Abstract: There is provided a 1005-sized or smaller multilayer ceramic electronic part, including: a ceramic body having internal electrodes having a directivity perpendicular to a printed circuit board; and external electrodes formed on both end portions of the ceramic body and electrically connected to the internal electrodes each including an active area part and a lead part, the active area parts facing each other to contribute to forming capacitance, and the lead part having a width smaller than that of the active area part, and wherein when a width of the active area part is defined as WLa, a width of the lead part on one end portion of the ceramic body connected to the external electrodes is defined as WL1, and a bottleneck rate ? of the lead part is defined as 1?WL1/WLa, the bottleneck rate ? of the lead part satisfies a range of 0<??0.12.

Abstract: Provided is a laminated ceramic capacitor which produces excellent lifetime characteristics in a high-temperature loading test even when dielectric layers are reduced in thickness. The dielectric ceramic contains, as its main constituent, a compound represented by the general formula (Ba1-x-yCaxRey)(Ti1-zMz)O3 (where Re is at least one or more elements selected from among La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, and Y, and M is at least one or more elements selected from among Mg, Mn, Al, Cr, and Zn), 0?x?0.2, 0.002?y?0.1, and 0.001?z?0.05. This dielectric ceramic has crystal grains of 20 nm or more and 150 nm or less in average grain size.

Abstract: The present invention provides a charge storage device, comprising a pair of electrodes, each electrode being operable to store electric charge and having a respective capacitance CP, CN that is different to the other, with the ratio of the capacitances CP/CN being greater than 1. In exemplary embodiments, the charge storage device may be an asymmetrical supercapacitor, which is operable to provide an enhanced energy capacity by increasing the cell voltage through unequalising the electrode capacitance. Hence, by increasing the CP/CN ratio an improved power capability can be achieved over conventional devices, while offering a simple and low cost manufacturing strategy. The present invention has particular application with cameras, electric vehicles, elevators, renewable energy stores, fuel cells, batteries and many forms of electronic devices.

Abstract: A power supply for a device disposed on a substrate is provided. An electrolytic double layer capacitor disposed in a circuit to provide power to circuit components is described. Aspects of fabrication are provided.

Abstract: A wet electrolytic capacitor is provided. The capacitor contains an anode comprising an anodically oxidized pellet formed from a pressed and sintered powder, a cathode that contains a metal substrate coated with a conductive polymer, and a working electrolyte in communication with the anode and the cathode. The working electrolyte is in the form of a gel and comprises an ammonium salt of an organic acid, inorganic oxide particles, an acid, and a solvent system that comprises water. The working electrolyte has a pH value of from about 5.0 to about 8.0.

Abstract: This document discusses capacitive elements including a first, second and third electrode arranged in a stack. The third electrode is positioned between the first and second electrode. An interconnect includes a unitary substrate shared with the first and second electrodes. The interconnect is adapted to deform to accommodate the stacked nature of the first and second electrodes. The unitary substrate includes a sintered material disposed thereon.

Abstract: A folding ballast has a ballast housing having an elongated shape. A first socket arm is mounted to the ballast housing at a first socket arm joint, and the first socket arm has a first closed position parallel to the ballast. The first socket arm has a first open position perpendicular to the ballast. A second socket arm is mounted to the ballast housing at a second socket arm joint, and the second socket arm has a second closed position parallel to the ballast. The second socket arm has a second open position perpendicular to the ballast. A first socket is mounted to the first socket arm, and the first socket is electrically connected to the ballast housing. A second socket is mounted to the second socket arm, and the second socket is electrically connected to the ballast housing.

Abstract: A handheld electronic device including a body and a QWERTY key layout is provided. The body has a case. The QWERTY key layout has a plurality of keys disposed on the case, wherein a fillet is disposed on a corner of each key, and there is a distance of the case between any two adjacent the keys. All the keys are adapted to users to press with their left or right thumb in single hand or both hands while using the handheld electronic device, and a heat conductivity of one of the keys is different from a heat conductivity of another one of the keys.

