Abstract: A routing layer for a semiconductor die is disclosed. The routing layer includes traces interconnecting integrated circuit bond-pads to UBMs. The routing layer is formed on a layer of dielectric material. The routing layer includes conductive traces arranged underneath the UBMs as to absorb stress from solder bumps attached to the UMBs. Traces beneath the UBMs protect parts of the underlying dielectric material proximate the solder bumps, from the stress.

Abstract: A semiconductor device includes a circuit substrate, a first semiconductor chip disposed on the circuit substrate, a plurality of first spacers disposed on the first semiconductor chip, a second semiconductor chip which includes a first adhesive agent layer on a lower face thereof and is disposed on upper portions of the plurality of spacers, a wire which connects the circuit substrate to the first semiconductor chip, and a first sealing material which seals a gap between the first semiconductor chip and the first adhesive agent layer, wherein each height of the plurality of the first spacers is greater than height of the wire relative to an upper face of the first semiconductor chip.

Abstract: A semiconductor device includes a semiconductor chip which includes a first circuit and a second circuit that are spaced apart from each other, without internal wirings electrically connecting the first circuit and the second circuit to each other, a substrate on which the semiconductor chip is disposed, and substrate wirings that are arranged on the substrate and electrically connect the first circuit and the second circuit to each other.

Abstract: A microelectronic package may include a stacked microelectronic unit including at least first and second vertically stacked microelectronic elements each having a front face facing a top surface of the package. The front face of the first element may be adjacent the top surface, and the first element may overlie the front face of the second element such that at least a portion of the front face of the second element having an element contact thereon extends beyond an edge of the first element. A conductive structure may electrically connect a first terminal at the top surface to an element contact at the front face of the second element, and include a continuous monolithic metal feature extending along the top surface and through at least a portion of an encapsulant, which is between the top surface and the front face of the second element, towards the element contact.

Abstract: An interconnect structure and methods for making the same include sidewall portions of an interlevel dielectric layer. The sidewall portions have a width less than a minimum feature size for a given lithographic technology and the width is formed by a thickness of the interlevel dielectric layer when conformally formed on vertical surfaces of a mandrel. The sidewall portions form spaced-apart openings. Conductive structures fill the spaced-apart openings and are separated by the sidewall portions to form single damascene structures.

Abstract: A method of forming stacked die devices includes attaching first semiconductor die onto a wafer to form a reconstituted wafer, and then bonding second semiconductor die onto the first semiconductor die to form a plurality of singulated stacked die devices on the wafer. A support tape is attached to a bottomside of the second semiconductor die. A dicing tape is attached to the wafer. The wafer is laser irradiated before or after attachment of the dicing tape at intended dicing lanes that align with gaps between the first semiconductor die to mechanically weaken the wafer at the intended dicing lanes, but not cut through the wafer. The dicing tape is pulled to cleave the wafer into a plurality of singulated portions to form a plurality of singulated stacked die devices attached to the singulated wafer portions by the dicing tape. The support tape is removed prior to cleaving.

Abstract: A semiconductor package that stably protects an internal semiconductor chip from external shocks, and a method of manufacturing the semiconductor package is disclosed. The semiconductor package includes a first semiconductor chip including a first body layer having a first surface, a second surface, and a lateral surface between the first surface and the second surface, and a first protective layer that exposes an edge portion of the first surface and forms a step difference with the first surface; an encapsulation structure that covers a lateral surface of the first body layer and the edge portion of the first surface so as to encapsulate the first semiconductor chip to have a locking structure; and a first conductive terminal formed on the first body layer through the protective layer.

Abstract: A semiconductor device including a substrate having grooves is provided. The semiconductor device includes a substrate including a first surface, a second surface opposite to the first surface, an opening penetrating from the first surface to the second surface, and a first groove formed at a side of the opening, a semiconductor chip formed on the opening at the first surface of the substrate and flip-chip bonded to the first surface by a plurality of first external connection terminals, and a molding unit filling a region between the substrate and the semiconductor chip, filling the opening and filling at least a portion of the first groove, and covering the semiconductor chip.

