Abstract: Cooling is performed efficiently by constituting: a fan which is provided with an outlet; a heatsink which is provided with an inlet with a larger size than that of the outlet of the fan in a height direction and through the interior of which an airflow generated by the fan passes; and a guide member which is disposed between the fan and the heatsink and which is configured to guide the airflow to an outer surface of the heatsink.

Abstract: A system for cooling components of a power generation system. The system may include a working fluid, 100% of which may be sent to a heat exchanger for cooling the components. During cooling, the working fluid may be retained in liquid form. All of the working fluid exiting the heat exchanger may be introduced to an evaporator which may transform the working fluid to a gas for use by an expander or other device to create motive power to run a generator. Upon exiting the expander, the gas may be condensed back to liquid form, 100% of which may be sent back to the heat exchanger to cool the components.

Abstract: A package includes a base body to which an electronic device is fixed, a lid body that faces the electronic device, and a frame body that encloses at least one of a space between the electronic device and the lid body, and the electronic device. The frame body has a first portion located at a side of an inner edge of the frame body with respect to an outer edge of the base body, and a second portion located at a side of an outer edge of the frame body with respect to the outer edge of the base body, in an X direction from the inner edge of the frame body toward the outer edge of the frame body.

Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.

Abstract: Provided are: a circuit device which has improved connection reliability in a solder joint portion by suppressing the occurrence of sink of solder; and a method for manufacturing the circuit device. In a method for manufacturing a circuit device of the present invention, a plurality of solders (19), which are apart from each other, are firstly formed on the upper surface of a pad (18A), and a chip component (14B) and a transistor (14C) are affixed at the same time. After that, a solder paste (31) is supplied to the upper surface of the pad (18A) using a syringe (30), a heatsink (14D) is mounted on top of the solder paste (31), and melting is caused by a reflow process. There is little risk of sinking of the solders (19) in the present invention since the solders (19) are discretely arranged on the upper surface of the pad (18A).

Abstract: A first tier die is provided having a thermal management floorplan with a heat region having an area for thermal coupling to a heat sink, a second tier die is provided, shaped and dimensioned to be stackable into a multi-tier stack with the first tier die and, when stacked in the multi-tier stack, to not substantially overlap the heat region. A heat sink is provided, and a thermal coupling element, the heat sink, a stack having the first tier die and the second tier die, and the heat sink are arranged to form the multi-tier stacked integrated circuit. In the arrangement, the thermal coupling element is located to form a thermal path from the heat region of the first tier die to the heat sink.

Abstract: An electronic device includes a circuit board, a connector fixed on the circuit board, and a heat sink mounted on the circuit board. The heat sink includes a securing portion. The securing portion defines a first cutout, a second cutout, and an arm located between the first and second cutouts. The arm resiliently urges the connector against the circuit board so as to firmly hold the connector between the heat sink and the circuit board.

Abstract: A waterproof controller used for electric power steering includes a shell, a chamber, at least one sealing block, a circuit board, at least one cable, and at least one board mounting accessory. The chamber is formed in the shell. The sealing block is disposed on the shell, and includes at least one hole. The circuit board is accommodated in the chamber. The cable includes a first terminal and a second terminal opposite to the first terminal. The first terminal passes through the hole of the sealing block. The board mounting accessory covers the second terminal, in which the board mounting accessory and the second terminal insert into the circuit board together.

Abstract: Regarding an electrical apparatus, in an opposing part facing a board, the opposing part being on a surface of in a heat dissipator, a contact part which is brought into contact with a first region of a second main surface corresponding to an electrical component and a surrounding region of the electrical component and which is brought into contact with a second region of the second main surface corresponding to a fixing member and a surrounding region of the fixing member protrudes relative to a portion of the opposing part other than the contact part. The degree of flatness of a contact surface, in the contact part, that is brought into contact with the first region and the second region is higher than the degree of flatness of a surface of the opposing part other than the contact surface.