Abstract: A module rail for a photovoltaic system includes a module-supporting surface, and upper portion, and opposing vertical sidewalls. A first set of openings are spaced apart from one another along the length of the rail. Each of the openings in the first set extend through the upper portion for receiving a first set of fasteners for use in securing at least one photovoltaic module to the module rail. A second set of openings are spaced apart from one another along the length of the rail. Each of the openings in the second set extending through at least one of the module-supporting surface and one of the sidewalls for receiving a second set of fasteners for use in securing at least one photovoltaic module to the module rail.

Abstract: The present invention discloses a backplane and an LCD device, the backplane is formed by jointing of at least two sub-backplanes, the joint of the sub-backplanes are provided with multiple vertical enhanced ribs perpendicular to the joint section of the joint, and the vertical enhanced ribs are arranged along the joint section.

Abstract: The present invention relates to a soft display device for a portable terminal and more specifically to a soft display device of a portable terminal, wherein a soft display that is fabricated with soft materials to be flexible is used to further enlarge the screen of a portable terminal (cellular phone, PMP, electronic dictionary, DMB, navigation, notebook, UMPC) so that a wider screen may be provided to the user. In the first embodiment of the present invention, the soft display device of a portable terminal of the present invention comprises a housing wherein an empty space is formed, a soft display wherein at least one part out of its entire surface area is exposed at the top of said housing and extended from the one part exposed on said top so that it may be pushed and pulled inside said housing, and a support part that supports said soft display accommodated inside said housing.

Abstract: A cable positioning mechanism includes a main body and first and second positioning members arranged on the main body. The first positioning member includes a first surface and a second surface connecting with the first surface. The second positioning member includes a first end parallel to the second surface and a second end parallel to the first surface. The second end cooperates with the second surface to define a first holding space for allowing a cable being placed thereinto. The first end cooperates with the first surface to define a second holding space communicating with the first holding space. The second positioning member further includes a hook. The hook extends into the second holding space and clamps the cable to the main body when the cable is rotated to be received in the second holding space. An electronic device using the cable positioning mechanism is also provided.

Abstract: According to one embodiment, an electronic apparatus includes a housing including a first surface and a second surface opposite the first surface. The first surface includes a protrusion. The second surface includes a first recess opposite the protrusion and a second recess adjacent to the first recess. The second recess has substantially the same shape as the first recess.

Abstract: An object of the invention is to provide a capacitor device that can be made slimmer and lighter and that enables the strength and heat dissipation properties to be improved. A capacitor device (1) has a plurality of capacitor units (2) integrally housed within a housing case (3), the housing case (3) having cylindrical housing sections (5) for housing the capacitor bodies. The housing sections (5) are longitudinally aligned in the same direction and are joined together as an integrated whole. A capacitor unit (2) is inserted via an opening (9) at one end of each of the housing sections (5) so that the entire circumference of the capacitor unit (2) is covered by the corresponding housing section (5). The housing sections (5) have a uniform thickness at least on the outer side along the outer periphery of the capacitor units.

Abstract: A modularized server includes a main housing, a first block unit, a second block unit, and a removable module. The main housing has a first inserting groove and a second inserting groove, and the removable module has a guide channel. When the removable module is disposed in the first inserting groove along a sliding direction, the first block unit is located in the guide channel. Moreover, the second block unit blocks the removable module from being installed to the second inserting groove.

Abstract: A boss for securing a pair of mainboards includes a circular top and a plurality of first flexible legs. The first flexible legs are disposed on one side of the circular top and are separated from each other. Each of the first flexible legs includes a tilted wall and a pressing component. The tilted wall is formed on a surface of the first flexible leg that faces another first flexible leg. The pressing component is formed on one end of the first flexible leg away from the circular top. The tilted walls of all the first flexible legs cooperatively define a tapered channel. The tapered channel can be expanded.

Abstract: An electronic apparatus including a main body and a detachable input device is provided. The main body has a first connecting interface. The detachable input device has an input interface and a second connecting interface. When the detachable input device is installed on the main body, the first connecting interface contacts the second connecting interface, and the detachable input device transmits signals to the main body through the first connecting interface and the second connecting interface, and receives electric power from the main body through the first connecting interface and the second connecting interface. When the detachable input device is detached from the main body, the first connecting interface is separate from the second connecting interface, and the detachable input device transmits signals to the main body in a wireless manner.