Abstract: An interconnect structure and methods for making the same include sidewall portions of an interlevel dielectric layer. The sidewall portions have a width less than a minimum feature size for a given lithographic technology and the width is formed by a thickness of the interlevel dielectric layer when conformally formed on vertical surfaces of a mandrel. The sidewall portions form spaced-apart openings. Conductive structures fill the spaced-apart openings and are separated by the sidewall portions to form single damascene structures.

Abstract: An integrated circuit die includes conductive connection sites located at least on a surface of the integrated circuit die within a contiguous region thereof. The integrated circuit also includes a core circuit located outside the contiguous region. The core circuit is coupled to at least one of the connection sites.

Abstract: A semiconductor device comprises an electrical contact designed to reduce a contact resistance. The electrical contact has a size that varies according to a length of a region where the contact is to be formed.

Abstract: A semiconductor device has a first semiconductor wafer mounted to a carrier. A second semiconductor wafer is mounted to the first semiconductor wafer. The first and second semiconductor wafers are singulated to separate stacked first and second semiconductor die. A peripheral region between the stacked semiconductor die is expanded. A conductive layer is formed over the carrier between the stacked semiconductor die. Alternatively, a conductive via is formed partially through the carrier. A bond wire is formed between contact pads on the second semiconductor die and the conductive layer or conductive via. An encapsulant is deposited over the stacked semiconductor die, bond wire, and carrier. The carrier is removed to expose the conductive layer or conductive via and contact pads on the first semiconductor die. Bumps are formed directly on the conductive layer and contact pads on the first semiconductor die.

Abstract: A method of manufacturing a plurality of electronic devices is provided. Each one of a plurality of first conductive terminals on a plurality of integrated circuits formed on a device wafer is connected to a respective one of a plurality of second conductive terminals on a carrier wafer, thereby forming a combination wafer assembly. The combination wafer assembly is singulated between the integrated circuits to form separate electronic assemblies. The combination wafer assembly also allows for an underfill material to be introduced and to cured at wafer level and for thinning of the device wafer at wafer level without requiring a separate supporting substrate. Alignment between the device wafer and the carrier wafer can be tested by conducting a current through first and second conductors in the device and carrier wafers, respectively.

Abstract: A stacked integrated circuit package-in-package system is provided including forming a first external interconnect; mounting a first integrated circuit die below the first external interconnect; stacking a second integrated circuit die over the first integrated circuit die in an offset configuration not over the first external interconnect; connecting the first integrated circuit die with the first external interconnect; and encapsulating the second integrated circuit die with the first external interconnect and the first integrated circuit die partially exposed.

Abstract: A system and method for a low-k dielectric layer are provided. A preferred embodiment comprises forming a matrix and forming a porogen within the matrix. The porogen comprises an organic ring structure with fewer than fifteen carbons and a large percentage of single bonds. Additionally, the porogen may have a viscosity greater than 1.3 and a Reynolds numbers less than 0.5.

Abstract: A method for manufacturing a semiconductor device includes a first photolithography step of forming a first device pattern corresponding to a first pattern, and a plurality of alignment marks corresponding to a plurality of marks, upon a step of exposing the entire device region in one shot using a first mask including the first pattern and the plurality of marks, and a second photolithography step of, after the first photolithography step, forming second device patterns respectively corresponding to second patterns in a plurality of divided regions which form the device region, upon steps of individually exposing the plurality of divided regions using second masks each including the second pattern corresponding thereto.

Abstract: An aeration system including a housing, a fluid inlet at a first end of the housing, an outlet at a second end of the housing, a cylindrical support member rotatably mounted within the housing between the inlet and the outlet, and supported by a plurality of bearings, the support member having an interior surface enclosing an interior cavity, the cavity being in communication with the inlet and the outlet, at least one vane disposed on the interior surface of the support member and extending from the interior surface towards the rotational axis of the support member, the vane including an inner edge positioned such that a gap is defined between the inner edge of the vane and the rotational axis of the support member, at least one gas inlet in communication with the cavity of the support member, and a motive device for rotating the support member within the housing.

Abstract: An apparatus for manufacturing light guide plate includes a coater containing UV curable glue, a first pressing roller and a second pressing roller. The first pressing roller and the second pressing roller are located nearby each other and space a predetermined distance from each other. The coater distributes UV curable glue on the surface of the first pressing roller or the second pressing roller. The first pressing roller and the second pressing roller cooperatively press the distributed UV curable glue. At least one of the first pressing roller and the second pressing roller includes a transparent shell and a UV lamp in the transparent shell. The UV lamp emits UV light to the other pressing roller. The UV lamp solidifies the UV curable glue pressed between the first pressing roller and the second pressing roller.