Abstract: A panel mounting assembly includes a cabinet frame, a panel, and a locking apparatus. The cabinet frame includes a pair of supporting rails. An engaging slot is defined in each of the pair of supporting rails. The panel is attached to the pair of supporting rails. The locking apparatus includes a rotatable latch rotatably attached to the panel, a pair of latch bars movably attached to the panel, and an engaging member protruding from each of the pair of latch bars. The rotatable latch is rotatable between a released position when the rotatable latch is disengaged from the engaging member and each of the pair of latch bars is disengaged from the engaging slot, and a locked position when the rotatable latch is resisted against the engaging member and each of the latch bars is moved away from each other and engaged with the engaging slot.

Abstract: A slide-cover electronic device includes a main body, a moveable body and a supporting assembly. The moveable body is combined with the main body to move linearly and rotate with respect to the main body. The supporting assembly is configured as a supporting structure protruding out of a back side of the main body with an included angle formed between the main body and the moveable body. The supporting assembly includes a rotating member, a first sliding member and a second sliding member. The rotating member is rotatably connected with the back side to lean on the back side or form an included angle in between. The first sliding member is movably connected with the rotating member to move linearly with respect to the rotating member. The second sliding member is movably connected with the moveable body for being clasped with the first sliding member in a second status.

Abstract: A portable terminal includes a display module and a case member coupled to the display module. A face of the case member is formed to have a center portion and an edge, which are different from each other in their heights to thereby support a center portion of the display module in lengthwise and widthwise directions of the display module respectively. The portable terminal configured above supports a rear face of the flat display module using at least one of a portion protruded from the case member and a stiff material film, to thereby diffuse an impact exerted on a display device to the case member. Thus, it is possible to relieve the damage to the flat display device due to an external impact.

Abstract: A wireless module includes a wireless signal transceiver and a transferring unit. The wireless module is assembled to a connector unit after the wireless signal transceiver is assembled to the transferring unit. Therefore, the connector unit transmits and receives wireless signals through the wireless module.

Abstract: According to one embodiment, there are provided a memory which is provided on a circuit board, a controller which is provided on the circuit board and controls the memory, and a signal line which is formed on the circuit board and configured to perform data transmission between the controller and the memory, in which a width of the signal line in the place where the signal line is led out from the memory is large compared with a place disposed under the memory.

Abstract: A photocurable resin composition which hardly causes leakage and is easily formed into a desired shape and an image display device using this photocurable resin composition are provided. Namely, a photocurable resin composition comprises a compound (A) having a photopolymerizable functional group and an oil gelling agent (B), is provided. Also, an image display device having a laminate structure including an image display unit having an image display part, a transparent protective plate, and a resin layer existent between the image display unit and the transparent protective plate, wherein the resin layer is a cured material of the above-described photocurable resin composition, is provided.

Abstract: An electronic device includes a housing having a bottom wall and a front sidewall slantingly extending from the bottom wall, a circuit board received in the housing and parallel to the bottom wall, a sensor window cover secured to the front sidewall, a signal receiving unit secured to the circuit board and corresponding to the sensor window cover, and a supporting mechanism secured to the circuit board. The supporting mechanism supports the signal receiving unit to slant toward the sensor window cover.

Abstract: A supporting structure comprises a base member to support a printed circuit board, a holder standing upright from the base member and supporting the printed circuit board; and a support standing upright from the base member and supporting the printed circuit board sidewise. The support includes a column standing upright from the base member, and having a modulus of elasticity greater than that of the holder, and an abutment portion to abut on a side surface of the printed circuit board.

Abstract: A circuit board includes an insulative substrate having a first surface on which an electronic component is mounted, a second surface opposite to the first surface, and a through-hole open in the first surface and the second surface, a first conductive layer formed on the first surface so as to reach the through-hole, to which the electronic component is electrically connected, a second conductive layer formed on the second surface so as to reach the through-hole and electrically connected to the first conductive layer through the through-hole, a third conductive layer formed over the second surface so as to reach the through-hole, covering at least part of the second conductive layer, and filling at least part of the through-hole, a first protective glass layer covering the second conductive layer and the third conductive layer, and an adhesive layer formed on the first protective glass layer.