Abstract: A portable computer that is configurable between a plurality of display modes including a laptop mode (in which the portable computer has a conventional laptop appearance) and an easel mode in which the base of the computer and its display component stand vertically forming an inverted “V.” The portable computer includes a hinge assembly that couples the display component to the base of the computer, and allows the display component to be rotated about an axis along an interface between the display component and the base to configure the portable computer between a closed position, the laptop mode and the easel mode. The portable computer further comprises a scroll wheel and optional navigation buttons that permit a user to control or manipulate various aspects of operation of the portable computer (such as volume or display brightness) and/or content displayed the computer.

Abstract: A portable computer includes a base, a display module, at least one support element and at least one sliding assembly. The display module comprises a connecting end and a display face. Each support element comprises a first end pivoted on a portion of the display module other than the display face and a second end pivoted on the rear end of the base. Each sliding assembly comprises a slide rail disposed at least in the second area and a sliding element combined with the connecting end and moving along the slide rail. Each sliding element includes at least one sliding auxiliary structure for decreasing friction during sliding.

Abstract: A liquid crystal display device with connector, wherein the front frame includes a front plate and a front plate side frame which defines with a front plate opening and has a first hole; the back plate includes a bottom plate and a bottom plate side frame which defines with a back plate opening, has an area smaller than that of the front plate opening, disposes with a second hole, moreover, a third hole is disposed on the bottom plate at a position corresponding to the second hole; the connector includes a first sheet body and a second sheet body which is provided with a first snap and a second snap, respectively; wherein, during the assemble process of the front frame and the back plate, the first snap engages with the first hole and the second hole, while the second snap engages with the third hole.

Abstract: A terminal apparatus that includes a first case, a second case, and a complex hinge module that has a slide hinge and a rotational hinge, to shift each of the first case and the second case between a closed state and an opened state. The slide hinge further includes a movable plate, a support plate that slidably supports the movable plate and is secured to the second case, and an elastic member configured to move the second case back toward the first case. The rotational hinge includes a fixed part secured to the first case, a rotational part which is rotatable on an axis common to the fixed part and the rotational part, and a link mechanism that connects the rotational part with the movable plate and has an extruding part to move the second case.

Abstract: A multi-chip package has a substrate with electrical contacts for connection to an external device. A CPU die is disposed on the substrate and is in communication with the substrate. The CPU die has a plurality of processor cores occupying a first area of the CPU die, and an SRAM cache occupying a second area of the CPU die. A DRAM cache is disposed on the CPU die and is in communication with the CPU die. The DRAM cache has a plurality of stacked DRAM die. The plurality of stacked DRAM dies are substantially aligned with the second area of the CPU die, and substantially do not overlap the first area of the CPU die. A multi-chip package having a DRAM cache disposed on the substrate and a CPU die disposed on the DRAM cache is also disclosed.

Abstract: Methods of forming microelectronic structures are described. Embodiments of those methods include attaching a patch structure to an interposer by thermal compression bonding, forming an underfill around an array of interconnect structures disposed on a top surface of the interposer, curing the underfill, and then attaching a die to the patch structure.

Abstract: A fixing mechanism for fixing expansion cards in place includes a fixing assembly, a clamping element opposite to the fixing assembly, and a connection element. A side of the clamping element away from the fixing assembly defines a recess for receiving the expansion card. The connection element is hinged to the fixing assembly and the clamping element. When the connection element is rotated relative to the fixing assembly and the clamping element, the clamping element is moved towards or away from the fixing assembly to adjust a distance between the fixing assembly and the clamping element.

