Abstract: The disclosure provides a positioning unit for an optical element in a microlithographic projection exposure installation having a first connecting area for connection to the optical element, and having a second connecting area for connection to an object in the vicinity of the optical element.

Abstract: Described herein are methods, apparatus, and computer readable medium to autofocus a lens of an imaging device. Parameters are received indicating a lens position. Lens actuator characteristics are determined. Lens damping parameters may be determined based, at least in part, on the input parameters and the lens actuator characteristics. In some aspects, lens damping parameters include a lens movement step size and a time delay between each step. In some aspects, the lens damping parameters include damping parameters for a plurality of regions of lens movement. Lens movement parameters are determined based, at least in part, on the input parameters and the lens damping parameters. The lens is then autofocused by moving it according to the lens movement parameters.

Abstract: A lens device includes a first barrel surrounding an optical axis, a first frame coupled rotatably to the first barrel and surrounding a first axis, and an adjusting unit. The adjusting unit has an adjusting groove formed in one of the first barrel and the first frame, and having adjusting groove segments, one of which extends spirally. The adjusting unit further has adjusting blocks formed on the other one of the first barrel and the first frame and engaging respectively and slidably the adjusting grooves. The first frame is rotatable relative to the first barrel to adjust the first axis relative to the optical axis.

Abstract: A mirror assembly for mounting to a handlebar of a motorcycle or other cycle vehicle, including a handle enabling an operator of the motorcycle to rotate the mirror without requiring the operator to remove a hand from the handlebar. The rotation swivels the mirror from a view to the rear to a position with a view to the side. Upon releasing the handle, a compression spring within the assembly returns the mirror to its original position. The mounting arrangement for the assembly includes two portions rotatable perpendicularly to one another, permitting the mirror arrangement to be adjusted after coupling with the handlebar such that the stem of the mirror is plumb. This ensures that when the handle is engaged rotating the mirror, the orientation of the mirror is maintained such that the top edge of the mirror remains level during rotation and that the mirror stem remains plumb.

Abstract: A bearing device for a solar power plant unit includes at least one support element, at least one first roller and at least one second roller. At least one first roller bearing unit is movably supported on the support element and rotatably supports the at least one first roller and the one second roller. At least one first spherical plain bearing having an outer ring is attached to the at least one first roller. A solar power plant includes at least one mirror movably supported by at least one such bearing device.

Abstract: A reflective film structure is provided for being adhered and shaped on multiple processing surfaces of a preformed structural element, in which the processing surfaces form a three-dimensional shape. The reflective film structure includes a thermoplastic adhesive film and a reflective layer. The thermoplastic adhesive film has a thickness ranging from 0.01 mm to 1 mm, and has an internal surface and an external surface. The internal surface is adhered to the processing surfaces. The reflective layer is laminated on the external surface, and massive beads are distributed on an outer surface of the reflective layer. The reflective film structure has a normal direction vertical to the reflective layer. Furthermore, the reflective layer has at least a first and a second reflective region in different directions, which are respectively towards different directions other than the normal direction. The first and the second reflective region are respectively disposed with beads.

Abstract: A display device in which an image with a wide color reproduction range and bright red can be displayed is provided. The display device is a display device such as, for example, a liquid crystal display device, a cathode ray tube, an organic electroluminescent display device, a plasma display panel, and a field emission display. The display device includes a display surface including a pixel having red, green, blue, and yellow sub-pixels, wherein the red sub-pixel preferably has the largest aperture area.

Abstract: Multi-rate oversampling of analog signals in storage devices is described. A method of processing an analog signal derived from a storage medium in a storage device includes: filtering the analog signal with an anti-alias filter having a fixed cut-off frequency related to a target sampling rate; sampling the analog signal using an over-sampling rate of a plurality of over-sampling rates provided by a variable-rate analog-to-digital converter (ADC) to produce an over-sampled digital signal; and filtering the over-sampled digital signal using a decimation filter of a plurality of decimation filters provided by a digital signal processor (DSP) to produce a digital signal having the target sampling rate.