Abstract: A chip card ejecting mechanism includes a base body, a push member, a rotating member and an elastic member resisting between the base body and the rotating member. The base body includes a guiding member defining a hole and having a number of guiding rails. Each guiding rail includes a resisting surface and a guiding surface. The push member includes a push rod extending through the hole and a number of active gears. Each active gear defines an active cooperative surface. The rotating member includes a number of the passive gears. Each passive gear includes a passive cooperative surface. When the push member is pressed toward the rotating member by a transient external force, the rotating member compresses the elastic member until the active cooperative surface arrives at the guiding surface, the elastic member releases and drives the passive cooperative gears to slide along the first sliding slot.

Abstract: Systems and methods for shielding circuitry from interference with conformal coating are disclosed. Systems having conformal EMI shields according to embodiments are provided by applying insulating and conductive layers to areas of a printed circuit board (PCB). This produces systems that may be thinner and also smaller in surface area, and that may be suitable as part of electronic devices.

Abstract: Abase substrate includes an insulator board comprising through holes penetrating between two opposed principal surfaces, penetrating electrodes provided within the through holes, and intermediate layers sandwiched between inner surfaces of the through holes and the penetrating electrodes and having surfaces with smaller concavities and convexities than those of the inner surfaces at the penetrating electrode sides.

Abstract: The smart card (98A) comprises an external connector (90), which is formed of an insulating support (6) and a plurality of external metal contact pads (4) arranged on the external face of said insulating support. The card body has a housing in which the external connector is arranged and includes an electronic unit and/or an antenna electrically connected to a plurality of internal metal contact pads (20), which are arranged underneath the external connector and respectively aligned with the plurality of external metal contact pads. The plurality of external metal contact pads are respectively electrically connected to the plurality of internal metal contact pads by a plurality of metal parts (100), which are each at least partially formed by a solder material and which traverse said insulating support through respective apertures (92).

Abstract: In mounting a relatively large circuit component such as an electrolytic capacitor and a film capacitor on a circuit board, the present invention decreases a protruding height of the component beyond the board, preventing abnormal noise caused by making contact the component with the board. The circuit board has an opening or a notch in which the body of a circuit component to be mounted on the board is disposed, and a protrusion that protrudes from one or more sides of the opening or the notch. The component is disposed on the board in a manner that the body of the component is inserted through the opening or the notch and that the body has no contact with the board except for the protrusion. With the condition maintained, the protrusion and the body of the component are bonded together by fixing material for fixing the component to the board.

Abstract: The invention provides an LCD module, an LCD device, and a backplane. The LCD module includes a backplane, and a circuit board arranged on a back of the backplane. The backplane is provided with a slot into which a circuit board is inserted, and the circuit board are arranged on the slot. In the invention, because the backplane of the LCD module is provided with the slot, the circuit board of the LCD module is fixed in the slot of the backplane by insertion. Thus, a screw is not used for fixing a plurality of fixed points of the circuit boards, thereby improving the assembly efficiency of the circuit board and the LCD modules.

Abstract: A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.

Abstract: A method for manufacturing a printed circuit board includes forming an opening portion in a substrate, positioning chip capacitors in the opening portion of the substrate such that the chip capacitors are accommodated in the opening portion of the substrate, forming a buildup structure including an interlayer resin insulating layer and a conductive layer over a surface of the substrate and the chip capacitors accommodated in the opening portion of the substrate, and forming on a surface of the buildup structure bump structures positioned to mount an IC chip such that the chip capacitors in the opening portion of the substrate are positioned directly below the IC chip.