Abstract: This relates to systems and methods for providing a system-on-a-substrate. In some embodiments, the necessary components for an entire system (e.g., a processor, memory, accelerometers, I/O circuitry, or any other suitable components) can be fabricated on a single microchip in “bare die” form. The die can, for example, be coupled to suitable flash memory through a substrate and flexible printed circuit board (“flex”). In some embodiments, the flex can extend past the substrate, die, or both, to allow additional, relatively large components to be coupled to the flex. In some embodiments, the die can be coupled to the flash memory through the flex and without a substrate. In some embodiments, component test points can be placed on the flash memory side of the substrate.

Abstract: Described are external storage devices including a substrate, a controller electrically coupled to the substrate, at least one memory die stack electrically coupled to the substrate, a plurality of connection fingers electrically coupled to the substrate, and a mounting bar electrically coupled to the substrate. The mounting bar may include a plurality of springs. In other examples, the external storage device may include a substrate, a controller electrically coupled to the substrate, at least one memory die stack electrically coupled to the substrate, a plurality of connection fingers electrically coupled to the substrate, and a contact bar electrically coupled to the substrate. The contact bar may include a plurality of extensions. One or more memory die stacks may be coupled to one or more surfaces of the substrate and may include a plurality of dies in each memory die stack.

Abstract: A computing device includes a chassis having a width that is equal to or less than half of the width of a standard slot of a rack. A circuit board assembly with at least one processor is coupled to the chassis in a primarily horizontal orientation. One or more rows of mass storage devices (such as hard disk drives) are coupled to the chassis. At least one of the rows of mass storage devices includes a stack of mass storage devices.

Abstract: An electronic device includes a housing. A motherboard is arranged in a first end of the housing. A hard disk drive area is arranged at a second end of the housing. A cooling module is arranged at the housing between the motherboard and the hard disk drive area. The cooling module includes a chassis and a semiconductor chilling plate received in the chassis. An outside airflow flows through the hard disk drive area, and then flows through the semiconductor chilling plate to be cooled. The cooled airflow is driven to flow through the motherboard.

Abstract: An exemplary heat dissipating system includes a case, a motherboard, an air conducting guide dividing the motherboard into a first area and a second area, a group of first fans, and a group of second fans. The group of first fans and the group of second fans draw cool air into the first area and the second area from different directions for dissipating heat generated by electronic components on the motherboard.

Abstract: Various computing devices and methods of thermally managing the same are disclosed. In one aspect, a method of thermally managing a computing device is provided where the computing device includes a housing that has a wall adapted to contact a body part of a user, a circuit board in the housing, and a semiconductor chip coupled to the circuit board. The method includes placing a first heat spreader in thermal contact with the semiconductor chip and the circuit board but separated from the wall by a gap.

Abstract: An air cooled switching unit for a motor drive includes a forced air cooling chamber and a convective cooling chamber separate from the forced air cooling chamber. An exhaust port of the forced cooling chamber is configured to direct exhaust air across an outlet of the convective cooling chamber to induce an increased air flow through the convective cooling chamber thereby increasing the cooling capacity of the convective cooling chamber.

Abstract: A printed circuit board having an electronic component which is to be cooled by a cooling surface biased thereon, where the biasing elements are abutted not by the PCB but a stiffer element attached to the PCB in order to not strain or bend the PCB.

Abstract: A heat dissipation module, comprising: a fan; and a heat dissipating fin; a heat conducting element, made of a conductive material, and composed of a first conductive component and two second conductive components in a manner that the first conductive component is disposed engaging with a heating element while allowing the two second conductive components to engage with the heat dissipating fin; and a wall element; wherein, the heat from the heating element is conducted to the first conductive component where it is further being dividedly conducted to the two second conductive components; and the air flow blowing from the fan is guided to the heating element and then it is blocked by the wall element for diverting the air flow toward the heat dissipating fin from an air intake side to an air outlet side, and then to be discharged out of the heat dissipating module through an outlet.

Abstract: A thin portable electronic device with a display is described. The components of the electronic device can be arranged in stacked layers within an external housing where each of the stacked layers is located at a different height relative to the thickness of the device. One of the stacked layers can be internal metal frame. The internal metal frame can be configured to act as a heat spreader for heat generating components located in layers adjacent to the internal frame. Further, the internal metal frame can be configured to add to the overall structural stiffness of the device. In addition, the internal metal frame can be configured to provide attachment points for device components, such as the display, so that the device components can be coupled to the external housing via the internal metal frame.