Abstract: Hardware-based methods and apparatus are provided for inter-track interference mitigation in magnetic recording systems using averaged values. Inter-track interference (ITI) is mitigated in a magnetic recording system by obtaining ITI cancellation data; and providing the ITI cancellation data for ITI mitigation, wherein the ITI mitigation is performed in combination with an averaging procedure for one or more of ITI mitigation of averaged data and averaging of ITI mitigated data. The sector is optionally decoded using the ITI mitigated samples. Samples for one or more side track sectors can also be averaged. The averaged side track samples can be provided as ITI cancellation data for ITI mitigation. The averaging procedure optionally applies a scaling factor to each read value.

Abstract: A method is provided. A first CMOS switch is deactivated while activating a second CMOS switch to cause the portion of the write signal to transition from a first direct current (DC) voltage to a first peak voltage. After a first interval, the second CMOS switch is deactivated while activating a third CMOS switch to cause the portion of the write signal to transition from the first peak voltage to a second DC voltage. After a second interval, the third CMOS switch is deactivated while activating a fourth CMOS switch to cause the portion of the write signal to transition from the second DC voltage to a second peak voltage After a third interval, the fourth CMOS switch is deactivated while activating the first CMOS switch to cause the portion of the write signal to transition from the second peak voltage to the first DC voltage.

Abstract: A module according to one embodiment includes a plurality of transducers; a tape bearing surface having a transducer region aligned with the transducers in a tape travel direction, and outer regions flanking the transducer region in a direction perpendicular to the tape travel direction; a first coating on the transducer region of the tape bearing surface; and a second coating on at least one of the outer regions of the tape bearing surface, the second coating being different than the first coating.

Abstract: A method comprises generating first and second magnetic field components in a magnetic medium, the second magnetic field component substantially opposite the first. A pattern is written onto the magnetic medium, and a signal is generated by reading the pattern. The magnitude of the second magnetic field component is controlled based on an asymmetry of the signal.

Abstract: Apparatus for two dimensional data reading. In accordance with some embodiments, a magnetic read element has a plurality of read sensors positioned symmetrically about a pivot point with at least two of the read sensors configured to concurrently read two dimensional user data while being immune to skew angle misalignment.

Abstract: A method according to one embodiment includes detecting a signal originating from at least one reader of a first outer module of a head as a tape passes thereacross, the head having at least the first outer module and a second outer modules positioned on opposite sides of an inner module and aligned with the inner module in a direction of tape travel thereacross. A first guide positioned in front of the first outer module is moved in a direction towards the tape until the signal detected by the first outer module decreases. The first guide is moved in a direction away from the tape to a position to set about a predetermined wrap angle of the tape relative to the first outer module after the signal detected by the first outer module decreases.

Abstract: A system comprises a first tapered core configured for positioning adjacent a first surface of a magnetic medium, and a second tapered core configured for positioning adjacent a second surface of the magnetic medium, opposite the first tapered core along a travel direction of the magnetic medium. Each of the first and second tapered cores has a transverse width defined with respect to the magnetic medium, where the transverse width decreases from a first end of the tapered core to a second end of the tapered core, the second end forming a pole face adjacent the magnetic medium.

Abstract: There are provided a magnetic recording medium and a magnetic memory device capable of implementing high recording density, in the case of using a microwave assisted magnetic recording (MAMR) scheme. In a magnetic memory device including a magnetic recording medium having a recording film with three or more layers, a recording magnetic pole generating a recording magnetic field, an opposed magnetic pole, a high frequency magnetic field generating element generating a microwave for recording assist, and a magnetic reproduction element, an anisotropic field of a first layer which is a top layer of the recording film is larger than 20 kOe.

Abstract: An assembly comprises a plurality of laterally spaced front blocks, a magnetic post coupling each of the front blocks to a common back bar, and a common front bar magnetically coupled to the back bar. A write gap spacer is positioned between the front bar and each of the plurality of front blocks, and a write gap element comprising write gaps couples the front bar to each front block across the write gap spacer. A coil is configured to generate magnetic flux in each magnetic post, and the front blocks are configured to direct the magnetic flux across the write gaps.