Abstract: A circuit device having superior voltage resistance is provided. A structure is achieved that omits the resin layer that is normally provided to the top surface of a circuit board. Specifically, a ceramic substrate (22) is disposed on the top surface of a circuit board (12) comprising a metal, and a transistor (34) such as an IGBT is mounted to the top surface of the ceramic substrate (22). As a result, the transistor (34) and the circuit board (12) are insulated from each other by the ceramic substrate (22). The ceramic substrate (22), which comprises an inorganic material, has an extremely high voltage resistance compared to the conventionally used insulating layer comprising resin, and so even if a high voltage on the order of 1000V is applied to the transistor (34), short circuiting between the transistor (34) and the circuit board (12) is prevented.

Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. A lead (30) and lead (28) though which high current passes are disposed superimposed on the upper surface of a circuit board (12). Also, a plurality of ceramic substrates (22A-22F) are affixed to the circuit board (12), and transistors, diodes, or resistors are mounted to the upper surface of the ceramic substrates. Furthermore, the circuit elements such as the transistors or diodes are connected to the lead (28) or the other lead (30) via fine metal wires.

Abstract: A compact circuit device wherein a semiconductor element that performs high current switching is embedded is provided. The hybrid integrated circuit device (10) is provided with: a circuit board (12); a plurality of ceramic substrates (22A-22G) disposed on the top surface of the circuit board (12); circuit elements such as transistors mounted on the top surface of the ceramic substrates (22A-22G); and a lead (29) or the like that is connected to the circuit elements and is exposed to the outside. Furthermore, in the present embodiment, leads (28, 30, 31A-31C) are disposed superimposed in the vicinity of the center of the circuit board (12), and a circuit element such as an IGBT is disposed and electrically connected approaching the region at which the leads are superimposed. The alternating current transformed by the IGBT is output externally via the leads (31A, etc.).

Abstract: An interconnection element is provided for conductive interconnection with another element having at least one of microelectronic devices or wiring thereon. The interconnection element includes a dielectric element having a major surface. A plated metal layer including a plurality of exposed metal posts can project outwardly beyond the major surface of the dielectric element. Some of the metal posts can be electrically insulated from each other by the dielectric element. The interconnection element typically includes a plurality of terminals in conductive communication with the metal posts. The terminals can be connected through the dielectric element to the metal posts. The posts may be defined by plating a metal onto exposed co-planar surfaces of a mandrel and interior surfaces of openings in a mandrel, after which the mandrel can be removed.

Abstract: A package is connected at a first side to a printed circuit board and with a die fixed to it on a second side opposite to the first side. The package has an integrated pre-match circuit to provide an impedance match for a signal to be sent to a circuit external to the package. The signal has a predetermined main frequency component. The pre-match circuit has a pair of transmission lines and a pair of stubs on a predetermined layer of the package and connected to the pair of transmission lines. The pair of stubs have a length such as to form a short circuit for an harmonic frequency of the main frequency component in the signal.

Abstract: Provided are a bonded structure by a lead-free solder and an electronic article comprising the bonded structure. The bonded structure has a stable bonding interface with respect to a change in process of time, an enough strength and resistance to occurrence of whiskers while keeping good wettability of the solder. In the bonded structure, a lead-free Sn—Ag—Bi alloy solder is applied to an electrode through an Sn—Bi alloy layer. The Sn—Bi alloy, preferably, comprises 1 to 20 wt % Bi in order to obtain good wettability of the solder. In order to obtain desirable bonding characteristics having higher reliability in the invention, a copper layer is provided under the Sn—Bi alloy layer thereby obtaining an enough bonding strength.

Abstract: A semiconductor device includes a first printed circuit board, a flat cable having electrical wires and a coating film which covers the electrical wires except for both ends, one end of each of the electrical wires is connected to the first printed circuit board, and a second printed circuit board connected to other end of each of the electrical wires. The flat cable is bent in such a manner that the first printed circuit board and the second printed circuit board face each other. A flat surface is formed in a portion of the coating film.

Abstract: An improved multi-purpose kickstand assembly 100 has a modular kickstand mechanism 134 to securely support an electronic communications device 102 in a landscape mode and/or portrait mode. One or more sensors in the electronic communications device can detect the position of a kickstand-magnet 156 secured to the kickstand 136 to electronically determine the position of the kickstand. The kickstand can serve as a channel 170 for a speaker port 166 and/or speaker 168 and can enhance antennae performance for improved audio quality.