Abstract: A method for manufacturing an optical film includes providing a molding machine. The molding machine includes a hopper, a first cylindrical roller, a second cylindrical roller, and a UV light source. The first and second cylindrical rollers are located at two opposite sides of a narrow outlet of the hopper and positioned at substantially a same height just below the narrow outlet. Thereafter, a UV-curable material is provided into the hopper, and flows out from the narrow outlet of the hopper. The UV light source is turned on toward the UV-curable material. Furthermore, the first and second cylindrical rollers are rotated to directly press the UV-curable material when the UV-curable material is cured.

Abstract: A modular plastic pipe formation apparatus, wherein at least two components of the pipe formation apparatus are disposed with respect to at least one or more respective modules.

Abstract: To execute a stable pressure control, in a control device for an injection molding machine, a filling/pressure-keeping determining unit determines whether the injection molding machine is performing a pressure keeping operation, an elastic constant identifier acquires, when the filling/pressure-keeping determining unit determines that the pressure keeping operation is in progress, a pressure detection value and a position detection value as operation information of a motor and identifies an elastic constant K based on the acquired pressure detection value and the position detection value, and a pressure-control control-parameter setting unit calculates a proportional gain Ka of a pressure controller such that a product of the proportional gain Ka of the pressure controller and the elastic constant K is smaller than a speed control bandwidth ?sc of a speed controller, and sets the calculated proportional gain Ka to the pressure controller.

Abstract: The present specification discloses porogen compositions comprising a core material and shell material, methods of making such porogen compositions, methods of forming such porous materials using such porogen compositions, biocompatible implantable devices comprising such porous materials, and methods of making such biocompatible implantable devices.

Abstract: Provided is a method that can improve formability and blow moldability of a foamed parison as compared with conventional production method and can produce a polypropylene-based resin foamed blow-molded article having excellent uniformity of wall thickness over a wide range of its density. The method comprises kneading a polypropylene-based resin with a physical foaming agent, extruding the thus obtained foamable molten resin through a die to obtain a foamed parison in a softened state, placing the foamed parison between molds and then blow-molding the foamed parison and is characterized in that the polypropylene-based resin comprises a polypropylene-based resin (A) satisfying specific requirements (1) to (3) and a polypropylene-based resin (B) satisfying a specific requirement (4), when the polypropylene-based resins (A) and (B) are each subjected to dynamic viscoelasticity measurement in which an oscillation strain is applied thereto at a temperature of 190° C.

Abstract: The exemplary embodiment provides a method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder. The method includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into the agitated mixture of the molding material and the solid powder while vibrating at least one of the component and the molding die.

Abstract: Disclosed is a method for hot isostatic pressing a substrate. At first, a metal container is provided. Powder is filled in the metal container before the metal container is located in an oven. The metal container is subjected to isostatic pressing that includes heating and pressing. Thus, the metal container shrinks and presses on the powder evenly and turns the powder into a nugget. The metal container is moved out of the oven and broken to release the nugget. A substrate is cut from the nugget. With the hot isostatic pressing, the substrate exhibits only a few flaws and is large, fine, homogenous and strong so that the substrate is not vulnerable to deformation in a high-pressure environment.

Abstract: The method of manufacturing a molded article including a component insert-molded in a molding material mixed with solid powder includes an injecting step of injecting the molding material and the solid powder into a molding die, an agitating step of agitating the molding material and the solid powder within the molding die to disperse the solid powder in the molding material, and an embedding step of pressing and embedding the component into an agitated mixture of the molding material and the solid powder.

Abstract: Methods of sterilizing medical devices, particularly stents, that include a polymer with ethylene oxide. The polymer may be in the device body or a coating on the device. The method entails exposure such that the temperature of the device does not exceed the glass transition temperature of the polymer in the wet stage, that is as plasticized by the sterilant. The sterilant may include water vapor.