Abstract: A thin-film magnetic head has a high write performance because its shape is smooth without roughness. The thin-film magnetic head includes a slider substrate, a write element and an antireflection film. The slider substrate has an air bearing surface at one side and supports a first support layer. The first support layer has a leading shield, and the leading shield has a low-level flat part, a slope part and a high-level flat part continuously arranged at one side in the recited order toward the air bearing surface. The antireflection film entirely covers the low-level flat part, the slope part and the high-level flat part of the leading shield. The write element has a recording magnetic pole film, and the recording magnetic pole film is formed above the antireflection film.

Abstract: A main pole layer having at least a leading taper and trimmed pole tip portion is described. The leading taper increases head field up to ?15000 Oe even for narrow track widths approaching 50 nm. For MAMR applications, a STO and trailing shield are sequentially formed on a trailing pole tip side. Furthermore, full side shields may be added to reduce fringing field. A preferred embodiment includes both of a leading taper and trailing taper at the pole tip where leading taper angle is between 20° and 60° and trailing taper angle is from 10° to 45°. A method is provided for forming various embodiments of the present invention. A key feature is that milling depth at an effective neck height distance is greater than or equal to the pole tip thickness. A self aligned STO may be formed by the same ion milling step that defines track width.

Abstract: A magnetic device including a write pole, a magnetic reader, or both; and one or more shields adjacent at least a portion of the write pole or the magnetic reader, or both, wherein at least a portion of the one or more shields includes or is made from Ni100-aXa, wherein X is chosen from: Ru, Re, Zr, Cr, and Cu; and a is the atomic percent of the element X, and can range from about 20 to about 90.

Abstract: A system comprises a magnetic medium with a first magnetic gap adjacent a first side and a second magnetic gap adjacent a second side, opposite the first magnetic gap. The first magnetic gap generates first longitudinal and perpendicular field components. The second magnetic gap generates second longitudinal and perpendicular field components. The first and second longitudinal field components are substantially aligned along a recording layer of the magnetic medium, and the first and second perpendicular field components are substantially opposed across the recording layer of the magnetic medium.

Abstract: Apparatus for two dimensional reading. In accordance with some embodiments, a magnetic read element has a bias magnet disposed between a plurality of read sensors. The bias magnet may be configured to concurrently bias each read sensor to a predetermined magnetization.

Abstract: A terminal includes a terminal wiring part extending from a flexure and having an insulating layer and a wiring layer formed on the insulating layer, a terminal main part formed at a front end of the terminal wiring part and connected to a piezoelectric element arranged to face the terminal main part, and a terminal bender that is made of a supportive metal layer, is arranged along a part of the terminal wiring part in an extending direction thereof, and is plastically deformed to form a bend in the part of the terminal wiring part so as to bring the terminal main part closer to the piezoelectric element.

Abstract: A system and method for subtransient current suppression in a power system. A generator is configured to provide an output current to a power distribution system. A current sensor is configured to sense the output current. A switch is configured to direct the output current to ground when the switch is closed. A controller is configured to close the switch for a time delay in response to identifying a level of the output current that is greater than a threshold level and to automatically open the switch in response to identifying an end of the time delay.

Abstract: A controller for switching an inverter includes a current detecting unit, an overcurrent level determining unit which determines an overcurrent level for stopping the inverter in accordance with a value corresponding to the number of revolutions of a motor, a current comparing unit which compares a detected output current value of the inverter with the overcurrent level, and a gate signal generating unit which generates a signal for turning off all semiconductor switching devices of the inverter when the current comparing unit makes a determination that the detected output current value has reached the overcurrent level. The overcurrent level is lowered as the number of revolutions of the motor increases.

Abstract: A system and method for protecting a power system. A generator is tripped in response to identifying a current on the generator that is greater than a first current threshold for a first time delay. The generator is also tripped in response to identifying the current on the generator that is greater than a second current threshold for a second time delay. The first current threshold is larger than the second current threshold and the first time delay is shorter than the second time delay.