Abstract: A display device includes a display panel having a display area and a bezel area formed around edges of the display area; a backlight unit disposed on a rear side of the display panel to provide light to the display panel; a supporting member to support the display panel and the backlight unit; and a top case having at least one joint and incorporated with a surface of the supporting member, wherein the top case has a main frame combined with the supporting member, and a sub frame having a design of at least one color and disposed on the bezel area.

Abstract: A portable apparatus includes a casing, a plastic holder and a touch pad. The casing has a fixing area, and a plurality of first through holes and at least a second through hole are formed around the fixing area. The plastic holder is disposed at the fixing area and has a plurality of first pillars and at least a second pillar. The first pillars are correspondingly disposed through the first through holes, respectively, and the second pillar is correspondingly disposed through the second through hole. The touch pad is connected with the plastic holder.

Abstract: A cable management device includes a device body, a connecting member, and an extension body. The device body includes a first cable management arm and a second cable management arm. The connecting member pivotally connects a first end of the first cable management arm and a first end of the second cable management arm to attain a first cable management configuration. The connecting member is removable from the first cable management arm and the second cable management arm. In response to removal of the connecting member, two opposing ends of the extension body are respectively connected to the first end of the first cable management arm and the first end of the second cable management arm to attain a second cable management configuration. The cable management device may be included in a rack assembly.

Abstract: A display device includes a display panel having a display area and a bezel area formed around edges of the display area; a backlight unit disposed on a rear side of the display panel to provide light to the display panel; a supporting member to support the display panel and the backlight unit; and a top case having at least one joint and incorporated with a surface of the supporting member, wherein the top case has a main frame combined with the supporting member and a sub frame disposed on the bezel area and combined with the main frame.

Abstract: A shading device for a greenhouse includes a shading element and at least one lighting element, wherein the shading element comprises an outer side and an inner side. The shading element is formed from interwoven electrically conductive first thread elements and electrically insulating second thread elements. The first and/or second thread elements each may be adapted for reflecting an ambient light. The lighting element(s) may be arranged at the inner side of the shading element and connected with the first thread elements, and the lighting element(s) may be driven by an electrical current, conducted by the first thread elements, resulting in the emission of an artificial light, which may illuminate a plant growing in the greenhouse.

Abstract: An optical system for laser forming netted dots on a workpiece is provided. The optical system includes a laser light source for emitting a laser light beam having a polarized direction, a polarizing beamsplitter, a first reflecting unit and a second reflecting unit. The polarizing beamsplitter has a splitting axis deviating the polarized direction of the laser light beam 45 degree and is configured for dividing the laser light beam into a transmitting light beam and a reflected light beam with a same energy. The first reflecting unit is configured for reflecting the reflected light beam to a first predetermined position of a workpiece. The second reflecting unit is configured for reflecting the transmitting light beam to a second predetermined position of the workpiece.

Abstract: An article including at least one lighting zone, manufacture of the article, and a cooking apparatus including such an article when in a form of a glass-ceramic plate. The article includes at least one glass-ceramic substrate, and at least one light guide, the light guide coupled to at least one light source on one side outside of the lighting zone, and including, in the lighting zone, at least one mechanism of extracting radiation emitted by the light source.

Abstract: A luminous keying module of a handheld device includes a light-emitting element, a light-guiding membrane wiring board, a keying layer, and an elastic layer. A circuit pattern including plural membrane switches is formed on the light-guiding membrane wiring board. When the keying layer is pressed down, the keycap is moved downwardly to push the elastic layer. Consequently, a corresponding conductive structure of the elastic layer is moved downwardly to trigger a corresponding membrane switch.

Abstract: Disclosed is an approach to implement a light emitting device with remote wavelength conversion. Lighting arrangements are disclosed which provides consistent color despite inconsistent light path lengths for phosphor light conversions.