Abstract: A method for preparing coated binder units wherein the coated binder units comprise a core of binder coated with a layer of coating material, wherein the binder is a bituminous binder or a synthetic binder comprising a resin, an oil and optionally a polymer, which method comprises the steps of: (a) supplying the binder and the coating material to an co-extrusion device which comprises an even number of pairs of inner and outer dies, whereby the binder is supplied to the inner dies and the coating material is supplied to the outer dies; (b) co-extruding the binder and the coating material by means of the co-extrusion device, thereby producing streams of extrudate in which the binder is coated with a layer of the coating material; and (c) optionally, shaping the streams of extrudate, into units of the coated binder. The invention further relates to the co-extrusion device.

Abstract: A permeable material compacting method includes positioning permeable material around a mandrel, rotating the permeable material about an axis of the mandrel, longitudinally moving at least one tapered surface against the permeable material and reducing a radial thickness of the permeable material between a surface of the mandrel and the at least one tapered surface.

Abstract: A process of manufacturing a white polyimide film comprising performing condensation polymerization of monomers comprising diamine and dianhydride components to obtain a solution; adding a dehydrant, a catalyst and a coloration filler into the solution to obtain a precursor solution; coating a layer of the precursor solution on a support; and baking the coated layer of the precursor solution to form a white polyimide film. The diamine component can include 2,2?-bis(trifluoromethyl)benzidine, and the dianhydride component can include 3,3?,4,4?-biphenyltetracarboxylic dianhydride and 2,2-bis[4-(3,4-dicarboxyphenoxy) phenyl]propane dianhydride. The coloration filler can include TiO2, Al2O3, CaCO3, CaSO4, SiO2, BN, AlN and clay.

Abstract: A resist layer constituted by a resist composition (which may include unavoidable impurities) including a polymerizable compound that includes polyfunctional monomers that become polymers having three dimensional structures by cross linking when polymerized and a polymerization initiating agent which is activated by one of light and an electron beam is formed on a substrate. A surface of a mold having a predetermined pattern of protrusions and recesses is pressed against the resist layer. Light is irradiated onto the resist layer to cure the resist layer. The mold is separated from the resist layer under conditions that the temperature of the resist layer is 40° C. or greater.

Abstract: The injection molding employing a mold that includes a molding surface in which a pin hole is formed, and at least one ejector pin that is inserted through the pin hole and that includes an outer peripheral surface facing an inner peripheral surface of the pin hole; includes closing a mold, injecting material into the mold, setting the material, opening the mold, and extruding the material by making a tip end surface of the at least one ejector pin protrude out of a pin hole. The tip end surface is recessed from the molding surface by a predetermined distance in a direction opposite a direction in which the material is extruded, while injecting the material into the mold.

Abstract: A method of manufacturing an electrode for a fuel cell, the method comprising forming a powder bed from a predetermined powder, sintering the powder bed at a first predetermined temperature to form a substrate, and in some embodiments subsequently distributing an electrolyte powder on a surface of the substrate, and impregnating the substrate with electrolyte by heating the substrate with the electrolyte powder thereon to a second predetermined temperature so as to melt and wick the electrolyte into the substrate, thereby forming the electrode for the fuel cell, wherein at least one of the sintering and impregnating is performed by applying induction heating to at least one of said powder bed and said substrate.

Abstract: A permeable material compacting method includes, forming a cavity between a membrane and a structure, porting fluid to or from the cavity, positioning permeable material adjacent the membrane, generating a differential pressure across the membrane, deforming the membrane, and decreasing volume of the permeable material

Abstract: Disclosed is a method for making a pure aluminum nitride substrate. At first, aluminum nitride is mixed with a water-resistant material and an adhesive material. The mixture is made into grains in a granulation process. The grains are molded into a nugget in a steel mode by hydraulic pressure. The nugget is subjected to a cold isostatic pressing process. At a low temperature, the water-resistant material and the adhesive material are removed from the nugget. Then, the nugget, boron nitride and nitrogen are introduced into and sintered in an oven, thus providing a pure aluminum nitride substrate. The purity and quality of the aluminum nitride substrate are high. The aluminum nitride substrate can be used in a light-emitting diode. The method is simple, the yield is high, and the heat radiation of the aluminum nitride substrate is excellent.

Abstract: A method of directing a gas flow in a tip of a gas torch includes: directing a flow of gas to an outer passageway of the tip; directing the flow of gas inwardly through at least one intermediate gas passageway; directing the flow of gas to a central gas passageway of the tip; and directing the flow of gas distally through a distal orifice of the tip.