Abstract: Protecting a gate dielectric is achieved with a gate dielectric protection circuit coupled to a transistor at risk. The protection circuit is activated to reduce the voltage across the gate dielectric (VDIFF) to below its breakdown voltage (VBD). The protection circuit is activated when an ESD event is detected. The protection circuit provides a protection or ESD bias to reduce VDIFF below VBD.

Abstract: This application discusses, among other things, apparatus and methods for electrostatic discharge (ESD) protection. In an example, an ESD protection circuit can include an ESD control circuit, and a driver-off circuit, wherein the ESD control circuit is configured to send an enable signal to the driver-off circuit and to perform electrostatic discharge to a ground node when detecting occurrence of electrostatic charges, and wherein the driver-off circuit is configured to disable a driving device upon reception of the enable signal.

Abstract: The described devices, systems and methods include an electro-static discharge clamp with a latch to prevent false triggering of an electro-static discharge protection circuit in response to fluctuations in a power supply rail.

Abstract: The described devices, systems and methods include an electro-static discharge clamp with a latch to prevent false triggering of an electro-static discharge protection circuit in response to fluctuations in a power supply rail.

Abstract: A high performance ESD protection circuit is provided. Embodiments include a circuit having an RC clamp circuit including a first NMOS transistor having a first source, drain, and gate, a current mirror circuit including first and second PMOS transistors having a second and third source, drain, and gate, respectively, and an SCR circuit including a first P+ contact. The first source is coupled to a ground rail, the first drain is coupled to the second drain, second gate, and third gate, the second and third sources are coupled to a power rail, and the third drain is coupled to the first P+ contact, wherein during an ESD event the first NMOS and PMOS transistors turn on to discharge a first current to the ground rail, and the current mirror provides a second current to the first P+ contact for turning on the SCR.

Abstract: In an example embodiment, systems and methods for detecting and handling faults in a DC bus system (“system”) can comprise detecting a fault in the segment, isolating the segment from the system, waiting for a period of time, connecting a probe power unit to the system at the isolated segment, and determining if a fault still exists on the isolated segment, wherein the determining is based on whether power is discharging from the probe power unit when connected to the system. The system can comprise one or more controllers and a probe power unit.

Abstract: A system that detects electrical disconnection of one connector from another connector includes a detection circuitry and a protection circuitry. The detection circuitry detects that a plug connector has been electrically disconnected from a corresponding receptacle connector. In response to the detection, the detection circuitry sends a signal to the protection circuitry. In response to the signal, the protection circuitry lowers or terminates power being supplied to a host device via one of the contacts of the plug connector. This helps to prevent shocks/shorts that may be caused by accidental disconnection of the plug connector.

Abstract: A system that detects electrical disconnection of one connector from another connector includes a detection circuitry and a protection circuitry. The detection circuitry detects that a plug connector has been electrically disconnected from a corresponding receptacle connector. In response to the detection, the detection circuitry sends a signal to the protection circuitry. In response to the signal, the protection circuitry lowers or terminates power being supplied to a host device via one of the contacts of the plug connector. This helps to prevent shocks/shorts that may be caused by accidental disconnection of the plug connector.

Abstract: A solid state switch module is provided for use in a power distribution network including an input differential protection connection for receiving a measured current value from an upstream module. The solid state switch module also includes an output differential protection connection for sending a measured current value. The solid state switch module includes a trip outlet for sending a trip signal to an upstream solid state switch, and a trip inlet for receiving a trip signal from a downstream solid state switch. The trip inlet is operably coupled to the switch. A current sensor measures the current value of a connected power transmission line across the solid state switch module. A summer adds a current input from a parallel module with the current measures by the current sensor. A comparator determines whether an amount of current lost between the solid state switch module and an upstream module is acceptable.

Abstract: A computing device including a power connector to interface with a power source, logic and power components on a current path from the power connector; the power connector providing electrical power to the logic and power components, and an inrush protection circuit on the current path between the power connector and the logic and power components, the inrush protection circuit including: a first power dissipation device and a second power dissipation device arranged in parallel on the current path, a feedback loop to detect an amount of current in the current path and to control the first power dissipation device to operate in a manner to dissipate detected inrush current, and a first time delay network in communication with the second power dissipation device and causing a delay for the second power dissipation device to transition to an on state, wherein during steady state.