Abstract: Proposed is an illumination device (100), comprising a light source (110) such as an LED or a laser diode, a wavelength conversion medium (120) such as a phosphor, and a periodic antenna array (300) made of a highly polarisable material such as a metal. The light source emits primary wavelength light that at least partially is converted in secondary wavelength light by the wavelength conversion medium. The periodic antenna array is positioned in close proximity to the wavelength conversion medium and functions to enhance the efficiency of the absorption and/or emission processes in the wavelength conversion medium through the coupling of the incident primary wavelength light or the emitted secondary light to surface lattice resonances that arise from the diffractive coupling of localized surface plasmon polaritons in the individual antennas of the array.

Abstract: A method for manufacturing optoelectronic devices comprising the steps of: providing a common growth substrate; forming a light-emitting epitaxy structure on the common growth substrate; forming a stripping layer on the light-emitting epitaxy structure; forming a solar cell epitaxy structure on the stripping layer; forming an adhesive layer on the solar cell epitaxy structure; proving a solar cell permanent substrate on the adhesive layer; and removing the stripping layer to form a light-emitting device and a solar cell device separately.

Abstract: A power tool includes a housing having a large diameter rear portion and a narrow diameter nosepiece. An end effector is rotatably coupled to the housing. A holder with a substantially annular holder body is received over the nosepiece and non-rotatably coupled to the housing. A substantially annular cover having at least one transparent surface, and an internal annular groove, is received at least partially inside the holder body, and non-rotatably and axially fixed with respect to the holder. A substantially annular printed circuit board is received at least partially inside the annular groove in the cover, and non-rotatably and axially fixed with respect to the cover. A plurality of lighting elements is operatively connected to the printed circuit board and radially disposed about the printed circuit board. The lighting elements are aligned with the at least one transparent surface so as to illuminate a workpiece.

Abstract: A light strand with integrated ornaments includes an elongated power cord positioned within a protective sheath having an electric plug at a first end and an electric receptacle at a second end. A plurality of lighted elements and decorative ornaments are secured along the length of the cord, and at least one of the decorative ornaments being suspended from the cord via a tether. A light strand with integrated ornaments also includes a plurality of connectors and lighted connectors for removably securing the ornaments to the sheath.

Abstract: A light fixture comprising a chamber portion is disclosed. In some embodiments, the fixture comprises a chamber portion shaped to house circuitry required for lighting elements such as light emitting diodes (LEDs) mounted elsewhere in the fixture. In some embodiments, LEDs are mounted facing a back reflector, which in turn reflects light out of a troffer to form an indirect lighting fixture. In some embodiments, light is emitted from one mixing chamber. In some embodiments, light is emitted from two or more mixing chambers. In some embodiments, LEDs are mounted on a heat sink which cooperates with a chamber portion.

Abstract: A luminaire and method of installing same on a mounting pole including a housing having a flange and a plurality of LEDs. The flange includes formed therein a plurality of spaced apart holes disposed along a line, a slot disposed along the line, and a central hole disposed along the line and between the slot and the spaced apart holes. The plurality of LEDs are attached to or disposed in the housing. The method includes hanging the luminaire on an upper mounting bolt extending from a mounting pole, sliding the upper mounting bolt along the slot so that a conduit hole and the central hole are at least partially aligned to each other and one of the plurality of spaced apart holes is aligned to a lower mounting hole, and installing a lower mounting bolt through a lower mounting hole and the one spaced apart hole aligned therewith.

Abstract: Embodiments provide a flashlight with a bezel configured to be moved relative to a body of the flashlight to adjust the focus of the light. A locking assembly may be disposed within the bezel and configured to switch between an unlocked position and a locked position if the bezel is rotated with respect to the body. The locking assembly may include a ring-shaped outer component having first and second curved walls separated by a gap. The locking assembly may further include an inner component coupled with the light assembly, the inner component including a nub configured to be disposed in the gap if the locking assembly is in the unlocked position, and to radially push an outer surface of the outer component against the inner surface of the bezel if the locking assembly is in the locked position.