Abstract: An object is to release heat efficiently to heat-resistance abilities of individual components by enhancing a heat-radiation performance of power circuit components forming a power module (100) and by enhancing a heat generation balance. The power circuit components formed of power switching elements (107 and 108) forming a bridge circuit and a motor relay switching element (109) are mounted on conductive members (102) while a heat generation balance is maintained. Then, the conductive members (102) are disposed on a heat-releasing heat sink (30) by abutment, and the power circuit components and the heat sink (30) are integrally molded using mold resin (101).

Abstract: A device has a passive cooling device having a surface, at least one active cooling device on the surface of the passive cooling device, and a thermal switch coupled to the passive cooling device, the switch having a first position that connects the active cooling device to a path of high thermal conductivity and a second position that connects the passive cooling device to the path of high thermal conductivity.

Abstract: The invention relates to a method of cooling electronic circuit boards using surface mounted devices (SMD), the method comprising the steps of: after or during the board layout, filling empty spaces V1, V2, V3, V4, V5, V6, V7, V8, V9, V10 with at a number of heat sink devices 1, 2, 3, 4, 5 near a thermal hot spot and connecting the number of heat sink devices 1, 2, 3, 4, 5 to a thermally conducting path 25, 27, 29, 31, 33, 35 of the board N, respectively. Further, the invention relates to a heat sink device 1, 2, 3, 4, 5 adapted to implement the method according to the invention.

Abstract: The present invention discloses a sliding mechanism for sliding a display module relative to a host module. The sliding mechanism includes a host module fixing component installed inside the host module, a display module fixing component connected to the host module fixing component, a sliding component disposed on a lateral side of the display module and installed on the display module fixing component in a slidable manner, and a roller set installed on the display module fixing component for guiding the sliding component to slide in a first direction relative to the display module fixing component, such that the display module can slide relative to the host module in the first direction.

Abstract: A connector with an audio receiving module provided for being electrically coupled to a main board of an electronic device includes an insulating base, an audio receiving module and a jack. The insulating base has a containing space and a containing groove, and the containing space has an opening, and the containing groove has a port. The audio receiving module is contained in the containing space and disposed at a position corresponding to the opening and includes a microphone unit and a plurality of pins, and the microphone unit is electrically coupled to each pin. The jack is contained in the containing groove and disposed at a position corresponding to the port. Therefore, the connector can provide an audio receiving effect.

Abstract: A connector with an audio playing module provided for being electrically coupled to a main board of an electronic device includes an insulating base, an audio playing module and a jack. The insulating base has a containing space and a containing groove, and the containing space has an opening, and the containing groove has a port. The audio playing module is contained in the containing space and disposed at a position corresponding to the opening and includes a speaker unit and a plurality of pins, and the speaker unit is electrically coupled to each pin. The jack is contained in the containing groove and disposed at a position corresponding to the port. Therefore, the connector can provide an audio playing effect.

Abstract: A fan-out circuit electrically connected to a driver and a plurality of signal lines is provided. The fan-out circuit includes a first fan-out trace including a first and a second conductive line, and a second fan-out trace including a third and a fourth conductive line. The second conductive line is connected between the first conductive line and one of the signal lines. The length of the second and fourth conductive lines are L1? and L2? respectively. An obtuse included angle is formed between the first and second conductive lines. The width of the first and third conductive lines is W1. The fourth conductive line is electrically connected to the third conductive line and another one of the signal lines. The obtuse included angle is formed between the third and fourth conductive lines. The width of the second and fourth conductive lines is W2, and (W2/L1?)>(W2/L2?) and L1?<L2?.

Abstract: The present application discloses a transformer conductive structure, which comprises a primary coiling, a printed circuit board and a secondary coiling unit comprising a plurality of conductive sheets; wherein each conductive sheet comprises an annular body and an output terminal arranged at the edge of the annular body and protruded to the outside; the annular bodies of the conductive sheets and the primary coiling are staggered arrangement together; and the output terminal of the conductive sheet directly clamps on the printed circuit board. The present application further discloses a transformer, which can effectively reduces the output path of the transformer, the AC and DC loss and the volume of the transformer device, so as to increase the power density and efficiency of power supply.