Abstract: A vehicle safety device installed in a hybrid electric vehicle or an electric vehicle is provided to be capable of interrupting a current supplied from a power supply to a load via a supply line. The vehicle safety device includes first interrupting mechanism adapted to set the supply line in an interrupted condition when a temperature of the load reaches a first set temperature and second interrupting mechanism adapted to set the supply line in the interrupted condition such that the supply line cannot be returned to an energized condition when the temperature of the load reaches a second set temperature that is higher than the first set temperature.

Abstract: An isolator 10 is formed with an isolation transformer 13 that blocks an abnormal voltage entering from a communication line 30 and protects a protection target device 40. A pulse transformer 43 in the device 40 includes a primary winding 43a connected to a secondary winding 13b of the transformer 13 and a secondary winding 43b connected to an inner circuit. A medium tap of the primary winding 43a is grounded through an inner capacitance Ci of the device 40. A parasitic capacitance Cs between the primary winding 13a and the secondary winding 13b of the transformer 13 and the inner capacitance Ci are connected in series, an abnormal voltage is divided by the capacitance Cs and the capacitance Ci, and a capacitance value of the capacitance Cs is set such that the divided voltage of the capacitance Ci is equal to or below a predetermined value.

Abstract: An electrical relay contact arrangement for switching an electrical relay ‘on’ or ‘off’ at zero crossings of an AC mains supply, wherein the arrangement rather than immediately sending a control signal from a microprocessor to the input of the electrical relay to close or open the mechanical electrode contacts when switching is required, relies upon a time interval made up two delays, firstly when the microprocessor first recognizes switching is required there is a waiting period until the next zero crossing, and then a further delay which is the time difference between the lag times of the mechanical contact electrodes physically opening or closing and that of the next zero crossing.

Abstract: Disclosed herein are different embodiments of a grounding apparatus, system and method, for use, in accordance with some embodiments, to ground an object to be coated in an electrostatic coating process. The apparatus generally comprises a structure and cover moveable relative to one another between a conductor receiving position and a covering position, such that a grounding conductor received therebetween may be conductively coupled therewith and at least partially covered thereby in the covered position. A removable grounding apparatus is also disclosed for positioning on an object support proximate a selected grounding location of the object.

Abstract: Embodiments of the present invention provide chamber components having a protective element for shielding bonding material from processing environments in a processing environment. The protective element may include protective seals, protective structures, erosion resistive fillers, or combinations thereof. Embodiments of the present invention reduce erosion of bonding material used in a processing chamber, thus, improving processing quality and reducing maintenance costs.

Abstract: An electrostatic chuck includes a base having a first through hole extending through the base. An electrostatic chuck attraction plate is bonded to the base. An attraction electrode is incorporated in the electrostatic chuck attraction plate to generates electrostatic charge and electrostatically attract an attraction subject. A recess is formed in the electrostatic chuck attraction plate in alignment with the first through hole. The recess partially exposes the attraction electrode. An adhesive layer is formed between the electrostatic chuck attraction plate and the base. The adhesive layer covers an inner surface of the recess. A tubular insulator is arranged in the recess. The tubular insulator includes a second through hole. A power supply terminal is arranged in the first through hole and the second through hole. The power supply terminal includes a distal portion electrically connected to the attraction electrode.

Abstract: In a semiconductor manufacturing apparatus member 10, paths that may become a discharge path between a wafer W and a cooling device 40 are a first path R1 and a second path R2. The path R1 is the shortest path from a hole 34a to a hole 42 across a plug 36. The length of the path R1 is larger than the thickness of the plug 36. The path R2 is a path that extends from one of holes 34 to an outer peripheral surface of the plug 36 along an adhesive layer 38 along the shortest path (portion R2a), then to a bonding sheet 50 along the outer peripheral surface, and to a hole 42 along the bonding sheet 50 along the shortest path (portion R2b). The sum of the lengths of these portions (R2a+R2b) is larger than the thickness of the plug 36.