Abstract: The mist cooling apparatus (3) includes: a cooling system (30) which includes a nozzle (35, 35A) that sprays cooling liquid in a form of a mist onto a treatment object which has been heated and provided in a cooling furnace (10), and a pump (33) that is driven by a drive source and thereby makes the cooling liquid flow toward the nozzle (35, 35A); and a second cooling system (40) which operates in response to a stoppage of the drive source, and thereby cools the treatment object.

Abstract: A burner enclosure for use in locating a burner in an a wall of an electric arc furnace, the burner enclosure includes a plurality of walls wherein each wall includes a serpentine cooling path therein and an inlet located proximal a first edge of each wall and an outlet located proximal a second edge of each wall and wherein the walls are assembled into the burner enclosure so an inlet of one wall can be connected by an elbow to an outlet of an adjoining wall to create a cooling fluid flow path through the entire burner enclosure to improve the performance of the burner in the burner enclosure and to improve the overall efficiency of the electric arc furnace.

Abstract: A damping strut for a bicycle has a hydraulic shock absorber having a damper volume filled with incompressible damping fluid, a pressure application device that detects the current displacement state of the damping strut, and at least one disk valve. When the damping strut is displaced, the damper volume changes so that the damping fluid flows, creating a damping force which counteracts the displacement, through the disk valve. A control piston is coupled to the disk valve in order to vary the degree of opening of the disk valve. Control piston pressure can be applied by the pressure application device with a compressible control fluid, dependent on the displacement state detected by the pressure application device, such that on detection of a pre-determined displacement state of the damping strut, the disk valve is pre-tensioned in the closing direction thereof, so that the damping force is increased.

Abstract: To provide an installation for cleaning and/or deburring workpieces, comprising a treatment region configured to enable a cleaning treatment and/or a deburring treatment to be performed on a workpiece therein, a loading device for transferring the workpiece from an outer area of the installation into the treatment region and an unloading device for transferring the workpiece from the treatment region into the outer area of the installation, with which installation there is achieved a high workpiece throughput with a favourable cleaning and/or deburring result, it is proposed that the loading device and/or the unloading device comprises at least one treatment device configured to enable the workpiece to be treated during the transfer between the outer area of the installation and the treatment region of the installation.

Abstract: The invention relates to a compressed-air-operated vacuum generator or vacuum gripper having at least two vacuum units, wherein each vacuum unit has a suction chamber, an intake opening which opens into the suction chamber, an outflow opening which opens out of the suction chamber, and at least one drive air opening which opens into the outflow opening between the intake opening and the outflow opening, and wherein the vacuum units operate on the basis of at least two different principles (Venturi, Bernoulli, Coanda, vortex, etc.) for generating a negative pressure.

Abstract: A workpiece-holding unit for installation on machining centers for connecting rods, comprising a crosspiece which is adapted to be rotatably supported about its axis in front of a machining head of the machining center and has internal, hydraulic longitudinal ducts which communicate with respective hydraulic outlets on the main faces of the crosspiece and are connected to hydraulic feed means. Several workpiece-holding tools are installable on the main faces of the crosspiece and are provided with positioning mechanisms and locking mechanisms for at least one connecting rod, which are hydraulically operated via respective hydraulic lines leading at positions aligned to said hydraulic outlets.

Abstract: A clamp meter has a main body and a stationary jaw fixed to an end of the main body. A hook portion of the clamp meter includes a movable jaw, a displacing means and a knob. The movable jaw is mounted on the main body corresponding to the position of the stationary jaw. The movable jaw and the stationary jaw together form a closed loop. The displacing means is mounted in the main body and comprises a displaceable rod connected to the movable jaw and a gear set for driving the displaceable rod. The knob is connected to the gear set for driving the displaceable rod and the movable jaw for linear displacement. The movable jaw is activated by the displaceable rod to generate a linear displacement, so that the user can operate the clamp meter more easily for measurement.