Abstract: Provided is a pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, which has transparent as the pressure-sensitive adhesive layer for transparent conductive film and can prevent the patterned transparent conductive thin film from degrading the appearance of the conductive film. A pressure-sensitive adhesive layer for a transparent conductive film having a patterned transparent conductive thin film, wherein the pressure-sensitive adhesive layer is made from an acrylic pressure-sensitive adhesive composition containing: 100 parts by weight of an acryl-based polymer obtained by polymerization of a monomer component including an alkyl(meth)acrylate; and 30 to 150 parts by weight of a styrene-based oligomer, the pressure-sensitive adhesive layer has a refractive index of 1.50 or more, the pressure-sensitive adhesive layer has a haze of 2% or less as measured at a thickness of 30 ?m.

Abstract: A flexible circuit assembly that includes a flexible circuit substrate. A spacer is attached to a first side surface of the substrate, and a die carrier is attached to the opposite side surface of the substrate. The die carrier includes one or more photonic die mounted thereon that face an opening formed through the substrate so that the photonic die transmits and/or receives optical signals through the opening. Wire bonds electrically connect the photonic die to an electrical pad on the first side surface of the substrate. The spacer helps to space the wire bonds from an optical connector that connects to the flexible circuit assembly, so that the wire bonds do not interfere with the mechanical connection between the flexible circuit assembly and the optical connector.

Abstract: In a display device (100), a row of protruding electrodes (115) and a row of protruding electrodes (116) are formed on the connecting surface of a terminal section (112), the row of the protruding electrodes (116) is disposed between the row of the protruding electrodes (115) and a display section (111), one end of a flexible printed board (150) is connected to the row of the protruding electrodes (115), one end of a flexible printed board (160) is connected to the row of the protruding electrodes (116), the row of the protruding electrodes (115) is adjacent to the row of the protruding electrodes (116), and the one end of the flexible printed board (150) and the one end of the flexible printed board (160) are opposed to each other.

Abstract: A mounting apparatus includes a chassis, an expansion piece attached to a first end of an expansion card, and a securing member. The chassis includes a bottom plate and a front plate substantially perpendicular to the bottom plate. The expansion piece is secured to the front plate. The securing member for securing a second opposite end of the expansion card and includes a first securing portion attached to the bottom plate and a second securing portion. The first securing portion includes a securing panel and a supporting tab extending from the securing panel for supporting the expansion card. The second securing portion includes a positioning post. The second securing portion is deformable in a direction away from the securing panel, and when the second securing portion is released, the positioning post is engaged in a retaining hole of the expansion card.

Abstract: Embodiments of the present disclosure describe techniques and configurations for an enclosure that can be used for channel isolation in a multi-channel modulator driver such as, for example, an optical modulator driver. A system may include a substrate, a multi-channel modulator driver mounted on the substrate, and an enclosure mounted on the substrate to cover the multi-channel modulator driver, the enclosure having a wall that is disposed between first components of the multi-channel modulator driver associated with a first channel and second components of the multi-channel modulator driver associated with a second channel, the wall being composed of an electrically conductive material. Other embodiments may also be described and/or claimed.

Abstract: According to one embodiment, an electronic component structure includes an electronic component, an electrode, and a restriction portion. The electrode is connected to the electronic component in a multilayer state and comprises a plurality of solder regions on a side opposite to a side of the electronic component. Each of the solder regions is soldered to a substrate by separate solders. The restriction portion is connected to a periphery of the solder regions, and has a level difference relative to the solder regions.

Abstract: A housing of an electronic device is provided, which includes a plastic substrate defining a through hole having an inner wall, and an antenna formed on a surface of the plastic substrate. A conductive element is formed on the inner wall of the substrate through hole to electronically connect to the antenna. The conductive element defines a hole. The conductive element hole is filled with solidified poly-putty base.

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.