Abstract: A member 10 for a semiconductor manufacturing apparatus includes an electrostatic chuck 20, a cooling unit 40, a spacer (an O-ring 44, an outer periphery spacer 58, or the like) for securing a gap 48 placed between the electrostatic chuck 20 and the cooling unit 40, and a clamp ring 50 placed on the upper surface of the outer periphery of the electrostatic chuck 20. The clamp ring 50 is fastened to the cooling unit 40 with screws 60. The screws 60 are inserted into coil springs 66 that prevent loosening, and are fastened to nuts 68. The coil springs 66 are attached not to the clamp ring side but to the cooling unit side.

Abstract: According to one embodiment, a variable-capacitor device includes a first MEMS variable-capacitor element, and a second MEMS variable-capacitor element including one end series-connected to one end of the first MEMS variable-capacitor element. In a down-state, a first capacitance value of the first MEMS variable-capacitor element differs from a second capacitance value of the second MEMS variable-capacitor element.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body formed by laminating dielectric layers having an average thickness of 0.7p or less; external electrodes formed on external surfaces of the ceramic body; and internal electrodes respectively disposed on the dielectric layer so as to have a gap formed therebetween, wherein, when a narrowest gap between the internal electrode edges adjacent to one another is denoted by Gmin, 10 ?m?Gmin?60 ?m is satisfied.

Abstract: Feedthrough and method for making a feedthrough. The feedthrough has a ferrule forming a ferrule lumen, an electrically conductive pin extending longitudinally through at least a portion of the ferrule lumen, a filter capacitor surrounding the electrically conductive pin within the ferrule lumen, the filter capacitor having a bonding surface, and a ceramic seal positioned within the ferrule lumen directly abutting the filter capacitor sealing a space between the electrically conductive pin and the ferrule. The ceramic seal adheres to and creates an adhesive bond with the bonding surface of the capacitor and substantially inhibits fluid flow through the ferrule lumen.

Abstract: An EMI filtered terminal assembly including at least one conductive terminal pin, a feedthrough capacitor, and a counter-bore associated with a passageway through the capacitor is described. Preferably, the feedthrough capacitor having counter-drilled or counter-bored holes on its top side is first bonded to a hermetic insulator. The counter-drilled or counter-bore holes in the capacitor provide greater volume for the electro-mechanical attachment between the capacitor and the terminal pin or lead wire, permitting robotic dispensing of, for example, thermal-setting conductive adhesive.

Abstract: There are provided a multilayer ceramic electronic component and a manufacturing method thereof, the multilayer ceramic electronic component including: a ceramic body including dielectric layers; a plurality of internal electrodes facing each other with the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein a thickness to of the internal electrode satisfies 0.1 ?m?Te?0.5 ?m, and when, in a cross-section of the ceramic body taken in length and thickness directions, cut through a central portion of the ceramic body in a width direction, a distance, in the length direction, of a central portion of an internal electrode grain closest to a disconnected portion of the internal electrode is denoted by Tc, and a distance, in the length direction, of the internal electrode grain at a point equal to 25% of the thickness thereof above or below the central portion thereof is denoted by Tl, 0.7?Tl/Tc?1.3 is satisfied.

Abstract: There is provided a multilayer ceramic electronic component, including: a ceramic body; and internal electrodes formed inside the ceramic body and having a plurality of non-electrode regions, wherein, on a cross-section taken in length and thickness directions of the ceramic body, when a thickness of the internal electrode is denoted by Te, a continuity of the internal electrode is denoted by C, an area of the internal electrode is denoted by Ae, an area of the plurality of non-electrode regions is denoted by Ao, and a maximum diameter of the non-electrode region having the maximum diameter among the plurality of non-electrode regions is denoted by Pmax, 0.1 ?m?Te?0.5 ?m, 1.1%?Ao/Ae?3.2%, Pmax?120 nm, and 95%?C?99.5% are satisfied.