Abstract: A pin locking apparatus 100 includes a base unit 101 having a plurality of vertical channels 120 formed therethrough. A first pin 122 is slidingly disposed in a first of the plurality of vertical channels 120 and a second pin 122 is slidingly disposed in a second of the plurality of vertical channels 120. A wedge 140 is slidingly disposed in a third of the plurality of vertical channels 142. The third vertical channel 142 is located between the first and second vertical channels 120. A first magnet 132 is slidingly disposed in a horizontal channel 130 between the first pin 122 and the wedge 140. A second magnet 132 is slidingly disposed in the horizontal channel 130 between the second pin 122 in the wedge 140. The magnetic pole of the second magnet 132 proximate to the wedge 140 is opposite the magnetic pole of the first magnet 132 proximate to the wedge 140.

Abstract: A portable workpiece stopping device, attachable to a work surface relative to a primary tool, permitting a repetitive same-length operation to be performed on any number of workpieces, and which allows for interruption of the operation without affecting the essential positioning of the stopping device relative to the primary tool. The stopping device comprises a base plate selectively attachable to a work surface, a rotation plate rotatably coupled to the base plate, an alignment plate adjustably coupled to the rotation plate, a stop plate fixedly coupled to the alignment plate, and a support shelf adjustably coupled to the stop plate. The stopping device can be selectively transitioned from an obstructing position, which blocks the end of a workpiece pressed against the stop plate, thereby allowing the repetitive same-length operation to be performed, to a non-obstructing position which provides for unfettered positioning of any workpiece relative to the primary tool.

Abstract: A printing press is provided. The printing press includes at least one printing unit for printing on a running web, a cutting cylinder for cutting the web into sheets and a folder for folding sheets cut from the web. The folder includes a collect cylinder for accumulating a number of sheets at a collect location, a folding cylinder for folding the accumulated number of sheets received from the collect location to form a folded section, a cam arrangement including a supplementary cam device for controlling the number of sheets collected on the collect cylinder and an actuator for actuating the supplementary cam device. Methods are also provided.

Abstract: A method for transporting newspapers includes the steps of feeding an asymmetrically folded multiple section newspaper into a pocket of a pocket conveyor of an inserting machine, wherein the asymmetrically folded multiple section newspaper has an extended lap having a height of at least 15% of a height of the asymmetrically folded newspaper when unfolded. A face of a first section of the headline side of the newspaper, when fed into the pocket is adjacent a movable wall of the pocket, and a back of a last section of the headline side of the newspaper adjacent a fixed wall of the pocket. The method further comprises feeding one or more inserts from a hopper to the pocket, where the inserts are fed into an opening between newspaper sections, removing the newspapers with the inserts therein from the pocket with a gripper conveyor, and releasing the newspapers with the inserts from the gripper conveyor headline up on a lapped stream conveyor.

Abstract: When information about weight of a sheet indicates weight less than a predetermined weight, a sheet stacking apparatus configured to align sheets to be stacked on a stacking tray discharges the sheet onto the stacking tray while overlapping the sheet with another sheet by an overlapping unit, and, when the information about the weight of the sheet indicates weight not less than the predetermined weight, the sheet stacking apparatus discharges the sheet onto the stacking tray without overlapping the sheet with another sheet by the overlapping unit.

Abstract: A sheet stackable device includes a sheet stackable plane. The sheet stackable device includes a first tray and a second tray, each of which is formed in a shape of a flat plate. The first tray includes a first contact part. The second tray is slidable along a slidable direction between a first position, in which the second tray overlaps the first tray, and a second position, in which the second tray is dawn out of the first tray. The second tray includes a second contact part, which is slidable on the first contact part. At least one of the first contact part and the second contact part includes a rack with rack teeth, which are aligned along the slidable direction. An upper plane of the first tray and an upper plane of the second tray in the second position form at least a part of the stackable plane.

Abstract: An n image forming system includes an image forming apparatus, a sheet processing apparatus including a post-processing unit to perform post-processing of sheets on a processing tray and a retaining channel disposed to accommodate at least a single sheet while the post-processing unit processes the sheets, and a controller that calculates a target interval time between an interval start sheet and an interval end sheet among the sheets output from the image forming apparatus to the sheet processing apparatus based on at least one of sheet data and post-processing data transmitted from the image forming apparatus to the sheet processing apparatus, and adjusts an interval between discharge of the interval start sheet and the interval end sheet from the image forming apparatus to the sheet processing apparatus in accordance with the target interval time.