gas pressure to form a second space at a greater size than the first space to become a lamp shell. The lamp shell thus formed has a greater structural strength to meet safety requirements, and also provides improved light penetration, and can reduce material consumption of the lamp shell to save production cost.

Abstract: A heating device for preheating a container (3), such as a transfer ladle, transferring liquid metal in melting operations, which is lined with refractory material, wherein the container is heated in a heating stand (1) having a container closure lid (2), is characterized by the use of porous burners (7) for heating the container (3) and keeping it warm.

Abstract: A flexible volumetric structure has a first spring that defines a three-dimensional volume and includes a serpentine structure elongatable and compressible along a length thereof. A second spring is coupled to at least one outboard edge region of the first spring. The second spring is a sheet-like structure capable of elongation along an in-plane dimension thereof. The second spring is oriented such that its in-plane dimension is aligned with the length of the first spring's serpentine structure.

Abstract: The invention proposes a method for improving the stability against vibrations of a stay cable (12) comprising at least one strand (11) housed in a substantially externally smooth sheath (1). In this method, at least one wire (2-3) is spirally wound round the sheath so as to be substantially in contact with said sheath along at least part of the stay cable.

Abstract: The invention relates to a vibration isolator comprising a canister which ends are closed by end caps and a shaft able to move inside the canister, wherein the shaft comprises a piston-like shaped part for separating the canister in two parts: the first part being defined between the piston-like shaped part of the shaft and the first end cap, and comprising at least one resilient and damping element able to be compressed by a compression movement of the shaft on a first nominal stroke; the second part being defined between the piston-like shaped part of the shaft and the second end cap, and comprising at least one resilient and damping element able to be compressed by a tension movement of the shaft on a second nominal stroke; the tangential stiffness of the vibration isolator being, on at least one part of the first nominal stroke of the shaft, at least twice as lower as its tangential stiffness on the entire second nominal stroke of the shaft.

Abstract: A thermally expandable material comprising a first thermoplastic elastomer having a first glass transition temperature, a second thermoplastic elastomer having a second glass transition temperature, wherein the first and the second glass transition temperature differ by at least 10° C.; at least one thermoplastic polymer selected from the group consisting of polymers and copolymers with at least one polymerizable C?C double bond, optionally at least one tackifying resin, at least one latent chemical blowing agent in an amount effective to cause the expandable material to expand at least 50% in volume when heated.

Abstract: A corralling utensil with associated cutting board (10). The corralling utensil (40) quickly, easily and accurately gathers and moves food or other items around and off the cutting board (20) to another location, and may be used separately from the cutting board (20) on other surfaces such as tables, counters, butcher blocks and chopping mats. The corralling utensil (40) may be rotated and/or change shape to facilitate better focusing of cut food into small containers. The corralling utensil (40) may be removably stored in, on, or to a designated area of the associated cutting board (20) for convenient storage and use.

Abstract: An apparatus and associated method are provided for positioning a workpiece. A workpiece positioner has a fixed base., and a support member is connected to the base by a joint that permits selectively articulating the support member with respect to the base. A plate defines a feature sized for operably supporting the workpiece. A connector is used to connect the plate to the support member. The connector fixes the plate in articulation with the support member so that a selected articulation of the support member with respect to the base defines a corresponding plane in which the plate is disposed. The connector also permits sliding movement of the plate in any direction within the corresponding plane to orient the workpiece in a desired position.

Abstract: A clamp includes two handles pivotally connected to each other, a jaw pivotally connected to a short section of each of the handles and a device for positioning of the handles relative to each other. The positioning device includes a cylinder pivotally connected to a long section of one of the handles, a rack pivotally connected to a long section of the other handle and movably inserted in the cylinder, a detent pivotally connected to the cylinder for engagement with the rack to position the handles relative to each other, a lever comprising a first section pivotally connected to the cylinder and a second section operable to cause the first section of the lever to pivot the detent, and a spring compressed between the cylinder and the second section of the lever, thus tending to cause the first section of the lever to pivot the detent towards the rack.

Abstract: A clamping apparatus includes a motor, a first cone gear secured to a shaft of the motor, and two clamping bodies attached to opposite sides of the motor. Each of the clamping bodies includes a second cone gear meshing with the first, a threaded post fixed to the second cone gear, a carriage threadedly connected with the threaded post, and a clamp arm fixed to the carriage. The motor rotates the first cone gear, and in turn the second cone gears and the corresponding threaded posts. With the rotation of the threaded posts, the carriages move towards or away from each other, whereby the clamp arms cooperatively acquire an object between the clamp arms, or release the object therefrom.

Abstract: Over tightening of clamps (2) utilised to secure components and frames to machine tables and beds can cause significant problems with regard to damage to the bed or machine table as well as mis-location. By providing a clamp 1 having a pivot 4 and peripheral springs 2, 3 a limitation on clamping force (B) can be achieved. The clamp 1 is formed from sheet materials and incorporates an over centre pivot 4 such that the retainer 5 and in particular head 6 is brought into clamping engagement by the peripheral springs 2, 3 coming into engagement with surfaces about a slot in order to generate the clamping force (B). The peripheral springs 2, 3 come into engagement by rotation about the pivot 4 to provide a progressive clamping action.

Abstract: An improved saddle stitcher incorporating alignment paddle which includes paddle 100, a base 200, and torque producing means wherein the torque producing means rotates the paddle which contacts and jogs passing signature groups, thereby aligning them.

Abstract: Document obfuscation devices and systems are disclosed for obfuscating paper documents so as to prevent dissemination of sensitive information without shredding in order to increase recycling potential. Certain obfuscation devices include a pair of rollers, at least one of which is imprinted with an obfuscation pattern, and a mechanism for feeding sheets of paper through the pair of rollers. Certain obfuscation systems include an obfuscation device and a recycle bin coupled together.

Abstract: A sheet container includes a case configured to contain a plurality of sheets stacked in a stacking direction, a first regulating member configured to regulate a first side of the sheets along a first direction perpendicular to the stacking direction, a second regulating member configured to regulate a second side perpendicular to the first side along a second direction perpendicular to the stacking direction and the first direction, the second regulating member to form a rectangular area with the first regulating member under the sheets, a tray configured to support a lower surface of a lowermost sheet of the sheets, and a guide member inclined with respect to the stacking direction, the first direction and the second direction on the rectangular area, and formed higher from a position lower than the lower surface of the lowermost sheet as approaching a closest corner in the rectangular area.